I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded views
I Parts List
This service manual is for the 31B-250 2006
version model, which is different from the
previous 31B-250 model.
For the 31B-250 2006 version model, the
letter (M210) is printed on the Rating label
on the back of the unit. Refer to the Rating
label illustration at right.
When servicing the deck
mechanism, refer to MK14 Deck
Mechanism Section.
Deck Mechanism Part No.:
N25A0FL
Rating Label
"M210"
VIDEO CASSETTE RECORDER
31B-250
PAL
Page 2
MAIN SECTION
VIDEO CASSETTE RECORDER
31B-250
Sec. 1: Main Section
I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded Views
I Par ts L ist
4-1. Video outputVp-p0.81.01.2E-E Mode
4-2. Video S/NdB3942E-E Mode
4-3. Audio outputdB-10-6-2E-E Mode
4-4. Audio S/NdB4046E-E Mode
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will
exceed and some may drop slightly below these specs. Limit specs repres ent the absolute worst con dition that
still might be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1HM340SP
Page 4
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristic s which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special s afety characteristics are
identifi ed b y a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electr ical codes of the
countries in which they are to be sold. However, in
order to maintai n suc h c omp li anc e, it is e qual ly imp or tant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spur ious radi ation. Thes e must also be
replaced only with specified replacements.
Examples: RF conver ters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do no t co ntac t he at prod uc -
ing parts (heatsink s, oxide metal film resist ors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has b een replac ed, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insu lation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the comp lete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconne ct the AC plug from the
AC outlet.
1-2-1U31P_ISP
Page 5
Safety Check after Servicing
Examine the area surrounding the repaired location
for damage or deterioration. Observe that screws,
parts, and wires have been returned to their original
positions. Afterwards, do the following tests and confirm the specified values to verify compliance with
safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance dista nce (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d), (d’)
220 to 240 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Curre nt Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across t he ter minals of l oad
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit
d'd
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
AC Voltmeter
(High Impedance)
Fig. 1
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
parallel
220 to 240 V
50kΩ RES.
Connected in
parallel
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-2-2U31P_ISP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 6
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pa ck-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the c hip par ts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protec t other pa r ts from
damage. (Fig. S-1-2)
1-3-1VCRP_SN
Page 7
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or dam age the foil of ea ch
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applie d to all pi ns of the fl at pack-IC,
you can remove it easily. (Fig. S-1-3)
CBA
Masking
Tape
Tweezers
Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a shar p pin or wi re to which s older will
not adhere (iron wire). W hen hea tin g the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
3. Bottom of the flat pa ck-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Fig. S-1-4
1-3-2VCRP_SN
Page 8
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is ap plied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the f lat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a r ep la cem ent fl at p ack-IC mo re
easily.
2. The “●” mar k on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be su re thi s mar k m atche s the 1
on the PCB when positioni ng for installa tion. Then
presolder the four corners of th e fl at pa ck-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
To Solid
Mounting Point
CBA
Tweezers
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
or
Presolder
Flat Pack-IC
CBA
Fig. S-1-8
Fig. S-1-6
1-3-3VCRP_SN
Page 9
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static el ectric ity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a c onductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductor s
with your clothing.
<Incorrect>
<Correct>
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-3-4VCRP_SN
Page 10
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Asse mbly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP507 (S-INH) to GND. T his will stop
the function of Tape Start Sensor, Tape End Sensor
and Reel Sensors. (If these TPs ar e c on nected before
plugging in the unit, the function of the sensors will
stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape al l t he way to the start or the end of the
tape to avoid tape damage.
Q505
Q504
TP507
S-INH
Fig. 1
1-4-1HM4N0PFS
Page 11
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembl y Flowchart
This flowchar t indi cates the di sass embly ste ps to ga in
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] T op Case
[2] Front Assembly
[3] VCR Chassis Unit
[4] Jack CBA
[5] Deck Assembly
[6] Main CBA
[7] Cylinder Shield
2. Disassembl y Method
REMOVAL
ID/
LOC
.No.
PART
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
Note
(1):Identification (location) No. of parts in the figures
(2):Name of the part
(3):Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5):Refer to “Reference Notes.”
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1. Remove five Screws (S-2), three Screws (S-3) and
Screw (S-4). Then, slowly lift the VCR Chassis Unit
(Deck Assembly, Jack CBA and Main CBA) up.
2. When reassembling, solder wire jumpers as shown
in Fig. D5.
3. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CBA as shown in
Fig. D6. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LDSW, the shaft of Cam Gear with the hol e of L D-SW
as shown in Fig. D6.
[1]Top CaseD17(S-1)-
Front
[2]
Assembly
VCR Chassis
[3]
Unit
[4]Jack CBAD4Desolder, (S-5)-
Deck
[5]
Assembly
[6]Main CBAD5-----------
Cylinder
[7]
Shield
↓
(1)
↓
(2)
D2*3(L-1),*4(L-2)-
D35(S-2), 2(S-3), (S-4)1
D5
(S-6A),(S-6B), Desolder2,3
D6
D5(S-7)-
↓
(3)
↓
(4)
(S-1)
(S-1)
[1] T op Case
(S-1)
↓
(5)
Fig. D1
1-5-1HM340DC
Page 12
(L-2)
[2] Front
Assembly
(S-2)
[3]VCR
Chassis
Unit
(L-1)
(S-3)
(S-2)
(L-2)
(S-2)
[4] Jack CBA
(S-5)
Desolder
Fig. D4
Fig. D2
(S-4)
(S-3)
(S-2)
Fig. D3
1-5-2HM340DC
Page 13
[7] Cylinder Shield
FE Head
Cylinder Assembly
(S-7)
ACE Head
Assembly
Pin
SW507
LD-SW
[6] Main CBA
From
FE Head
From
Cylinder
Assembly
(S-6B)
TOP VIEW
From
ACE Head
Assembly
[5] Deck
Assembly
[6] Main CBA
(S-6A)
From
Capstan Motor
Assembly
Lead with
blue stripe
[5] Deck Assembly
Shaft
Hole
LD-SW
Cam Gear
Hole
Pin
[6] Main CBA
Fig. D6
Printing
Lead with
white stripe
Lead connections of Deck Assembly and Main CBA
Lead with
blue stripe
Desolder
from bottom
side
Fig. D5
1-5-3HM340DC
Page 14
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electri cal adjustm ents are re quired after re placing
circuit components and certain mechanical par ts.
It is impor tant to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perfor m these alignment / confirmation procedures, make sure that the tracking control is set in
the center po sition: Press either "CHANNEL L5??" or
"CHANNEL K" button on the remote control unit
first, then the "PLAY" button (Front Panel only).
Te st Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determ ine the Head Switching position during
playback.
Symptom of Misadjustment:
May cause Head Switch ing noise or vertical jit ter
in the picture.
Test pointAdj.PointModeInput
J23(V-OUT)
TP502(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
J23
GND
TP502
PLAY
(SP)
6.5H±1H
(416µs±64µs)
Oscilloscope
-----
Spec.
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edg e of the CH1 video out put waveform is at the 6.5H±1H (416µs±64µs) delayed position
from the rising edge o f the CH2 head switching pulse
waveform.
1.0H
6.5H+/-1H (416µs+/-64µs)
Switching Pulse
0.5H
V-Sync
1-6-1FEGVCREA
Page 15
HOW TO INITIALIZE THE VCR
To put the program back at the factory-default,
initialize the VCR as the following procedure.
1. Make sure that no timer programming is set. If not,
reset all timer programming.
2. Turn the power off.
3. Press the [STOP/EJECT] button and
[CHANNEL K] button on the unit simultaneously
for at least 2 seconds.
4. Release the [STOP/EJECT] button and
[CHANNEL K] button to complete this mode.
1-7-1HM340INT
Page 16
FUNCTION INDICATOR SYMBOLS
Note:
The following symbols will appear on the indicator panel to indicate the current mode or operation of the VCR.
On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
Display panel
STANDBY
FUNCTION
TAPE IN
T
IM
E
R
" H "= LED Light on, " L "= LED Light off
MODEINDICATOR ACTIVE
STANDBYAlways " H " during electricity
FUNCTIONPower on = " H "
Power off = " L "
TAPE INCassette in = " H "
Cassette out = " L "
TIMERTimer stand by = " H "
One touch recording = " H "
Timer recording = " H "
General mode = " L "
RECREC mode = " H "
REC pause
General mode = " L "
REC
Blinks at 0.8Hz interval
1-8-1HK21VFIS
Page 17
TV screen
Note:
OSD for mechanical error will be displayed for 5 sec. after the mechanical error occurs.
CauseIndicator Active
When reel or capstan mechanism is not
functioning correctly
When tape loading mechanism is not
functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safety detection
When reel or capstan mechanism is not functioning
correctly
A
R
When tape loading mechanism i s not function ing correctly
“A R” is displayed on a TV screen. (Refer to Fig. 1.)
“A T” is displayed on a TV screen. (Refer to Fig. 2.)
“A C” is displayed on a TV screen. (Refer to Fig. 3.)
“A D” is displayed on a TV screen. (Refer to Fig. 4.)
“A P” is displayed on a TV screen. (Refer to Fig. 5.)
Fig. 1
When the drum is not working properly
A
D
P-ON Power safety detection
Fig. 4
A
T
Fig. 2
When cassette loadi ng mechanism is not functi oning
correctly
A
C
Fig. 3
A
P
Fig. 5
1-8-2HK21VFIS
Page 18
BLOCK DIAGRAMS
Servo / System Control Block Diagram
TO
AUDIO BLOCK
FROM/TO
VIDEO BLOCK
TP507
SENS-INH
KEY
IC501
(SERVO/SYSTEM CONTROL)
REMOTE
RS501
AL+5V
SWITCH
8
7
KEY- 2
KEY- 1REMOCON-IN
CTL(+)
LD-SW9
14
957610480
SENSOR
S-LED
D502
AL+5V
KEY
CTL(-)
94
SWITCH
ST-S
AL+5V
END-S
T-REEL
VR501
SW-POINT
2
PG-DELAY
S-REEL79
Q501
PS503
AL+5V
31
REC-SAF-SW
RESET
34
RESET
TIMER+5V
S-REEL
REC-SAFETY
SW506
AL+5V
STAND-BY
D561
SDA
SCL
SDA
SCL
5
12
11
POWER-LED
CAS-LED
TIMER-LED
25
24
23
D563
CAS
Q563
IC503 (MEMORY)
REC-LED
26
TU701(TUNER UNIT)
3
D562
POWER
Q562
SDA
5
D564
TIMER
Q564
SCL
6
AUDIO-SW-1
AUDIO-SW-2
29
30
AUDIO-SW-1
AUDIO-SW-2
D565
REC
Q565
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDA
83
A-MUTE-H
P-ON+15V
CN502
12 P-ON+15V
IIC-BUS SCL
IIC-BUS SDA
71
72
IIC-BUS SCL
IIC-BUS SDA
D-CONT77
D-PFG
90
AL+12V
AL+12V(2)
D-PFG8D-CONT7LM-FWD/REV
9
11
10 GND
V-ENV
RF-SW
D-REC-H
33
D-REC-H
LM-FWD/REV
81
GND5C-CONT4C-F/R3C-FG2P-ON+5V1AL+12V/+20.5V
6
C-ROTA
15
18
RF-SW
C-ROTA
C-CONT
C-SYNC
D-V-SYNC
6
13
V-ENV
D-V-SYNC
C-F/R
C-FG
78
87
P-ON+5V
58
C-SYNC
AL+12V/+20.5V
P-ON-H
C-POW-SW
P-DOWN-L
67
66
86
P-ON-H
C-POW-SW
P-DOWN-L
FROM/TO
POWER
SUPPLY
BLOCK
SW507
LD-SW
MAIN CBA
ST-S
Q504
Q505
SENSOR CBA
END-S
T-REEL
Q503
TP506
END-S
SENSOR CBA
(DECK ASSEMBLY)
CN504
CL504
2 CTL(+)
1 CTL(-)
CONTROL
ACE HEAD ASSEMBLY
HEAD
1-9-1
MOTOR
CAPSTAN MOTOR
M
PG
SENSOR
CYLINDER ASSEMBLY
DRUM
MOTOR
DRIVE
CIRCUIT
CAPSTAN
MOTOR
M
M
LOADING
MOTOR
HM210BLS
Page 19
Video Block Diagram
VIDEO (L)
HEAD
VIDEO (R)
HEAD
CYLINDER ASSEMBLY
(DECK ASSEMBLY)
123
CN253
VIDEO(L)
VIDEO(R)
VIDEO-COM
969593
94
SP
HEAD
AMP
SP
EP
EP
HEAD
AMP
WF1
TP502
RF-SW
FROM/TO SERVO/SYSTEM
CONTROL BLOCK
V-ENV
RF-SW
D-REC-H
80
D-REC-H
C-SYNC
C-ROTA
D-V-SYNC
67
84
62
70
V-ENV
C-SYNC
D-V-SYNC
C-ROTA/RF-SW
SERIAL
DECORDER
Y. DELAY
P
R
LUMINANCE
SIGNAL
PROCESS
7978
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
69684643
IIC-BUS SDA
IIC-BUS SCL
65
FROM
SERVO/SYSTEM
CONTROL BLOCK
50
OSD
CHARACTER
IC501 (OSD)
MIX
52
IC301
(Y/C SIGNAL PROCESS)
BUFFER
AGC
BYPASS
IN1
TUNER
485052
REC FM
AGC
AGCVXO
63
21
2928
5859
C-PB
TP301
X301
4.433619MHz
WF2
+
Y
C
RPRP
CHROMINANCE
SIGNAL
1/2
MUTE
IN1
TUNER
PROCESS
MUTE
PB/EE
Y/C
FBC
MIX
WF3
J23
PR
61
V-OUT
CCD 1H DELAY
CHARA.
INS.
IN2
IN2
PB/EE
56
MAIN CBA
Q351
6
24
VIDEO IN
VIDEO OUT
TU701(TUNER UNIT)
1-9-2
JACK CBA
CN151
CN101
JK101
CN152
1
VIDEO-OUT1
1
Q101
BUFFER
19
VIDEO
-OUT1
1
VIDEO-OUT2
VIDEO-IN1
33
20
VIDEO
-IN1
CN102
Q102
JK102
VIDEO
VIDEO-IN2 3
3
1
BUFFER
19
20
-OUT2
VIDEO
-IN2
HM210BLV
Page 20
Audio Block Diagram
Mode : SP/REC
152
PB/EE
PB-AUDIO SIGNALREC-AUDIO SIGNAL
MAIN CBA
IC151 (SWITCHING)
PB/EE
PB/EE
3
4
1214151110
PB/EE
TUNER
IN2
IN1
13
IN1
TO SERVO/SYSTEM
CONTROL BLOCK
AUDIO-SW-1
AUDIO-SW-2
9
SW
CTL
ALC
TO SERVO/SYSTEM
71
68 69
16
CONTROL BLOCK
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDA
11
12
MUTE
SERIAL
DECODER
AUDIO HD-SW
CONTROL
DET
INV
LINE
ALC
R
AMP
ATT
REC-ON
P
REC
AMP
J972
2
21
AUDI O
TU-AUDIO
TU701(TUNER UNIT)
CN151
5
7
Q151
CN152
8
BUFFER
6
Q152
BUFFER
TUNER
IC301 (AUDIO SIGNAL PROCESS)
IN1
J982
IN2
151317
EQ
PB-ON
5
98
AMP
6
7
SP/LP-ON
+5V
Q401
Q402
CN504
AUDIO-PB/REC
3
BIAS
OSC
4 A-COM
6 AE-H
100
3
AUTO
BIAS
2
1
Q406
5 AE-H/FE-H
+5V
Q403 (SWITCHING)
Q405
(PB=ON)
CN501
2 FE-H
1 FE-H-GND
JACK CBA
JK101
AUDIO-IN1
AUDIO-OUT1
5
7
CN101
261
AUDIO-IN1
AUDIO-IN1
AUDIO-OUT1
CN102
JK102
3
261
AUDIO-OUT1
AUDIO-IN2
AUDIO-IN2
AUDIO-OUT2
6
8
3
AUDIO-IN2
AUDIO-OUT2
AUDIO-OUT2
1-9-3
ACE HEAD ASSEMBLY
AUDI O
HEAD
(DECK ASSEMBLY)
AUDI O
ERASE
HEAD
FE HEAD
FULL
ERASE
HEAD
HM210BLA
Page 21
Power Supply Block Diagram
P-ON+44V
P-ON+15V12P-ON-H
AL+12V/+20.5V
AL+12V
C-POW-SW
AL+5V
TIMER+5V
P-ON+5V
AL-5V
P-DOWN-L
MAIN CBA
Q051
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
T001
2
Q057
Q052
13
Q055
Q058
14
4
15
Q001
Q054
Q059
16
Q056
SHUNT
REGULATOR
Q004
11
17
18
1
4
IC001
ERROR
6
7
VOLTAGE DET
COLD
23
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
BRIDGE
D001 - D004
LINE
F001L003
T1.6A L 250V
HOT CIRCUIT. BE CAREFUL.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
AC001
RECTIFIER
FILTER
1-9-4
Q002
Q003
HOT
HM210BLP
Page 22
SCHEMATIC DIAG RAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these special safety character istics are id entified in th is manual
and its supplements; electrical components having
such features are identified by the m ark " ! " in the
schematic diagram and the par ts list. Before replacing
any of these components, read the parts list in this
manual carefully. The use of substitute replacement
parts that do not have the same safety characterist ics
as specified in the pa r ts list may create sh ock, fire, or
other hazards.
Notes:
1. Do not use the part number sh own on these draw-
ings fo r orde ring. The cor rect part number is sho wn
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless other-
wise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-10-1SCPA1
Page 23
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOW ING
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the
power supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the
parts list, and may be slightly different or amended since the drawings were prepared.
(2) To maintai n original function and reliabi lity of repaired units, use only orig inal replacement par ts which are
listed with their part numbers in the parts list section of the service manual.
4. Mode: SP/REC
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
6. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
5.0
231
5.0
PLAY mode
REC mode
(2.5)
Indicates that the voltage
is not consistent here.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-10-2SCRK05
Page 24
Main 1/5 Schematic Diagram
1-10-3
HM210SCM1
Page 25
Main 2/5 & Sensor Schematic Diagram
1-10-4
HM210SCM2
Page 26
Main 3/5 Schematic Diagram
1-10-5
HM210SCM3
Page 27
Main 4/5 & Jack Schematic Diagram
1-10-6
HM210SCM4
Page 28
Main 5/5 Schematic Diagram
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
1-10-7
HM210SCM5
Page 29
Main CBA Top View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
Sensor CBA Top View
BHF300F01012A
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BHF300F01012B
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
WF3
J23
V-OUT
WF1
TP502
RF-SW
VR501
SW-POINT
1-10-8
TP507
S-INH
TP501
CTL
WF2
TP301
C-PB
BHM450F01011A
Page 30
Main CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
1-10-9
BHM450F01011A
Page 31
Jack CBA Top View
Jack CBA Bottom View
1-10-10
BHM450F01011C
Page 32
WAVEFORMS
NOTE:
Input
VCR: COLOR BAR SIGNAL (WITH 1KHz AUDIO SIGNAL)
(WF1~WF3)
WF2
UPPER
TP301
WF1
LOWER
TP502
C-PB 10mV x 10
RF-SW 0.5V x 10
5ms
WF3
UPPER
J23
WF1
LOWER
TP502
V-OUT 0.1V x 10
RF-SW 0.5V x 10
50µs
WF3
J23
V-OUT E-E
10µs 50mV x 10
1-11-1
U31PWF
Page 33
WIRING DIAGRAM
AC CORD
JK101,102
1234567
JW001
AL+12V(1)
GND
1 VIDEO-OUT1
2
3 VIDEO-IN1
4
CN151CN101
123456789
AUDIO-IN17
JK1-8P-OUT
AUDIO-OUT1
5
6
1011121314151617181920
JACK CBA
1234567
JW002
GND
1 VIDEO-OUT2
CN152CN102
GND5
2NU3 VIDEO-IN2
4
21
8
AUDIO-IN28
SC2-IN
AUDIO-OUT2
6
7
SENSOR CBA
SENSOR CBA
ANT-INANT-OUT
CTL(-)1
CN504
MAIN CBA
A-COM4
CTL(+)2
AE-H6
AE-H/FE-H5
AUDIO-PB/REC3
FE-H2
CN501
FE-H GND1
CAPSTAN
MOTOR
CN502
M
C-F/R
P-ON+5V
1 AL+12V/+20.5V
2
3 C-FG
4
MOTOR
C-CONT5
DRIVE
GND
6
CIRCUIT
GND
D-PFG9
D-CONT8
LM-FWD/REV
7
10
P-ON+15V12
AL+12V(2)
11
CAPSTAN
MOTOR
CN253
VIDEO(R)1
VIDEO-COM2
3 VIDEO(L)
M
LOADING
MOTOR
AUDIO HEAD
CONTROL HEAD
ACE HEAD ASSEMBLY
(DECK ASSEMBLY)
AUDIO
ERASE HEAD
FULL
ERASE HEAD
FE HEAD
M
PG
SENSOR
CYLINDER ASSEMBLY
DRUM
MOTOR
VIDEO(R)
HEAD
VIDEO(L)
HEAD
HM210WI1-12-1
Page 34
IC PIN FUNCTION DESCRIPTIONS
IC501( SERVO / SYSTEM CONTROL IC )
“H” ≥ 4.5V, “L” ≤ 1.0V
Pin
IN/
No.
OUT
1INSC2-IN
Signal
Name
Function
Input Signal from Pin
8 of SCART2
Active
Level
A/D
Pin
IN/
No.
OUT
25
OUT
26
OUT REC-LED
27-NUNot Used-
Signal
Name
TIMERLED
Function
“TIMER” LED Signal
Output
“REC” LED Signal
Output
Active
Level
H
H
2IN
3INPOW-SAF
4INEND-S
5INAFC
6INV-ENV
7INKEY-1
8INKEY-2
9INLD-SW
10INST-S
11-NUNot Used-
12-NUNot Used13 OUT
14IN
15 OUT C-ROTA
16-NUNot Used-
17-NUNot Used18 OUT RF-SW
19-NUNot Used-
20-NUNot Used21-NUNot Used22-NUNot Used-
23 OUT
24
PGDELAY
D-VSYNC
REMOCON
-IN
POWERLED
OUT CAS-LED
Video Head Switching
Pulse Signal Adjusted
Voltage
P-ON Power
Detection Input Signal
Tape End Position
Detect Signal
Automatic Frequency
Control Signal
Video Envelope
Comparator Signal
Key Scan Input Signal
1
Key Scan Input Signal
2
Deck Mode Position
Detector Signal
Tape Start Position
Detector Signal
Dummy V-syn c
Output
Remote Control
Sensor
Color Phase Rotary
Changeover SIgnal
Video Head Switching
Pulse
“STANDBY” LED Signal Output
“T APE IN” LED Signal
Output
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
H/Hi-z
H/L
H/L
28-NUNot Used-
29 OUT
30 OUT
31IN
32INA-MODE
33 OUT D-REC-H
34INRESET
35INXcinSub Clock-
36 OUT XcoutSub Clock37-VccVcc38INXinMain Clock Inp ut39 OUT XoutMain Clock Inp ut40-VssVss(GND)41-NUNot Used-
L
H
H
42-NUNot Used43INCLKSELClock Select (GND)-
44INOSCin
45 OUT OSCout
46-NUNot Used-
47-LPLP48IN
49-OSDVssOSDVss50INOSD-V-IN
51-NUNot Used52 OUT
AUDIOSW-1
AUDIOSW-2
RECSAF-SW
FSC-IN
[4.43MHz]
OSD-VOUT
Audio IN/OUT
Control Signal
Audio IN/OUT
Control Signal
Recording Safety SW
Detect (With Record
tab="L"/With out
Record tab="H")
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
2L021
2L021
2B5
2L051
MAIN CBA
2L041
SENSOR CBA
2B46
2B8
2L031
2B7
2L041
2L099
2L021
1B1
A10
A3
A7
A21
1-15-2HM210CEX
Page 39
Packing
X36
S2
X20
X3
X2
X1
X4
S2
Some Ref. Numbers
are not in sequence.
S3
S9
Unit
S1
A14
1-15-3HM210PEX
Page 40
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTE: Parts that are not assigned part numbers
(---------) are not available.
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA
Consists of the following:
MAIN CBA (MCV-A)
JACK CBA (MCV -C)
SENSOR CBA
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA (MCV-A)
Consists of the following:
CAPACITORS
C002!METALIZED FILM CAP. 0.068µF/250V K orCT2E683DC011
!METALIZED FILM CAP. 0.068µF/250V K orCT2E683DC014
!METALIZED FILM CAP. 0.068µF/25 0V MCT2E683MS0 37C003!SAFTY CAP. 2200pF/250V orCCN2EMA0E222
!SAFETY CAP. 2200pF/250VCA2E222MR049
C004ELECTROLYTIC CAP . 33µF/400V MCE2HMZXJH330
C005CERAMIC CAP. B K 0.01µF/500VCCD2JKP0B103
C006CERAMIC CAP. SL K 56pF/1KV orCCD3AKPSL560
CERAMIC CAP. SL J 56pF/1KVCCD3AJPSL560
C007CERAMIC CAP.(AX) B K 1000pF/50VCCA1JKT0B102
C008CERAMIC CAP.(AX) X K 5600pF/16VCCA1CKT0X562
C010FILM CAP (P) 0.022µF/50V J orCMA1JJP00223
FILM CAP.(P) 0. 022 µF/50V J orCA1J223MS02 9
FILM CAP.(P) 0. 022 µF/100V JCMA2AJP0022 3
C011ELECTROLYTIC CAP . 10µF/ 16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C012ELECTROLYTIC CAP . 10µF/ 50V M H7 orCE1JMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/50V H7 CE1JMAVS M100
C014ELECTROLYTIC CAP . 470µF/ 35V M orCE1GMASDL471
ELECTROLYTIC CAP . 47 0µF/35V MCE1GMASTM471
C015ELECTROLYTIC CAP . 47µF/25V M H7 orCE1EMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/25V H7 CE1EMAVSM470
C017ELECTROLYTIC CAP . 470µF/ 16V M orCE1CMASDL471
ELECTROLYTIC CAP . 47 0µF/16V MCE1CMASTM471
C018ELECTROLYTIC CAP . 100µF/ 16V M orCE1CMASDL101
ELECTROLYTIC CAP . 10 0µF/16V MCE1CMASTM101
C020ELECTROLYTIC CAP . 1000µF/16V M orCE1CMASDL102
ALUMINUM ELECTROL YT IC CAP 1000µF/16V MCE1CMZPTM102
C021ELECTROLYTIC CAP . 470µF/ 10V M orCE1AMASDL471
ELECTROLYTIC CAP . 47 0µF/10V MCE1AMASTM471
C022ELECTROLYTIC CAP . 22µF/ 16V M H7 orCE1CMA VS L220
CAP ELE H7-85 22µF/16V H7CE1CMAVSM220
1VSA14612
----------
---------0VSA14893
----------
Ref. No.DescriptionPart No.
C025CHIP CERAMIC CAP. B K 8200pF/50VCHD1JK30B822
C026ELECTROLYTI C CAP. 47µF/16V M H7 orCE1CMA VS L470
ALUMINUM ELECTROLYTIC CAP 47µF/16V H7 CE1CMAVSM470
C053ELECTROLYTI C CAP. 220µF/6.3V M H7 orCE0KMASSL221
ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSM221
C056CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C057CHIP CERAMIC CAP.(1608) CH J 470pF/50VCHD1JJ3CH471
C151CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C152CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C154CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C155ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C156ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C157ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C158CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C159CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C251ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C252CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C253ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C254CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C302CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C303ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C304ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C305CHIP CERAMIC CAP. F Z 0.22µF/16VCHD1CZ30F224
C307CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C308CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C309CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C310CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C312CHIP CERAMIC CAP. B K 8200pF/50VCHD1JK30B822
C313CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C314CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C316CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C317ELECTROLYTI C CAP. 47µF/6.3V M H7 orCE0KMA VSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMAVSM470
C318ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C319ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C320CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C321CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C322ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
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Ref. No.DescriptionPart No.
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C323CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C324CHIP CERAMIC CAP .(1608) CH J 68pF/50VCHD1JJ3CH680
C325CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C326CHIP CERAMIC CAP .(1608) CH J 68pF/50VCHD1JJ3CH680
C327ELECTROLYTIC CAP . 0.47µF/50V M H7 orCE1JMA VS LR47
ALUMINUM ELECTROL YT IC CAP 0.47µF/50V H7CE1JMA VS MR47
C331CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C332CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C333ELECTROLYTIC CAP . 0.47µF/50V M H7 orCE1JMA VS LR47
ALUMINUM ELECTROL YT IC CAP 0.47µF/50V H7CE1JMA VS MR47
C334ELECTROLYTIC CAP . 4.7 µF/25V M NP H7CP1EMAVSB4R7
C335ELECTROLYTIC CAP . 10µF/ 16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C336CHIP CERAMIC CAP .(1608) CH J 1000pF/50V orCHD1JJ3CH102
CHIP CERAMIC CAP . CH J 1000pF/25VCHD1EJ3CH102
C337CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C338ELECTROLYTIC CAP . 100µF/ 6.3V H7 orCE0KMA V SL101
ALUMINUM ELECTROL YT IC CAP 100µF/6.3V H7CE0KMAVSM101
C339ELECTROLYTIC CAP . 1µF/ 50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C340CHIP CERAMIC CAP . CH J 120pF/50VCHD1JJ3CH121
C341CHIP CERAMIC CAP . CH J 220pF/50VCHD1JJ3CH221
C342ELECTROLYTIC CAP . 1µF/ 50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C343CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C345CHIP CERAMIC CAP .(1608) CH J 68pF/50VCHD1JJ3CH680
C346CHIP CERAMIC CAP .(1608) CH J 68pF/50VCHD1JJ3CH680
C347CHIP CERAMIC CAP .(1608) CH D 10pF/50VCHD1JD3CH100
C351ELECTROLYTIC CAP . 220µF/ 6.3V M H 7 orCE0KMAVSL221
ALUMINUM ELECTROL YT IC CAP 220µF/6.3V H7CE0KMAVSM221
C352ELECTROLYTIC CAP . 100µF/ 16V M H7 orCE1CMAVS L101
ALUMINUM ELECTROL YT IC CAP 100µF/16V H7CE1CMA VSM1 01
C401ELECTROLYTIC CAP . 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C402ELECTROLYTIC CAP . 220µF/ 6.3V M H7 orCE0KMASSL221
ELECTROLYTIC CAP . 22 0µF/6.3V M H7CE0KMASSM221
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404FILM CAP.(P) 0.018µF/50V J orCMA1JJP00183
FILM CAP.(P) 0. 018 µF/50V J orCA1J183MS02 9
FILM CAP.(P) 0. 018 µF/100V JCMA2AJP0018 3
C411CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C412CHIP CERAMIC CAP . B K 1800pF/50VCHD1JK30B182
C414CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C415ELECTROLYTIC CAP . 10µF/ 16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C416CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C417CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B22 3
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C418CHIP CERAMIC CAP .(1608) CH J 33pF/50VCHD1JJ3CH330
C419CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C421ELECTROLYTIC CAP . 33µF/6.3V M H7 orCE0KMAVSL330
ALUMINUM ELECTROL YT IC CAP 33µF/6.3V H7CE0KMAVSM330
C422ELECTROLYTIC CAP . 4.7 µF/25V M H7 orCE1EMAVSL4R7
Ref. No.DescriptionPart No.
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C423CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C424ELECTROLYTI C CAP. 22µF/6.3V M H7 orCE0KMA VSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMAVSM220
C425CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C426CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C427CHIP CERAMIC CAP. CH J 220pF/50VCHD1JJ3CH221
C428CHIP CERAMIC CAP.(1608) CH J 68pF/50VCHD1JJ3CH680
C429CHIP CERAMIC CAP.(1608) CH J 68pF/50VCHD1JJ3CH680
C430ELECTROLYTI C CAP. 47µF/6.3V M H7 orCE0KMA VSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMAVSM470
C501ELECTROLYTI C CAP. 220µF/6.3V M H7 orCE0KMAVSL221
ALUMINUM ELECTROLYTIC CAP 220µF/6.3V H7CE0KMAVSM221
C502CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C508ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C510ELECTROLYTI C CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/10V H7 CE1AMAVSM220
C511ELECTROLYTI C CAP. 100µF/6.3V H7 orCE0KMAVSL101
ALUMINUM ELECTROLYTIC CAP 100µF/6.3V H7CE0KMAVSM101
C512CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C513CHIP CERAMIC CAP.(1608) CH J 22pF/50VCHD1JJ3CH220
C514CHIP CERAMIC CAP.(1608) CH J 22pF/50VCHD1JJ3CH220
C515CHIP CERAMIC CAP. CH J 18pF/50VCHD1JJ3CH180
C516CHIP CERAMIC CAP. CH J 18pF/50VCHD1JJ3CH180
C517CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C518CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C519CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C520CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C521CHIP CERAMIC CAP. CH J 560pF/50VCHD1JJ3CH561
C522ELECTROLYTI C CAP. 22µF/6.3V M H7 orCE0KMASSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMASSM220
C523CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C524CHIP CERAMIC CAP. CH J 330pF/50VCHD1JJ3CH331
C526CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C527ELECTROLYTI C CAP. 22µF/6.3V M H7 orCE0KMASSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMASSM220
C528CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C530CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C531CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C532ELECTROLYTI C CAP. 22µF/6.3V M H7 orCE0KMASSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMASSM220
C533CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C535CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C538CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C563CHIP CERAMIC CAP. F Z 1µF/10V orCHD1AZB0F105
CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
C564CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C567CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C701CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C702CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
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Ref. No.DescriptionPart No.
C704CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C705CHIP CERAMIC CAP . CH J 56pF/50VCHD1JJ3CH560
C706CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C708CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C709ELECTROLYTIC CAP . 1µF/ 50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C710CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C715CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C851CHIP CERAMIC CAP .(1608) CH J 22pF/50VCHD1JJ3CH220
C852CHIP CERAMIC CAP .(1608) CH J 22pF/50VCHD1JJ3CH220
C853CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C854CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C855CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C856CHIP CERAMIC CAP . CH J 180pF/50VCHD1JJ3CH181
C859ELECTROLYTIC CAP . 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C862CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C102CHIP CERAMIC CAP .CHD1JK30B222
C104CHIP CERAMIC CAP .(1608)CHD1JJ3CH471
C105CHIP CERAMIC CAP .(1608) orCHD1JZ30F104
CHIP CERAMIC CAP . (1608)CHD1EZ30F104
C107ELECTROLYTIC CAP . 1µF/ 50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C108CHIP CERAMIC CAP .(1608)CHD1JK30B102
C109CHIP CERAMIC CAP .CHD1JK30B222
C112CHIP CERAMIC CAP .(1608)CHD1JJ3CH471
C113CHIP CERAMIC CAP .CHD1JK30B222
C115ELECTROLYTIC CAP . 100µF/ 16V M H7 orCE1CMAVS L101
ALUMINUM ELECTROL YT IC CAP 100µF/16V H7CE1CMA VSM1 01
----------
Ref. No.DescriptionPart No.
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM471
C117ELECTROLYTI C CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM471
DIODES
D101ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D102ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D103ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D104ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D105ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
COILS
L101BEAD CORE ASSEMBL Y HK47 PED1VSA12574
L102BEAD CORE ASSEMBL Y HK47 PED1VSA12574