Galaxy GHDX2-2430S-24F4D, GHDX2-2430R-24F4D Installation And Hardware Reference Manual

Galaxy RAID
Model GHDX2-2430S-24F4D
24 bay FC-4G to SATA-II RAID Subsystem
Single Controller
Model GHDX2-2430R-24F4D
24 bay FC-4G to SATA-II RAID Subsystem
Dual Controller
Installation and Hardware
Version 1007
Version 1.0 (08, 2005)
Galaxy Raid GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
Contact Information
Americas
Rorke Data Inc 7626 Golden Triangle Drive Eden Prairie, MN 55344 USA Tel: +1-800 328 8147 Fax: +1-952 829 0988
sales@rorke.com techsupport@rorke.com http://www.rorke.com
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Copyright 2007
This Edition First Published 2007
All rights reserved. This publication may not be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written consent of Rorke Data , Inc.
Disclaimer
Rorke Data makes no representations or warranties with respect to the contents hereof and specifically disclaims any implied warranties of merchan tability or fitness for any particular purpose. Furthermore, Rorke Data reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation to notify any person of such revisions or changes. Product specifications are also subject to change without prior notice.
Galaxy Raid Installation and Hardware Reference Manual
Trademarks
Galaxy and the Galaxy logo are registered trademarks of Rorke Data , Inc.
®
PowerPC Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered trademarks of their respective owners.
is a trademark of International Business Machines Corporation and
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Galaxy Raid GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
Warnings and Certifications
Restricted Access Location:
This equipment is intended to be installed in a RESTRICTED ACCESS LOCATION only.
Electric Shock Warning!
To Prevent Electric Shock: Access to this equipment is granted only to trained operators and service personnel who have
been instructed of and fully understand the possible hazardous conditions and the consequences of accessing non-field-serviceable units. For example, accessing the backplane may cause electric shock.
FCC (applies in the U.S. and Canada)
FCC Class A Note
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device may accept any interference received, including interference that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residen tial area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
WARNING:
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Galaxy Raid Installation and Hardware Reference Manual
Use only shielded cables to connect I/O devices to this equipment.
You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment.
This device is in conformity with the EMC.
CB
This device is in conformity with the CB safety specifications.
This device meets the requirements of the CB standard for electrical equipment with regard to establishing a satisfactory level of safety for persons using the device and for the area surrounding the apparatus. This standard covers only safety aspects of the above apparatus; it does not cover other matters, such as style or performance.
CCC for Power Supplies’ compatibility to China Compulsory Certification.
This device is in conformity with UL standards for safety.
ITE BSMI Class A, CNS 13438 (for Taiwan)
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Galaxy Raid GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
This device is in conformity with UL standards for safety.
RoHS 2002/96/EC compliant
WEEE Disposal of Old Electrical and Electronic Equipment
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Galaxy Raid Installation and Hardware Reference Manual
Table of Contents
CHAPTER 1 INTRODUCTION
1.1. PRODUCT OVERVIEW ................................................................................................1-1
1.1.1 Product Introduction........................................................................................1-1
1.1.2 Enclosure Chassis ............................................................................................1-2
1.1.2.1 Chassis Overview........................................................................................................... 1-2
1.1.2.2 Physical Dimensions................................................................................................... ... 1-3
1.1.2.3 Front Panel Overview....................................................................................................1-3
1.1.2.4 Hard Drive Numbering.................................................................................................. 1-4
1.1.2.5 Rear Panel Overview.....................................................................................................1-4
1.1.2.6 Back-plane Board........................................................................................................... 1-5
1.2. SUBSYSTEM COMPONENTS........................................................................................1-5
1.2.1 LCD Panel........................................................................................................1-5
1.2.2 Drive Trays.......................................................................................................1-6
1.2.3 RAID Controller Modules ................................................................................1-6
1.2.4 Controller Module Interfaces...........................................................................1-7
1.2.5 DIMM Modules ................................................................................................1-9
1.2.6 BBU..................................................................................................................1-9
1.2.7 PSUs...............................................................................................................1-10
1.2.8 Cooling Modules ............................................................................................1-11
1.3. S
1.4. H
UBSYSTEM MONITORING.......................................................................................1-12
1.3.1 I2C bus ...........................................................................................................1-12
1.3.2 LED Indicators...............................................................................................1-12
1.3.3 Firmware (FW) and RAIDWatch GUI ...........................................................1-13
1.3.4 Audible Alarms...............................................................................................1-13
OT-SWAPPABLE COMPONENTS..............................................................................1-13
1.4.1 Hot-swap Capabilities....................................................................................1-13
1.4.2 Components....................................................................................................1-14
1.4.3 Normalized Airflow ........................................................................................1-14
CHAPTER 2 HARDWARE INSTALLATION
2.1. INSTALLATION OVERVIEW...............................................................................2-1
2.2. INSTALLATION
2.3. SAFETY
2.3.1 Precautions and Instructions............................................................................2-2
2.3.2 Static-free Installation......................................................................................2-3
2.4. GENERAL
2.4.1 Installation Procedure Flowchart....................................................................2-4
2.5. UNPACKING
2.6. INSTALLATION
2.6.1 Pre-installed Components................................................................................2-5
2.6.2 Uninstalled Components ..................................................................................2-5
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PRECAUTIONS:......................................................................................2-2
INSTALLATION PROCEDURE.........................................................2-3
PRE-REQUISITES.....................................................................2-1
THE SUBSYSTEM..........................................................................2-5
OVERVIEW...............................................................................2-5
Galaxy Raid GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
2.7. INSTALLING
THE OPTIONAL BBU....................................................................2-6
2.7.1 BBU Installation Overview...............................................................................2-6
2.7.2 BBU Warnings and Precautions.......................................................................2-6
2.7.3 Installation Procedure......................................................................................2-7
2.8. HARD
DRIVE INSTALLATION............................................................................2-9
2.8.1 Hard Drive Installation Prerequisites..............................................................2-9
2.8.2 SATA Drive Installation ...................................................................................2-9
2.9. DRIVE
2.10. RACK/CABINET
TRAY INSTALLATION ..........................................................................2-10
INSTALLATION.....................................................................2-12
CHAPTER 3 SUBSYSTEM MONITORING
3.1. SUBSYSTEM MONITORING OVERVIEW ......................................................................3-1
3.2. S
3.3. A
3.4. I2C
TATUS-INDICATING LEDS .......................................................................................3-2
3.2.1 Brief Overview of the LEDs..............................................................................3-2
3.2.2 LCD Panel........................................................................................................3-3
3.2.3 Drive Tray LEDs ..............................................................................................3-4
3.2.4 Controller Module LEDs..................................................................................3-5
3.2.5 LAN Port LEDs ................................................................................................3-6
3.2.6 BBU LED..........................................................................................................3-7
3.2.7 PSU LEDs.........................................................................................................3-8
3.2.8 Cooling Module LEDs......................................................................................3-9
UDIBLE ALARM ....................................................................................................3-10
3.3.1 Default Threshold Values...............................................................................3-10
3.3.2 Failed Devices................................................................................................3-11
MONITORING....................................................................................................3-11
CHAPTER 4 SUBSYSTEM CONNECTION AND OPERATION
4.1 FC HOST CONNECTION PREREQUISITES ........................................................4-1
4.1.1 Choosing the Fibre Cables...............................................................................4-1
4.1.2 FC Lasers.........................................................................................................4-2
4.1.3 FC Speed Auto-detection..................................................................................4-2
4.1.4 SFP Transceivers..............................................................................................4-2
4.2 TOPOLOGY
4.2.1 Basic Configuration Rules................................................................................4-3
4.2.2 Fibre Channel Topologies................................................................................4-3
4.2.3 Host-side Topologies........................................................................................4-4
4.2.4 Unique Identifier ..............................................................................................4-4
4.2.5 ID/LUN Mapping..............................................................................................4-4
4.3 SAMPLE
4.3.1 Sample Topology – Clustered Hosts.................................................................4-4
4.3.2 Sample Topology – Direct-Attached.................................................................4-5
4.4 POWER
4.4.1 Check List.........................................................................................................4-6
4.4.2 Power On Procedure........................................................................................4-7
4.4.3 Power On Status Check....................................................................................4-8
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AND CONFIGURATION CONSIDERATIONS ..............................4-3
TOPOLOGIES.........................................................................................4-4
ON .............................................................................................................4-6
Galaxy Raid Installation and Hardware Reference Manual
4.4.4 LCD Screen ......................................................................................................4-9
4.5 POWER
OFF PROCEDURE .................................................................................4-10
CHAPTER 5 SUBSYSTEM MAINTENANCE
5.1. OVERVIEW.............................................................................................................5-1
5.1.1 Maintenance.....................................................................................................5-1
5.1.2 General Notes on Component Replacement.....................................................5-1
5.2. REPLACING
5.2.1 Overview...........................................................................................................5-2
5.2.2 Notes on Controller Module Maintenance.......................................................5-3
5.2.3 Removing the Controller Module.....................................................................5-3
5.2.4 Replacing the Controller Module.....................................................................5-4
5.3. DIMM
5.3.1 DIMM Module Considerations.........................................................................5-6
5.3.2 DIMM Module Replacement Procedure...........................................................5-6
5.4. REPLACING
5.5. REPLACING
5.5.1 PSU Module Overview .....................................................................................5-9
5.5.2 Replacing the PSU Module.............................................................................5-10
5.6. COOLING
5.6.1 Cooling Module Overview..............................................................................5-13
5.6.2 Replacing a Cooling Module..........................................................................5-14
5.7. REPLACING
5.7.1 Hard Drive Maintenance Overview................................................................5-16
5.7.2 Replacing a Hard Drive .................................................................................5-17
CONTROLLER MODULE COMPONENTS ...................................5-2
MODULE REPLACEMENT.......................................................................5-6
A FAULTY BBU ..............................................................................5-7
A FAULTY PSU MODULE..............................................................5-9
MODULE MAINTENANCE ..............................................................5-13
A FAILED HARD DRIVE..............................................................5-16
APPENDIX A SPECIFICATIONS
A.1. TECHNICAL SPECIFICATIONS.................................................................................. A-1
A.2. CONTROLLER SPECIFICATIONS............................................................................... A-3
A.2.1 Configuration .................................................................................................A-3
A.2.2 Architecture....................................................................................................A-3
A.3. DRIVE TRAY SPECIFICATIONS ................................................................................A-4
A.4. POWER SUPPLY SPECIFICATIONS............................................................................A-4
A.5. COOLING MODULE SPECIFICATIONS ......................................................................A-5
A.6. RAID MANAGEMENT............................................................................................. A-5
A.7. FAULT TOLERANCE MANAGEMENT........................................................................ A-6
APPENDIX B SPARE PARTS AND ACCESSORIES
B.1. SPARE PARTS ......................................................................................................... B-1
B.2. ACCESSORIES ......................................................................................................... B-2
APPENDIX C PIN OUTS
C.1. SFP CONNECTOR PIN OUTS ................................................................................... C-1
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Galaxy Raid GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
C.2.
COM1 CABLE: DB9 AUDIO JACK PIN OUTS.......................................................... C-3
C.3. COM2 CABLE: DB9 AUDIO JACK PIN OUTS.......................................................... C-4
C.4. GAL-9011 NULL MODEM...................................................................................... C-5
C.5. ETHERNET PORT PIN OUTS..................................................................................... C-6
C.6. MAIN POWER ......................................................................................................... C-6
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Safety Precautions
Precautions and Instructions
Prior to powering on the subsystem, ensure that the correct power range is being
used.
The Galaxy subsystem comes with twenty four (24) drive bays. Leaving any of th ese
drive bays empty will greatly affect the efficiency of the airflow within the enclosure, and will consequently lead to the system overheating, which can cause irreparable damage.
If a module fails, leave it in place until you have a replacement unit and you are
ready to replace it.
Airflow Consideration: The subsystem requires an airflow clearance, especially at
the front and rear.
Galaxy Raid Installation and Hardware Reference Manual
Handle subsystem modules using the retention screws, eject levers, and the metal
frames/face plates. Avoid touching PCB boards and connector pins.
To comply with safety, emission, or thermal requirements, none of the covers or
replaceable modules should be removed. Make sure that during operation, all enclosure modules and covers are securely in place.
Be sure that the rack cabinet into which the subsystem chassis will be installed
provides sufficient ventilation channels and airflow circulation around the subsystem.
Provide a soft, clean surface to place your subsystem on before working on it.
Servicing on a rough surface may damage the exterior of the chassis.
If it is necessary to transport the subsystem, repackage all disk drives separately.
Dual redundant controller models come with two controller modules that must be
installed into the subsystem. Single controller modules come with a single controller module and a metal sheet is placed over the lower controller bay at the rear of the subsystem. Since single controller modules cannot be upgraded, this metal sheet should NEVER be removed.
ESD Precautions
Observe all conventional anti-ESD methods while handling system modules. The use of a grounded wrist strap and an anti-static work pad are recommended. Avoid dust and debris in your work area.
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Galaxy Raid GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
About This Manual
This manual:
Introduces the Galaxy RAID GHDX2-2430S/R-24F4D 400mhz ASIC
subsystem.
Describes all the active components in the subsystem.
Provides recommendations and details about the hardware installation
process.
Briefly describes how to monitor the subsystem.
Describes how to maintain the subsystem.
This manual does not:
Describe components that are not user-serviceable.
Describe the configuration options of firmware, using terminal emulation
programs, or the RAIDWatch GUI software that came with your subsystem.
Give a detailed description of the RAID controllers embedded within the
subsystem.
Revision History
Initial release
Who should read this manual?
This manual assumes that its readers are experienced with computer hardware installation and are familiar with storage enclosures.
Related Documentation
User’s Operation Manual
• RAIDWatch User’s Manual
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These two documents can be found in the product utility CD included with yo ur subsystem package.
Conventions
Naming
From this point on and throughout the rest of this manual, the Galaxy series is referred to as simply the “subsystem” or the “system” and Galaxy is frequently abbreviated as “Gal.”
Lists
Bulleted Lists: Bulleted lists are statements of non-sequential facts. They can be read in any order. Each statement is preceded by a round black dot “•.”
Numbered Lists: Numbered lists are used to describe sequential steps you should follow in order.
Galaxy Raid Installation and Hardware Reference Manual
Important information that users should be aware of is indicated with the following icons:
NOTE:
These messages inform the reader of essential but non-critical information. These messages should be read carefully as any directions or instructions contained therein can help you avoid making mistakes.
CAUTION!
Cautionary messages should also be heeded to help you reduce the chance of losing data or damaging the system.
IMPORTANT!
The Important messages pertain to use the Galaxy subsystem introduced in this manual.
Warnings appear where overlooked details may cause damage to the
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WARNING!
Galaxy Raid GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
equipment or result in personal injury. Warnings should be taken seriously.
Software and Firmware Updates
Please contact Rorke Technical Support for the latest software or firmware updates.
Problems that occur during the updating process may cause unrecoverable errors and system down time. Always consult technical personnel before proceeding with any firmware upgrade.
NOTE:
The firmware version installed on your system should provide the complete functionality listed in the specification sheet/user’s manual. We provide special revisions for various application purposes. Therefore, DO NOT upgrade your firmware unless you fully understand what a firmware revision will do.
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Galaxy Raid Installation and Hardware Reference Manual
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Chapter 1
Introduction
1.1. Product Overview
This hardware manual briefly introduces the Galaxy GHDX2-2430S/R-16F4D Fibre-4G to SATA-II RAID subsystem as shown in Figure 1-1.
Figure 1-1: GHDX2-2430S/R-24F4D FC-to-SATA RAID Subsystem
The GHDX2-2430S-24F4D RAID subsystem is powered by a single RAID controller, the GHDX2-2430R-24F4D by dual redundant RAID contro llers. Each RAID controller comes with two (2) 4Gbps Fibre host channels that are interfaced through four (4) separate SFP ports. A total of eight (8) SFP ports are available in a redundant-controller configuration. The additional SFP ports facilitate connection to multiple application servers and for connecting fault-tolerant data paths. The subsystem houses twenty-four (24) 3Gbps SATA-II disk drives each with dedicated channel bandwidth. Each controller board comes with a pre-installed 512MB DDR RAM DIMM module and can support memory modules with the capacities up to 2GB.
The Galaxy HDX2 series is built around a custom ASIC400 specifically designed with the hardware RAID6 capability. RAID6 can sustain two member drives of a RAID array to fail at the same time and thereby helps achieve a higher level of data availability. There are six (6) dedicated RCC paths strung between the partner RAID controllers in a dual-active configuration. The RCC chips reside on the third, separate PCI-X bus. This design takes benefits of the abundant system bandwidth brought by the new architecture and hence the inter-controller communications do not affect drive channel throughput.
Introduction 1-1
Galaxy GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
A SAS expansion port comes with each RAID controller and provides easy connectivity to terabytes of expansion capacity over the 4x, wide SAS link cables.
Two (2) RS-232C (audio jack) serial port connectors are located on the controller faceplate. One serial port (COM1) enables serial communication between the controller and an external PC running terminal emulation software that can be used to configure and manage the RAID subsystem. The second serial port (COM2) connects to an uninterruptible power supply (UPS). An RJ-45 Ethernet connector allows telnet access and web-based management using the included browser-based or Java-based versions of the RAIDWatch manager software.
Disk drives in the front section of the subsystem are directly mated with a common backplane. The backplane receives a maximum of twenty-four (24) SATA-II hard drives that should be separately purchased.
Two (2) redundant, hot-swappable, dual-fan cooling modules protect the RAID subsystem from overheating and three (3) redundant, hot-swappable, 1U 405W power supply unit (PSU) modules provide constant power to the RAID subsystem. The modular nature of the subsystem and the easy accessibility to all major components ensure that the subsystem can be reliably and efficiently operated and maintained.
1.1.1 Enclosure Chassis
1.1.1.1 Chassis Overview
The Galaxy HDX2 24bay subsystem comes with a 4U compact steel chassis and aluminum alloy framework for even distribution of component heat. A back-end PCB is enclosed in thick gauge sheet metal that divides the enclo sure intern ally into th e front and rear sections. (See Figure 1-2) The front section accommodates twenty-four (24) drive trays (with their associated hard drives) and the rear section accommodates three (3) PSU modules, two (2) dual-fan cooling modules, and RAID controllers in a single- or dual­controller configurations. The two (2) foldable handles on the front of the chassis enable you to easily extract the chassis from a rack cabinet. The subsystem enclosure can be mounted into standard 19-inch rack cabinets using separately purchased slide rails.
1-2
Introduction
Chapter 1: Introduction
Figure 1-2: Galaxy 24-bay SATA RAID Subsystem Overview
1.1.1.2 Physical Dimensions
The Galaxy HDX2 24bay subsystem comes in a standard 4U chassis with the following dimensions:
With forearm handles: 482W x 174.4H x 514D mm (19 x 6.87 x 20.2 inches)
Without forearm handles: 445W x 174.4H x 498D mm (17.5 x 6.87 x 19.6
inches)
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Galaxy GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
1.1.1.3 Front Panel Overview
Figure 1-3: Galaxy HDX2 24bay RAID Subsystem Front View
As shown above, the front section of the subsystem features a 4-column by 6-row layout to accommodate twenty-four (24) drive trays that are designed to house standard 3.5-inch SATA drives. The left-side forearm handle comes with a 16 characters by 2 rows LCD screen and four (4) function keys that can be used to configure and monitor the subsystem.
1.1.1.4 Drive Slot Numbering
The front section of the enclosure houses twenty-four (24) hard drives. When viewed from the front, the drive bays (slots) are numbered 1 to 24 from left to right, then from top to bottom.
Slot-1 Slot-2 Slot-3 Slot-4 Slot-5 Slot-6 Slot-7 Slot-8
Slot-9 Slot-10 Slot-11 Slot-12 Slot-13 Slot-14 Slot-15 Slot-16 Slot-17 Slot-18 Slot-19 Slot-20 Slot-21 Slot-22 Slot-23 Slot-24
1-4
Introduction
Figure 1-4: Hard Drive Slot Numbering
1.1.1.5 Rear Panel Overview
Figure 1-5: Galaxy GHDX2-2430R-24F4D Rear View
Chapter 1: Introduction
The rear panel of the Dual redundant controller version of the Galaxy HDX2 subsystem is shown in Figure 1-5. The rear panel provides access to all the components located in the rear half of the RAID subsystem enclosure. The rear panel of the single controller version of the Galaxy HDX2 subsystem is shown in Figure 1-5.
Three (3) (N+1) redundant, hot-swappable 405W PSU modules provide converted power from the power source. Two (2) redundant, hot-swappable, dual-fan cooling modules are located above the PSU modules. One power switch on the chassis rear panel controls all PSU modules. Each PSU module contains two cooling fans.
Figure 1-6: Galaxy GHDX2-2430S-24F4D Rear View
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Galaxy GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
Each RAID controller module comes with four (4) SFP host ports, two (2) RS-232C (audio jack) serial ports, one (1) RJ-45 Ethernet connector and status-indicating LEDs located on its rear-facing faceplate.
1.1.1.6 The Backplane Board
An integrated backplane board receives disk drives on the front end and connects the RAID controller, cooling, and PSU modules on the other side. The PCB board provides logic level signals and low voltage power paths. It contains no user-serviceable components.
1.1.1.7 Subsystem Rack/Cabinet Installation
The subsystem chassis has pre-drilled screw holes for rackmounting. Separately
purchased, independently installed rackmount rails are available for rack or cabin et installation.
The slide rails come with their own printed copies of installation guide.
1.2. Subsystem Components
1.2.1 LCD Keypad Panel
Figure 1-7: LCD Keypad Panel
The LCD keypad panel consists of an LCD display with push buttons and LEDs that indicate array statuses. The LCD panel provides full access to all RAID configurations and monitoring options. After powering up the subsystem, the initial screen will display
1-6
Introduction
the subsystem model name. A different name can be assigned for the subsystem or specific logical drives. This enables ease of identification in a topology consisting of numerous arrays.
1.2.2 Drive Trays
The subsystems’ twenty-four (24) drive trays accommodate separately purchased, standard 1-inch pitch, 3.5-inch disk drives. The drive bays are accessed through the front of the enclosure. Two (2) LEDs on each tray bezel indicate the disk drive’s operation status. A rotary bezel lock on each drive tray secures the hard drive in place, while a release button can be used to open the front bezel.
Chapter 1: Introduction
Figure 1-8: Drive Tray
WARNING!
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it or resting heavy objects on it). The drive tray has been customized to fit into th e drive bays in the subsystem and if it is deformed or altered it may not fit into the drive bay.
NOTE:
The redundant-controller subsystem is shipped with twenty-four drive trays with multiplexer (MUX) adapter boards. These MUX boards provide access routes for different RAID controllers.
Please DO NOT use drive trays from a previous Galaxy model, GHDX-7376R6­24F2D. They are not compatible.
1.2.3 RAID Controller Module
The RAID controller module contains a main circuit board and a daughter card providing additional interface connectors, management and host interfaces, and a preinstalled 512MB DDR RAM DIMM. The subsystem comes standard with BBU protection. The BBU is installed in the module bay located at the top center of the controller module. The BBU can be independently inserted or removed. Please note: The controller module
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Galaxy GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
contains no user-serviceable components. Only remove the controller when replacing a faulty unit or installing/ the cache memory inside.
WARNING!
Although the RAID controllers are hot-swappable, the only time you should handle the controller itself is to remove a failed controller, or to install and replace memory modules. Unnecessary tampering with the RAID controller can damage the controller.
Figure 1-9: RAID Controller Faceplate
The controller faceplate provides external interfaces including four (4) SFP host ports, two (2) RS-232C (audio jack) serial ports (labeled COM1 and COM2), one (1) RJ-45 Ethernet connector and six (6) status-indicating LEDs (labeled from 1 to 6), one Restore Default LED and the associated push button. The controller main circuit board is hou sed in a metal canister and can only be seen after the controller is removed from the chassis. The controller canister has two (2) ejection levers that can be used to retrieve or secure the controller module to the chassis. These levers are secured to the enclosure chassis using two (2) retention screws through the screw holes underneath each lever.
1.2.4 Controller Module Interfaces
All host I/O and management interfaces are located on the controller faceplate. The interfaces are listed below.
SFP host ports: Host ports are SFP sockets that receive 4Gb/s interface fiber optical
transceivers. It is recommended to use only certified transceivers and cables.
SAS expansion port: The SAS expansion port provides a 12Gb/s wide link to the
Galaxy series expansion JBODs.
RS-232C (Audio Jack): All controller modules come with two (2) RS-232C (audio
jack) serial ports The serial ports can be used for establishing a management session through terminal emulation and uninterruptible power supply ( UPS) support.
1-8
Introduction
Chapter 1: Introduction
The dual-controller subsystem comes with a serial port Y-cable that allows you to access a surviving controller in the event of controller failure without physically changing the connection.
TIPS:
Connect both Ethernet ports (if you are using a dual-controller subsystem) to the Ethernet ports of your network switch.
The Ethernet port on a non-dominant (secondary) controller will stay idle until the occurrence of primary controller failure.
Ethernet port: A single 10/100BaseT Ethernet port is used for local/remote
management over LAN/WAN. For a dual-controller configuration, connect the Ethernet ports on both RAID controllers to your local network. The Ethernet port on a non-dominant (stand-by, usually the controller in the lower slot) controller will remain idle until a dominant, primary controller fails and the management service is transferred to the surviving controller.
Disk Drive Channels: All models come with twenty-four (24) SATA drive channels
that are interfaced thorough a backplane to the hard disk drives.
1.2.5 DIMM Module
Each controller module comes with a preinstalled 512MB DDR RAM DIMM module mounted on the controller board within a metal chassis. The controller module supports memory modules with sizes from 512MB to 2GB.
1.2.6 BBU Module
The BBU can sustain cached data for days during a power failure. If power outage occurs, the BBU supplies power to sustain the unfinished writes in cache memory.
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Galaxy GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
Figure 1-10: BBU Module, Controller Top Cover, and the Module Slot
The BBU functionality consists of two major parts. One is the charger circuitry mounted on top of the controller main board. The other is an optional BBU module that contains several battery cells. On a single-controller configuration, the BBU is an optional accessory. The BBU module is hot-swappable so it can be replaced while the subsystem is running.
New Feature:
The battery cell packs come with an EEPROM to record the date of installation and other service data; and when the appro ximate on e-year life expectancy is reached (by checking against the real-time-clock), system administrators will be notified for replacing the BBU.
In accordance with international transportation regulations, the BBU is only charged to between 35% and 45% of its total capacity when shipped. After powering on the subsystem (see Section 4.1) the BBU will automatically start charging its battery cells. It usually requires approximately twelve (12) hours for the battery to be fully charged.
The BBU is aware of its life expectancy as well as its charge level. Charge level awareness helps avoid frequent re-charge.
1.2.7 Power Supply Units
The subsystem is equipped with three (3) hot swappable, 1U-profile, 405W PSU modules. The PSU modules are located on the rear panel of the subsystem.
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Introduction
Chapter 1: Introduction
Figure 1-11: PSU Module
Each PSU module comes with a power socket for power cord plug-in. All three power supplies are turned on and off using a single powe r switch on th e enclos ure chas sis. Each PSU also comes with two (2) embedded cooling fans to provide sufficient airflow across its heat-generating components and one (1) LED to indicate the PSU status. An extraction handle makes it easier to install or remove the PSU from the subsystem. While a PSU may be removed when the system is still online, this should only be done if the PSU has failed and needs to be replaced.
A retention screw through the extraction handle secures the PSU to the chassis. If the PSU needs to be removed, the retention screw must be removed first. After installing a new PSU module, make sure that the retention screw has been firmly secured. The shipping package contains adjustable cable clamps that can be used to secure power cord connections.
PSU specifications are shown in Appendix A.
Power Supply Safety Restrictions
No. of Failed PSUs Responses and Preventive Actions
1. Warning messages are issued.
2. Cached data is flushed to the hard drives (also depends on
the Event Triggered configuration settings of the
1
firmware).
3. If previously configured to the Write-back mode, the
caching mode is automatically switched to the conservative Write-through mode.
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Galaxy GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
1. Warning messages are issued.
2. The subsystem is temporarily held in an idle state.
3. The firmware forces the subsystem to stop serving host
I/O requests.
2
4. After the failed PSUs are replaced, array administrators
should manually turn the power switch off and then on.
5. If the subsystem is powered on with only one PSU, the
firmware will start the initialization process but stays idle until at least one other PSU is added.
Table 1-1: Power Supply Safety Restrictions
1.2.8 Cooling Modules
These Galaxy 24 bay subsystems come with two (2) hot swappable, redundant, dual-fan cooling modules. Two (2) 8cm blowers are housed in each cooling module and provide ventilation airflow from the front to the rear of the subsystem, extracting the heat generated by the SATA hard drives and other components.
Intelligent Dual Speed Operation
The fans in the cooling module operate with two rotation speeds. Under normal operating conditions, the cooling fans run at the low speed, which is sufficient for maintaining an efficient airflow across components. Under the following conditions, the cooling fans automatically increase their rotation speed to increase the airflow:
1. Component Failure: if a cooling fan, PSU, or temperature sensor fails, the remaining cooling fan(s) automatically raises its rotation speed.
2. Elevated Temperature: if the temperature breaches the upper threshold set for any of the interior temperature sensors, the cooling fans automatically raise its rotation speed.
3. During the initialization stage, the cooling fans operate at the high speed and return to low speed once the initialization process is completed and no erro neous condition is detected.
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Introduction
1.2.9 Enclosure DIP Switches
Chapter 1: Introduction
Figure 1-12: Cooling Module
DIP switches are located on the upper left corner of enclosure rear panel. The first tree switches determine an enclosure ID and should always be kept at their default, “0-0-0.” The two (2) switches marked as #7 and #8 have no function. The #4 switch is for controlling the onboard hub across the host ports on partner controllers, to enable/d isable the onboard bypass. Switch #4 is only applicable in a dual-controller configuration. Switches #5 and #6 control host channel 4G or 2G speed.
When the onboard hub is enabled, host channels on the partner controllers will be combined, e.g., Channel 0 on Controller A and Channel 0 on Controller B combined into a host loop. Using the onboard hub enables fault-tolerant host links without the use of expensive FC switches in a DAS (Direct Attach Storage) topology.
The configuration options for setting the DIP switches is fully discussed in Chapter 4.
Figure 1-13: Enclosure DIP Switches
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Galaxy GHDX2-2430S/R-24F4D Installation and Hardware Reference Manual
1.3. Subsystem Monitoring
The RAID subsystem comes with several monitoring methods to give you constant updates on the status of the system and its individual components. The following monitoring features are included in the subsystem.
1.3.1 I2C bus
The following subsystem elements interface to the RAID controller over a non-user­serviceable I
Disk drives (drive failure output) PSU modules Cooling modules
2
C bus:
Temperature sensors
1.3.2 LED Indicators
The following active components all come with LEDs that indicate the status of the individual component:
RAID controller (7 LEDs) LCD keypad panel (3 LEDs) Cooling module (2 LEDs) PSU module (1 LED) Drive tray (2 LEDs) BBU module (1 LED)
1.3.3 Firmware and RAIDWatch® GUI
Firmware: The firmware (FW) is pre-installed software that is used to configure the subsystem. The FW can be accessed through either the front panel LCD keypad or a terminal emulation program that is installed on an external computer/application server used as a management station.
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Introduction
RAIDWatch: RAIDWatch is a premier, web-based or Java-based graphical user interface (GUI) that can be installed on an adjacent or a remote computer and accessed via standard TCP/IP.
1.3.4 Audible Alarm
The RAID subsystem comes with audible alarms that are triggered when certain active components fail or when certain controller or subsystem thresholds are exceeded. When you hear an audible alarm emitted from the subsystem, it is imperative that you determine the cause and rectify the problem immediately.
WARNING!
Failing to respond when an audible alarm is heard can lead to permanent subsystem damage. When an audible alarm is heard, rectify the problem as soon as possible.
Chapter 1: Introduction
1.4. Hot-swappable Components
1.4.1 Hot-swap Capabilities
The subsystem comes with hot-swappable components that can be exchanged while the subsystem is still online without affecting the operational integrity of the subsystem. These components should only be removed from the subsystem when they are being replaced. At no other time should these components be removed from the subsystem.
1.4.2 Components
The following components are all hot swappable:
RAID controller modules PSU modules Host I/O modules Cooling modules Hard drives BBU modules
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