Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop s lightly bel ow these spec s. Limit sp ecs rep resent the a bsolute wo rst con dition that still migh t
be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1HE450SP
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related charac teristics which are often not evident from visual inspection, nor can the protection they
give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special s afe ty c har ac te rist ic s ar e i den tified by a ! on schematics and in parts lists. Use of a
substitute replacement that does not have the same
safety characteristics as the recommended replacement part might create shock, fi re, and/or other hazards. The Product’s Safety is under review
continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory,
our products are carefully inspected to confirm with
the recognized prod uct safety and electrical codes of
the countries in whic h th ey are to be sold. However, in
order to maintain such comp lianc e, it is equ ally impor tant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spur ious rad iation. T hese m ust also be
replaced only with specified re pla ce men ts.
Examples: RF converters, RF c ables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wir es do n ot co ntact h eat pr od uc -
ing parts (heatsinks, oxide metal fil m re sisto rs, fus ible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord h as been repl aced, ch eck that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power tr ansformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent
shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to th e complete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, discon nect the AC plug from the
AC outlet.
1-2-1H8740SFP
Safety Check after Servicing
1
B
Z
2
Examine the area surrounding the repaired location for
damage or deterio ration. Observe that screws , parts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified cleara nce distanc e (d) and (d’) between sol dered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
T able 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
230 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure acr oss the ter minals of l oad
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
Fig.
Exposed Accessible Part
AC Voltmeter
(High Impedance)
One side of
Power Cord Plug Prongs
Fig.
T able 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
230 V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-2-2H8740SFP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
STANDARD NOTES FOR SERVICING
O
P
P
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Input
ut
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
In
in 1
c. The 1st pin of every male connector is indicated as
shown.
in 1
Bottom View
5
10
How to Remove / Install Flat Pac k-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of th e flat pack-IC is fixed with glue to the
CBA; when removing entire fl at pack-IC, fir st apply
soldering iron to center of the fla t pack-IC and hea t
up. Then remove (glue will be melted). (Fig . S-1-6)
(4) Releas e the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Instructions for Connectors
1. When you c onn ect o r di scon nec t the FF C (Fl exib le
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Caution:
1. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
2. The flat pack-I C on th e CB A i s a ffixed with g lue , so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
Machine
Flat Pack-IC
Fig. S-1-2
1-3-1NOTE_1
With Soldering Iron:
F
F
S
rp
or
n
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. Wh en you use solder flux
which is applied to all pins of the f lat pack-IC, you
can remove it easily. (Fig. S-1-3)
lat Pack-IC
Desoldering Braid
(4) Bottom of th e flat pack-IC is fixed with glue to the
CBA; when removing entire fl at pack-IC, fir st apply
soldering iron to center of the fla t pack-IC and hea t
up. Then remove (glue will be melted). (Fig . S-1-6)
(5) Releas e the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a sold ering iron, care must be taken
to ensure that the flat pack-IC is not being hel d by
glue. When the flat pack-IC is removed from the
CBA, handle it ge ntl y bec au se it may be damaged
if force is applied.
Soldering Iron
Hot Air Blower
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which sold er will
not adhere (iron wir e). When heating the pi ns , use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Iron Wire
Soldering Iron
To Solid
Mounting Point
Fig. S-1-5
Sha
Pin
ine Tip
oldering Iron
Fig. S-1-4
CBA
Fine Tip
Soldering Iro
(3)Bottom of the flat pack-IC is fix ed with glue to the
CBA; when removing enti re flat pack-IC, fi rst apply
soldering iron to c en ter o f th e f lat pack-I C an d h eat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Release the fla t pack-IC from the CBA us ing twee-
zers. (Fig. S-1-6)
Tweezers
Flat Pack-IC
With Iron Wire:
(1)Using desoldering braid, remove the solder from all
Fig. S-1-6
pins of the flat pack-IC. Wh en you use solder flux
which is applied to all pins of the f lat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solde r
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
1-3-2NOTE_1
2. Installation
P
i
d
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replac ement flat pack-IC more
easily.
(2)The “ I ” mark on the flat pack-IC in dicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when position ing for installation. Then
presolder the four corne rs of th e fla t pack-IC. (See
Fig. S-1-8.)
(3)Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Example :
in 1 of the Flat Pack-IC
s indicated by a " " mark.
Fig. S-1-7
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a po tential difference ca used by electr ostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a gr oundin g band (1MΩ) that is properly grounded to re move any static electricity th at may
be charged on the body.
2. Ground for Workbench
Be sure to place a c onductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electri city charge on clothing will not escape through the body grounding band ,
be careful to avoid contacting semi-conductors with
your clothing.
< Incorrect >
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
CBA
< Correct >
Grounding Ban
1MΩ
CBA
1MΩ
Conductive Sheet or
Copper Plate
1-3-3NOTE_1
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the D eck Mechanis m Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Ass embly. Make sure the power
is on, connect TP507 (SENSOR INHIBITION) to GND.
This will stop the functio n of Tape Start Sensor, Tape
End Sensor and Reel Sensors . (If these TPs are connected before plugging in the unit, the function of the
sensors will stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape all the way to the start or the end of the
tape to avoid tape damage.
Q505
Q504
TP507
S-INH
Fig. 1
1-4-1HE470PFS
CABINET DISASSEMBLY INSTRUCTIONS
)
1. Disassembly Flowchart
This flowchart indicates the disassem bly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Case
[2] Front Assembly
[3] VCR Chassis Unit
[4] Jack CBA
[5] Deck Assembly
[6] Main CBA
[7] Cylinder Shield
[8] Jack Board
2. Disassembly Method
REMOVAL
ID/
LOC.
No.
[1]Top Case17(S-1)-
PART
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
Note
(1): Identification (location) No. of parts in the figures
(2):Name of the part
(3):Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5):Refer to “Reference Notes.”
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1. Remove five Screws (S-2), three Screws (S-3) and
Screw (S-4). Then, slowly lift the VCR Chassis Unit
(Deck Assembly, Jack CBA and Main CBA) up.
2. When reassembling, solder wire jumpers as shown
in Fig. 5.
3. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CBA as sho wn in
Fig. 6. Then, install the Deck Assembly while aligning the hole of Cam Gear with the pin of LD-SW,
the shaft of Cam Gear with the hole of LD-SW as
shown in Fig. 6.
(S-1)
(S-1)
Front
[2]
Assembly
VCR
[3]
Chassis
Unit
[4]Jack CBA4Desolder, (S-5)-
Deck
[5]
Assembly
[6]Main CBA5*(L-3)-
Cylinder
[7]
Shield
Jack
[8]
Board
↓
(1)
↓
(2)
2*3(L-1),*4(L-2)-
35(S-2), 3(S-3), (S-4), 1
5,62(S-6), Desolder2,3
52(S-7)-
5-----------
↓
(3)
↓
(4)
[1] T op Case
↓
(5)
1-5-1HE450DC
(S-1
Fig. 1
(L-2)
(S-5)
[4] Jack CBA
Desolder
[2] Front
Assembly
(S-2)
(S-3)
[3]VCR
Chassis
Unit
(L-1)
(S-2)
(S-3)
(L-2)
Fig. 4
Fig. 2
(S-2)
(S-4)
(S-3)
(S-2)
Fig. 3
1-5-2HE450DC
[7] Cylinder Shield
FE Head
Cylinder Assembly
(S-7)
Pin
[8] Jack Board
(L-3)
From
FE Head
From
Cylinder
Assembly
(S-6)
TOP VIEW
From
AC Head
Assembly
AC Head
Assembly
[5] Deck Assembly
[6] Main CBA
(S-6)
From
Capstan Motor
Assembly
Lead with
blue stripe
[6] Main CBA
[5] Deck Assembly
Shaft
Hole
LD-SW
SW507
LD-SW
Cam Gear
Hole
Pin
[6] Main CBA
Fig. 6
Printing
Lead with
blue stripe
Lead connections of Deck Assembly and Main CBA
Lead with
blue stripe
Desolder
from bottom
side
Fig. 5
1-5-3HE450DC
ELECTRICAL ADJUSTMENT INSTRUCTIONS
e
2
)
C
C
c
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electrical adjus tments are required after replacing
circuit components a nd certain mechanical parts.
It is important to do these a djustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these a lignment / confirmation procedures, make sure that the tracki ng co ntrol is set in
the center position: P ress eith er "L5??" or "K" button
on the remote control unit first, then the "PLAY"
button (Front Panel only).
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching point during
playback.
Symptom of Misadjustment:
May cause Head Switching noise or ver tical jitter
in the picture.
Test pointAdj.PointModeInput
J23(V-OUT)
TP502(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
J23
GND
TP502
PLAY
(SP)
6.5H±1H
(412.7µs±60µs)
Oscilloscop
-----
Spec.
CH1 CH
Trig. (+
Figure 1
EXT. Syncronize Trigger Point
H1
H2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edg e of the CH1 video output waveform is at the 6.5H(412.7µs) delaye d p os ition fr om the
rising edge of the CH2 head switching pulse waveform.
1.0H
6.5H
Switching Pulse
0.5H
V-Syn
1-6-1HE240EA
Servo/System Control Block Diagram
BLOCK DIAGRAMS
Q504
ST-S
SENSOR CBA
Q505
END-S
SENSOR CBA
(DECK ASSEMBLY)
AC HEAD ASSEMBLY
CONTROL
HEAD
CL287
55CTL(+)
66CTL(-)
CL504
MAIN CBA
END-S
SW507
LD-SW
Q503
T-REEL
AL+5V
PS503TP505
S-REEL
D502
S-LED
TIMER+5V
AL+5V
Q501
RESET
RS501
REMOTE
SENSOR
SW508
RESET
IC501
(SERVO/SYSTEM CONTROL)
REMOCON-IN
14
LD-SW9
95
CTL(+)
CTL(-)
94
10
ST-S
4
END-S
T-REEL
80
S-REEL79
RESET
34
KEY- 1
KEY- 2
DRV-DATA
DRV-STB
DRV-CLK
68
69
70
7
8
KEY
SWITCH
IC561
(FIP DRIVE)
DRV-DATA
28
DRV-STB
2
DRV-CLK
1
TP507
SENS-INH
KEY
SWITCH
S10
G1
G2
G3
G4
S1
S2
S7
S8
S9
23
22
21
20
13
14
16
17
FP562
LED CLOCK
7
8
TU701(TUNER UNIT)
SDA
3
SDA
12
SCL
5
SCL
11
IC503 (MEMORY)
SDA
5
SCL
6
CYLINDER ASSEMBLYCAPSTAN MOTOR
PG
DRUM
MOTOR
SENSOR
M
LOADING
MOTOR
M
CAPSTAN
MOTOR
M
VR501
SW-POINT
CL502
12 P-ON+15V
11
AL+12V(2)
10 GND
D-PG
9
D-CONT
8
LM-FWD/REV
7
GND
6
C-CONT
5
C-F/R
4
C-FG
3
P-ON+5V
2
AL+12V/+20.5V
1
AL+5V
FROM/TO
POWER
SUPPLY
BLOCK
AL+5V
SW506
REC-SAFETY
P-ON+15V
AL+12V
P-ON+5V
AL+12V/+20.5V
C-POW-SW
P-ON-H
P-DOWN-L
PG-DELAY
2
REC-SAF-SW
31
D-PG
90
D-CONT77
LM-FWD/REV
81
C-CONT
76
C-F/R
78
C-FG
87
C-POW-SW
66
P-ON-H
67
P-DOWN-L
86
A-MUTE-H
Hi-Fi-H-SW
A-MODE
LINE-MUTE
IIC-BUS SDA
IIC-BUS SCL
D-REC-H
RF-SW
C-ROTA
D-V SYNC
H-A-SW
H-A-COMP
V-ENV
C-SYNC
83
19
32
28
72
71
33
18
15
13
16
17
58
IIC-BUS SDA
IIC-BUS SCL
A-MUTE-H
IIC-BUS SDA
IIC-BUS SCL
Hi-Fi-H-SW
A-MODE
LINE-MUTE
IIC-BUS SDA
IIC-BUS SCL
D-REC-H
RF-SW
C-ROTA
D-V SYNC
H-A-SW
H-A-COMP
6
V-ENV
C-SYNC
TO
AUDIO BLOCK
FROM/TO
Hi-Fi AUDIO
BLOCK
FROM/TO
VIDEO BLOCK
1-7-11-7-2HE4F0BLS
Video Block Diagram
MAIN CBA
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
V-OUT1
V-IN1
SERVO/SYSTEM
CONTROL BLOCK
JACK CBA
JK101
Q101
19
20
BUFFER
TU701
TU-VIDEO
JK756
V-IN-F
CL101
1
33
VIDEO
V-OUT1
V-IN1
V-IN1TO
TU-VIDEO
6
24
CL151
1
Q351
BUFFER
WF1
J23
V-OUT
IC501 (OSD)
OSD
52
CHARACTER
MIX
IC301
(Y/C SIGNAL PROCESS)
48
50
52
54
56
61
63
TUNER
PB/EE
TUNER
IN1
PB/EE
MUTE
IN1
IN2
FRT
IN2
FRT
MUTE
COLOR
-IN
FROM
SERVO/SYSTEM
CONTROL BLOCK
50
55
65
BYPASS
CHARA.
INS.
FBC
AGCVXO
AGC
PR
Y. DELAY
1/2
IIC-BUS SDA
IIC-BUS SCL
LUMINANCE
SIGNAL
PROCESS
CCD 1H DELAY
CHROMINANCE
SIGNAL
PROCESS
Y/C
MIX
69684643
SERIAL
DECORDER
7978
R
Y
+
C
RP RP
P
REC FM
AGC
SP
SP
HEAD
AMP
EP
EP
HEAD
AMP
D-REC-H
C-ROTA/RF-SW
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
C-SYNC
96
95
93
94
90
89
88
87
80
70
62
71
83
84
67
V-COM
V-COM
WF1
TP502
RF-SW
CL253
V(R)-1
V(L)-1
V(L)-2
V(R)-2
D-REC-H
RF-SW
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
C-SYNC
(DECK ASSEMBLY)
CYLINDER ASSEMBLY
1
2
3
4
5
6
FROM/TO SERVO/SYSTEM
CONTROL BLOCK
VIDEO (R)-1
HEAD
VIDEO (L)-1
HEAD
VIDEO (L)-2
HEAD
VIDEO (R)-2
HEAD
V-OUT2
V-IN2
JK102
19
20
Q102
BUFFER
CL102
1
V-OUT2
V-IN23
3
CL152
1
5859
2928
X301
4.433619MHz
21
TP301
C-PB
WF2
1-7-31-7-4HE4F0BLV
Audio Block Diagram
PB-AUDIO SIGNALREC-AUDIO SIGNALMode : SP/REC
MAIN CBA
TO Hi-Fi
AUDIO BLOCK
(DECK ASSEMBLY)
ACE HEAD ASSEMBLY
AUDIO
HEAD
AUDIO
ERASE
HEAD
N-A-PB
N-A-REC
CL287
A-PB/REC4
A-COM3
AE-H1
AE-H/FE-H2
CL504
4 A-PB/REC
3 A-COM
1 AE-H
2 AE-H/FE-H
Q401
Q402
BIAS
OSC
+5V
Q406
IC301
(AUDIO SIGNAL PROCESS)151317
TUNERIN2
INV
R
98
ATT
P
REC
AMP
5
6
1
2
PB-ON
EQ
AMP
SP/LP-ON
AUTO
BIAS
7
3
100
IN1
ALC
DET
ALC
LINE
AMP
REC-ON
MUTE
12
11
FULL
ERASE
HEAD
FE HEAD
SERIAL
DECODER
68 69
71
A-MUTE-H
IIC-BUS SDA
IIC-BUS SCL
TO SERVO/SYSTEM
CONTROL BLOCK
CL501
2 FE-H
1 FE-H-GND
Q405
(PB=ON)
Q403
SWITCHING
D-REC-OFF
+5V
AUDIO HD-SW
CONTROL
16
1-7-51-7-6HE4F0BLA
Hi-Fi Audio Block Diagram
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
A-IN1(R)
A-IN1(L)
A-OUT1(R)
A-OUT1(L)
A-IN2(R)
A-IN2(L)
A-OUT2(R)
A-OUT2(L)
JACK CBA
JK101
2
6
1
3
JK102
2
6
1
3
CL101
CL102
10
A-IN1(R)
A-IN1(L)8
8
6
A-OUT1(R)
A-OUT1(L) 12
12
9
A-IN2(R)
A-IN2(L)8
8
6
A-OUT2(R)
A-OUT2(L) 11
11
10
6
9
6
CL151
CL152
67
65
(Hi-Fi AUDIO SIGNAL PROCESS)
IC451
SW
SW
ALC
ALC
ALC
MAIN CBA
CN701CN1
4
TU-AUDIO(R)
TU-AUDIO(L)
5
4
5
AFV CBA
IF SIGNAL
PROCESS
OUTPUT
SELECT
CN1
SIF
CN701
2
MUTE-ON
VCOMUTE
MUTE-ON
73
74
72
76
77
75
CL509
2
A-OUT1(L)
1
A-OUT1(R)
JK751
SUB JACK CBA
TU701
22
SIF
2
AUDIO
A-OUT
(L)
A-OUT
(R)
JK758
A-IN(R)-F
JK757
A-IN(L)-F
TO AUDIO BLOCK
N-A-REC
N-A-PB
52
56
54
50
60
10
78
80
62
70
6171
47
R-CH
INSEL
2
6
L-CH
8
4
INSEL
+
48
14
15
ALC
R-CH
PNR
L-CH
PNR
P
R
R
P
SW
NOISE
LIMDEV
LIMDEV
SW
NOISE
DO
DET
R-CH
BPF
NOISE
DET
HOLD
PULSE
L-CH
BPF
COMP
VCO
LPF
MIXV/I
LPF
VCO
COMP
LIM
ENV
DET
34 33
LOGIC
LINE-MUTE
R
L
37
38
Q451
21
53
39
24
26
27
IIC-BUS SDA
IIC-BUS SCL
A-MODE
LINE-MUTE
Hi-Fi-H-SW
CL253
Hi-Fi-A(R)9
Hi-Fi-COM 8
Hi-Fi-A(L)7
FROM/TO SYSTEM
CONTROL BLOCK
CYLINDER
ASSEMBLY
Hi-Fi
AUDIO
(R) HEAD
Hi-Fi
AUDIO
(L) HEAD
1-7-71-7-8
HE4F0BLH
Power Supply Block Diagram
AC001
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
HOT CIRCUIT. BE CAREFUL.
F001
T1.6A L 250V
L003
LINE
FILTER
D001 - D004
BRIDGE
RECTIFIER
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
T001
Q051
2
4
Q001
12
Q052
13
Q057
14
Q058
15
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
The following symb ol s wil l appear on the indica tor panel to ind ic ate the c urre nt m ode or o per at ion of the VCR .
On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
Display panel
" H "= LED Light on, " L "= LED Light off
LED MODEINDICATOR ACTIVE
CASSETTE "IN"
CASSETTE "OUT"
CLOCK" 88:88ON
POWER ON" PWR."ON
REC" REC "ON
REC PAUSE" REC "Blinks at 0.8Hz interval
T-REC,OTR
When reel and capstan mechanism is not
functioning correctly
When tape loading mechanism is not functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safety detection
" "
" "
" "
" "
" 1 "
" "
" 2 "
" "
" 3 "
" "
" 4 "
" "
" 5 "
ON
OFF
ON
(T-REC OFF,T-REC incomplete
Blinks at 0.8Hz interval)
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
S-INH conditionAll modesBlinks at 0.8Hz interval
1-7-11HE450FIS
(
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot nece ssar ily b e ob tai ned by us ing repl ac ement components rated for higher voltage, wattage,
etc. Replacement parts that have th ese spe cial safety
characteristics are identified in this manual and its
supplements; electrical comp onents having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual
carefully. The use of substitute replacement parts that
do not have the same s afety character istics as specified in the parts list may create shock, fire, or other
hazards.
Capacitor Temperature Markings
Mark
Capacity
change rate
Standard
temperature
Temperature
range
Notes:
1. Do not use the part n umber shown on thes e drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless o therwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identi fied by fou r digits. The fir st two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
(B)
(F)+30 - 80%20°C-25~+85°C
(SR)
(Z)+30 - 80%20°C-10~+70°C
Capacitors and transistors are represented by the following symbols.
±10%
±15%
CBA Symbols
(Top View) (Bottom View)
Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
20°C-25~+85°C
20°C-25~+85°C
Schematic Diagram Symbols
Digital Transistor
+
Electrolytic Capacitor
(Top View)
E C B
(Top View)
E C B
NPN Transistor
NPN Digital Transistor
PNP Transistor
E C B
(Top View)
PNP Digital
Transistor
E C B
1-8-1SCPA1
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
1
".
".
3
2
1
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supp ly. Otherwise it may c ause some components in the
power supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only origina l replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Wire Connectors
(1) Prefix symbol "CN" means "connector" (can disconnect and reconnect).
(2) Prefix symbol "CL" means "wire-solder holes of the PCB" (wire is soldered directly).
5. Mode: SP/REC
6. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
7. How to read converged lines
-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3
2. "1-B1" means that line number "1" goes to area "B1
8. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
5.0
231
5.0
PLAY mode
REC mode
(2.5)
Indicates that the voltage
is not consistent here.
AREA D3
1-B1
AREA B1
1-D3
ABCD
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-8-2SCRK05
Main 1/6 Schematic Diagram
1-8-3
1-8-4
HE4F0SCM1
Main 2/6 & Sensor Schematic Diagram
1-8-5
1-8-6
HE4F0SCM2
Main 3/6 Schematic Diagram
1-8-7
1-8-8
HE4F0SCM3
Main 4/6 & Jack Schematic Diagram
1-8-9
1-8-10
HE4F0SCM4
Main 5/6 Schematic Diagram
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
1-8-11
1-8-12
HE4F0SCM5
Main 6/6 Schematic Diagram
1-8-131-8-14
HE4F0SCM6
AFV Schematic Diagram
1-8-15
1-8-16
HE4F0SCAFV
Main CBA Top View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Sensor CBA Top View
BHB300F01014-A
BHB300F01014-B
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
WF1
J23
V-OUT
VR501
SW-P
WF2
TP502
RF-SW
1-8-17
1-8-18
TP507
S-INH
TP501
CTL
WF3
TP301
C-PB
BHE470F01013-A
Main CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
1-8-19
1-8-20
BHE470F01013-A
Jack CBA Top View
Jack CBA Bottom View
BHE470F01013-C
1-8-21
1-8-22
Sub Jack CBA Top View
Sub Jack CBA Bottom View
BHE470F01013-B
AFV CBA Top View
AFV CBA Bottom View
BHC400F01091
1-8-231-8-24
WAVEFORMS
WF2
UPPER
(TP301 of Main CBA)
WF1
LOWER
(TP502 of Main CBA)
C-PB 10mV x 10
RF-SW 0.5V x 10
5msec
WF3
UPPER
(J23 of Main CBA)
WF1
LOWER
(TP502 of Main CBA)
V-OUT 0.1V x 10
RF-SW 0.5V x 10
50usec
WF3
(J23 of Main CBA)
V-OUT E-E
10usec 50mV x 10
1-9-1U27WFPAL
WIRING DIAGRAM
FRONT
AC CORD
(DECK ASSEMBLY)
AC HEAD ASSEMBLY
AUDIO
ERASE HEAD
AUDIO HEAD
CONTROL HEAD
FE HEAD
FULL
ERASE HEAD
CYLINDER ASSEMBLY
PG
SENSOR
DRUM
MOTOR
M
VIDEO
(R)1
HEAD
MOTOR
CL287
AE-H
AE-H/FE-H
A-COM
A-PB/REC
CTL(+)
CTL(-)
VIDEOINAUDIO
IN (R)
SENSOR CBA
(BHB300F01014)
SENSOR CBA
(BHB300F01014)
CL504
1
2
3
4
5
6
CAPSTAN MOTOR
MLOADING
M
CAPSTAN
MOTOR
AE-H
1
AE-H/FE-H2
A-COM3
A-PB/REC4
CTL(+)5
6
CTL(-)
CL501
FE-H2
FE-H GND1
CL502
1 AL+12V/+20.5V
P-ON+5V
2
3 C-FG
4
C-F/R
C-CONT5
GND
6
LM-FWD/REV
7
D-CONT8
D-PG9
GND
10
AL+12V(2)
11
P-ON+15V12
AUDIO
IN (L)
MAIN CBA
(BHE470F01013A)
ANT-INANT-OUT
CN701CN1
1 NU
SIF
2
3 GND
4
TU-AUDIO(R)
TU-AUDIO(L)5
P-ON+5V
6
P-ON+5V
7
IIC-BUS SCL8
IIC-BUS SDA9
CL151CL101
1 V-OUT1
GND
2
3 V-IN1
4
AL+12V(1)
NU5
A-OUT1(R)
6
JK1-8P-OUT
7
A-IN1(L)8
NU9
A-IN1(R)
10
GND
11
A-OUT1(L)12
CL152CL102
1 V-OUT2
GND
2
3 V-IN2
4
NU
GND5
A-OUT2(R)
6
SC2-IN
7
A-IN2(L)8
A-IN2(R)9
GND
10
A-OUT2(L)
11
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
6
7
8
9
10
11
AFV CBA
(BHC400F01091)
JACK CBA
(BHE470F01013C)
JK101,102
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
VIDEO
(L)1
HEAD
VIDEO
(L)2
HEAD
VIDEO
(R)2
HEAD
Hi-Fi AUDIO
(L) HEAD
Hi-Fi AUDIO
(R) HEAD
CL253
V(R)-11
V-COM2
3 V(L)-1
V(L)-2
4
V-COM5
V(R)-26
Hi-Fi-A(L)7
Hi-Fi-COM8
Hi-Fi-A(R)9
A-OUT1(R)
A-OUT1(L)
GND
CL509
1
SUB JACK CBA
2
(BHE470F01013B)
3
HE4F0WI1-10-11-10-2
AUDIO
OUT(R)
AUDIO
OUT(L)
IC PIN FUNCTION DESCRIPTIONS
IC501( SERVO / SYSTEM CONTROL IC )
“H” ≥ 4.5V, “L” ≤ 1.0V
Pin
IN/
No.
OUT
1IN
2IN
3IN
4IN
5IN
6IN
7IN
8IN
9IN
10 OUT
11-
1213 OUT
14IN
15 OUT
OUT
16
IN
17
18 OUT
19 OUT
-
20
IN
212223-
Signal
Name
SC2-IN
PG-DELAY
POW-SAF
END-S
AFC
V-ENV
KEY-1
KEY-2
LD-SW
ST-S
N.U.Not Used
N.U.Not Used
D-V- SYNC
REMOCON-INRemote
C-ROTA
H-A-SW
H-A-COMP
RF-SW
HiFi-H-SW
N.U.Not Used
DAVN-L
N.U.Not Used
N.U.Not Used
N.U.Not Used
Function
Input Signal from
Pin 8 of SCART2
Video Head
Switching Pulse
Signal Adjusted
Voltage
P-ON Power
Detection Input
Signal
Tape End Position
Detect Signal
Automatic
Frequency Control
Signal
Video Envelope
Comparator Signal
Key Scan Input
Signal 1
Key Scan Input
Signal 2
Deck Mode Positio n
Detector Signal
Tape Start Position
Detector Signal
Dummy V-sync
Output
Control Sensor
Color Phase Rotary
Changeover SIgnal
Video Head Amp
Switching Pulse
Head Amp
Comparator Signal
Video Head
Switching Pulse
HiFi Audio Head
Switching Pulse
VPS/PDC Data
Receive = “L”
Active
Level
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
H/Hi-
H/L
H/L
H/L
H/L
H/L
Pin
IN/
No.
OUT
242526-
27 OUT
28 OUT
29-
30-
31IN
32IN
33 OUT
34IN
35IN
36 OUT
3738IN
-
-
z
L
-
L
-
-
-
39 OUT
40414243IN
44IN
45 OUT
46-
4748IN
4950IN
5152 OUT
53-
Signal
Name
N.U.Not Used
N.U.Not Used
N.U.Not Used
RGBTHROUGH
LINE MUTE
N.U.Not Used
N.U.Not Used
REC-SAF-SW
A-MODE
D-REC-H
RESET
XC-INSub Clock
XC-OUTSub Clock
VccVcc
X-INMain Clock Input
X-OUTMain Clock Input
VssVss(GND)
N.U.Not Used
N.U.Not Used
CLKSELClock Select (GND)
IN
OSC
OUT
OSC
NUBNot Used
LPLP
FSC-IN
[4.43MHz]
OSDVssOSDVss
OSD-V-IN
N.U.Not Used
OSD-V-OUT
OSDVccOSDVcc
Function
SCART 2 RGB
Through Control
Signal
Audio Mute Control
Signal
Recording Safety
SW Detect (With
Record tab="L" /With
out Record tab="H")
Hi-Fi T ape Detection
Signal
Delayed Record
Signal
System Reset
Signal (Reset=”L”)
Clock Input
for letter size
Clock Output for
letter size
4.43MHz Clock
Input
OSD Video Signal
Input
OSD Video Signal
Output
Active
Level
-
-
-
H/L
L
-
-
H
L
L
L
-
-
-
-
-
-
-
-
L
-
-
-
-
-
-
L
-
L
-
1-11-1HE4F0PIN
Pin
IN/
No.
OUT
5455-
5657-
58IN
59 OUT
606162636465-
66 OUT
67IN
68 OUT
69 OUT
70 OUT
71 OUT
IN/
72
OUT
73 OUT
7475-
76 OUT
77 OUT
78 OUT
79IN
80IN
81 OUT
82-
Signal
Name
HLF
Function
LPF Connected
Terminal (Slicer)
N.U.Not Used
N.U.Not Used
N.U.Not Used
C-SYNC
Composite
Synchronized Pulse
SCART 1 8Pin
8POUT-1
Output Control
Signal
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
C-POWER-SWCapstan Power
Switching Signal
P-ON-H
DRV-DATA
DRV-STB
DRV-CLK
IIC BUS- SCL
IIC BUS- SDA
Power On Signal at
High
LED Clock Driver IC
Control Data
LED Clock Driver IC
Chip Select Signal
LED Clock Driver IC
Control Clock
2
C BUS Control
I
Clock
2
I
C BUS Control
Data
P-OFF-HPower Off at High
N.U.Not Used
N.U.Not Used
C-CONT
D-CONT
Capstan Motor
Control Signal
Drum Motor Control
Signal
Capstan Motor
C-F/R
FWD/REV Control
Signal (FWD=”L”/
REV=”H”)
S-REEL
T-REEL
LM-FWD/REV
Supply Reel
Rotation Signal
Take Up Reel
Rotation Signal
Loading Motor
Control Signal
N.U.Not Used
Active
Level
-
-
-
-
PUL
SE
H/L
-
-
-
-
-
-
H/L
H
H/L
H/L
H/L
H/L
H/L
L
-
-
PWM
PWM
H/L
PUL
SE
PUL
SE
H/L/
Hi-z
-
IN/
Pin
OUT
No.
83 OUT
Signal
Name
A-MUTE-H
Audio Mute Control
Signal (Mute = “H”)
CTL Frequency
84
OUT
FF/REW-L
Characteristics
Switching Signal
(FF/REW=”L”)
85-
N.U.Not Used
Power Voltage
86IN
P-DOWN-L
Down Detector
Signal
Capstan Motor
87IN
C-FG
Rotation Detection
Pulse
8889-
N.U.Not Used
N.U.Not Used
Drum Motor Phase/
90IN
D-PFG
Frequency
Generator
9192-
9394 OUT
95 OUT
96-
9798-
AMPVREF
OUT
AMPVREF
V-Ref for CTL AMP
INV-Ref for CTL AMP
P80/CP80/C Terminal
CTL -
CTL +
AMPC
CTLAMPout
Playback/Record
Control Signal (-)
Playback/Record
Control Signal (+)
CTL AMP
Connected Terminal
To Monitor for CTL
AMP Output
AMPVccAMPVcc
A/D Converter
99-
AVcc
Power Input/
Standard
Voltage Input
100 IN
AGC
Tuner IF Output
Signal
Notes:
Abbreviation for Active Level:
PWM -----Pulse Wide Modulation
A/D--------Analog - Digital Converter
1.Clean all parts for the tape tr ansport (Upp er Drum with Video Head / Pinch Roll er / Audio Control Head / Full
Erase Head) using 90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording Model only
M Brake (TU) Assembly (HI)
LDG Belt
II
II
2-1-1U27MENHS
Cleaning
V
d
Cleaning of Video Head
Clean the head with a head cleanin g stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few d rops of 90% Isopropyl alcohol o n the
head cleaning stick or on the chamois cloth and,
by slightly pressi ng it a gai ns t th e he ad tip , tur n the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it i s very thin, avoid clea ning it
vertically.
2.Wait for the cleaned part to dry thorough ly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of Audio Control Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% is opropyl alcohol and
clean the audio control head. Be careful not to
damage the upper drum and other tape running
parts.
Notes:
1.Avoid cleaning the audio control head vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit or damage may occur.
ACE Hea
Upper
Cylinder
Do Not !
ideo Head
Cleaning Stick
2-1-2U27MENHS
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-2
J-4
J-5
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of Audio Control Head
J-1-2Alignment TapeFL6N8
(1 speed only)
FL6NS8
(2 speed only)
J-2Guide Roller Adj.Screwdr i ve rAvailable
Locally
J-3MirrorAvailable
Locally
J-4Azimuth Adj.Screwdriver +Available
Locally
J-5X Value Adj.Screwdriver -Available
Locally
2-2-1U25PFIX
Azimuth and X Value Adjustment of Audio Control
Head / Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
A/C Head Height
X Value
MECHANICAL ALIGNMENT PROCEDURES
k
Explanation of alignme nt for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets stuck , for example, in the
mechanism due to some electrical trouble of the unit.
Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Insert a cassette tape. Though the tape will not be
automatically loaded, make sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, lightly push the cassette
tape further in and see if the tape c omes bac k out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 f or a minute or two to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure t hat the Moving gui de preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 until the Moving guide preparations come to the Eject Position. Stop turning when
the preparations begin clicking or can not be
moved further. However, the tape will be left wound
around the cylinder.
5. Turn the LDG Belt in t he app ropriat e dir ection c ontinuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place the Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 . Rel eas e the lo ck in g tabs s hown
in Fig. M1 and contin ue turning the LDG Belt un til
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unloc
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1U27PMAPC
F
1.Tape Interchangeability Alignment
Note:
To do these alignmen t proc edu re s, mak e sur e that the
Tracking Control Circuit is set to the center position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
lowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Not good
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (pg. 2-3-3)
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
Adjust the X Value for maximum envelope.
(pg. 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (pg. 2-3-4)
Check the envelope.
OK
Adjust the Audio Section.
(Azimuth Alignment) (pg. 2-3-4)
1-A
1-A
1-B
1-C
1-C
1-D
Not good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Completion
1-A
Check the audio output.
OK
Check the following:
1. X Value (pg. 2-3-3)
2. Envelope (pg. 2-3-4)
OK
1-D
1-B, 1-C
Not good
Not good
2-3-2U27PMAPC
Adjust the X value and envelope.
1-B, 1-C
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this proce-
dure. If the unit is not correctl y aligned, the tape may
be damaged.
1. Playback a blank cassette tape and check to s ee
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the le ad surface. (Refer to Fig. M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the to p of Guide Rollers [2] and
[3] with a Guide Roller Adj. Screwdrive r. (Refer to
Fig. M3 and M5.)
Guide Roller [2]
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Guide Roller [3]
B
Tape
Incorrect
ACE Head
Fig. M3
Fig. M4
3. Check to se e tha t the tape r uns wi thou t cr ea si ng a t
Take-up Guide Post [4] or without snaking between
Guide Roller [3] and AC Head. (Fig. M3 and M5)
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the AC Head. (Fig. M6)
Azimuth Adj. Screw
AC Head
X-Value Adj.
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To align the Horizontal Position of the Audio/Co ntrol/
Erase Head.
Symptom of Misalignment:
If the Horizontal Position of the Audio/Control/Erase
Head is not proper ly a ligned , m ax imu m e nv el ope ca nnot be obtained at the Neutral position of the Tracking
Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) and
TP501 (CTL) on the Main CBA. Use TP502 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6NS8) and confirm that the PB FM signal is
present.
3. Set the Tracking Control Circ uit to the center position by pressing CH UP button then “ PLAY ” button
on the unit. (Refer to note on bottom of page
2-3-4.)
4. Use the X-Value Adj. Screwdriver so that the PB
FM signal at TP301 (C-PB) is maximum. (Fig. M6)
5. Press CH UP button on the unit until the CTL waveform has shifted by approx. +2msec. Make sure
that the envelope is simply attenuated (shrinks in
height) during this process so that you will know the
envelope has been at its peak.
Tape
Take-up Guide
Post
Fig. M5
2-3-3U27PMAPC
6. Press CH DOWN button on the unit until the CTL
waveform has shifted from its origi nal position (not
the position achie ved in step 5, b ut the position of
CTL waveform in step 4) by approximately -2msec.
Make sure that th e envelope is simply attenuated
(shrinks in heigh t) once CTL waveform passes its
original position and is fur ther bro ught in the minu s
direction.
7. Set the Tracking Co ntrol Circuit to the ce nter posi tion by pressing CH UP button and then “ PLAY ”
button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture and precise tracking.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracki ng will then lose precision and the
playback picture w ill be distorted by any sligh t variation of the Tracking Control Circuit.
1. Connect the osci lloscope to TP301 (C-PB) on the
Main CBA. Use TP502 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6NS8). Set the Tracking Control Circuit to the
center position by pressing CH UP b utton and then
“ PLAY ” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscill oscope di splay so that the enve lope becomes as flat as possible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelo pe is as shown in Fig. M7, ad just the
height of Guide Ro ll er [2] (Re fer to Fig. M3) s o that
the waveform looks like the one shown in Fig. M9.
4. If the envelo pe is as shown in Fig. M8, ad just the
height of Guide Ro ll er [3] (Re fer to Fig. M3) s o that
the waveform looks like the one shown in Fig. M9.
5. When Guide R ollers [2] and [3] (Refer to Fig.M3)
are aligned properly, there is no envelope drop
either at the beginning or end of track as shown in
Fig. M9.
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushin g the CH UP or DOWN buttons al ternately, to check the symmetry of the envelope. Check
the number of pushe s to ensure cente r position. The
number of pushes CH UP button to achieve 1/2 level of
envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
1-D. Azimuth Alignment of Audio/Con-
trol/ Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks proper ly.
Symptom of Misalignment:
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio output jack
on the rear side of the deck.
2. Playback the alignment tape (FL6NS8) and confirm
that the audio signal output level is 6kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Dropping envelope level at the beginning of track.
Fig. M7
Dropping envelope level at the end of track.
Fig. M8
Envelope is adjusted properly. (No envelope drop)
Fig. M9
2-3-4U27PMAPC
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS on page 1-5-1.)
All the following proc edures, including those for adjustment and replacement of parts, should be done in Ejec t
mode; see the positions of [44] and [45] in Fig.DM1 on page 2-4-3. When reassembling, follow the steps in reverse
order.
STEP
/LOC.
No.
[10][2]Tape Guide Arm Assembly TDM1,DM8*(P-2)
[11][10]C Door Opener TDM1,DM8*(L-4)
[12][11]Pinch Arm (B)TDM1,DM8*(P-3)
[13][12]Pinch Arm AssemblyTDM1,DM8
[14][14]FE Head AssemblyTDM1,DM9(S-5)
[15][15]PrismTDM1,DM9(S-6)
[16][2]Slider ShaftTDM10*(L-5)
[17][16]C Drive Lever (SP)TDM10
[18][16]C Drive Lever (TU)TDM10(S-7),*(P-4)
[19][19]Capstan MotorBDM2,DM11 3(S-8), Cap Belt
[20]
(1): Follow steps in sequence. When reassembling, follow the steps in reverse order.
These numbers are also used as identification (location) No. of parts in the figures.
(2): Indicates the part to start disassembling with in order to disassemble the part in column (1).
(3):Name of the part
(4): Location of the part: T=Top B=Bottom R=Right L=Left
(5): Figure Number
(6): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered.
e.g., 2(L-2) = two Locking Tabs (L-2).
(7): Adjustment Information for Installation
(+):Refer to Deck Exploded Views for lubrication.
.
* [ 22 ] F Brake Assembly (HI) is not used in 2 head model.
2-4-2U27HSPAL2DA
T op View
[14]
[38]
[37]
[45][44][46][9]
[7][49][8]
[32][43][41][40][31][42]
[13]
[11]
[15]
[10]
[12]
[36]
Bottom View
[23]
[24]
[27]
Fig. DM1
[19]
[35]
[34]
[25]
[26]
[33][20][28][22]
Fig. DM2
2-4-3U27HSPAL2DA
(S-1)
[1]
(S-1)
Fig. DM3
(S-1A)
[7]
[3]
(L-1)
[6]
(L-2)
(P-1)
[49]
[4]
(L-3)
[5]
Fig. DM5
Pin D
Pin C
Slots B
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
[2]
Pin A
Locking tab
2
Pull up
A
1
Slide
Pin B
Slot A
Slot A
View for A
Fig. DM4
Desolder
from bottom
(S-2)
View for A
[50]
(L-12)
A
Lead with
Red Stripe
Fig. DM6
2-4-4U27HSPAL2DA
[9]
)
A
(S-4)
[8]
[14]
(S-5)
(S-6)
[15]
(S-3)
Adj. Screw
[13]
LDG
Belt
Desolder
from bottom
Lead with White Stripe
View for A
[8]
Fig. DM7
[11]
(L-4)
(P-3)
[12]
[10]
Fig. DM9
[17]
(L-5)
[16]
[18]
(P-4)
(P-2
Pin of [12]
View for A
Pin of [10]
Groove of [27]
[27]
A
(S-7)
Fig. DM10
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
groove of [27] as shown.
Fig. DM8
2-4-5U27HSPAL2DA
1
Cap Belt
[19]
(S-8)
Fig. DM1
[24]
[27]
(S-9)
(L-8)
(C-4)
(C-5)
[28]
[29]
[30]
[26]
(L-7)
(C-3)
[23]
(C-2)
[25]
[22]
turn
(L-6)
(C-1)
[21]
Pin on [22]
[20]
[31]
Position of Mode Lever when installed
Pin of [36]
Bottom View
[27]
Pin of [33]
Align [26] and [27] as shown.
First groove on [27]
Pin of [37]
First tooth on [44]
[26]
Position of pin on [22]
[27]
Fig. DM12
[27]
When reassembling [27],
meet the first groove on
[27] to the first tooth on
T op Vie w
[44] as shown.
Fig. DM13
2-4-6U27HSPAL2DA
[33]
(P-5)
[32]
(L-9)
Refer to the Alignment
Section, Page 2-4-8.
[35]
[34]
Fig. DM14
[44]
[45]
[46]
(L-11)
Fig. DM16
(P-6)
[37]
(C-7)
[41]
[39]
turn
(C-6)
[40]
turn
[43]
(L-10)
[42]
[38]
[36]
turn
[48]
[47]
Slide
Fig. DM17
Fig. DM15
2-4-7U27HSPAL2DA
ALIGNMENT PROCEDURES OF MECHANISM
2
T
ly
The following procedures describe how to align the
individual gears and levers that make up the tape loading/unloading mechanism. Since information about the
state of the mechanism is provided to the System
Control Circuit only through the Mode Switch, it is
essential that the corr ect relatio nship bet ween ind ividual gears and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequenc e given. Each
procedure assumes th at all pr evious pro cedures hav e
been completed.
IMPORTANT:
If any one of these al ignments is not p erformed properly, even if off by only one tooth, the unit will unload
or stop and it ma y res ult in damag e to th e m echan ical
or electrical parts.
Alignment points in Eject Position
T op View
Alignment 3
Alignment 1
Loading Arm (SP) and (TU) Assembly
Install Loading Arm ( SP) and (TU) Assembly so that
their triangle marks point to each other as shown in
Fig. AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other, install
the Loading Arm (SP) Assembly so that the last tooth
of the gear meets the most ins ide teeth of the Mode
Gear. See Fig. AL2.
Alignment 1
Triangle Marks
Loading Arm
(SP) Assembly
Last T ooth
Alignment 2
Loading Arm
(TU) Assembly
Most inside teeth
of Mode Gear
Mode Gear
Fig. AL2
Alignment 3
Cam Gear (A) (HI), Rack Assembly
Install the Rack As s emb ly s o that th e first tooth on the
gear of the Rack Assembly meets the firs t groove on
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
SANKOUL FG84M
(Yellow grease)
(Blue grease)
B508
B414
B572
B565
B499
B417
B568
B573
B585
B574
B518
B564
B584
B590
B148
B592
B31
B522
L1151
L1406
B3
B558
B557
B525
B578
B579
B582
B580
B583
B579
View
for A
Some Ref. Numbers are not in sequence.
A
B581
B559
B516
B133
B52
B551
B507
B488
B491
B513
Bottom Side (Grease point)
Bottom Side
(Grease point)
3-1-5U27HSPA2DEX
Deck Mechanism View 3
L1321
B355
L1341
B347
B482
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
L1321
B354
B483
B425
(Blue grease)
B562
B563
B300
B313
B529
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
3-1-6U27HSPA2DEX
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these compone nts, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTE:
Parts that are not assign ed part numbers (---------) are
not available.
! have special characteristics important to safety.
Before replacing any of these compone nts, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.Parts that are n ot assigned part number s (---------)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA0 VSA14166
Consists of the following
Main CBA(MCV-A)-----------SUB JACK CBA(MCV-B)-----------JACK CBA(MCV-C)-----------SENSOR CBA0VSA13549
MAIN CBA
Ref. No.DescriptionPart No.
Main CBA ( MCV-A)----------Consists of the following
CAPACITORS
C002!METALLIZED FILM CAP. 0.068µF/275V K orCT2E683HJE06
!METALLIZED FILM CAP . 0.068µF/250V KCT2E683DC011C003!SAFETY CAP . 2200pF/250V orCCN2EMP0E222
!SAFETY CAP. 2200pF /250VCA2E222MR049
C004ELECTROL YTIC CAP. 33µF/400V M(L•Z)CA2H330NC010
C005CERAMIC CAP . B K 0.01µF/500VCCD2JKP0B103
C006CERAMIC CAP . SL K 56pF/1KV orCCD3AKPSL560
CERAMIC CAP . SL J 56pF/1KVCCD3AJPSL560
C007CERAMIC CAP.(AX) B K 1000pF/50VCCA1JKT0B102
C008CERAMIC CAP.(AX) X K 5600pF/16VCCA1CKT0X562
C010FILM CAP.(P) 0.022µF/50V J orCMA1JJS00223
FILM CAP.(P) 0.022µF/50V JCA1J223MS0 29
C011ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVS L10 0
C012ELECTROL YTIC CAP. 10µF/50V M H7CE1JMAV SL10 0
C014ELECTROL YTIC CAP. 470µF/35V M orCE1GMASDL471
CHIP CERAMIC CAP. CG J 470pF/50VCHD1JJ3CG471
C060ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C061CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C157ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C158CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C251ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C253ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C254CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C302CHIP CERAMIC CAP . B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP . B K 0.022µF/25VCHD1EK30B223
C303ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C304ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C305CHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C307CHIP CERAMIC CAP . B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP . B K 0.047µF/25VCHD1EK30B473
C308CHIP CERAMIC CAP . B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP . B K 0.022µF/25VCHD1EK30B223
C309CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C310CHIP CERAMIC CAP . B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP . B K 0.047µF/25VCHD1EK30B473
C312CHIP CERAMIC CAP . B K 8200pF/50VCHD1JK30B822
C313CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C314CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C316CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C317ELECTROL YTIC CAP. 47 µF/6.3V M H7CE0KMAVSL470
C318ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C319ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C320CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C321CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C322ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C323CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C347CHIP CERAMIC CAP . CH D 10pF/50V orCHD1JD3CH100
CHIP CERAMIC CAP. CG D 10pF/50VCHD1JD3CG100
C351ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C352ELECTROL YTIC CAP. 100µF/16V M H7CE1CMAVSL101
C401ELECTROL YTIC CAP. 47µF/6.3V M H7CE0KMA VSL4 70
C402ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C403CERAMIC CAP . B K 470pF/100VCCD2AKS0B471
C404FILM CAP.(P) 0.018µF/100V J orCMA2AJP00183
FILM CAP.(P) 0.018µF/50V JCMA1JJP00183
C411CHIP CERAMIC CAP . CH J 820pF/50V orCHD1JJ3CH821
CHIP CERAMIC CAP . CH J 820pF/25V orCHD1EJ3CH821
CHIP CERAMIC CAP. CG J 820pF/50VCHD1JJ3CG821
C412CHIP CERAMIC CAP . B K 1800pF/50VCHD1JK30B182
C414CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C415ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVS L10 0
C416CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C417CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C418CHIP CERAMIC CAP . CH J 33pF/50V orCHD1JJ3CH330
CHIP CERAMIC CAP. CG J 33pF/50VCHD1JJ3CG330
C419CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
Ref. No.D e scr ip tionPart No.
C421ELECTROL YTIC CAP. 33 µF/6.3V M H7CE0KMAVSL330
C422ELECTROL YTIC CAP. 4. 7µF/25V M H7CE1EMAVSL4R7
C424ELECTROL YTIC CAP. 22 µF/6.3V M H7CE0KMAVSL220
C425CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
CHIP CERAMIC CAP. CG J 220pF/50VCHD1JJ3CG221
C430ELECTROL YTIC CAP. 47 µF/6.3V M H7CE0KMAVSL470
C431CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C451ELECTROL YTIC CAP. 47 µF/16V M H7CE1CMAVSL470
C452CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C453ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C454ELECTROL YTIC CAP. 22 µF/10V M H7CE1AMAVSL220
C455CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C456CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C457ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C458ELECTROL YTIC CAP. 4. 7µF/25V M H7CE1EMAVSL4R7
C459CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C460CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C461ELECTROL YTIC CAP. 22 µF/10V M H7CE1AMAVSL220
C462CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C463CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C464ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C465CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C466ELECTROL YTIC CAP. 22 0µF/6.3V M H7CE0KMAVSL221
C467ELECTROL YTIC CAP. 22 µF/10V M H7CE1AMAVSL220
C468CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C469CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C470ELECTROL YTIC CAP. 4. 7µF/25V M H7CE1EMAVSL4R7
C471ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C472CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C473CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C474ELECTROL YTIC CAP. 22 µF/6.3V M H7CE0KMAVSL220
C475CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C476CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C477ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C478ELECTROL YTIC CAP. 4. 7µF/25V M H7CE1EMAVSL4R7
C479ELECTROL YTIC CAP. 4. 7µF/25V M H7CE1EMAVSL4R7
C480CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C481ELECTROL YTIC CAP. 4. 7µF/25V M H7CE1EMAVSL4R7
C482ELECTROL YTIC CAP. 4. 7µF/25V M H7CE1EMAVSL4R7
C483ELECTROL YTIC CAP. 4. 7µF/25V M H7CE1EMAVSL4R7
200304253-3-2HE4F0EL
Ref. No.DescriptionPart No.
C484ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVS L10 0
C485CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C486CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C489CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C501ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C502CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C506CERAMIC CAP.(AX) B K 100pF/50VCCA1JKT0B101
C508ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C510ELECTROL YTIC CAP. 22µF/10V M H7CE1AMAVSL 220
C511ELECTROL YTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C512CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C513CHIP CERAMIC CAP . CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 560pF/50VCHD1JJ3CG561
C522ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMASSL220
C523CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C524CHIP CERAMIC CAP . CH J 330pF/50V orCHD1JJ3CH331
CHIP CERAMIC CAP. CG J 330pF/50VCHD1JJ3CG331
C526CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C527ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMASSL220
C529CERAMIC CAP .(AX) Y M 0.01µF/16VCCA1CMT0Y103
C530CERAMIC CAP .(AX) F Z 0.022µF/25VCCA1EZTFZ223
C531CERAMIC CAP .(AX) Y M 0.01µF/16VCCA1CMT0Y103
C532ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMASSL220
C533CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C535CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C538CHIP CERAMIC CAP . B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP . B K 0.022µF/25VCHD1EK30B223
C540ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C561CHIP CERAMIC CAP . B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP . B K 0.022µF/25VCHD1EK30B223
C562ELECTROL YTIC CAP. 330µF/6.3V M H7CE0KMASSL331
C563CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0 .1µF/50VCHD1JZ3FZ104
C564CHIP CERAMIC CAP . CH J 100pF/50V orCHD1JJ3CH101
CHIP CERAMIC CAP. CG J 100pF/50VCHD1JJ3CG101
Ref. No.D e scr ip tionPart No.
C701CHIP CERAMIC CAP . B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP . B K 0.047µF/25VCHD1EK30B473
C702CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C703ELECTROL YTIC CAP. 10 µF/16V M H7CE1CMAVSL100
C704CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C706CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C707ELECTROL YTIC CAP. 10 0µF/6.3V H7CE0KMAVSL101
C708CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C716CHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C717CHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C853CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C854CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C855CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
JK751RCA JACK MSP-282V-12 PBSNJXRL030L Y01 1
JW004FLAT CABLE, 3P A WG2 6#2651 /P2.0/ 200WX 1HE48 0-001
JACK CBA
Ref. No.D e scr ip tionPart No.
JACK CBA (MCV-C)-----------
Consists of the following
CAPACITORS
C101CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C102CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C103CHIP CERAMIC CAP. CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50VCHD1JJ3CG471
C105CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C107ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C108CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C109CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C110CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C111CHIP CERAMIC CAP . CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C4CHIP CERAMIC CAP . CH J 56pF/50V orCHD1JJ3CH560
CHIP CERAMIC CAP. CG J 56pF/50VCHD1JJ3CG560
C5CHIP CERAMIC CAP . CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C6CHIP CERAMIC CAP . CH J 56pF/50V orCHD1JJ3CH560
CHIP CERAMIC CAP. CG J 56pF/50VCHD1JJ3CG560
C7CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP . CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP . CH D 3pF/50VCHD1JD3CH3R0
C8CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP . CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP . CH D 3pF/50VCHD1JD3CH3R0
C11CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C12ELECTROLYTIC CAP . 1 0µF/16V M H7CE1CMASSL100
C13CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C14CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C15ELECTROLYTIC CAP . 1 0µF/16V M H7CE1CMASSL100
C16ELECTROLYTIC CAP . 1 0µF/16V M H7CE1CMASSL100
C17CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C19CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C20ELECTROLYTIC CAP . 3 .3µF/50V M H7CE1JMASSL3R3
C21CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C22ELECTROLYTIC CAP . 1 0µF/16V M H7CE1CMASSL100
C24ELECTROLYTIC CAP . 0 .22µF/50V M H7CE1JMASSLR22
CONNECTORS
CN1ANGLE PIN HEADER, 9P 6029B-1-09Z003-T5700069
DIODES
D2SWITCHING DIODE 1N4148 M orNDT Z01N4148 M
SWITCHING DIODE 1SS133(T-7 7)QDTZ001SS133
ICS
IC1IC:AUDIO PROCESSOR MSP3417G-QG-B8 or NSZBA0SP3002
Four different, but interchangeable, types of B558
(LOADING MOTOR) may be i nstalled in these models.
Please confirm B558 (LOADING MOTOR) type by a
part number on it. B558 (LO ADING MOTOR) type va ries in combination with L1151. Please see Table 1 for
details and combination.
Table 1 (B558 and L1151 Combination)
LOADING MOTOR (B558)SCREW (L1151)
DescriptionParts No.DescriptionParts No.
LOADING MOTOR
M31E-1 R-14 7376
LOADING MOTOR
M31E-1 R-14 7391
LOADING MOTOR
MDB2B80
LOADING MOTOR
MDB2B82
Ref. No.Desc ri pt ionPart No.
B2CYLINDER ASSEMBLY MK12 P AL 4HD HI FI or N1767CYL
CYLINDER ASSEMBLY(V) MK12 PAL 4HD HIFI N1769CYL
B3LOADING MOTOR ASSEMBLY MK11 TVCR0VSA13465
B8PULLEY ASSEMBLY(HI) MK120VSA13501
B9MOVING GUIDE S PREPARA TION MK120VSA13560
B10MOVING GUIDE T PREPARATION MK120VSA13562
B11LOADING ARM(TU) ASSEMBLY MK120VSA13300
B12LOADING ARM(SP) ASSEMBLY MK120VSA13299
B31AC HEAD ASSEMBLY MK120VSA13275
B35TAPE GUIDE ARM ASSEMBL Y MK120VSA13277
B37CAPSTAN MOTOR 288/VCCM012N9671CML
B52CAP BELT MK100VM411 13 8
B73FE HEAD ASSEMBLY MK1 1 orN9742FEL
FE HEAD ASSEMBLY MK11 orN9743FEL
FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD(MK11) VTR-1X2ERS11-148 orDHVEC01TE004
FE HEAD(MK12) VTR-1X 2ERS11-155 orDHVEC0 1 TE00 5
FE HEAD(MK12) HVFHP0047ADHVEC01AL007
B74PRISM MK100VM202870
B86F BRAKE ASSEMBLY(HI) M K120VSA13447
B121WORM MK120 VM41409 1
B126PULLEY MK120VM414330B
B133IDLER ASSEMBL Y(HI) MK120VSA13451
B148TG CAP MK60VM407664C
B300C DRIVE LEVER(TU) MK120VM203773
B303F DOOR OPENER MK12 or0VM203751C
F DOOR OPE NER M K120VM203 751
B313C DRIVE SPRING MK 120VM414145
B347GUIDE HOLDER A MK100VM304920
B354SLIDER(TU) MK120VM101172F
B355SLIDER(SP) MK12 or0VM101182F
SLIDER(SP) SUB ASSEMBL Y MK12 or0VDM12542
SLIDER(SP) MK120VM101182H
B359CLEANER LEVER MK100VM304413
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBL Y(4) MK12 or0VSA13572
MMDZB12 MM0 0 3
MMDZB12 MM0 0 4
MMDZB12 SJ 00 8
MMDZB10 SJ 00 1
SCREW, SEMS
M2.6X4 PAN HEAD+
SCREW, SEMS
M3X4 PAN HE AD+
CPM39040
CPM33040
Ref. No.DescriptionPart No.
PINCH ARM(A) ASSEMBLY(5) MK120VSA13788
B411PINCH SPRING MK120VM414644
B414M BRAKE(SP) ASSEMBL Y(HI) MK120VSA13655
B416M BRAKE(TU) ASSEMBL Y(HI) MK120VSA13449
B417TENSION SPG(3002654) MK120VM414221E
B425LOCK LEVER SPRING MK100VM411110
B482CASSETTE PLA TE MK120VM203749
B483LOCK LEVER MK120VM414095
B487BAND BRAKE(SP) MK120VM305723
B488MODE LEVER(HI) MK120VM101175J
B491CAM GEAR(A)(HI) MK120VM101 176
B492MODE GEAR(LM) MK120VM204236
B494C DOOR OPENER MK120VM305719
B499T LEVER HOLDER MK120VM305729
B501WORM HOLDER MK120VM203767
B507REEL WASHER MK9 5*2.1* 0.50VM410058
B508S BRAKE SPRING(HI) MK120VM414899
B513P.S.W F 6* 2.55*0 .50VM402629A
B514SCREW RACK MK100VM41 1535
B516REEL WASHER MK9 5*2.1* 0.50VM410058
B518P.S.W CUT 1.6X4.0X0.5T0VM408485A
B521REV BRAKE SPG(HI) MK120VM414943
B522TG POST ASSEMBL Y MK100VSA11012
B525LDG BELT MK110VM412804
B529CLEANER ASSEMBL Y MK100VSA1 1 1 61
B551FF ARM(HI) MK120VM306183
B553REV SPRING MK110VM412555
B555RACK ASSEMBLY MK120VSA13289
B557MOTOR PULLEY U50VM403205A
B558LOADING MOTOR MDB2B82 orMMDZB10SJ001
LOADING MOTOR MDB2B80 orMMDZB12SJ008
LOADING MOTOR M31E-1 R-14 7376 orMMDZB12MM003
LOADING MOTOR M31E-1 R14 7391MMDZB12MM004
B559CLUTCH ASSEMBLY(HI) MK120VSA13450
B562C DRIVE LEVER(SP) MK120VM203772
B563SLIDER SHAFT MK120VM305762
B564M GEAR(HI) MK120VM305755
B565SENSOR GEAR(HI) MK120VM305756
B567PINCH ARM(B) MK120VM305718
B568BT ARM MK120VM305728
B571P.S.W CUT 1.6X4.0X0.5T0VM408485A
B572P.S.W CUT 1.6X4.0X0.5T0VM408485A
B573REEL S MK110VM203436
B574REEL T MK100VM202872C
B578TR GEAR A MK100VM304440
B579TR GEAR B MK120VM305900
B580TR GEAR C MK120VM305743A
B581CENTER GEAR MK110VM305081
B582TR GEAR SPRING MK100VM411187
B583CAM WASHER MK120VM414741
B584TR GEAR SHAFT MK100VM411 186
B585PSW(317505) MK110VM413663
B587TENSION LEVER ASSEMBL Y MK120VSA13279
B590BRAKE ARM(TU) MK120VM203752E
B591BAND BRAKE(TU) MK120VM305724C
B592TG POST MK100VM41 1 108E
L1051SCREW, B-TIGHT M2.6X6 PA N HEAD+GPMB9060
L1053SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1151SCREW, SEMS M3X4 PAN HEAD + orCPM33040
SCREW, SEMS M2.6X4 PAN HEAD+CPM39040
L1191SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
200304253-4-1HE4F0DPL
Ref. No.Desc ri pt ionPart No.
L1321SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
L1341SCREW, P-TIGHT 2X8 PAN HEAD +GPMP2080
L1406AC HEAD SCREW MK90VM410964
L1450SCREW, SEMS M2.6X5 PAN HEAD+CPM39050
L1466SCREW, S-TIGHT M2.6X6 BIND HEAD+GBMS9060
L1467SCREW, S-TIGHT M2.6X5 WASHER HEAD+GCMS9050
200304253-4-2HE4F0DPL
27A-850
HE4F0ED
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.