Important Safety Precautions............................................................................................................................. 1-2-1
Standard Notes for Servicing............................................................................................................................. 1-3-1
Preparation for Servicing ................................................................................................................................... 1-4-1
Function Indicator Symbols................................................................................................................................ 1-7-11
Schematic Diagrams / CBA’ s and Test Points .................................................................................................. 1-8-1
IC Pin Function ...................................................................................................................................................1-11-1
Lead Identifications............................................................................................................................................ 1-12-1
MAIN SECTION
VIDEO CASSETTE RECORDER
23C-250 / 23C-250A
Sec. 1: Main Section
● Specifications
● Preparation for Servicing
● Adjustment Procedures
● Schematic Diagrams
● CBA’ s
H7700CVR
Page 3
SPECIFICATIONS
DescriptionUnitMinimumNominalMaximumRemark
1. Video
1-1. Video Output (PB)Vp-p0.81.01.2FL6A
1-2. Video Output (R/P)Vp-p0.81.01.2
1-3. Video S/N Y (R/P)
1-4. Video Color S/N AM (R/P)dB3741SP Mode
1-5. Video Color S/N PM (R/P)dB3036SP Mode
1-6. Resolution (PB)Line230245SP Mode
4-1. Video output Vp-p0.81.01.2E-E Mode
4-2. Video S/N dB3942E-E Mode
4-3. Audio output dB-10-6-2E-E Mode
4-4. Audio S/N dB4046E-E Mode
dB4045
SP Mode,
W/O Burst
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop slightly below these specs. Limit specs represent the absolute worst condition that still might be
considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1H8740SP
Page 4
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection they
give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc. Parts
that have special safety characteristics are identified by
a ! on schematics and in parts lists. Use of a substitute replacement that does not have the same safety
characteristics as the recommended replacement part
might create shock, fire, and/or other hazards. The
Product’s Safety is under review continuously and new
instructions are issued whenever appropriate. Prior to
shipment from the factory, our products are carefully
inspected to confirm with the recognized product safety
and electrical codes of the countries in which they are
to be sold. However, in order to maintain such compliance, it is equally important to implement the following
precautions when a set is being serviced.
Precautions during Servicing
A.Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B.In addition to safety, other parts and assemblies are
specified for conformance with regulations applying
to spurious radiation. These must also be replaced
only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C.Use specified internal wiring. Note especially:
1) Wires covered with PVC tubing
2) Double insulated wires
3) High voltage leads
D.Use specified insulating materials for hazardous live
parts. Note especially:
1) Insulation tape
2) PVC tubing
3) Spacers
4) Insulators for transistors
E.When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of wires
securely about the terminals before soldering.
F. Observe that the wires do not contact heat produc-
ing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.).
G.Check that replaced wires do not contact sharp
edges or pointed parts.
H.When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I.Also check areas surrounding repaired locations.
J.Use care that foreign objects (screws, solder drop-
lets, etc.) do not remain inside the set.
K.Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent
shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends of
the wires. If the wires are stranded, twist the strands
to avoid frayed conductors.
3)Align the lengths of the wires to be connected. Insert
the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the complete closure
of the tool.
L.When connecting or disconnecting the internal con-
nectors, first, disconnect the AC plug from the AC
outlet.
1-2-1H8740SFP
Page 5
Safety Check after Servicing
Examine the area surrounding the repaired location for
damage or deterioration. Observe that screws, parts,
and wires have been returned to their original positions.
Afterwards, do the following tests and confirm the specified values to verify compliance with safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
230 V
≥ 3mm(d)
≥ 6 mm(d’)
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
2. Leakage Current Test
Confirm the specified (or lower) leakage current between B (earth ground, power cord plug prongs) and
externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and output terminals, microphone jacks, earphone jacks, etc.) is lower
than or equal to the specified value in the table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC
voltmeter to measure across the terminals of load Z.
See Fig. 2 and the following table.
Table 2 : Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
230 V
2kΩ RES.
Connected in
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
AC Voltmeter
(High Impedance)
Fig. 1
Fig. 2
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-2-2H8740SFP
Page 6
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a.The output pin of the 3 pin Regulator ICs is indicated
as shown.
Top View
Out
b.For other ICs, pin 1 and every fifth pin are indicated
as shown.
Input
In
Bottom View
5
Pin 1
10
c.The 1st pin of every male connector is indicated as
shown.
Pin 1
Instructions for Connectors
1.When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect the
AC cord.
2.FFC (Flexible Foil Connector) cable should be inserted parallel into the connector, not at an angle.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
(1)Prepare the hot-air flat pack-IC desoldering ma-
chine, then apply hot air to the Flat Pack-IC (about
5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
(2)Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3)Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Release the flat pack-IC from the CBA using tweez-
ers. (Fig. S-1-6)
Caution:
1.Do not supply hot air to the chip parts around the flat
pack-IC for over 6 seconds because damage to the
chip parts may occur. Put masking tape around the
flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
2.The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
1-3-1NOTE_1
Machine
Flat Pack-IC
Fig. S-1-2
Page 7
With Soldering Iron:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(4)Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5)Release the flat pack-IC from the CBA using tweez-
ers. (Fig. S-1-6)
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
(2)Lift each lead of the flat pack-IC upward one by one,
using a sharp pin or wire to which solder will not
adhere (iron wire). When heating the pins, use a fine
tip soldering iron or a hot air desoldering machine.
(Fig. S-1-4)
Sharp
Pin
Note:
When using a soldering iron, care must be taken to
ensure that the flat pack-IC is not being held by glue.
When the flat pack-IC is removed from the CBA,
handle it gently because it may be damaged if force
is applied.
Hot Air Blower
or
Iron Wire
Soldering Iron
To Solid
Mounting Point
Fig. S-1-5
Fine Tip
Fig. S-1-4
Soldering Iron
(3)Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Release the flat pack-IC from the CBA using tweez-
ers. (Fig. S-1-6)
With Iron Wire:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting point,
as shown in Fig. S-1-5.
(3)While heating the pins using a fine tip soldering iron
or hot air blower, pull up the wire as the solder melts
so as to lift the IC leads from the CBA contact pads
as shown in Fig. S-1-5.
CBA
Tweezers
Fine Tip
Soldeing Iron
Flat Pack-IC
Fig. S-1-6
1-3-2NOTE_1
Page 8
2. Installation
(1)Using desoldering braid, remove the solder from the
foil of each pin of the flat pack-IC on the CBA so you
can install a replacement flat pack-IC more easily.
(2)The " ● " mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
pre- solder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
(3)Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " ● " mark.
Fig. S-1-7
Instructions for Handling
Semiconductors
Electrostatic breakdown of the semiconductors may
occur due to a potential difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1MΩ) that is properly
grounded to remove any static electricity that may be
charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate with
proper grounding (1MΩ) on the workbench or other
surface, where the semiconductors are to be placed.
Because the static electricity charge on clothing will not
escape through the body grounding band, be careful to
avoid contacting semiconductors with your clothing.
< Incorrect >
CBA
Presolder
Flat Pack-IC
CBA
< Correct >
Grounding Band
Fig. S-1-8
1MΩ
CBA
1MΩ
Conductive Sheet or
Copper Plate
1-3-3NOTE_1
Page 9
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start and
End Sensors on this equipment. Carefully read and
follow the instructions below. Otherwise the unit may
operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Assembly and
press the PLAY button. The tape will be loaded into the
Deck Mechanism Assembly. Make sure the power is
on, connect TP502 (SENSOR INHIBITION) to GND.
This will stop the function of Tape Start Sensor, Tape
End Sensor and Reel Sensors. (If these TPs are connected before plugging in the unit, the function of the
sensors will stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape all the way to the start or the end of the
tape to avoid tape damage.
About REC-Safety Switch
Caution:
The REC-Safety Switch is directly mounted on the Main
CBA. When the Deck Mechanism Assembly is removed
from the Main CBA for servicing, this switch does not
work automatically.
What to do for preparation
In order to record, press the Rec button while pushing
REC-SAFETY SW on the Main CBA. See Fig. 1.
CN501
Q504
CN504
CN251
SW506
CN506
Q503
CN503
TP502
S-INH
(REC-SAFETY SW)
Fig. 1
1-4-1H8740PFS
Page 10
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and dress
the cables as they were originally.
[1] Top Case
[2] Front Assembly
[3] Jack CBA
[4] Function CBA[5] Deck Assembly
[7] REC Arm Assembly
[8] Main CBA
[6] Cylinder Shield
Disassembly Method
REMOVAL
ID/
LOC.
No.
[1]Top Case16(S-1)-
[2]
[3]Jack CBA33(S-2), (CN101)-
[4]
[5]
[6]
[7]
[8]Main CBA63(S-5), *2(L-4)3
↓
➀
PART
Front
Assembly
Function
CBA
Deck
Assembly
Cylinder
Shield
REC Arm
Assembly
↓
➁
REMOVE/
Fig.
*UNHOOK/UNLOCK/
No.
RELEASE/UNPLUG/
DESOLDER
2*3(L-1), *4(L-2)
2, 4 *(L-3), (CN505)
5,76(S-3), Spacer
*(CN251, CN501,
CN503, CN504,
CN506)
52(S-4)
5----------
↓
➂
↓
➃
Note
-
1
2, 4
-
-
↓
➄
1 : Identification (location) No. of parts in the figures
2 : Name of the part
3 : Figure Number for reference
4 : Identification of parts to be removed, unhooked, un-
locked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
5 :Refer to "Reference Notes."
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile. Be
careful not to break them.
1. Disconnect Connector (CN505) to remove Function
CBA. Hold Main CBA while pulling up on the Function CBA. (Fig. 4)
2. Remove six Screws (S-3) and the Spacer. Then
slowly lift the Deck Assembly up. Lifting Deck Assembly disconnects five Connectors (CN251,
CN501, CN503, CN504, CN506) . (Fig. 5)
3. When reassembling the unit, always reinsert Locking Tabs (L-4), and then reinstall Screws (S-5).
These screws are critical for proper shielding of the
Main CBA. (Fig. 7)
4. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CBA as shown in
Fig. 7. Then, install the Deck Assembly while aligning the hole of Cam Gear with the pin of LD-SW, the
shaft of Cam Gear with the hole of LD-SW as shown
in Fig. 7.
1-5-1H8740DC
Page 11
(S-1)
(S-1)
[1]Top Case
(L-3)
Lift PCB up and
over tab
[4] Function CBA
(L-2)
(L-2)
(S-1)
Fig. 1
[4]Function C.B.A.
[8] Main CBA
(S-3)
[7]REC Arm
Assembly
Spacer
CN505
Fig. 4
(S-3)
[5]Deck Assembly
(S-4)
[6]Cylinder
Shield
(L-1)
(S-2)
CN101
(S-2)
[2]Front Assembly
Fig. 2
(S-2)
[3] Jack CBA
Fig. 3
CN501
CN251
CN503
CN504
CN506
Fig. 5
1-5-2H8740DC
Page 12
(S-5)
(L-4)
Triangle Marks
[8]Main C.B.A.
(L-4)
Fig. 6
SW507
LD-SW
[5]Deck Assembly
Cam Gear
Shaft
Hole
LD-SW
Hole
Pin
[8]Main C.B.A.
[8]Main C.B.A.
Fig. 7
1-5-3H8740DC
Page 13
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for "Circuit
Board Assembly".
Notes:
1.Electrical adjustments are required after replacing
circuit components and certain mechanical parts. It
is important to do these adjustments only after all
repairs and replacements have been completed.
Also, do not attempt these adjustments unless the
proper equipment is available.
2.To perform these alignment / confirmation procedures, make sure that the tracking control is set in
the center position: Press either channel "▼" or "▲"
button first, then the " PLAY " button (VCR’s Front
Panel only).
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe, V-Range:
0.001~50V/Div., F-Frange: AC~DC-20MHz
2.Alignment Tape ( FL6A )
1. Head Switching Position
Adjustment
Purpose: To determine the Head Switching point dur-
ing playback.
Symptom of Misadjustment: May cause Head
Switching noise or vertical jitter in the picture.
Test PointAdj. PointModeInput
TP751(V-OUT)
TP502(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501 (SW-P)
Measurement
Equipment
TP751
GND
PLAY
(SP)
6.5H±1H
(412.7±60µs)
Oscilloscope
CH1 CH2
----
Spec.
TP502
Figure 1
EXT. Synchronize Trigger Point
CH1
6.5H
CH2
Switching Pulse
Reference Note:
TP502, TP751, VR501 : Main CBA
• Play back the test tape and adjust VR501 so that the
V-sync front edge of the CH1 video output waveform is at the 6.5H(412.7µs) delayed position from
the rising edge of the CH2 head switching pulse
waveform.
Trig. (+)
V-Sync
0.5H1.0H
1-6-1H8740EA
Page 14
M
M
CN506
DRUM
MOTOR
PG
SENSOR
1LD-M(-)
2LD-M(+)
LOADING
MOTOR
CONTROL
HEAD
CN287
58CTL(+)
69CTL(-)
CN504
CN504
1C-F/R
2P-ON+5V
3
AL+15V/+12V
4C-FG
5C-POW-SW
6C-DRIVE
7
FG-GND
8CM-GND
CN503
CAPSTAN
MOTOR
CYLINDER ASSEMBLY
LOADING MOTOR ASSEMBLY
AC HEAD ASSEMBLY
MAIN CBA
CAPSTAN MOTOR
KEY-2
RF-SW
C-FG
D-FG
D-PG
PB-CTL
ST-S
T-REEL
C-CONT
C-F/R
KEY-1
V-ENV
REMOCON
REC-CTL(+)
RESET
C-ROTA
D-REC-H
D-REC-H
PG-DELAY
A-MUTE-H
I2C BUS SCL-2
I2C BUS SDA-2
A-MUTE-H
RF-SW
V-ENV
I2C BUS SCL-1
I2C BUS SDA-1
C-ROTA
END-S
IC501
(SERVO/SYSTEM CONTROL)
1
53
52
54
19
REC-CTL(-)
20
51
75
68
49
34
66
55
71
17
15
70
9
10
62
60
5
73
72
RS501
REMOTE
SENSOR
LMFWD/REV
59
D-CONT56
AL+5V
P-ON+5V
D555
S-LED
(MEMORY)
IC505
(DRUM /LOADING MOTOR DRIVE)
IC506
IC503
Servo/System Control Block DiagramBLOCK DIAGRAMS
END-S
END-S
T-REEL
ST-S
Q503
Q504
Q501
RESET
SW508
RESET
Q506
S-REEL
50
C-POW-SW46
SW-POINT
AL+5V
VR501
TIMER+5V
TP506
S-REEL
PS502
DEC-L
DEC-L
79
SECAM-H
23
TRICK-H
47
SECAM-CHARA-H
2
SECAM-H
TRICK-H
SECAM-CHARA-H
I2C BUS SCL-1
I2C BUS SDA-1
I2C BUS SCL-1
I2C BUS SDA-1
TO VIDEO
BLOCK
TO AUDIO
BLOCK
I2C BUS SDA-1
I2C BUS SCL-1
TO JACK
BLOCK
22KEY-2
KEY
SWITCH
KEY SWITCH
TP501
GND
TP507
S-INH
CN651CN505
FUNCTION CBA
1-7-11-7-2H8743BLS
SCL
SDA
TU701
SCL
SDA
6
5
25
24
22
21
16
15
10
9
8
14
17
4
2
18
14
20
LD-SW74
DRUM
MOTOR
DRIVE
DRIVE
LOADING
MOTOR
CONTROL
+
-
+
-
13
12
+
-
P-ON+5V
AL+15V/+12V
SCL
SDA
4
AL+5V
SW507
LD-SW
(1/3)
TP501
CTL
11
5
12
3
(DECK ASSEMBLY)
9
M
REC-SAF-SW 25
SW506
REC-SAFETY
AL+5V
G1
G6
P1
P6
P7
83
88
93
98
92
P10
89
FIP501
F I P
1D-W
2D-V
3D-U
4D-COM
5PG-IN
Page 15
VIDEO (L) HEAD
CYLINDER ASSEMBLY
VIDEO (R) HEAD
V(L)
V-COM
V(R)
CN251
1
2
3
10
Video Block Diagram
1-7-31-7-4H8743BLV
(DECK ASSEMBLY)
BUFFER
Q305
BUFFER
Q308
C-SYNCC-SYNC
OSD-BB-OUT
C-ROTA
TU701
CN751
TO CN101
FROM/TO
JACK BLOCK
TP751 V-OUT
TU-VIDEO
24
26
FBC
VXO
CHARA
INS.
Y/C
MIX
PIC-CTL
ANR
KILL
B.D.
AMP
NOISE
CANCELMDE EMPA
CCD 1H
DELAY
1/2
Y-LPF
CLAMP
L
R
REC FM
AGC
PB FM
AGC
FM
DEMOD.
DOUBLE
LIMIT
V/I
CONV
SUB
LPF
SERIAL
DECORDER
11
93
V-ENV
RF-SW
TO
SERVO/SYSTEM
CONTROL BLOCK
C-ROTA
ENV DET
TP502
RF-SW
TO
SERVO/SYSTEM
CONTROL BLOCK
I2C BUS SDA-1
I2C BUS SCL-1
C-LPF
R P
R
P
R P
R P
R/P
B/B
R
P
DOC YNR Y/C COMB
ACC
B-UP
AMP
MAIN
CONV
R
R
P
P
R P
SUB
CONV
4.43MHz
629KHz
2124 2320
IC301
IC501
(Y/C PROCESS)
2967 6649
X302
4.43MHz
43
45
4641
Q307
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
BUFFER
Q304
Q371
Q372
BUFFER
88
89
90
91
7271575954 52 51 61
28
D-V SYNCD-V SYNC
25
27
21
31
30
33
OSD-CHARA-OUT
38
17
19
18
MAPBPF
BPF
D.E.
NL
EMPHA
C-COMBCOMB
AMP
CCD
LPF
BPF
KIL
Q302,
Q303
PEAKING
AMP
V-OUT
7
V-IN5
TU-VIDEO 19
3231
EE
AGC
CLAMP
REC
FM-EQ
PB
FM-EQ
FM
MOD
DETAIL
ENH
W/D
CLIP
CLAMP
MAIN CBA
74
WF2
WF1
IC370 (PAL/SECAM DECTECOTR)
VXO/XO/OUT2 5
VIDEO-SW
3
C-PB
PAL/SECAM
DETECTOR
9
5
3
9
TRICK-H8
REC-C OUT
10
C-SYNC1
8
10
1
SECAM-H77
SECAM CBA
CN370CN371
2
15
13
1
17
27
26
26
TRICK-H
TO SERVO/SYSTEM
CONTROL BLOCK
SECAM-H
TP301 C-PB
WF5
BUFFER
Q311
AMP
Q310
Q309
SECAM-CHARA-H
BUFFER
BUFFER
Page 16
Audio Block Diagram
98
REC
AMP
7
6
AUTO
BIAS
99
P-ON+5V
P-ON+5V
Q401
BIAS
OSC
Q402
Q404 (PB=ON)
Q405
(PB=ON)
Q403
SWITCHING
D-REC-OFF
4
EQ
AMP
100
1
2
LINE
AMP
MUTE
96
3
PB-ON
SP/LP-ON
P
R
ALC
IC301
(AUDIO PROCESS)76
TU701
TU-AUDIO
21
J981
A-OUT
7 A-PB/REC
CN504
6 A-COM
4 AE-H
5 FE-H
A-PB/REC 4
A-COM3
AE-H1
AE-H/FE-H 2
CN287
AUDIO
HEAD
AUDIO
ERASE
HEAD
ACE HEAD ASSEMBLY
FE HEAD
1 FE-H
2 FE-H-GND
CN501
1-7-51-7-6H8743BLA
MAIN CBA
PB-AUDIO SIGNALREC-AUDIO SIGNALMode : SP/REC
1030
D-REC-H
A-MUTE-H
I2C BUS SCL-1
I2C BUS SDA-1
TO SERVO/SYSTEM
CONTROL BLOCK
FULL
ERASE
HEAD
23 24
SERIAL
DECODER
CN751
TO CN101
TO
JACK BLOCK
TU-AUDIO
13
A-OUT3
A-IN1
(DECK ASSEMBLY)
Page 17
2
4
16
6
7
Power Supply Block Diagram
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
The following symbols will appear on the indicator panel to indicate the current mode or operation of the VCR.
On-Screen modes will also be momentarily displayed on the TV screen when you press the operation buttons.
Display panel
PWR.
AM
PM
VCR
LED MODEINDICATOR ACTIVE
CASSETTE "IN"
CASSETTE "OUT"
CLOCK" 88:88 "ON
POWER ON" PWR. "ON
REC" REC "ON
REC PAUSE" REC "Blinks at 0.8Hz interval
T-REC, OTR" "ON
When reel and capstan mechanism is not
functioning correctly
When tape loading mechanism is not
functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly " "
P-ON Power safety detection" "
COUNTER" -8:88:88 "ON
VPS/PDC"ON"
"OFF"
" "
" "
" "
" No.1 "
" "
" No.2 "
" "
" No.3 "
" No.4 "
" "
" No.5 "
" "
" "
ON
OFF
(T-REC OFF, T-REC incomplete
Blinks at 0.8Hz interval)
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
Blinks at 0.8Hz interval
ON
OFF
1-7-11H8743FIS
Page 20
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage, etc.
Replacement parts that have these special safety characteristics are identified in this manual and its supplements; electrical components having such features are
identified by the mark " !" in the schematic diagram
and the parts list. Before replacing any of these components, read the parts list in this manual carefully. The
use of substitute replacement parts that do not have the
same safety characteristics as specified in the parts list
may create shock, fire, or other hazards.
Capacitor Temperature Markings
Mark
(B)±10%20°C-25~+85°C
Capacity
change rate
Standard
temperature
Temperature
range
Note:
1.Do not use the part number shown on these drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2.
All resistance values are indicated in ohms (K=10
6
M=10
3.Resistor wattages are 1/4W or 1/6W unless otherwise specified.
4.All capacitance values are indicated in µF
(P=10
5.All voltages are DC voltages unless otherwise specified.
6.Electrical parts such as capacitors, connectors, diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits
are not shown for each component. In each block
of the diagram, there is a note such as shown below
to indicate these abbreviated two digits.
Capacitors and transistors are represented by the following symbols.
CBA Symbols
(Top View) (Bottom View)
+
Electrolytic Capacitor
-
(Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
NPN Transistor
(Top View)
PNP Transistor
Schematic Diagram Symbols
Digital Transistor
E C B
(Top View)
NPN Digital Transistor
E C B
E C B
(Top View)
PNP Digital Transistor
E C B
1-8-1SCPA1
Page 21
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAGES:
1. CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power
supply circuit to fail.
3. Note:
(1)Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2)To maintain original function and reliability of repaired units, use only original replacement parts which are listed
with their part numbers in the parts list section of the service manual.
4. Wire Connectors
(1)Prefix symbol "CN" means "connector" (can disconnect and reconnect).
(2)Prefix symbol "CL" means "wire-solder holes of the PCB" (wire is soldered directly).
5. Note: Mark "•" is a leadless (chip) component.
6. Mode: SP/REC
7. Voltage indications for PLAY and REC modes on the schematics are as shown below:
PLAY mode
REC mode
5.0
The same voltage for
both PLAY & REC modes
231
5.0
(2.5)
Indicates that the voltage
is not consistent here.
8. How to read converged lines
1-D3
3
AREA D3
Distinction Area
Line Number
2
(1 to 3 digits)
Examples:
1
1-D3
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
ABCD
Unit: Volts
1-B1
AREA B1
9. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-8-2SCRK05
Page 22
1-8-3
1-8-41-8-5
H8624SCM1
Main 1/4 Schematic Diagram
Page 23
1-8-6
1-8-7
1-8-8
H8624SCM2
Main 2/4 Schematic Diagram
Page 24
1-8-91-8-10
1-8-11H8624SCM3
Main 3/4 Schematic Diagram
Page 25
1-8-12
1-8-131-8-14
H8624SCM4
Main 4/4 Schematic Diagram
Function Schematic Diagram
H8743SCF
Page 26
1-8-151-8-16
Jack Schematic Diagram
H8622SCJ
Page 27
1-8-171-8-18
SECAM Schematic Diagram
H8624SCS
Page 28
TP501
CTL
TP507
S-INH
WF1
TP751
V-OUT
VR501
SW-P
TP502
RF-SW
WF2
TP301
C-PB
WF5
J981
A-OUT
BH8700F01011-A
1-8-19
1-8-201-8-21
Main CBA Top View
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
NOTE :
THE VOLTAGE FOR PARTS IN HOT CIRCUIT IS MEASURED USING
HOT GND AS A COMMON TERMINAL.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE FUSE.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Page 29
1-8-221-8-231-8-24
BH8700F01011-A
Main CBA Bottom View
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
NOTE :
THE VOLTAGE FOR PARTS IN HOT CIRCUIT IS MEASURED USING
HOT GND AS A COMMON TERMINAL.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE FUSE.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Standard Maintenance....................................................................................................................................... 2-1-1
Service Fixtures and Tools................................................................................................................................. 2-2-1
Disassembly / Assembly Procedures of Deck Mechanism ................................................................................ 2-4-1
Alignment Procedures of Mechanism ................................................................................................................ 2-4-9
DECK MECHANISM
SECTION
VIDEO CASSETTE RECORDER
23C-250 / 23C-250A
Sec. 2: Deck Mechanism Section
● Standard Maintenance
● Alignment for Mechanism
● Disassembly/Assembly of Mechanism
● Alignment Procedures of Mechanism
H7700CVR
Page 40
STANDARD MAINTENANCE
Service Schedule of Components
H: Hours ❍: Check ●: Change
DeckPeriodic Service Schedule
Ref. No.Part Name1,000 H2,000 H3,000 H4,000 H
B2Cylinder Assembly❍●❍●
B3Loading Motor Assembly●
B8Pulley Assembly●●
B27Tension Lever Sub Assembly●●
B31AC Head Assembly●
B573, B574 Reel (S), Reel (T)●
B37Capstan Motor ●●
B52Cap Belt●●
*B73FE Head●
B133Idler Assembly●●
B410Pinch Arm (A) Assembly●●
B414M Brake S Assembly●●
B416M Brake T Assembly●●
B525LDG Belt ●●
Notes:
1. Clean all parts for the tape transport (Upper Drum with Video Head / Pinch Roller / Audio Control Head / Full
Erase Head) using 90% Isopropyl Alcohol.
2. After cleaning the parts, do all DECK ADJUSTMENTS.
3. For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ VCR Model only
2-1-1MENT_03
Page 41
Cleaning
Cleaning of Video Head
Clean the head with a head cleaning stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2. Put on a glove (thin type) to avoid touching the upper
and lower drum with your bare hand.
3.Put a few drops of 90% Isopropyl alcohol on the
head cleaning stick or on the chamois cloth and, by
slightly pressing it against the head tip, turn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard material, but since it is very thin, avoid cleaning it vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of Audio Control Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% isopropyl alcohol and
clean the audio control head. Be careful not to
damage the upper drum and other tape running
parts.
Notes:
1.Avoid cleaning the audio control head vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit or damage may occur.
A/C Head
Upper
Cylinder
Do Not !
Video Head
Cleaning Stick
2-1-2MENT_03
Page 42
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2J-2
J-3
J-5
Ref. No. NamePart No.Adjustment
J-1-1Alignment Tape FL6AHead Adjustment of Audio Control Head
J-1-2Alignment Tape FL6N8
Azimuth and X Value Adjustment of Audio Control
Head / Adjustment of Envelope Waveform
A/C Head Height
X Value
J-4
2-2-1U23FXPA
Page 43
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignment for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Insert a cassette tape. Though the tape will not be
automatically loaded, make sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, lightly push the cassette
tape further in and see if the tape comes back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or two to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the Moving guide preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 until the Moving guide preparations come to the Eject Position. Stop turning
when the preparations begin clicking or can not
be moved further. However, the tape will be left
wound around the cylinder.
5. Turn the LDG Belt in the appropriate direction continuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place the Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the locking tabs
shown in Fig. M1 and continue turning the LDG
Belt until the Cassette Holder comes to the tapeloaded position. Allow a minute or two to complete this task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1H8740MA
Page 44
1. Tape Interchangeability Alignment
Note:
To do these alignment procedures, make sure that the
Tracking Control Circuit is set to the center position
every time a tape is loaded or unloaded. (Refer to page
2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (pg. 2-3-3)
1-A
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
Adjust the X Value for maximum envelope.
(pg. 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (pg. 2-3-4)
Check the envelope.
OK
Adjust the Audio Section.
(Azimuth Alignment) (pg. 2-3-4)
Check the audio output.
OK
Check the following:
1. X Value (pg. 2-3-3)
2. Envelope (pg. 2-3-4)
OK
1-A
1-B
1-C
1-C
1-D
1-D
1-B, 1-C
Not good
Not good
Not good
Not good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Completion
Adjust the X value and envelope.
1-B, 1-C
1-A
2-3-2H8740MA
Page 45
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this procedure.
If the unit is not correctly aligned, the tape may be
damaged.
1. Play back a blank cassette tape and check to see
that the tape runs without creasing at Guide Rollers [2] and [3], and at points A and B on the lead
surface. (Refer to Fig M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the top of Guide Rollers [2] and
[3] with a Guide Roller Adj. Screwdriver. (Refer to
Fig. M3 and M5.)
Note: Beneath each Guide Roller, there is a
small screw. (Refer to Fig. M5.) This screw works
Guide Roller [2]
Guide Roller [3]
to apply adequate torque to the shaft of each
Guide Roller so that the Guide Roller turns properly. Even when adjusting the height of the Guide
Roller(s), do not touch these two small screws.
3. Check to see that the tape runs without creasing at
Take-up Guide Post [4] or without snaking between Guide Roller [3] and AC Head.
(Fig. M3 and M5)
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the AC Head. (Fig. M6)
Azimuth Adj. Screw
AC Head
X-Value Adj.
Screwdriver
Tilt Adj. Screw
Fig. M6
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Small Screw
Take-up Guide
Tape
Post
B
AC Head
Tape
Incorrect
Fig. M3
Fig. M4
1-B. X Value Alignment
Purpose:
To align the Horizontal Position of the Audio/Control/Erase Head.
Symptom of Misalignment:
If the Horizontal Position of the Audio/Control/Erase
Head is not properly aligned, maximum envelope cannot be obtained at the Neutral position of the Tracking
Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) and
TP501 (CTL) on the Main CBA. Use TP502 (RFSW) as a trigger.
2. Play back the Gray Scale of the Alignment Tape
(FL6N8) and confirm that the PB FM signal is present.
3. Set the Tracking Control Circuit to the center position by pressing the CH UP button then the PLAY
button on the VCR. (Refer to note on bottom of
page 2-3-4.)
4. Use the X-Value Adj. Screwdriver so that the PB FM
signal at TP301 (C-PB) is maximum. (Fig. M6)
5. Press CH UP button on the VCR until the CTL waveform has shifted by approx. +2msec. Make sure
that the envelope is simply attenuated (shrinks in
height) during this process so that you will know
the envelope has been at its peak.
Fig. M5
2-3-3H8740MA
Page 46
6. Press CH DOWN button on the VCR until the CTL
waveform has shifted from its original position (not
the position achieved in step 5, but the position of
CTL waveform in step 4) by approximately
-2msec. Make sure that the envelope is simply attenuated (shrinks in height) once CTL waveform
passes its original position and is further brought
in the minus direction.
7. Set the Tracking Control Circuit to the center position by pressing the CH UP button and then the
PLAY button on the VCR.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture and precise tracking.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracking will then lose precision and the
playback picture will be distorted by any slight variation
of the Tracking Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) on the
Main CBA. Use TP502 (RF-SW) as a trigger.
2. Play back the Gray Scale on the Alignment Tape
(FL6N8). Set the Tracking Control Circuit to the
center position by pressing the CH UP and then
the PLAY button on the VCR. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscilloscope display so that the envelope becomes as flat as possible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjust the
height of Guide Roller [2] (Refer to Fig. M3) so
that the waveform looks like the one shown in Fig.
M9.
4. If the envelope is as shown in Fig. M8, adjust the
height of Guide Roller [3] (Refer to Fig. M3) so
that the waveform looks like the one shown in Fig.
M9.
5. When Guide Rollers [2] and [3] (Refer to Fig.M3)
are aligned properly, there is no envelope drop
either at the beginning or end of track as shown in
Fig. M9.
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X Value
by pushing the CH UP or DOWN buttons alternately, to
check the symmetry of the envelope. Check the number
of pushes to ensure center position. The number of
pushes UP to achieve 1/2 level of envelope should
match the number of pushes DOWN from center. If
required, redo the "X Value Alignment."
1-D. Azimuth Alignment of Audio/Control/
Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio output jack
on the rear side of the deck.
2. Play back the alignment tape (FL6N8) and confirm
that the audio signal output level is 8 kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Dropping envelope level at the beginning of track.
Fig. M7
Dropping envelope level at the end of track.
Fig. M8
Envelope is adjusted properly. (No envelope drop)
Fig. M9
2-3-4H8740MA
Page 47
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS on page 1-5-1.)
All the following procedures, including those for adjustment and replacement of parts, should be done in Eject mode;
see the positions of [48] and [49] in Fig. DM1 on page 2-4-3. When reassembling, follow the steps in reverse order.
[52][51]F Door Opener ARDM18*(P-9)
[53][53]Cleaner Lever AssemblyTDM1,DM6
[54][53]CL PostTDM1,DM6*(L-6)
↓
➀
➁
Tension Lever Sub
Assembly
Moving Guide S
Preparation
Moving Guide T
Preparation
↓
PART
↓
➂
Fig. No.
TDM1, DM16
TDM1, DM17
TDM1, DM17
↓
➃
↓
➄
REMOVALINSTALLATION
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
(C-9)
(S-17), Slide Holder S
(S-18), Slide Holder T
↓
➅
ADJUSTMENT
CONDITION
(+) Refer to Alignment
Sec. Pg. 2-4-9
(+) Refer to Alignment
Sec. Pg. 2-4-9
(+) Refer to Alignment
Sec. Pg. 2-4-10
↓
➆
1 : Follow steps in sequence. When reassembling, follow the steps in reverse order.
These numbers are also used as Identification (location) No. of parts in the figures.
2 : Indicates the part to start disassembling with in order to disassemble the part in column (1).
3 : Name of the part
4 : Location of the part: T=Top B=Bottom R=Right L=Left
5 : Figure Number
6 : Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered.
e.g., 2(L-2) = two Locking Tabs (L-2).
7 : Adjustment Information for Installation
(+): Refer to Deck Exploded Views for lubrication.
2-4-2H8743DA
Page 49
Top View
[13]
[14]
[43]
[16][49][48][50]
[7][53][54][8]
[12]
[10]
[15]
[44]
[42]
Bottom View
[20]
[37][47][36][45] [46]
[35][34]
[9]
[11]
[41]
Fig. DM1
[40]
[39]
[29]
[30]
[24]
[26]
[31]
[27]
[28]
[32][38][22]
[21]
2-4-3H8743DA
Fig. DM2
Page 50
(S-1)
(L-1)
[1]
[3]
[4]
(S-1)
(L-1)
[5]
(S-2)
[6]
Pin C
Pin D
[2]
Pin A
2
Pull up
Fig. DM3
A
1
Slide
Pin B
Slot A
[7]
Connector
(S-3)
(S-4)
(P-1)
Fig. DM5
Connector
[53]
[54]
(L-6)
Slots
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
Locking tab
Slot A
View for A
Fig. DM4
(S-5)
(S-19)
Fig. DM6
2-4-4H8743DA
Page 51
ACH Connector
9B (9P)
(S-7)
FFC Cable
ACH Connector
AN (9P)
[8]
(S-10)
[14]
[13]
(S-9)
(S-11)
[15]
[16]
(L-4)
(S-6)
[12]
(L-2)
(S-8)
LDG
Belt
Fig. DM7
Fig. DM9
[10]
[18]
(P-3)
[11]
[9]
A
Adj.
Screw
(P-2)
(L-7)
After removing the Screw (S-12),
while pressing the Locking Tab
(L-7), remove [17].
[17]
[19]
Pin of [11]
Pin of [9]
Grooves of [31]
When reassembling [9]
and [11], confirm that pin of
[31]
[9] and pin of [11] are in the
View for A
grooves of [31] as shown.
(C-8)
Fig. DM8
(S-12)
Fig. DM10
2-4-5H8743DA
Page 52
Cap Belt
(C-2)
(S-15)
(S-14)
(C-1)
[23]
[22]
[20]
Fig. DM11
Pin on
bottom
of [26]
[26]
(P-4)
(C-3)
[24]
(P-4)
[31]
When installing [26], install
the spring (P-4) to [31] as
shown in the left figure, and
then install [26] while
pressing the spring (P-4) to
the direction of the arrow in
the left figure and confriming
that the position of the
spring (P-4) is placed as
shown in the left figure.
[26]
[21]
Fig. DM12
Top View
Pin on [24]
[31]
Position of pin on [24]
Fig. DM13
2-4-6H8743DA
Page 53
[28]
(C-5)
Refer to the Alignment Section, Page 2-4-9.
(P-5)
[38]
[35]
[30]
[31]
(S-16)
[29]
(C-6)
[32]
[33]
[34]
(C-4)
[27]
[37]
(C-7)
[36]
[43]
[40]
[39]
Fig. DM15
Position of Mode Lever when installed
Pin of [41]
Bottom View
[31]
Top View
Pin of [38]
Align [28] and [31] as shown.
First groove on [31]
First tooth on [51]
[31]
When reassembling [31],
meet the first groove on
[31] to the first tooth on
[51] as shown.
Pin of [42]
[28]
[42]
(P-7)
turn
[44]
(L-5)
turn
(C-9)
[47]
(C-10)
[45]
[46]
[41]
turn
Fig. DM16
(P-6)
Fig. DM14
2-4-7H8743DA
Page 54
[48]
Slide Holder S
[49]
(L-3)
[50]
(S-17)
(P-9)
[52]
Slide Holder T
(S-18)
Fig. DM17
[51]
Slide
Fig. DM18
2-4-8H8743DA
Page 55
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape loading/unloading mechanism. Since information about the
state of the mechanism is provided to the System Control Circuit only through the Mode Switch, it is essential
that the correct relationship between individual gears
and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes that all previous procedures have
been completed.
IMPORTANT:
If any one of these alignments is not performed
properly, even if off by only one tooth, the unit will
unload or stop and it may result in damage to the
mechanical or electrical parts.
Alignment points in Eject Position
Top View
Alignment [a]
Alignment 3
Alignment 1
Loading Arm, S and T Assembly
Install Loading Arm S and T Assembly so that their
triangle marks point to each other as shown in
Fig. AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other, in-
stall the Loading Arm T Assembly so that the last
tooth of the gear meets the most inside teeth of
the Mode Gear. See Fig. AL2.
Alignment 1
Triangle Marks
Loading Arm
T Assembly
Loading Arm
S Assembly
Last Tooth
Alignment 2
Most inside teeth
of Mode Gear
Mode Gear
Bottom View
Alignment [a] can be done independently of any
other alignment.
Alignment 1
Alignment 2
Fig. AL1
Fig. AL2
Alignment [a]
Tape Guide Assembly
Measurement of the screw must be as specified in
Fig. AL3.
Tape Guide
Assembly
Screw
3.25 – 0.1 mm
0.128 – 0.004 inch
This alignment can be
done independently of
any other alignment.
Fig. AL3
2-4-9H8740APM
Page 56
Alignment 3
Cam Gear (A), Rack Assembly
Install the Rack Assembly so that the first tooth on
Mechanical Parts List........................................................................................................................................... 3-2-1
Electrical Parts List .............................................................................................................................................. 3-3-1
Deck Parts List..................................................................................................................................................... 3-4-1
EXPLODED VIEWS AND
PARTS LIST SECTION
VIDEO CASSETTE RECORDER
23C-250 / 23C-250A
Sec. 3: Exploded views
and Parts List Section
● Exploded views
● Parts List
H7700CVR
Page 58
EXPLODED VIEWS
Front Panel
A1X
3-1-1H8743FEX
Page 59
Cabinet
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
2B4
FUNCTION CBA
A4
A7
A3
A10
2L061
2L061
2L061
2L061
2L032
2L012
JACK CBA
JW751
A5
2B18
2L011
2L011
2L011
2L011
A2
2L011
2B18
1B1
2L021
2L021
2L032
2L021
2L051
2L021
2L021
2B43
2B44
MAIN CBA
2B7
2L031
2L031
2L031
2B3
2B3
2B8
B361
2B22
B359
B360
2B46
2L021
2B45
B529
3-1-2H8743CEX
Page 60
Packing
Some Ref. Numbers are not in sequence.
S3
X1
S2
X20
X3
X2
X4
S2
Unit
S1
3-1-3H8740PEX
Page 61
Deck Mechanism View 1
B2
B401
B10
L1053
B9
B523
L1463
L1191
B73
B402
B411
B567
L1471
B494
B35
MarkDescription
Floil G-374G
L1460
B552
B550
Part No.
0VZZ00109(Blue grease)
B11
B12
B576
L1482
B571
L1482
B492
B74
B577
L1051
B37
B410
L1450
B426
B121
B560
B126
B122
B8
Chassis Assembly
Top View (Grease Point)
B501
L1466
B510
Some Ref. Numbers are not in sequence.
Chassis Assembly
Bottom View (Grease Point)
3-1-4H8743DEX
Page 62
Deck Mechanism View 2
B27
B508
B573
B414
B499
B487
B556
B564
B574
B518
B521
MarkDescription
Floil G-374G
B148
B520
B522
Part No.
0VZZ00109(Blue grease)
B3
L1406
B524 (Motor
PCB Ass’y)
B558
B512
B566
L1469
B417
B568
B551B584
B578
B579
B582
B580
B583
B133
B581
B559
B572
B507
B569
B565
B488
B416
B505
B491
B502
B570
B513
B31
L1151
B404
Bottom Side
(Grease point)
B557
B403
B525
B516
B52
Some Ref. Numbers are not in sequence.
Bottom Side (Grease point)
3-1-5H8743DEX
Page 63
Deck Mechanism View 3
MarkDescription
Floil G-374G
Part No.
0VZZ00109(Blue grease)
L1321
B562
B355
L1341
B347
B482
B563
L1321
B472
B319
L1483
B354
B483
B425
L1461
L1341
B300
B313
Some Ref. Numbers are not in sequence.
B555
B561
B303
B514
3-1-6H8743DEX
Page 64
H8743FP3-2-1H8743CA
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
(See Electrical Parts List)
A7PANEL, BOTTOM H8700EP 0VM203013
A10!LABEL, RATING H8743FP 0VM411914
B359CLEANER LEVER MK10 0VM304413
B360CLEANER ROLLER MK9 0VM410032C
B361CL POST MK10 0VM411114
B529CLEANER ASSEMBLY MK10 0VSA11161
1B1DECK ASSEMBLY CZD006/VM1323 N1323FK
2B3HOLDER, SENSOR(2) H5700UD
(See Electrical Parts List)
2B4EARTH PLATE(CONV) H2660BD 0VM409009B
2B7SHIELD ASSEMBLY H8700EP
(See Electrical Parts List)
2B8BUSH, LED(F) H3700UD
(See Electrical Parts List)
2B18FIBER, TOP CASE H8101BD U15 PAL 0VM408394
2B22SHEILD, CYLINDER H8700EP 0VM304667
2B43REC ARM H7700UD 0VM202907
2B44REC ARM SPRING MK6 0VM407708C
2B45SPACER H7700UD 0VM411667
2B46ROHM HOLDER H7770JD
REMOTE CONTROL UNIT 364/CRC005 N9464FN
X2DRY BATTERY R6P/2S orXB0M451T0001
DRY BATTERY(SUNRISE) R6SSE/2S XB0M451MS002
X3RF CORD PAL 1.2M WPZ0122LG001
X4ACCESSORY BAG K8092BA 0VM404632
X20!OWNER'S MANUAL H8743FP 0VMN02676
Page 65
H8743FP3-3-1H8743EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
Parts that not assigned part numbers (---------) are not
available.
Tolerance of Capacitors and Resistors are noted with
the following symbols.
Main CBA
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
Ref. No.DescriptionPart No.
Main CBA0VSA11514
Consists of the following:
CAPACITORS
C002!METALLIZED FILM CAP. 0.068µF/250V K orCT2E683DC011
!METALLIZED FILM CAP. 0.068µF/250V M CT2E683MS037C003!SAFETY CAP. 2200pF/250V orCCN2EMP0E222
!SAFETY CAP. 2200pF/400V M CCN2HMP0E222
C004ELECTROLYTIC CAP. 22µF/400V M(L,Z) CA2H220NC010
C005CERAMIC CAP. B K 0.01µF/500V CCD2JKP0B103
C006CERAMIC CAP. SL K 56pF/1KV orCCD3AKPSL560
CERAMIC CAP. SL J 56pF/1KV CCD3AJPSL560
C007CERAMIC CAP.(AX) X K 3300pF/16V CCA1CKT0X332
C008CERAMIC CAP.(AX) X K 5600pF/16V CCA1CKT0X562
C010FILM CAP.(P) 0.022µF/50V J orCMA1JJS00223
FILM CAP.(P) 0.022µF/50V J CA1J223MS029
C011ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V M CE1CMASTL100
C012ELECTROLYTIC CAP. 10µF/50V M H7 CE1JMASSL100
C014ELECTROLYTIC CAP. 470µF/25V M orCE1EMASDL471
ELECTROLYTIC CAP. 470µF/25V M CE1EMASTL471
C015ELECTROLYTIC CAP. 47µF/25V M H7 CE1EMASSL470
C016FILM CAP.(P) 0.0012µF/50V J orCMA1JJS00122
FILM CAP.(P) 0.0012µF/50V J CA1J122MS029
C017ELECTROLYTIC CAP. 470µF/16V M orCE1CMASDL471
ELECTROLYTIC CAP. 470µF/16V M CE1CMASTL471
C018ELECTROLYTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V M CE1CMASTL101
C020ELECTROLYTIC CAP. 1000µF/16V M CE1CMZPTL102
C021ELECTROLYTIC CAP. 470µF/10V M orCE1AMASDL471
ELECTROLYTIC CAP. 470µF/10V M CE1AMASTL471
C022ELECTROLYTIC CAP. 22µF/50V M H7 CE1JMASSL220
C023ELECTROLYTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V M CE1CMASTL101
C024CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C025CERAMIC CAP.(AX) X K 5600pF/16V CCA1CKT0X562
C052CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C053ELECTRIC DOUBLE LAYER CAP. 0.047F/5.5V
Z or
CA0J473MS014
ELECTRIC DOUBLE LAYER CAP0.047F/5.5V Z CA0J473NE003
C054ELECTROLYTIC CAP. 220µF/6.3V M orCE0KMASDL221
ELECTROLYTIC CAP. 220µF/6.3V M CE0KMASTL221
C056CERAMIC CAP.(AX) F Z 0.047µF/16V CCA1CZTFZ473
C252CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102
C253ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMASSL100
C255ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C256CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V CHD1EZ30F104
C301ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C302CHIP CERAMIC CAP. B K 0.047µF/50V orCHD 1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25V CHD1EK30B473
C303ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C304ELECTROLYTIC CAP. 100µF/6.3V M H7 CE0KMASSL101
C305CHIP CERAMIC CAP. B K 0.047µF/50V orCHD 1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25V CHD1EK30B473
C306CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V CHD1EZ30F104
C307CHIP CERAMIC CAP. CH J 27pF/50V orCHD1JJBCH270
CHIP CERAMIC CAP. CH J 390pF/50V CHD1JJ3CH391
C311ELECTROLYTIC CAP. 3.3µF/50V M H7 CE1JMASSL3R3
C312CERAMIC CAP.(AX) SL J 47pF/50V CCA1JJTSL470
C313CERAMIC CAP.(AX) SL J 22pF/50V CCA1JJTSL220
C314CERAMIC CAP.(AX) B J 180pF/50V CCA1JJT0B181
C315CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C316CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102
C317ELECTROLYTIC CAP. 220µF/6.3V M orCE0KMASDL221
ELECTROLYTIC CAP. 220µF/6.3V M CE0KMASTL221
C318ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMASSL100
C319ELECTROLYTIC CAP. 22µF/10V M H7 CE1AMASSL220
C320CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C321ELECTROLYTIC CAP. 0.47µF/50V M H7 CE1JMASSLR47
C324CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V CHD1EZ30F104
C325CHIP CERAMIC CAP. CH J 68pF/50V orCHD1JJBCH680
CHIP CERAMIC CAP. CH J 68pF/50V CHD1JJ3CH680
Ref. No.DescriptionPart No.
Page 66
H8743FP3-3-2H8743EL
C326CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25V CHD1EK30B473
C327CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C328ELECTROLYTIC CAP. 47µF/6.3V M H7 CE0KMASSL470
C330CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C331ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C332ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMASSL100
C333ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C334CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C335CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C336CHIP CERAMIC CAP. CH J 470pF/50V orCHD1JJBCH471
CHIP CERAMIC CAP. CH J 470pF/50V CHD1JJ3CH471
C337CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C338ELECTROLYTIC CAP. 47µF/6.3V M H7 CE0KMASSL470
C339CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C340CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C341CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C342CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V CHD1EZ30F104
C344ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C345ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C346CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25V CHD1EK30B223
C348ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C349CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25V CHD1EK30B223
C351CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25V CHD1EK30B473
C352CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25V CHD1EK30B223
C355ELECTROLYTIC CAP. 100µF/16V M orCE1CMASDL101
CHIP CERAMIC CAP. CH J 33pF/50V CHD1JJ3CH330
C420ELECTROLYTIC CAP. 22µF/10V M H7 CE1AMASSL220
C421ELECTROLYTIC CAP. 33µF/6.3V M H7 CE0KMASSL330
C423CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C424ELECTROLYTIC CAP. 47µF/6.3V M H7 CE0KMASSL470
C502ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C503CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25V CHD1EK30B223
C504ELECTROLYTIC CAP. 100µF/6.3V M H7 CE0KMASSL101
C505CHIP CERAMIC CAP. CH D 10pF/50V orCHD1JDBCH100
CHIP CERAMIC CAP. CH D 10pF/50V CHD1JD3CH100
C506CHIP CERAMIC CAP. CH D 10pF/50V orCHD1JDBCH100
C558CHIP CERAMIC CAP. B K 0.022µF/50V orCHD 1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25V orCHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25V CHD1EK30B223
C559CHIP CERAMIC CAP. B K 0.047µF/50V orCHD 1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25V CHD1EK30B473
C561CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102
C562CHIP CERAMIC CAP. B K 2200pF/50V orCHD1JKB0B222
CHIP CERAMIC CAP. B K 2200pF/50V CHD1JK30B222
C581ELECTROLYTIC CAP. 47µF/16V M H7 CE1CMASSL470
C583CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V CHD1EZ30F104
C584ELECTROLYTIC CAP. 47µF/16V M H7 CE1CMASSL470
C585CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C586CHIP CERAMIC CAP. B K 0.01µF/50V orCHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01µF/50V CHD1JK30B103
C587CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V CHD1EZ30F104
C588CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V CHD1EZ30F104
C589ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMASSL100
C590CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V CHD1EZ30F104
C591CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102
C594ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMASSL100
C602CHIP CERAMIC CAP. B K 0.047µF/50V orCHD 1JKB0B473
CHIP CERAMIC CAP. B K 0.047µF/25V orCHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25V CHD1EK30B473
C702CERAMIC CAP.(AX) F Z 0.047µF/16V CCA1CZTFZ473
Ref. No.DescriptionPart No.
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H8743FP3-3-4H8743EL
C703ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMASSL100
C704CERAMIC CAP.(AX) F Z 0.1µF/50V CCA1JZTFZ104
C705CERAMIC CAP.(AX) SL J 56pF/50V CCA1JJTSL560
C710ELECTROLYTIC CAP. 100µF/6.3V M H7 CE0KMASSL101
C711CERAMIC CAP.(AX) B K 1000pF/50V orCCA1JKT0B102
CERAMIC CAP.(AX) B J 1000pF/50V CCA1JJT0B102
C721CERAMIC CAP.(AX) Y M 0.01µF/16V CCA1CMT0Y103
C722CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102
C723ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMASSL010
C724CERAMIC CAP.(AX) SL J 33pF/50V CCA1JJTSL330
C725CERAMIC CAP.(AX) Y M 0.01µF/16V CCA1CMT0Y103
C726CERAMIC CAP.(AX) Y M 0.01µF/16V CCA1CMT0Y103
C728CERAMIC CAP.(AX) F Z 0.1µF/50V CCA1JZTFZ104
C758CHIP CERAMIC CAP. B K 4700pF/50V orCHD1JKB0B472
CHIP CERAMIC CAP. B K 4700pF/50V CHD1JK30B472
C852CHIP CERAMIC CAP. B K 1000pF/50V orCHD1JKB0B102