FUJITSU MB98C81013, MB98C81123, MB98C81233, MB98C81333 DATA SHEET

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FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-30338-2E
FLASH MEMORY CARD
5V-ONLY FLASH MINIATURE CARD
MB98C81013(1MB)/81123(2MB)/81233(4MB)/81333(8MB)-10
1M/2M/4M/8M-BYTE 5 V-ONLY FLASH MINIATURE CARD
The Fujitsu Flash Miniature cards conform to “Miniature Card Specification” pubulished by MCIF; Miniature Card Implementers Forum.
The Fujitsu Flash Miniature cards are small form factor Flash memory cards targeted various markets; digital pho­tography, audio recording, hand held PCs and other small portable equipments. Miniature cards’ high performance, small size (38 mm × 33 mm × 3.5 mm), low cost and simple interface are ideal f or portable applications that require high speed flash disk drives or eXecute In Place (XIP).
The Flash Miniature cards are 5 V -only oper ational and allow the users to use as ×8 or ×16 organization on low power at high speed.
• Small size : 33.0 mm (length) × 38.0 mm (width) × 3.5 mm (thickness)
• +5 V ±5% power supply program and erase
• Command control for Automated Program/Automated Erase operation
• Erase Suspend Read/Program Capability (Only Erase Suspend Read is possible for MB98C81013)
• 128 KB Sector Erase (at ×16 mode)
• Any Combination of Sectors Erase and Full Chip Erase
• Detection of completion of program/erase operation with Data# Polling or Toggle bit.
• Ready/Busy Output with BUSY# (Except for MB98C81013)
• Reset Function with RESET# pin (Except for MB98C81013)
• Write protect function with WP switch
• Low VCC Write Inhibit
• AIS (Attribute Information Structure) is available from the address “0000H” of Lower Byte.
This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields. However, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high-impedance circuit.
MB98C81013/81123/81233/81333-10

PACKAGE

5 V - ONLY FLASH MINIATURE CARD
Flash Memory
8
M byte
5V OPERATION
(CRD-60P-M01)
WRITE PROTECT
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DESCRIPTIONS

DIFFERENCES
MB98C81013 MB98C81123 MB98C81233 MB98C81333
Density 1 MB 2 MB 4 MB 8 MB Memory Device 4 M bit 8 M bit 16 M bit Quantity 2224 Read 1 B unit Program 1 B unit Chip Erase 512 KB unit 1 MB unit 2 MB unit Sector Erase 64 KB unit Number of Sectors 16 32 64 128 Erase Suspend Read Yes Yes Yes Yes Erase Suspend Program No Yes Yes Yes Address A0 to A18 A0 to A19 A0 to A20 A0 to A21 RESET# No Yes Yes Yes BUSY# No Yes Yes Yes
←←← ←←←
←←←
2

MEMORY MAP

4 MW
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MB98C81013/81123/81233/81333-10
2 MW
1 MW
512 KW
chip1,0
MB98C81013
4M bit × 2
MB98C81123
8M bit × 2
MB98C81233
16M bit × 2
chip3,2
chip1,0chip1,0chip1,0
MB98C81333
16M bit × 4
3
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MB98C81013/81123/81233/81333-10

PAD ASSIGNMENTS

Pad No Symbol Pad No Symbol Pad No Symbol Pad No Symbol
1A1816 N.C. 31 A 2A1617 N.C. 32 A 3A
14
4 N.C. 19 D 5 CEH# 20 D 6A1121 D 7A 8A
9A 10 A 11 A 12 A 13 A
9
8
6
5
3
2
0
18 OE# 33 A
34 A 35 A 36 RESET# 51 RFU 37 A 38 VS1# 53 VS2# 39 A 40 N.C. 55 D 41 A
22 D 23 D 24 D 25 D 26 D
15
13
12
10
9
0
2
4
27 N.C. 42 CEL# 57 D 28 D
7
43 A
* 46 CD#
17
15
13
12
10
7
4
1
47 A21 * 48 BUSY# 49 WE# 50 D
52 D
54 D
56 D
58 D 14 N.C. 29 N.C. 44 N.C. 59 N.C. 15 N.C. 30 N.C. 45 N.C. 60 A20 *
EX 1 V
CC
EX 2 GND EX 3 CINS#
14
11
8
1
3
5
6
* :A19, A20, A21 are “N.C.” for each product. See “DESCRIPTIONS”.
4
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MB98C81013/81123/81233/81333-10

PAD DESCRIPTIONS

Symbol I/O Pad Name Symbol I/O Pad Name
A0 to A D0 to D CEL# I Card Enable for Lower Byte VS1#, VS2# O Voltage Sense CEH# I Card Enable for Upper Byte N.C. Non Connection OE# I Output Enable V WE# I Write Enable GND Ground RESET# I Hardware Reset CINS# O Card Insertion *
* :Take notice that those pads are connected internally.
21
15
I Address Input BUSY# O Ready/Busy
I/O Data Input/Output CD# O Card Detect *
CC
Power Supply

PAD LOCATIONS

Fig. 1 — BOTTOM VIEW
60
31
30
EX 1 EX 3 EX 2
CC Key: See “UNIQUE FEATURES”.
V
1
VCC Key
5
MB98C81013/81123/81233/81333-10

BLOCK DIAGRAM

MB98C81013, MB98C81123 and MB98C81233

Fig. 2.1 — BLOCK DIAGRAM
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VCC
GND
Address
RESET# *
CEL#
CEH#
OE#
D0 to D7
VCC
Internal circuit
Internal circuit
VCC
100K
100K
RESET WE OE CE
Even Flash Memory
4M bit × 1 (MB98C81013) 8M bit × 1 (MB98C81123)
16M bit × 1 (MB98C81233)
Address
I/O
R/B
D8 to D15
VCC
WE#
VS1# VS2#
BUSY# *
CINS#
CD#
100K
Write Protect Switch
N.C.
N.C. N.C.
VCC
10K
* : Except for MB98C81013.
RESET WE OE CE
Odd Flash Memory
4M bit × 1 (MB98C81013) 8M bit × 1 (MB98C81123)
16M bit × 1 (MB98C81233)
Address
I/O
R/B
6

MB98C81333

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MB98C81013/81123/81233/81333-10
Fig. 2.2 — BLOCK DIAGRAM
VCC
GND
Address
RESET#
CEL#
CEH#
OE#
D0 to D7
A21
VCC
Internal circuit
Internal circuit
A /G1
Decoder
/G2
100K
1Y
2Y
VCC
2
2
100K
RESET WE OE CE
Even Flash Memory
16M bit × 2 (MB98C81333)
Address
I/O
R/B
D8 to D15
WE#
VS1# VS2#
BUSY#
CINS#
CD#
N.C. N.C.
VCC
100K
Write Protect Switch
N.C.
VCC
10K
RESET WE OE CE
Odd Flash Memory
16M bit × 2 (MB98C81333)
Address
I/O
R/B
7
MB98C81013/81123/81233/81333-10

CHIP AND SECTOR DECODING

ERASE SECTOR DECODING TABLE
Sector Address (SA)
2
A20 * Sector 31 11111 Sector 30 11110 Sector 29 11101
Total 32 sectors *
per 1 chip
1 *2
Sector 2 0 0 0 1 0
A19 *
1
A18 A17 A16
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Sector 1 0 0 0 0 1 Sector 0 0 0 0 0 0
Notes: *1. A19 is not availabe for MB98C81013. MB98C81013 has 8 sectors.
*2. A20 is not availabe f or MB98C81013 and MB98C81123. MB98C81013 has 8 sectors and MB98C81123
has 16 sectors.
8
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MB98C81013/81123/81233/81333-10

CHIP CONFIGURATION

The miniature cards use 2 or 4 pcs of Flash Memory. 2 pcs of Flash Memory are operated simultaneously at 16 bit mode and even number of chip is applied to lower byte and odd number of chip is applied to upper byte. At ×8 bit mode, even address and odd address are selected with CEL# and CEH#.
× 16 bit mode
1
CEL# = “L”, CEH# = “L”
: :
Odd Number of Chip + Even Number of Chip
Odd Number of Chip + Even Number of Chip
Odd Number of Chip + Even Number of Chip
Odd Number of Chip + Even Number of Chip
• • • • • • • • • • • • • • D0
D15
× 8 bit mode
2
CEL# = “H”, CEH# = “L”
: :
odd Number of Chip
003h
CEL# = “L”, CEH# = “H”
even Number of Chip
003h
002h
001h
000h
: :
003h
odd Number of Chip
odd Number of Chip
odd Number of Chip
D15
• • • • D8
002h
001h
000h
even Number of Chip
even Number of Chip
even Number of Chip
D7
• • • • • D0
002h
001h
000h
9
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MB98C81013/81123/81233/81333-10

FUNCTION DESCRIPTIONS

1. Read Mode
The data in the common can be read with “OE# = VIL ” and “WE# = VIH”. The address is selected with A0-A21. And CEL# and CEH# select output mode.
2. Standby Mode
– CEL# and CEH# at “VIH” place the card in Standby mode. D0-D15 are placed in a high-Z state independent
of the status “OE#” and “WE#”.
3. Output Disable Mode
– The outputs are disabled with OE# and WE# at “VIH”. D0-D15 are placed in high-Z state.
4. Write Mode
– The card is in Write mode with “OE# = VIH” and “WE# and CE# = VIL”. – Commands can be written at the Write mode. – Two types of the Write mode, “WE# control” and “CE# control” are available.
5. Command Definitions
– User can select the card operation by wr iting the specific address and data sequences into the command
register. If incollect address and data are written or improper sequence is done, the card is reseted to read mode. See “COMMAND DEFINISION TABLE”.
6. Automated Program Capability
– Programming operation can switch the data from “1” to “0”. – The data is programmed on a byte-by-byte or word-by-word basis. – The card will automatically provide adequate internally generated programming pulses and verify the pro-
grammed cell margin by writing four bus cycle operation. The card returns to Common Memory Read mode automatically after the programming is completed.
– Addresses are latched at falling edge of WE# or CE# and data is latched at rising edge of WE# or CE#. The
fourth rising edge of WE# or CE# on the command write cycle begins programming operation.
– W e can check whether a byte (w ord) programming operation is completed successfully b y sequence flug with
BUSY# (except MB98C81013), Data# Polling or Toggle Bit function. See “WRITE OPERATION STATUS”.
– Any commands written to the chip during programming operation will be ignored.
7. Automated Chip Erase Capability
– W e can execute chip erase operation b y 6 bus cycle operation. Chip erase does not require the user to program
the chip prior to erase. Upon executing the Erase command sequence the chip automatically will program and verify the entire memory for an all zero data pattern prior to electrical erase. The system is not required
to provide any controls or timing during these operations. – The card returns to Common Memory Read mode automatically after the chip erasing is completed. – Whether or not chip erase oper ation is completed successfully can be checked b y sequence flug with BUSY#
(except MB98C81013), Data# Polling or Toggle Bit function. See “WRITE OPERATION STATUS”. – Any commands written to the chip during programming operation will be ignored.
10
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MB98C81013/81123/81233/81333-10
8. Automated Sector Erase Capability
– We can execute the erase operation on any sectors by 6 bus cycle operation. – A time-out of 50 µs (typ .) from the rising edge of the last Sector Erase command will initiate the Sector Erase
command(s). – Multiple sectors in a chip can be erased concurrently . This sequence is f ollowed with writes of 30H to addresses
in other sectors desired to be concurrently erased. The time between writes 30H must be less than 50 µs,
otherwise that command will not be accepted. Any command other than Sector Erase or Erase Suspend
during this time-out period will reset the chip to Read mode. The automated sector erase begins after the 50
µs (typ.) time out from the rising edge of WE# pulse for the last Sector Erase command pulse. Whether the
sector erase window is still open can be monitored with D3 and D11. – Sector Erase does not require the user to program the chip prior to erase. The chip automatically progr ams
“0” to all memory locations in the sector(s) prior to electrical erase. The system is not required to provide any
controls or timing during these operations. – The card returns to Common Memory Read mode automatically after the chip erasing is completed. – Whether or not sector erase operation is completed successfully can be checked by sequence flug with
BUSY#, Data# Polling or Toggle Bit function. The sequence flug must be read from the address of the sector
involved in erase operation. See “WRITE OPERATION STATUS”.
9. Erase Suspend
– Erase Suspend command allows the user to interrupt the sector erase operation and then do data reads or
program from or to a non-busy sector in the chip which has the sector(s) suspended erase (only data read is
possible for MB98C81013). This command is applicable only during the sector erase operation (including the
sector erase time-out period after the sector erase commands 30H) and will be ignored if written during the
chip erase or programming operation. Writing this command during the time-out will result in immediate
termination of the time-out period. The addresses are “don’t cares” in wrinting the Erase Suspend or Resume
commands in the chip. – When the Erase Suspend command is written during a Sector Erase operation, the chip will enter the Erase
Suspend Read mode. User can read the data from other sectors than those in suspention. The read oper ation
from sectors in suspention results D2/D10 toggling except MB98C81013. User can program to non-busy sectors
by writing program commands except MB98C81013. – A read from a sector being erase suspended may result in invalid data.
10. Intelligent Identifier (ID) Read Mode
– Each common memory can execute an Intelligent Identifier operation, initiated by writing Intelligent ID com-
mand (90H). Following the command write, a read cycle from address 00H retrieves the manufacture code,
and a read cycle from address 01H returns the device code as follows. To terminate the operation, it is
necessary to write Read/Reset command.
11. Hardware Reset (not applied for MB98C81013)
– The Card may be reset by driving the RESET# pin to VIL. The RESET# pin must be kept High (VIL) for at
least 500 ns. Any operation in progress will be terminated and the card will be reset to the read mode 20 µs
after the RESET# pin is driven Low. If a hardware reset occurs during a program operation, the data at that
particular location will be indeterminate. – When the RESET# pin is Low and the internal reset is complete, the Card goes to standb y mode and cannot
be accessed. Also, note that all the data output pins are High-Z for the duration of the RESET# pulse. Once
the RESET# pin is taken high, the Card requires 500 ns of wake up time until outputs are v alid for read access. – If hardware reset occurs during a erase operation, there is a possibility that the erasing sector(s) cannot be
used.
11
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MB98C81013/81123/81233/81333-10
12. Data Protection
– The card has WP (Write Protect) switch for write lockout. – To avoid initiation of a write cycle during V
less than 3.2 V. If VCC < VLKO, the command register is disabled and all internal program/erase circuits are
disabled.
Under this condition the device will reset to the read mode. Subsequent writes will be ignored until the VCC
level is greater than VLKO. It is the users responsibility to ensure that the control pins are logically correct to
prevent unintentional writes when VCC is above 3.2 V. – If VCC would be less than VLKO during program/erase operation, the operation will stop. And after that, the
operation will not resume even if VCC returns recommended voltage le vel. Therefore , program command must
be written again because the data on the address interrupted program operation is invalid. And regarding
interrupting erase operation, there is possibility that the erasing sector(s) cannot be used. – Noise pulses of less than 5 ns (typical) on OE#, CE# or WE# will not initiate a write cycle.
CC power-up and power-down, a write cycle is locked out for VCC
12
MB98C81013/81123/81233/81333-10

FUNCTION TRUTH T ABLE

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Mode
Hardware Reset L X X X X P or NP High-Z High-Z
Standby
Read (×8 bit)
Read (×16 bit) L L DOUT DOUT
Write (×8 bit)
Write (×16 bit) L L DIN DIN
Output Disable
H : “H” level, L : “L” level , X : “H” or “L”
Notes: *1. WPSW = Write Protect Switch, NP = NON-PROTECT, P = PROTECT
*2. Except for MB98C81013.
RESET# *
2
CEH# CEL# OE# WE#
H H X X P or NP High-Z High-Z HL
L H DOUT High-Z
HL
H
L H DIN High-Z
HL
L H High-Z High-Z L L High-Z High-Z
L H P or NP
HL
WPSW *
NP
P
Data Input/Output
1
D8 to D15 D0 to D7
High-Z DOUT
High-Z DIN
High-Z High-Z
13
MB98C81013/81123/81233/81333-10

COMMAND DEFINITION TABLE

Command Table for 8-bit Mode
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Command
Read/Reset 1 2
Read/Reset 2 4
Read Intelligent ID Codes
Byte Program 4
Sector Erase 6
Chip Erase 6
Sector Erase Suspend
Bus
Cycle
1st Bus
Write Cycle
Write Read
CA F0H RA RD
Write Write Write Read
RCMA1 AAH RCMA2 55H RCMA1 F0H RA RD
Write Write Write Read
4
ICMA1 AAH ICMA2 55H ICMA1 90H IA ID
Write Write Write Write
PCMA1 AAH PCMA2 55H PCMA1 A0H PA PD
Write Write Write Write Write Write
SCMA1 AAH SCMA2 55H SCMA1 80H SCMA1 AAH SCMA2 55H SA 30H
Write Write Write Write Write Write
CCMA1 AAH CCMA2 55H CCMA1 80H CCMA1 AAH CCMA2 55H CCMA1 10H
Write
1
CA B0H
2nd Bus
Write/Read
Cycle
3rd Bus
Write Cycle
4th Bus
Write/Read
Cycle
5th Bus
Write Cycle
Write Cycle
6th Bus
Sector Erase Resume
Note: CA: Chip Address. (address in chip selected by A21 for MB98C81333)
SA: Sector Address (address in 64 KB selected by A16, A17, A18, A19, A20 and A21) PA: Program Address (address to be programmed) RA: Read Address (address to be read) IA: Intelligent ID read address (Manufacture Code 0000H, Device Code 0001H)
PD: Programming data RD: Read data ID: Intelligent Identifier (ID) Code
CCMA1, CCMA2: Command address for chip erase SCMA1, SCMA2: Command address for sector erase PCMA1, PCMA2: Command address for program RCMA1, RCMA2: Command address for Read/Reset ICMA1, ICMA2: Command address for Intelligent ID read
1
Write
CA 30H
See “Command Address Table for 8-bit Mode” in page 16.
14
MB98C81013/81123/81233/81333-10
Command Table for 16-bit Mode
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Command
Read/Reset 1 2
Read/Reset 2 4
Read Intelligent ID Codes
Byte Program 4
Sector Erase 6
Chip Erase 6
Sector Erase Suspend
Bus
Cycle
1st Bus
Write Cycle
Write Read
CA F0F0H RA RD
Write Write Write Read
RCMA1 AAAAH RCMA2 5555H RCMA1 F0F0H RA RD
Write Write Write Read
4
ICMA1 AAAAH ICMA2 5555H ICMA1 9090H IA ID
Write Write Write Write
PCMA1 AAAAH PCMA2 5555H PCMA1 A0A0H PA PD
Write Write Write Write Write Write
SCMA1 AAAAH SCMA2 5555H SCMA1 8080H SCMA1 AAAAH SCMA2 5555H SA 3030H
Write Write Write Write Write Write
CCMA1 AAAAH CCMA2 5555H CCMA1 8080H CCMA1 AAAAH CCMA2 5555H CCMA1 1010H
Write
1
CA B0B0H
2nd Bus
Write/Read
Cycle
3rd Bus
Write Cycle
4th Bus
Write/Read
Cycle
5th Bus
Write Cycle
6th Bus
Write Cycle
Sector Erase Resume
Note: CA: Chip Address. (address in chip selected by A21 for MB98C81333)
SA: Sector Address (address in 128 KB selected by A16, A17, A18, A19, A20 and A21) PA: Program Address (address to be programmed) RA: Read Address (address to be read) IA: Intelligent ID read address (Manufacture Code 0000H, Device Code 0001H)
PD: Programming data RD: Read data ID: Intelligent Identifier (ID) Code
CCMA1, CCMA2: Command address for chip erase SCMA1, SCMA2: Command address for sector erase PCMA1, PCMA2: Command address for program RCMA1, RCMA2: Command address for Read/Reset ICMA1, ICMA2: Command address for Intelligent ID read
1
Write
CA 3030H
See “Command Address Table for 16-bit Mode” in page 16.
15
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