: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
Note
and some may drop slightly below these specs. Limit specs represent the absolute worst condition that still might
be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1HC4C0SP
Page 4
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special safety characteristics are
identified by a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electrical codes of the
countries in which they are to be sold. However, in
order to maintain such compliance, it is equally important to implement the following precautions when a set
is being serviced
Precautions during Servicing
Parts identified by the ! symbol are critical for
A.
safety. Replace only with part number specified.
In addition to safety, other parts and assemblies
B.
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
Use specified internal wiring. Note especially:
C.
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
Use specified insulating materials for hazardous
D.
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
When replacing AC primary side components
E.
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
Observe that the wires do not contact heat produc-
F.
ing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.).
Check that replaced wires do not contact sharp
G.
edges or pointed parts.
When a power cord has been replaced, check that
H.
5 - 6 kg of force in any direction will not loosen it.
.
Also check areas surrounding repaired locations.
I.
Be careful that foreign objects (screws, solder
J.
droplets, etc.) do not remain inside the set.
Crimp type wire connector
K.
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important:
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the complete closure of the tool.
When connecting or disconnecting the internal con-
L.
nectors, first, disconnect the AC plug from the AC
outlet.
Do not re-use a connector. (Discard it.)
1-2-1H8740SFP
Page 5
Safety Check after Servicing
Examine the area surrounding the repaired location for
damage or deterioration. Observe that screws, parts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
230 V
This table is unofficial and for reference only.
Note:
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the terminals of load
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
AC Voltmeter
(High Impedance)
Fig. 1
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
230 V
This table is unofficial and for reference only. Be sure to confirm the precise values.
Note:
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-2-2H8740SFP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 6
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Out
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
Input
In
Pin 1
c. The 1st pin of every male connector is indicated as
shown.
Pin 1
Bottom View
5
10
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
.
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Caution:
1. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
2. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
Machine
Flat Pack-IC
Fig. S-1-2
1-3-1NOTE_1
Page 7
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a soldering iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it may be damaged
if force is applied.
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
To Solid
Mounting Point
CBA
Tweezers
Hot Air Blower
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
1-3-2NOTE_1
Page 8
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
(2) The “ I ” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
(3) Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1MΩ) that is properly grounded to remove any static electricity that may
be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on clothing will not escape through the body grounding band,
be careful to avoid contacting semi-conductors with
your clothing.
< Incorrect >
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
CBA
< Correct >
Grounding Band
1MΩ
CBA
1MΩ
Conductive Sheet or
Copper Plate
1-3-3NOTE_1
Page 9
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, TP507 (SENSOR INHIBITION) to GND. This will
stop the function of Tape Start Sensor, Tape End Sensor and Reel Sensors. (If these TPs are connected
before plugging in the unit, the function of the sensors
will stay valid.) See Fig. 1.
Because the Tape End Sensors are inactive, do
Note:
not run a tape all the way to the start or the end of the
tape to avoid tape damage.
About REC-Safety Switch
Caution:
The REC-Safety Switch is directly mounted on the
Main CBA. When the Deck Mechanism Assembly is
removed from the Main CBA for servicing, this switch
does not work automatically.
What to do for preparation
In order to record, press the Rec button while pushing
REC-SAFETY SW on the Main CBA. See Fig. 1.
Q503
SW506
Q504
TP507
S-INH
(REC-SAFETY SW)
Fig. 1
1-4-1HC2C0PFS
Page 10
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Case
[2] Front Assembly
[3] VCR Chassis Unit
[4] Jack CBA
[5] Function CBA
[6] Deck Assembly
[7] Main CBA
2. Disassembly Method
REMOVAL
ID/
LOC.
No.
PART
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
Note
(1): Identification (location) No. of parts in the figures
(2): Name of the part
(3): Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5): Refer to “Reference Notes.”
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1. Release Locking Tab (L-3) and remove Screw
(S-2), five Screws (S-3), three Screws (S-4) and
Screw (S-5). Then, slowly lift the VCR Chassis Unit
(Deck Assembly, Function CBA, Jack CBA and
Main CBA) up.
2. When reassembling, solder wire jumpers as shown
in Fig. 5.
3. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CBA as shown in
Fig. 6. Then, install the Deck Assembly while aligning the hole of Cam Gear with the pin of LD-SW,
the shaft of Cam Gear with the hole of LD-SW as
shown in Fig. 6.
[1]Top Case17(S-1)-
Front
[2]
Assembly
VCR
[3]
Chassis
Unit
[4]Jack CBA4Desolder, (S-6)-
Function
[5]
CBA
Deck
[6]
Assembly
[7]Main CBA5-----------
↓
(1)
↓
(2)
2*3(L-1),*4(L-2)-
*(L-3), 5(S-3), 3(S-4),
3
(S-5)
5Desolder-
5,62(S-7), Desolder2,3
↓
(3)
↓
(4)
1
↓
(5)
1-5-1HC2C0DC
Page 11
(S-1)
[1] Top Case
(S-1)
(S-1)
Fig. 1
(S-3)
[3]VCR
Chassis Unit
(S-4)
(S-3)
(S-5)
(S-4)
(S-3)
(L-2)
[2] Front
Assembly
(L-1)
(L-2)
(L-3)
Fig. 3
[4] Jack CBA
(S-6)
Desolder
Fig. 2
Fig. 4
1-5-2HC2C0DC
Page 12
FE Head
Cylinder Assembly
AC Head
Assembly
Pin
SW507
LD-SW
[6] Deck Assembly
(S-7)
[5] Function
CBA
Desolder from
bottom
From
FE Head
Lead with
red stripe
From
Cylinder
Assembly
Lead with
white stripe
From
AC Head
Assembly
[7] Main CBA
From
Capstan Motor
Assembly
Lead with
white stripe
(S-7)
[7] Main CBA
[6] Deck Assembly
Shaft
Hole
LD-SW
Cam Gear
Hole
Pin
[7] Main CBA
Fig. 6
TOP VIEW
Lead connections of Deck Assembly and Main CBA
Fig. 5
1-5-3HC2C0DC
Page 13
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electrical adjustments are required after replacing
circuit components and certain mechanical parts.
It is important to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these alignment / confirmation procedures, make sure that the tracking control is set in
the center position: Press either "L5??" or "K" button
on the remote control unit first, then the "PLAY"
button (Front Panel only).
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching point during
playback.
Symptom of Misadjustment:
May cause Head Switching noise or vertical jitter
in the picture.
Test pointAdj.PointModeInput
TP751(V-OUT)
TP502(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
TP751
GND
TP502
PLAY
(SP)
6.5H±1H
(412.7µs±60µs)
Oscilloscope
-----
Spec.
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
V-Sync
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 video output waveform is at the 6.5H(412.7µs) delayed position from the
rising edge of the CH2 head switching pulse waveform.
1.0H
Switching Pulse
6.5H
0.5H
1-6-1HC2C0EA
Page 14
M
M
LOADING
MOTOR
CYLINDER ASSEMBLYCAPSTAN MOTOR
DRUM
MOTOR
PG
SENSOR
CONTROL
HEAD
CL287
55CTL(+)
66CTL(-)
CL504
AC HEAD ASSEMBLY
MAIN CBA
KEY- 2
C-FG
C-CONT
D-FG
D-PG
ST-S
T-REEL
C-F/R
KEY- 1
REMOCON-IN
CTL(+)
RESET
REC-SAF-SW
PG-DELAY
CTL(-)
D-V SYNC
D-REC-H
DAVN-L
RF-SW
H-A-SW
C-ROTA
END-S
14
90
89
94
95
76
87
10
4
80
34
78
2
13
15
18
65
20
16
31
8
7
RS501
REMOTE
SENSOR
LM-FWD/REV
81
D-CONT77
(DECK ASSEMBLY)
Servo/System Control Block Diagram
BLOCK DIAGRAMS
T-REEL
Q501
RESET
Q503
S-REEL79
SW-POINT
AL+5V
VR501
TIMER+5V
S-REEL
PS503
TP506
IIC-BUS SDA
IIC-BUS SDA
IIC-BUS SCL
A-MUTE-H
IIC-BUS SDA
IIC-BUS SCL
Hi-Fi-H-SW
A-MODE
A-MUTE-H
Hi-Fi-H-SW
A-MODE
H-A-COMP
17
V-ENV
6
P-ON-H
C-POW-SW
P-ON-H
C-POW-SW
P-DOWN-L
67
66
86
P-DOWN-L
C-SYNC
58
SW506
TO
VIDEO BLOCK
TO
Hi-Fi AUDIO
BLOCK
TO
AUDIO BLOCK
22KEY-2
44KEY-1
KEY SWITCH
KEY SWITCH
CL505CN651
FUNCTION CBA
1-7-11-7-2HC4S4BLS
SDA
SDA
SCL
SCL
TU701(TUNER UNIT)
IC503 (MEMORY)
72
61
19
83
IIC-BUS SCL
D-V SYNC
D-REC-H
DAVN-L
RF-SW
H-A-SW
C-ROTA
IIC-BUS SDA
H-A-COMP
V-ENV
C-SYNC
IIC-BUS SCL
71
3
5
SDA
SCL
12
11
LD-SW9
AL+15V/+12V
AL+12V
AL+5V
AL+5V
SW507
P-ON+5V
LD-SW
AL+5V
D502
S-LED
TO
POWER
SUPPLY
BLOCK
KEY
SWITCH
TP507
S-INH
SW505
CH-UP
M
CAPSTAN
MOTOR
IC561
(FIP DRIVER)
IC501
(SERVO/SYSTEM CONTROL)
DRV-DATA
DRV-STB
DRV-CLK
DRV-DATA
DRV-STB
DRV-CLK
FP562
LED CLOCK
G1
G2
G3
G4
S1
S2
S7
S8
S9
S10
23
22
21
28
2
1
68
69
70
20
13
14
16
17
7
8
5
6
CL502
12 C-F/R
11
AL+15V/+12V
10 AL+12V
9
P-ON+5V
8
GND
7
C-FG
6
C-CONT
5
GND
4
D-FG
3
LM-FWD/REV
2
D-CONT
1
D-PG
SENSOR CBA
SENSOR CBA
END-S
ST-S
Q504
Q505
REC-SAFETY
END-S
CTL97
FF/REW-L84
Q502
TP501
CTL
SW508
RESET
Page 15
CYLINDER ASSEMBLY
V(R)-1
V-COM
V(L)-1
CL253
1
2
3
Video Block Diagram
1-7-31-7-4HC4S4BLV
(DECK ASSEMBLY)
VIDEO (R)-1
HEAD
SP
HEAD
AMP
EP
HEAD
AMP
REC FM
AGC
TO SERVO/SYSTEM
CONTROL BLOCK
TO SERVO/SYSTEM
CONTROL BLOCK
C-SYNC
RF-SW
D-REC-H
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
LUMINANCE
SIGNAL
PROCESS
CHROMINANCE
SIGNAL
PROCESS
C-SYNC
V-ENV
H-A-COMP
H-A-SW
D-V-SYNC
RF-SW/C-ROTA
VIDEO (L)-1
HEAD
VIDEO (L)-2
HEAD
VIDEO (R)-2
HEAD
V(L)-2
V-COM
V(R)-2
4
5
6
TU701
IC301
(Y/C SIGNAL PROCESS)
IC501 (OSD)
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
SERIAL
DECORDER
V-OUT1
1
V-IN1133
V-OUT2
1
V-IN23
1
3
JACK CBA
48
50
52
56
24
6
50
52
19
20
JK101
V-OUT1
V-IN1
19
20
JK102
CL151
CL152
CL101
CL102
V-OUT2
V-IN2
61
63
96
95
93
94
90
89
88
87
CHARA.
INS.
CCD 1H DELAY
SP
BYPASS
MUTE
PB/EE
IN1
TUNER
IN1
TUNER
MUTE
PB/EE
FRT
IN2
FRT
IN2
AGC
PR
R
Y
C
P
R P R P
EP
Y. DELAY
Y/C
MIX
+
21
7978
AGCVXO
OSD
CHARACTER
MIX
FBC
1/2
5859
65
2928
IIC BUS SDA
69684643
67
84
83
71
62
70
D-REC-H
80
BUFFER
Q101
BUFFER
Q102
TP751
V-OUT
WF1
TP301
C-PB
WF5
TU-VIDEO
TU-VIDEO
V-IN1TO
SERVO/SYSTEM
CONTROL BLOCK
VIDEO
BUFFER
Q351
MAIN CBA
IIC BUS SCL
54
TP502
RF-SW
WF2
X301
4.43MHz
JK756
V-IN-F
IC640 (VPS)
VPS-V
IIC BUS SDA
DAVN-L
IIC BUS SCL
6
14
7
16
VPS CBA
IIC BUS-SCL
IIC BUS-SDA
DAVN-L
OSD-V-IN
DAVN-L
Page 16
Audio Block Diagram
REC
AMP
100
3
AUTO
BIAS
2
1
+5V
+5V
Q401
Q406
BIAS
OSC
Q402
N-A-PB
TO Hi-Fi
AUDIO BLOCK
N-A-REC
Q404 (PB=ON)
Q405
(PB=ON)
Q403
SWITCHING
D-REC-OFF
5
EQ
AMP
98
7
LINE
AMP
REC-ON
AUDIO HD-SW
CONTROL
MUTE
11
6
PB-ON
SP/LP-ON
P
TUNERIN2
IN1
R
ALC
DET
ALC
IC301
(AUDIO SIGNAL PROCESS)151317
4 A-PB/REC
CL504
3 A-COM
1 AE-H
2 AE-H/FE-H
A-PB/REC 4
A-COM3
AE-H1
AE-H/FE-H 2
CL287
AUDIO
HEAD
AUDIO
ERASE
HEAD
ACE HEAD ASSEMBLY
FE HEAD
2 FE-H
1 FE-H-GND
CL501
1-7-51-7-6 HC4S4BLA
MAIN CBA
PB-AUDIO SIGNALREC-AUDIO SIGNALMode : SP/REC
71
A-MUTE-H
IIC BUS-SCL
IIC BUS-SDATO SERVO/SYSTEM
CONTROL BLOCK
FULL
ERASE
HEAD
68 69
SERIAL
DECODER
(DECK ASSEMBLY)
12
16
INV
ATT
Page 17
48
47
13
14
51
65
67
69
73
6
7
11
53
R-CH
INSEL
L-CH
INSEL
IF SINAL
PROCESS
NOR
SW
SERIAL
DATA
DECODER
OUTPUT
SELECT
VCO
LPF
L-CH BPF
R-CH
PNR
L-CH
PNR
LIMDEV
COMP
SW
NOISE
VCO
LPF
LIMDEV
COMP
COMP
SW
NOISE
ENV
DET
DO
DET
MIX
R-CH BPF
P
R
R
L
P
R
HOLD
PULSE
NOISE
DET
ALC
31 30
23
80
2
78
38
39
40
26
24
27
N-A-REC
TU-AUDIO
TU701
AUDIO
SIF
LIM
MUTE
4
N-A-PB
Hi-Fi-H-SW
A-MODE
TO AUDIO BLOCK
IIC-BUS SDA
IIC-BUS SCL
TO
SERVO/ SYSTEM
CONTROL BLOCK
Hi-Fi
AUDIO
(R) HEAD
Hi-Fi
AUDIO
(L) HEAD
CYLINDER
ASSEMBLY
MAIN CBA
Hi-Fi-A(R) 7
Hi-Fi-COM 8
Hi-Fi-A(L) 9
CL253
IC451 (MTS/ SAP/ Hi-Fi AUDIO PROCESS/ Hi-Fi HEAD AMP)
Hi-Fi Audio Block Diagram
HC4S4BLH
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
JACK CBA
AFV CBA
JK101
A-IN1(R)
A-IN1(L)
2
6
2
6
1
3
1
3
JK102
CL151
CL152
CL101
CL102
A-IN2(R)
A-IN2(L)
A-OUT1(R)
A-OUT1(L)
A-OUT2(R)
A-OUT2(L)
TU-AUDIO(R)
4
TU-AUDIO(L)
5
4
5
CN701CN1
SIF
2
TU-AUDIO 1
2
1
CN701CN1
2
21
22
D.C.
ALC
SW
SW
ALC
D.C.
76
75
A-IN2(R)
9
A-IN2(L) 8
9
8
A-OUT2(R)
6
A-OUT2(L) 11
6
11
A-IN1(R)
10
A-IN1(L) 8
10
8
A-OUT1(R)
6
A-OUT1(L) 12
6
12
Q451
1-7-71-7-8
REAR
JK751
A-OUT(R)
A-OUT(L)
JK758
A-IN(R)-F
JK757
A-IN(L)-F
FRONT
71
9
Page 18
2
4
16
6
7
Power Supply Block Diagram
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
The following symbols will appear on the indicator panel to indicate the current mode or operation of the VCR.
On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
Display panel
" H "= LED Light on, " L "= LED Light off
LED MODEINDICATOR ACTIVE
CASSETTE "IN"
CASSETTE "OUT"
CLOCK" 88:88ON
POWER ON" PWR."ON
REC" REC "ON
REC PAUSE" REC "Blinks at 0.8Hz interval
T-REC,OTR
When reel and capstan mechanism is not
functioning correctly
When tape loading mechanism is not functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safety detection
" "
" "
" "
" "
" 1 "
" "
" 2 "
" "
" 3 "
" "
" 4 "
" "
" 5 "
ON
OFF
ON
(T-REC OFF,T-REC incomplete
Blinks at 0.8Hz interval)
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
S-INH conditionAll modesBlinks at 0.8Hz interval
1-7-11HC460FIS
Page 20
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacement parts that have these special safety
characteristics are identified in this manual and its
supplements; electrical components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual
carefully. The use of substitute replacement parts that
do not have the same safety characteristics as specified in the parts list may create shock, fire, or other
hazards.
Capacitor Temperature Markings
Mark
Capacity
change rate
Standard
temperature
Temperature
range
Notes:
1. Do not use the part number shown on these drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
(B)
(F)+30 - 80%20°C-25~+85°C
(SR)
(Z)+30 - 80%20°C-10~+70°C
Capacitors and transistors are represented by the following symbols.
±
±
10%
15%
20°C-25~+85°C
20°C-25~+85°C
CBA Symbols
(Top View) (Bottom View)
+
Electrolytic Capacitor
(Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
(Top View)
Schematic Diagram Symbols
Digital Transistor
NPN Transistor
E C B
(Top View)
NPN Digital Transistor
E C B
PNP Transistor
E C B
(Top View)
PNP Digital
Transistor
E C B
1-8-1SCPA1
Page 21
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAGES:
1.
CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2.
CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the
power supply circuit to fail.
3.
Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Wire Connectors
(1) Prefix symbol "CN" means "connector" (can disconnect and reconnect).
(2) Prefix symbol "CL" means "wire-solder holes of the PCB" (wire is soldered directly).
5. Mode: SP/REC
6. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
7. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
8. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
5.0
231
5.0
PLAY mode
REC mode
(2.5)
Indicates that the voltage
is not consistent here.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-8-2SCRK05
Page 22
1-8-31-8-41-8-5
HC4S4SCM1
Main 1/5 Schematic Diagram
Page 23
1-8-61-8-71-8-8HC4S4SCM2
Main 2/5 Schematic Diagram
Page 24
1-8-9
1-8-10
1-8-11
HC4S4SCM3
Main 3/5 Schematic Diagram
Page 25
1-8-12
1-8-131-8-14
HC4S4SCM4
Main 4/5 Schematic Diagram
NOTE :
THE VOLTAGE FOR PARTS IN HOT CIRCUIT IS MEASURED USING
HOT GND AS A COMMON TERMINAL.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE FUSE.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Page 26
Main 5/5 Schematic Diagram
1-8-15
1-8-16
HC4S4SCM5
Page 27
VPS Schematic Diagram
1-8-17
1-8-18
HC4S4SCV
Page 28
1-8-19
1-8-20
HC4S4SCF
Function Schematic Diagram
Page 29
AFV Schematic Diagram
1-8-21
1-8-22
HC4S4SCAFV
Page 30
Jack Schematic Diagram
1-8-23
1-8-24
HC4S4SCJ
Page 31
1-8-25
1-8-26
Function CBA Top ViewFunction CBA Bottom View
BHC400F01018-B
Page 32
1-8-27
1-8-28
AFV CBA Top View
AFV CBA Bottom View
BHC400F01091
VPS CBA Top ViewVPS CBA Bottom View
BHC400F01018-C
Page 33
1-8-29
1-8-30
Jack CBA Top View
Jack CBA Bottom View
BHC400F01018-E
Page 34
VR501
SW-P
WF2
TP502
RF-SW
TP501
CTL
TP507
S-INH
WF5
TP301
C-PB
TP506
END-S
WF1
TP751
V-OUT
1-8-31
BHC400F01018-A
Main CBA Top View
BHB300F01011-A
BHB300F01011-B
Sensor CBA Top View
1-8-321-8-33
CAUTION !
Fixed voltage power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE FUSE.
Page 35
1-8-34
1-8-35
1-8-36
BHC400F01018-A
Main CBA Bottom View
CAUTION !
Fixed voltage power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE FUSE.
Page 36
1-9-1U25WFPAL
WF1
V-OUT E-E
10usec 50mV x 10
WAVEFORMS
(TP751 of Main CBA)
WF1
UPPER
WF2
LOWER
V-OUT 0.1V x 10
RF-SW 0.5V x 10
50usec
(TP751 of Main CBA)
(TP302 of Main CBA)
WF5
C-PB 10mV x 10
RF-SW 0.5V x 10
5msec
UPPER
LOWER
WF2
(TP302 of Main CBA)
(TP301 of Main CBA)
Page 37
WIRING DIAGRAM
HC4S4WI1-10-11-10-2
GND
1 V-OUT1
2
AL+12V(2)
3 V-IN1
4
NU5
A-OUT1(R)
6
JK1-8P-OUT
7
A-IN1(L)8
NU9
A-IN1(R)
10
GND
11
A-OUT1(L)12
1
2
3
4
5
6
7
8
9
10
11
12
CL151CL101
KEY2
GND
2
3
2
NU
11
3
KEY1
44
CN651CL505
SIF
1 NU
2
TU-AUDIO(R)
3 GND
4
TU-AUDIO(L)5
P-ON+5V
6
P-ON+5V
7
IIC BUS-SCL8
IIC BUS-SDA9
1
2
3
4
5
6
7
8
9
CN701CN1
GND
1 V-OUT2
2
NU
3 V-IN2
4
GND5
A-OUT2(R)
6
SC2-IN
7
A-IN2(L)8
A-IN2(R)9
GND
10
A-OUT2(L)
11
1
2
3
4
5
6
7
8
9
10
11
CL152CL102
AC CORD
ANT-INANT-OUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
AFV CBA
JK101,102
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
AC HEAD ASSEMBLY
AUDIO HEAD
AUDIO
ERASE HEAD
CONTROL HEAD
AE-H
AE-H/FE-H
A-COM
A-PB/REC
CTL(+)
CTL(-)
6
5
4
3
2
1
CL287
MLOADING
MOTOR
CYLINDER ASSEMBLY
AE-H
1
AE-H/FE-H2
A-COM3
A-PB/REC4
CTL(+)5
CTL(-)
6
Hi-Fi-A(R)7
Hi-Fi-COM8
Hi-Fi-A(L)9
V-COM5
V(R)-26
V(R)-11
V-COM2
V(L)-2
3 V(L)-1
4
AL+15V/+12V
12 C-F/R
11
P-ON+5V
10 AL+12V
9
GND8
C-FG
7
C-CONT
6
GND5
D-FG4
LM-FWD/REV
3
D-CONT
2
D-PG1
FE-H2
FE-H GND1
CL501
CL502
CL504
CL253
CAPSTAN MOTOR
FULL
ERASE HEAD
FE HEAD
VIDEO
(R)1
HEAD
VIDEO
(L)1
HEAD
VIDEO
(L)2
HEAD
VIDEO
(R)2
HEAD
Hi-Fi AUDIO
(R) HEAD
Hi-Fi AUDIO
(L) HEAD
M
DRUM
MOTOR
PG
SENSOR
(DECK ASSEMBLY)
SENSOR CBA
(BHB300F01011)
(BHC400F01018A)
SENSOR CBA
(BHB300F01011)
MAIN CBA
FUNCTION CBA
JACK CBA
(BHC400F01091)
VIDEOINAUDIO
IN (R)
AUDIO
IN (L)
AUDIO
OUT (R)
AUDIO
OUT (L)
FRONTREAR
(BHC400F01018E)
(BHC400F01018B)
VPS CBA
OSD-V-IN
IIC BUS-SCL
TUN-SW2
FSC-IN(4.43MHz)
IIC BUS-SDA
P-ON+5V
DAVN-L
(BHC400F01018C)
Page 38
IC PIN FUNCTION DESCRIPTIONS
IC501( SERVO / SYSTEM CONTROL IC )
“H” ≥ 4.5V, “L” ≤ 1.0V
Pin
IN/
No.
OUT
1IN
2IN
3IN
4IN
5IN
6IN
7IN
8IN
9IN
10 OUT
11-
12-
13 OUT
14IN
15 OUT
16 OUT
17IN
18 OUT
19 OUT
20IN
21-
22 OUT
23-
Signal
Name
SC2-IN
PGDELAY
POWSAF
END-S
AFC
V-ENV
KEY-1
KEY-2
LD-SW
ST-S
N.U.Not Used
N.U.Not Used
D-VSYNC
REMOCO
N-IN
C-ROTA
H-A-SW
H-ACOMP
RF-SW
HiFi-H-SWHiFi Audio Head
DAVN-L
N.U.Not Used
TUNSW2
N.U.Not Used
Function
Input Signal from
Pin 8 of SCART2
Video Head
Switching Pulse
Signal Adjusted
Voltage
P-ON Power
Detection Input
Signal
Tape End Position
Detect Signal
Automatic Frequency
Control Signal
Video Envelope
Comparator Signal
Key Scan Input
Signal 1
Key Scan Input
Signal 2
Deck Mode Position
Detector Signal
Tape Start Position
Detector Signal
Dummy V-sync
Output
Remote
Control Sensor
Color Phase Rotary
Changeover SIgnal
Video Head Amp
Switching Pulse
Head Amp
Comparator Signal
Video Head
Switching Pulse
Switching Pulse
VPS/PDC Data
Receive = “L”
Tuner System
Control Signal
Output
Active
Level
L/Hi-z
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
A/D
H/Hi-z
H/L
H/L
H/L
H/L
H/L
H/L
Pin
IN/
No.
OUT
24-
25-
26-
27-
28-
29-
30-
31IN
32-
33-
34IN
35IN
36OUT
37-
38IN
39OUT
40-
-
-
L
L
-
-
41-
42-
43IN
44IN
45OUT
46-
47-
48IN
49-
50IN
51-
52OUT
53-
54-
55-
56-
Signal
Name
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
N.U.Not Used
RECSAF-SW
N.U.Not Used
N.U.Not Used
RESET
XC-INSub Clock
XC-OUTSub Clock
VccVcc
X-INMain Clock Input
X-OUTMain Clock Input
VssVss(GND)
N.U.Not Used
N.U.Not Used
CLKSELClock Select (GND)
IN
OSC
OSC
OUT
N.U.Not Used
LPLP
FSC-IN
[4.43MHz]
OSDVssOSDVss
VIDEO-IN Video Signal Input
N.U.Not Used
VIDEOOUT
OSDVccOSDVcc
HLF
N.U.Not Used
N.U.Not Used
Function
Recording Safety SW
Detect (With Record
tab="L"/With out
Record tab="H")
System Reset
Signal (Reset=”L”)
Clock Input
for letter size
Clock Output for letter
size
4.43MHz Clock Input
Video Signal Output
LPF Connected
Terminal (Slicer)
Active
Level
-
-
-
-
-
-
-
H
-
-
L
-
-
-
-
-
-
-
-
L
-
-
-
-
-
-
-
-
-
-
-
-
-
1-11-1HC4S4PIN
Page 39
Pin
IN/
No.
OUT
57-
58IN
59 OUT
60-
61IN
62-
63-
64-
65 OUT
66 OUT
67IN
68 OUT
69 OUT
70 OUT
71 OUT
IN/
72
OUT
73-
74-
75-
76 OUT
77 OUT
78 OUT
79IN
80IN
81 OUT
82-
83 OUT
Signal
Name
Function
N.U.Not Used
C-SYNC
8POUT-1
Composite
Synchronized Pulse
SCART 1 8Pin
Output Control Signal
N.U.Not Used
A-MODE
Hi-Fi Tape Detection
Signal
N.U.Not Used
N.U.Not Used
N.U.Not Used
D-REC-H
CPOWERSW
P-ON-H
DRVDATA
DRV-STB
DRV-CLK
2
I
C BUS-
SCL
2
I
C BUS-
SDA
Delayed Record
Signal
Capstan Power
Switching Pulse
Power On Signal at
High
LED Clock Driver IC
Control Data
LED Clock Driver IC
Chip Select Signal
LED Clock Driver IC
Control Clock
I2C BUS Control
Clock
2
I
C BUS Control Data
N.U.Not Used
N.U.Not Used
N.U.Not Used
C-CONT
D-CONT
Capstan Motor
Control Signal
Drum Motor Control
Signal
Capstan Motor FWD/
C-F/R
REV Control Signal
(FWD=”L”/REV=”H”)
S-REEL
T-REEL
LM-FWD/
REV
Supply Reel
Rotation Signal
Take Up Reel
Rotation Signal
Loading Motor
Control Signal
N.U.Not Used
A-MUTE-H Audio Mute Control
Signal (Mute = “H”)
Active
Level
-
PULSE
H/L
-
L
-
-
-
L
L/Hi-z
H
H/L
H/L
H/L
H/L
H/L
-
-
-
PWM
PWM
H/L
PULSE
PULSE
H/L/
Hi-z
-
H
Pin
IN/
No.
OUT
84OUT
85-
86IN
Signal
Name
FF/REWL
Function
CTL Amp Gain
Switching Signal (FF/
REW=”L”)
N.U.Not Used
P-DOWN-LPower Voltage Down
Detector Signal
Capstan Motor
87IN
C-FG
Rotation Detection
Pulse
88-
89IN
90IN
91-
92-
93-
94OUT
95OUT
96-
97-
98-
AMPVssAMPVss (GND)
D-FG
D-PG
Drum Motor Rotation
Detection Pulse
Drum Motor Pulse
Generator
N.U.Not Used
AMPVRE
IN
F
V-Ref for CTL AMP
CC Terminal
CTL (-)
CTL (+)
AMPC
CTLAMP
out
Playback/Record
Control Signal (-)
Playback/Record
Control Signal (+)
CTL AMP Connected
Terminal
To Monitor for CTL
AMP Output
AMPVccAMPVcc
A/D Converter Power
99-
AVcc
Input/ Standard
Voltage Input
100-
N.U.Not Used
Notes:
Abbreviation for Active Level:
PWM -----Pulse Wide Modulation
A/D--------Analog - Digital Converter
1.Clean all parts for the tape transport (Upper Drum with Video Head / Pinch Roller / Audio Control Head / Full
Erase Head) using 90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording Model only
LDG Belt
II
2-1-1U25MEN
Page 43
Cleaning
Cleaning of Video Head
Clean the head with a head cleaning stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isopropyl alcohol on the
head cleaning stick or on the chamois cloth and,
by slightly pressing it against the head tip, turn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it is very thin, avoid cleaning it
vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of Audio Control Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% isopropyl alcohol and
clean the audio control head. Be careful not to
damage the upper drum and other tape running
parts.
Notes:
1.Avoid cleaning the audio control head vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit or damage may occur.
A/C Head
Upper
Cylinder
Do Not !
Video Head
Cleaning Stick
2-1-2U25MEN
Page 44
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-2
J-4
J-5
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of Audio Control Head
J-1-2Alignment TapeFL6N8
J-2Guide Roller Adj.ScrewdriverAvailable
J-3MirrorAvailable
J-4Azimuth Adj.Screwdriver +Available
J-5X Value Adj.Screwdriver -Available
(1 speed only)
FL6NS8
(2 speed only)
Locally
Locally
Locally
Locally
2-2-1U25PFIX
Azimuth and X Value Adjustment of Audio Control
Head / Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
A/C Head Height
X Value
Page 45
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignment for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
Service Information
Method for Manual Tape Loading/Unloading
A.
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Insert a cassette tape. Though the tape will not be
automatically loaded, make sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, lightly push the cassette
tape further in and see if the tape comes back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or two to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the Moving guide preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 until the Moving guide preparations come to the Eject Position. Stop turning
when the preparations begin clicking or can not be
moved further. However, the tape will be left
wound around the cylinder.
5. Turn the LDG Belt in the appropriate direction continuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
Method to place the Cassette Holder in the tape-
B.
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the locking tabs shown
in Fig. M1 and continue turning the LDG Belt until
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1U25PALMA
Page 46
1.Tape Interchangeability Alignment
Note:
To do these alignment procedures, make sure that the
Tracking Control Circuit is set to the center position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (pg. 2-3-3)
1-A
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
1-A
Adjust the X Value for maximum envelope.
(pg. 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (pg. 2-3-4)
Check the envelope.
1-B
1-C
1-C
OK
Adjust the Audio Section.
(Azimuth Alignment) (pg. 2-3-4)
Check the audio output.
1-D
1-D
OK
Not good
Not good
Not good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Completion
1-A
Check the following:
1. X Value (pg. 2-3-3)
2. Envelope (pg. 2-3-4)
OK
1-B, 1-C
Not good
2-3-2U25PALMA
Adjust the X value and envelope.
1-B, 1-C
Page 47
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Do not use an Alignment Tape for this proce-
Note:
dure. If the unit is not correctly aligned, the tape may
be damaged.
1. Playback a blank cassette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead surface. (Refer to Fig M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the top of Guide Rollers [2] and
[3] with a Guide Roller Adj. Screwdriver. (Refer to
Fig. M3 and M5.)
Guide Roller [2]
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Guide Roller [3]
B
Tape
Incorrect
AC Head
Fig. M3
Fig. M4
3. Check to see that the tape runs without creasing at
Take-up Guide Post [4] or without snaking between
Guide Roller [3] and AC Head. (Fig. M3 and M5)
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the AC Head. (Fig. M6)
Azimuth Adj. Screw
AC Head
X-Value Adj.
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To align the Horizontal Position of the Audio/Control/
Erase Head.
Symptom of Misalignment:
If the Horizontal Position of the Audio/Control/Erase
Head is not properly aligned, maximum envelope cannot be obtained at the Neutral position of the Tracking
Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) and
TP501 (CTL) on the Main CBA. Use TP502 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6N8) and confirm that the PB FM signal is
present.
3. Set the Tracking Control Circuit to the center position by pressing CH UP button then “ PLAY ” button
on the unit. (Refer to note on bottom of page
2-3-4.)
4. Use the X-Value Adj. Screwdriver so that the PB
FM signal at TP301 (C-PB) is maximum. (Fig. M6)
5. Press CH UP button on the unit until the CTL waveform has shifted by approx. +2msec. Make sure
that the envelope is simply attenuated (shrinks in
height) during this process so that you will know
the envelope has been at its peak.
Take-up Guide
Post
Tape
Fig. M5
2-3-3U25PALMA
Page 48
6. Press CH DOWN button on the unit until the CTL
waveform has shifted from its original position (not
the position achieved in step 5, but the position of
CTL waveform in step 4) by approximately -2msec.
Make sure that the envelope is simply attenuated
(shrinks in height) once CTL waveform passes its
original position and is further brought in the minus
direction.
7. Set the Tracking Control Circuit to the center position by pressing CH UP button and then “ PLAY ”
button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture and precise tracking.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracking will then lose precision and the
playback picture will be distorted by any slight variation of the Tracking Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) on the
Main CBA. Use TP502 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6N8). Set the Tracking Control Circuit to the
center position by pressing CH UP button and then
“ PLAY ” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscilloscope display so that the envelope becomes as flat as possible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjust the
height of Guide Roller [2] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjust the
height of Guide Roller [3] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
5. When Guide Rollers [2] and [3] (Refer to Fig.M3)
are aligned properly, there is no envelope drop
either at the beginning or end of track as shown in
Fig. M9.
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushing the CH UP or DOWN buttons alternately, to check the symmetry of the envelope. Check
the number of pushes to ensure center position. The
number of pushes CH UP button to achieve 1/2 level
of envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
1-D. Azimuth Alignment of Audio/Control/
Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio output jack
on the rear side of the deck.
2. Playback the alignment tape (FL6N8) and confirm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Dropping envelope level at the beginning of track.
Fig. M7
Dropping envelope level at the end of track.
Fig. M8
Envelope is adjusted properly. (No envelope drop)
Fig. M9
2-3-4U25PALMA
Page 49
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS on page 1-5-1.)
All the following procedures, including those for adjustment and replacement of parts, should be done in Eject
mode; see the positions of [45] and [46] in Fig.DM1 on page 2-4-3. When reassembling, follow the steps in reverse
order.
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
Locking tab
Slot A
View for A
Fig. DM4
A
Desolder
from bottom
View for A
Lead with
Blue Stripe
Fig. DM6
2-4-4U25PALDA
Page 53
[9]
A
(S-7)
(S-6)
(L-2)
LDG
Belt
Adj. Screw
[8]
Desolder
from bottom
Lead with White Stripe
View for A
[8]
Fig. DM7
[11]
(L-1)
[14]
[17]
(L-3)
(S-9)
(S-10)
[15]
Fig. DM9
After removing the Screw (S-11),
while pressing the Locking Tab
(L-3), remove [16].
Pin of [12]
Pin of [10]
[13]
[10]
A
Grooves of [28]
(P-3)
[12]
[16]
[18]
(P-2)
(S-11)
Fig. DM10
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
[28]
grooves of [28] as shown.
View for A
Fig. DM8
2-4-5U25PALDA
Page 54
Cap Belt
(C-1)
[20]
[19]
[21]
Fig. DM12
(S-12)
Fig. DM11
2-4-6U25PALDA
Page 55
[23]
(P-4)
(C-3)
(C-2)
(P-4)
[28]
[22]
[27]
[28]
[26]
(S-15)
[25]
(L-4)
(C-6)
[29]
[30]
[31]
(C-5)
(C-4)
[24]
Pin on
bottom
of [23]
Top View
When installing [23], install
the spring (P-4) to [28] as
shown in the left figure, and
then install [23] while
pressing the spring (P-4) to
the direction of the arrow in
the left figure and confirming
that the position of the
spring (P-4) is placed as
shown in the left figure.
[23]
Position of pin on [22]
Pin on [22]
[28]
Fig. DM13
[32]
Pin of [37]
Bottom View
Top View
Position of Mode Lever when installed
Pin of [34]
[28]
Align [25] and [28] as shown.
First groove on [28]
First tooth on [48]
[28]
When reassembling [28],
meet the first groove on
[28] to the first tooth on
[48] as shown.
Pin of [38]
[25]
Fig. DM14
2-4-7U25PALDA
Page 56
Refer to the Alignment Section, Page 2-4-9.
(P-5)
[45]
[46]
[47]
[34]
[38]
(P-7)
turn
[40]
[33]
(L-6)
turn
[44]
[42]
(L-5)
[39]
(C-8)
[36]
(C-7)
[41]
[35]
Fig. DM15
[43]
(P-6)
[37]
[49]
[48]
(L-7)
Fig. DM17
Slide
Fig. DM18
turn
Fig. DM16
2-4-8U25PALDA
Page 57
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape
loading/unloading mechanism. Since information
about the state of the mechanism is provided to the
System Control Circuit only through the Mode Switch,
it is essential that the correct relationship between
individual gears and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes that all previous procedures have
been completed.
IMPORTANT:
If any one of these alignments is not performed
properly, even if off by only one tooth, the unit will
unload or stop and it may result in damage to the
mechanical or electrical parts.
Alignment points in Eject Position
Top View
Alignment [a]
Alignment 3
Alignment 1
Loading Arm, S and T Assembly
Install Loading Arm S and T Assembly so that their
triangle marks point to each other as shown in Fig.
AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other,
install the Loading Arm T Assembly so that the last
tooth of the gear meets the most inside teeth of the
Mode Gear. See Fig. AL2.
Alignment 1
Triangle Marks
Loading Arm
T Assembly
Loading Arm
S Assembly
Last Tooth
Alignment 2
Most inside teeth
of Mode Gear
Mode Gear
Bottom View
Alignment [a] can be done independently of any
other alignment.
Alignment 1
Alignment 2
Fig. AL1
Fig. AL2
Alignment [a]
Tape Guide Assembly
Measurement of the screw must be as specified in
Fig. AL3.
Tape Guide
Assembly
Screw
3.25 – 0.1 mm
0.128 – 0.004 inch
This alignment can be
done independently of
any other alignment.
Fig. AL3
2-4-9U25NAPM
Page 58
Alignment 3
Cam Gear (A), Rack Assembly
Install the Rack Assembly so that the first tooth on
the gear of the Rack Assembly meets the first
groove on the Cam Gear (A) as shown in Fig. AL4.
Note: Both the TENSION
LEVER SUB ASSEMBLY
MK11(B27) and the TENSION
LEVER ASSEMBLY MK11
(B587) can be used.
B573
B518
B521
B585
B564
B572
B565
B574
B520
B416
MarkDescription
Floil G-374G
SANKOUL FG84M
(Yellow grease)
B148
L1406
B522
B31
B525
(Blue grease)
B3
B558
B557
B579
View
for A
B568
B559
B578
B579
B582
B580
B583
B133
B581
B551
A
B516
B584
B507
B569
B505
B488
B491
B570
B502
B513
Bottom Side (Grease point)
L1151
Bottom Side
(Grease point)
B52
Some Ref. Numbers are not in sequence.
3-1-5U25PALDEX
Page 65
Deck Mechanism View 3
L1321
B355
L1341
B347
L1321
B354
MarkDescription
Floil G-374G
Note: There are two different, but interchangeable
types of CLEANER LEVER(B359) in this model,
and have different combination with B361. Please
see Table 1 for details and combination. (Refer to
DECK PARTS LIST section.)
Table 1 (B359 and B361 Combination)
TypePart No.Part No.
A0V M411114
B
B483
B425
L1461
0VM304413
0VM305090
B360
(Blue grease)
B361B359 CLEANER LEVER
Not used
B529
Type B
B359
B562
B482
B563
L1341
B300
B529
Type A
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
3-1-6U25PALDEX
Page 66
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
have special characteristics important to safety.
!
Before replacing any of these components, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTE:
Parts that are not assigned part numbers (---------) are
not available.
Ref. No.DescriptionPart No.
A1XFRONT ASSEMBLY HC4C3ED0VM203606
A2CASE, TOP(ANTHRACITE) HC400EP0VM101078
A3CHASSIS(PAL-FTZ) HC460ED0VM000159
A4JACK BOARD(CONV) HC461BD
A5JACK BOARD(2-21P) HC460ED
A7PANEL, BOTTOM HC460ED0VM203358
A10!LABEL, RATING HC4S4ED----------
A14LABEL, SERIAL NO. H39H0JD(JPN) or0VM409906
A19LABEL, SHOW VIEW H6745EP0VM411073
1B1DECK ASSEMBLY CZD011/VM15E0N15E0FL
2B5SHEILD, CYLINDER HC460ED0VM305182
2B7SHIELD ASSEMBLY HC460ED
2B8BUSH, LED(F) H3700UD (See Electrical Parts List)
2B9CUSHION HC460ED0VM413251
2B14CUSHION(PCB) HC460ED0VM413265
2B18FIBER, TOP CASE HC460ED0VM412906
2B46ROHM HOLDER H7770JD
2B49CHASSIS FIBER HC460ED0VM413311
2L011SCREW, P-TIGHT 3X12 BIND HEAD+GBCP3120
2L012SCREW, P-TIGHT 3X12 BIND HEAD+GBCP3120
2L021SCREW, P-TIGHT M3X10 WASHER HEAD+GCMP3100
2L022SCREW, P-TIGHT M3X10 WASHER HEAD+
2L031SCREW, B-TIGHT M3X8 BIND HEAD+GBMB3080
2L041P-TIGHT SCREW 3X8 BIND +GBMP3080
2L042P-TIGHT SCREW 3X8 BIND +GBMP3080
2L051SCREW, S-TIGHT M3X5 BIND HEAD+GBMS3050
2L099SCREW, P-TIGHT M3X8 BIND HEAD+GBCP3080
S1GIFT BOX CARTON HC4S4ED0VM305809
S2STYROFOAM HC460ED0VM203356
S3UNIT, BAG V4010PA0VM406453B
X1REMOTE CONTROL UNIT 364/CRC005 orN9460ED
X2DRY BATTERY R6P/2S orXB0M451T0001
X3RF CORD PAL 1.2M orWPZ0122LG001
X4ACCESSORY BAG K8092BA0VM404632
X20A! OWNER'S MANUAL(ENGLISH) HC4S4ED0VMN03280
(See Electrical Parts List)
(See Electrical Parts List)
LABEL, BAR CODE HC4S4ED0VM414279
(See Electrical Parts List)
(See Electrical Parts List)
(See Electrical Parts List)
PACKING
ACCESSORIES
REMOTE CONTROL UNIT 364/CRC006NA173ED
DRY BATTERY(SUNRISE) R6SSE/2SXB0M451MS002
RF CABLE CC1001020012010WPZ0122LW001
Ref. No.DescriptionPart No.
X20B! OWNER'S MANUAL(DUTCH) HC4S4ED0VMN03281
X20C! OWNER'S MANUAL(FRENCH) HC4S4ED0VMN03282
200209243-2-1HC4S4CA
Page 67
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
have special characteristics important to safety.
!
Before replacing any of these components, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.Parts that are not assigned part numbers (---------)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA
Consists of the following:
MAIN CBA (MCV-A)
FUNCTION CBA (MCV-B)
VPS CBA (MCV-C)
JACK CBA (MCV-E)
SENSOR CBA
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA (MCV-A)
Consists of the following:
CAPACITORS
C002! METALLIZED FILM CAP. 0.068µF/275V K orCT2E683HJE06
!METALLIZED FILM CAP. 0.068µF/250V K orCT2E683DC011
!METALLIZED FILM CAP. 0.068µF/250V MCT2E683MS037
C025CERAMIC CAP.(AX) X K 5600pF/16VCCA1CKT0X562
C026ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C053ELECTRIC DOUBLE LAYER CAP0.047F/5.5V Z or CA0J473NE003
ELECTRIC DOUBLE LAYER CAP. 0.047F/5.5V ZCA0J473MS014
C056CERAMIC CAP.(AX) F Z 0.047µF/16VCCA1CZTFZ473
C060ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C061CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C157ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C158CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C251ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C253ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C254CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C302CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C303ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C304ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C305CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C307CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C308CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C309CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C310CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C312CERAMIC CAP.(AX) Y M 8200pF/16VCCA1CMT0Y822
200209243-3-1HC4S4EL
Page 68
Ref. No.DescriptionPart No.
C313CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C314CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C316CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C317ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C318ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C319ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C320CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C321CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C322ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C323CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
C330CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C332CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C333ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C334ELECTROLYTIC CAP. 4.7µF/25V M NP H7CP1EMAVSB4R7
C335ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C337CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C338ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C339ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C419CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C421ELECTROLYTIC CAP. 33µF/6.3V M H7CE0KMAVSL330
C422ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C424ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C425CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. CG J 220pF/50VCHD1JJ3CG221
C430ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C431CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C451ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C452ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C453CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C454ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C455ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C456CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C457ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C458ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C459ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C460CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C461ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C462CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
Ref. No.DescriptionPart No.
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C463CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C464CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C465ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C466CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C467ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C468ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C469CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C470CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C471ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C472ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C473CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C474ELECTROLYTIC CAP. 2.2µF/50V M H7CE1JMAVSL2R2
C475ELECTROLYTIC CAP. 2.2µF/50V M H7CE1JMAVSL2R2
C476ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C477ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C478ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C479ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C480ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C481CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C482CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C483ELECTROLYTIC CAP. 330µF/6.3V M H7CE0KMASSL331
C484CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C485CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
C502CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C506CERAMIC CAP.(AX) B K 100pF/50V orCCA1JKT0B101
CERAMIC CAP.(AX) B J 100pF/50VCCA1JJT0B101
C508ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C510ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C511ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C512CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C526CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C527ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C529CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C530CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C531CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C535CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C540ELECTROLYTIC CAP. 330µF/6.3V M orCE0KMASDL331
ELECTROLYTIC CAP. 330µF/6.3V MCE0KMASTL331
C543CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C561CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C622CHIP RES.(1608) 1/10W 0 Ω orRRXAZB5Z0000
CHIP RES.(1608) 1/10W 0 ΩRRXAZR5Z0000
C701CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C702CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C703ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C704CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C706CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C707ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C708CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C715CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C751CHIP CERAMIC CAP. B K 2200pF/50V orCHD1JKB0B222
CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C752CHIP CERAMIC CAP. B K 2200pF/50V orCHD1JKB0B222
C853CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C854CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C855CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C640CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C642SEMICONDUCTOR CAP. SR K 0.056µF/25V orCDA1EKS0X563
SEMICONDUCTOR CAP. SR K 0.056µF/25V12Y2563S
C643ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C644ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C645CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C648ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C649ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C105CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V orCHD1JZBFZ104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C107ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C108CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C109CHIP CERAMIC CAP. B K 2200pF/50V orCHD1JKB0B222
CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C110CHIP CERAMIC CAP. B K 2200pF/50V orCHD1JKB0B222
C11CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C12ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C13CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C14CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C15ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C16ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C17CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C19CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C20ELECTROLYTIC CAP. 3.3µF/50V M H7CE1JMASSL3R3
C21CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C22ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C24ELECTROLYTIC CAP. 0.22µF/50V M H7CE1JMASSLR22
1. There are two different, but interchangeable types of
CLEANER LEVER(B359) in this model, and have
different combination with B361. Please see Table 1
for details and combination.
Table 1 (B359 and B361 Combination)
B359 CLEANER LEVERB361
TypePart No.Part No.
A0VM3044130VM411114
B0VM305090Not used
2. There are two different types of RACK
ASSEMBLY(B555), and have different combination
with B514. Please see Table 2 for details and
combination.
Table 2 (B555 and B514 Combination)
Carved Seal on
Chassis
(see below)
TypePart No.Part No.
“1xx” or “2xx”A0VSA120710VM412597
“3xx” or “4xx”B0VSA128870VM411535
B555
RACK ASSEMBLY
B514
Carved Seal on Chassis
Top View
Ref. No.DescriptionPart No.
B2CYLINDER ASSEMBLY MK11 PAL 4HD HIFI orN1567CYL
CYLINDER ASSEMBLY(V) MK11 PAL 4HD HIFIN1569CYL
B3LOADING MOTOR ASSEMBLY MK110VSA12093
B8PULLEY ASSEMBLY MK110VSA12078
B9MOVING GUIDE S PREPARATION MK100VSA11002
B10MOVING GUIDE T PREPARATION MK100VSA11004
B11LOADING ARM T(B) ASSEMBLY MK110VSA12110
B12LOADING ARM S(B) ASSEMBLY MK110VSA12109
B27TENSION LEVER SUB ASSEMBLY MK110VSA12076A
B31AC HEAD ASSEMBLY MK110VSA12074
B35TAPE GUIDE ASSEMBLY MK110VSA12069
B37CAPSTAN MOTOR 288/VCCM011N9661CML
Ref. No.DescriptionPart No.
B52CAP BELT MK100VM411138
B73FE HEAD ASSEMBLY MK11 orN9742FEL
FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD ASSEMBLY MK11 orN9743FEL
FE HEAD(MK11) VTR-1X2ERS11-148DHVEC01TE004
B74PRISM MK100VM202870
B121WORM MK110VM412544
B126PULLEY MK110VM412543
B133IDLER ASSEMBLY(2) MK100VSA11531
B148TG CAP MK60VM407664C
B300C DRIVE LEVER R MK110VM305068
B303F DOOR OPENER MK110VM203299
B347GUIDE HOLDER A MK100VM304920
B354SLIDER R MK110VM101040
B355SLIDER L MK110VM203296
B359CLEANER LEVER MK10 or0VM304413
CLEANER LEVER MK110VM305090
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBLY(Y) MK11 or0VSA12807
PINCH ARM(A) ASSEMBLY(M) MK11 or0VSA12808
PINCH ARM(A) ASSEMBLY(F) MK110VSA12809
B411PINCH SPRING MK100VM411092
B414M BRAKE S(HI) ASSEMBLY MK110VSA12225
B416M BRAKE T(HI) ASSEMBLY MK110VSA12226
B417TENSION SPG(190256) MK110VM413624
B425LOCK LEVER SPRING MK100VM411110
B426KICK PULLEY MK100VM411095
B482C PLATE MK110VM203297
B483LOCK LEVER MK100VM411109D
B487BAND BRAKE MK100VM304416B
B488MODE LEVER(HI) MK110VM101042L
B491CAM GEAR(A) MK110VM101044
B492MODE GEAR MK110VM305074
B494DOOR OPENER B MK110VM305072
B499T LEVER HOLDER MK100VM304419
B501WORM HOLDER MK110VM305067
B502CAM GEAR(B) MK100VM304403
B505PSCW(625504) MK110VM413288
B507REEL WASHER MK9 5*2.1*0.50VM410058
B508S BRAKE SPRING(19T) MK110VM413581
B513PSCW(752605) MK100VM411516
B514SCREW RACK MK11 or0VM412597
SCREW RACK MK100VM411535
B516REEL WASHER MK9 5*2.1*0.50VM410058
B518P.S.W CUT 1.6X4.0X0.5T0VM408485A
B520T BRAKE SPRING HI(F) MK110VM412778
B521SOFT SPRING MK100VM411122
B522TG POST ASSEMBLY MK100VSA11012
B525LDG BELT MK110VM412804
B529CLEANER ASSEMBLY MK110VSA12086
B551FF ARM(HI) MK100VM304438L
B553REV SPRING MK110VM412555
B555RACK ASSEMBLY MK11 or0VSA12071
RACK(T1.2) ASSEMBLY MK110VSA12887
B557MOTOR PULLEY U50VM403205A
B558LOADING MOTOR M31E-1 R14 7351MMDZB12MM002
200209243-4-1HC4S4DPL
Page 80
Ref. No.DescriptionPart No.
B559CLUTCH ASSEMBLY(HI)(2) MK110VSA12367
B560KICK SPRING MK100VM411475A
B562C DRIVE LEVER L MK100VM304408
B563SLIDER SHAFT MK100VM411112
B564M GEAR(HYT) N12G5F*0VM412378
B565SENSOR GEAR MK110VM305080
B567PINCH ARM(B) MK100VM304396
B568BT ARM MK100VM304417H
B569CAM HOLDER F MK110VM305075
B570CAM RACK SPRING(HI) MK110VM412923
B571P.S.W F 6*2.55*0.50VM402629A
B572P.S.W CUT 1.6X4.0X0.5T0VM408485A
B573REEL S MK110VM203436
B574REEL T MK100VM202872C
B578TR GEAR A MK100VM304440
B579TR GEAR B MK100VM304441C
B580TR GEAR C MK110VM305094
B581CENTER GEAR(HYT) N12G5F* or0VM412379
CENTER GEAR MK110VM305081
B582TR GEAR SPRING MK100VM411187
B583REEL WASHER MK9 5*2.1*0.50VM410058
B584TR GEAR SHAFT MK100VM411186
B585PSW(317505) MK110VM413663
B587TENSION LEVER ASSEMBLY MK110VSA12075A
L1051SCREW, B-TIGHT M2.6X6 PAN HEAD+GPMB9060
L1053SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1151SCREW, SEMS M2.6X4 PAN HEAD+CPM39040
L1191SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1321SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
L1341SCREW, P-TIGHT M2.6X6 BIND HEAD+GBMP9060
L1406AC HEAD SCREW MK90VM410964
L1450SCREW, SEMS M2.6X5 PAN HEAD+CPM39050
L1461SCREW, P-TIGHT M2.6X6 WASHER HEAD+GCMP9060
L1466SCREW, S-TIGHT M2.6X6 BIND HEAD+GBMS9060
L1467SCREW, S-TIGHT M2.6X5 WASHER HEAD+GCMS9050
L1468SCREW, B-TIGHT M1.7X12GAMB7120
200209243-4-2HC4S4DPL
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25A-664
HC4S4ED
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