The MB91F109 has been developed as one of the "32-bit single-chip microcontroller FR30
series" products that use new RISC architecture CPUs as their cores. It has optimal
specifications for embedding applications that require high CPU processing power.
This manual explains the functions and operations of the MB91F109 for the engineers who
actually develop products using the MB91F109. Read this manual thoroughly. Refer to the
instruction manual for details on individual instructions.
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Trademarks
FR stands for FUJITSU RISC controller, a product of Fujitsu Limited.
Embedded Algorithm
TM
is a trademark of Advanced Micro Devices, Inc.
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Organization of This Manual
This manual consists of 16 chapters and an appendix.
Chapter 1 Overview
Chapter 1 provides ba sic general infor mation on the MB91F1 09, inc luding i ts c haracteri stic s,
a block diagram, and function overview.
Chapter 2 CPU
Chapter 2 provides basic information on the FR series CPU core functions including the
architecture, specifications, and instructions.
Chapter 3 Clock Generator and Controller
Chapter 3 provides detailed information on the generation and control of the clock that
controls the MB91F109.
Chapter 4 Bus Interface
Chapter 4 explain s the basic items of the external bus interface, register co nfiguration and
functions, bus operations, bus timing, and provides bus operation program samples.
Chapter 5 I/O Ports
Chapter 5 provides an overv iew of I/O ports, explains the I/O port register c onfiguration and
the conditions for using external terminals as I/O ports.
Chapter 6 External Interrupt/NMI Controller
Chapter 6 provides an overvi ew of the external inter rupt/NMI controlle r, explains the regi ster
configuration and functions, and operations of the external interrupt/NMI controller.
Chapter 7 Delayed Interrupt Module
Chapter 7 provides an overview of the delayed interrupt module, explains the register
configuration and functions, and operations of the delayed interrupt module.
Chapter 8 Interrupt Controller
Chapter 8 provides an overview of the inte rrupt contro ller, expl ains the register con figurati on
and functions, and operations of th e interrupt con troller. The chapt er also explains the hold
request cancel request function using examples.
Chapter 9 U-TIMER
Chapter 9 provides an overview of the U-TIMER, explains the register configuration and
functions, and operations of the U-TIMER.
Chapter 10 UART
Chapter 10 provides an overview of the UART, explains the register configuration and
functions, and operations of the UART.
Chapter 11 provides an overview of the A/D converter, explains the register configuration
and functions, and operations of the A/D converter.
Chapter 12 16-bit Reload Timer
Chapter 12 provides an overview of the 16-bit reload timer, explains the register
configuration and functions, and operations of the 16-bit reload timer.
Chapter 13 Bit Search Module
Chapter 13 provides an overview of the bit search module, explains the register configuration
and functions, and operations and save/restore processing of the bit search module.
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Chapter 14 PWM Timer
Chapter 14 provides a n overview of the PWM timer, expl ains the register configurati on and
functions, and operations of the PWM timer.
Chapter 15 DMAC
Chapter 15 provides an overview of the DMAC, explains the register configuration and
functions, and operations of the DMAC.
Chapter 16 Flash Memory
Chapter 16 explains the flash memory functions and operations.
The chapter provides information on using the flash memory from the FR CPU.
For information on usi ng the fl ash memo ry from th e ROM writ er, refer to the user ’s guid e for
the ROM writer.
Appendix
The appendix provides information on I/O maps, interrupt vectors, terminal states in each
CPU status, notes on usin g the little endian area, and a listing of instructi ons. It includes
details of these types of inform ation that are not covered by the text that can be refere nced
for programming.
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1. The contents of this document are subject to change without notice. Customers are advised to consult
with FUJITSU sales representatives before ordering.
2. The information and circuit diagrams in this document are presented as examples of semiconductor
device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is
unable to assume responsibility for infringement of any patent rights or other rights of third parties
arising from the use of this information or circuit diagrams.
3. The contents of this document may not be reproduced or copied without the permission of FUJITSU
LIMITED.
4. FUJITSU semiconductor devices are intended for use in standard applications (computers, office
automation and other office equipments, industrial, communications, and measurement equipments,
personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special applications where failure or abnormal
operation may directly affect human lives or cause physical injury or property damage, or where
extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls,
sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to
consult with FUJITSU sales representatives before such use. The company will not be responsible for
damages arising from such use withou t prior approval.
5. Any sem iconductor devi ces have inherent ly a certain ra te of failure. You must protect against injur y,
damage or loss from such failures by incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of over-current levels and other
abnormal operating conditions.
6. If any products described in this document represent goods or technologies subject to certain
restrictions on export under the Foreign Exchange and Foreign Trade Control Law of Japan, the prior
authorization by Japanese government should be required for export of those products from Japan.
Major terms used in this manual are explained below:
TermMeaning
I-BUS16-bit wide bus used for internal instructions. Since the FR series uses
an internal Harvard architecture, independent buses are used for
instructions and data. A bus converter is connected to the I-BUS.
D-BUSInternal 32-bit wide data bus. Internal resources are connected to the
D-BUS.
C-BUSInternal multiplex bus. The C-BUS is connected to the I-BUS and D-
BUS via a switch. An external interface module is connected to the CBUS. Data and instructions are multiplexed in the external data bus.
R-BUSInternal 16-bit wide data bus. The R-BUS is connected to the D-BUS
via an adapter. Various I/O ports, the clock generator, and interrupt
controller are connected to the R-BUS. Since the R-BUS is 16 bits
wide in which addresses and data are multiplexed, it takes twice as
much or more cycle time than usual for the CPU to access these
resources.
E-unitOperation executing unit
φ
θ
System clock output from the clock generator to each internal resource
connected to the R-BUS. The system clock at the highest speed
shows the same cycle as source oscillation but is divided into 1, 1/2, 1/
4, and 1/8 (or 1/2, 1/4, 1/8, and 1/16) by PCK1 and PCK0 of the clock
generator GCR register.
System clock or operation clock for the CPU and resources connected
to a bus other than the R-BUS. The system clock at the highest speed
shows the same cycle as source oscillation but is divided into 1, 1/2, 1/
4, and 1/8 (or 1/2, 1/4, 1/8, and 1/16) by CCK1 and CCK0 of the clock
generator GCR register.
1.6I/O Circuit Format ................................................................................................................................ 22
1.7Memory Address Space ......................................... ...... ............................................. ....... .... ............... 24
1.8Handling of Devices ............................................................................................................................. 26
3.8PLL Control Register (PCTR) .............................................................................................................. 86
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3.9Gear Function ..................................................................................................................................... 87
3.10 Standby Mode (Low Power Consumption Mechanism) ...................................................................... 90
3.10.1 Stop State ...................................................................................................................................... 92
3.10.2 Sleep State .................................................................................................................................... 95
3.10.3 Standby Mode State Transition ..................................................................................................... 98
3.11 Watchdog Function ............................................................................................................................. 99
3.12 Reset Source Hold Circuit ................................................................................................................. 101
4.1Outline of Bus Interface .................................................................................................................... 112
4.2Chip Select Area ............................................................................................................................... 115
4.16.4 DRAM Relationships .................................................................................................................... 155
4.17 Bus Timing ........................................................................................................................................ 159
12.4 Operation of 16-Bit Reload Timer .................................................................................................... 287
12.5 Counter States .................................................................................................................................. 289
Figure 4.2-1Example of Setting Chip Select Areas ..................................................................................... 115
Figure 4.4-1Sample Maps of the Chip Select Areas ................................................................................... 120
Figure 4.16-1Data bus Widths and Control Signals in Usual Bus Interface .................................................. 139
Figure 4.16-2Data Bus Widths and Control Signals in DRAM Interface ....................................................... 139
Figure 4.16-3Relationship between Internal Register and External Data Bus for Word Access .................. 141
Figure 4.16-4Relationship between Internal Register and External Data Bus for Half-Word Access ........... 141
Figure 4.16-5Relationship between Internal Register and External Data Bus for Byte Access .................... 142
Figure 4.16-6Relationship between Internal Register and External Data Bus for 16-bit Bus Width ............. 142
Figure 4.16-7Relationship between Internal Register and External Data Bus for 8-bit Bus Width ............... 143
Figure 4.16-8External Bus Access for 16-bit Bus Width ............................................................................... 144
Figure 4.16-9External Bus Access for 8-bit Bus Width ................................................................................. 145
Figure 4.16-10 Example of Connection between MB91F109 and External Devices ....................................... 146
Figure 4.16-11 Relationship between Internal Register and External Data Bus for Word Access .................. 147
Figure 4.16-12 Relationship between Internal Register and External Data Bus for Half-word Access ............ 148
Figure 4.16-13 Relationship between Internal Register and External Data Bus for Byte Access .................... 148
Figure 4.16-14 Relationship between Internal Register and External Data Bus for 16-bit Bus Width ............. 149
Figure 4.16-15 Relationship between Internal Register and External Data Bus for 8-bit Bus Width ............... 149
Figure 4.16-16 Example of Connection between MB91F109 and External Devices (16-Bit Bus Width) ......... 150
Figure 4.16-17 Example of Connection between MB91F109 and External Devices (8-Bit Bus Width) ........... 150
Figure 4.16-18 Example of Connection between MB91F109 and One 8-bit Output DRAM (8-Bit Data Bus) . 156
Figure 4.16-19 Example of Connection between MB91F109 and Two 8-Bit Output DRAMs
(16-Bit Data Bus) ..................................................................................................................... 157
Figure 4.16-20 Example of Connection between MB91F109 and Two 16-Bit Output DRAMs
(16-Bit Data Bus) ..................................................................................................................... 158
Figure 4.17-1Example of Basic Read Cycle Timing Chart ............................................................................ 162
Figure 4.17-2Example for Basic Write Cycle Timing .................................................................................... 164
Figure 4.17-3Example 1 of Read Cycle Timing Chart .................................................................................. 166
Figure 4.17-4Example 2 of Read Cycle Timing Chart .................................................................................. 166
Figure 4.17-5Example 3 of Read Cycle Timing Chart .................................................................................. 166
Figure 4.17-6Example 4 of Read Cycle Timing Chart .................................................................................. 167
Figure 4.17-7Example 5 of Read Cycle Timing Chart .................................................................................. 167
Figure 4.17-8Example 1 of Write Cycle Timing Chart ................................................................................... 168
Figure 4.17-9Example 2 of Write Cycle Timing Chart ................................................................................... 168
Figure 4.17-10 Example 3 of Write Cycle Timing Chart ................................................................................... 168
Figure 4.17-11 Example 4 of Write Cycle Timing Chart ................................................................................... 169
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Figure 4.17-12 Example 5 of Write Cycle Timing Chart .................................................................................. 169
Figure 4.17-13 Example of Read and Write Combination Cycle Timing Chart ............................................... 170
Figure 4.17-14 Example of Automatic Wait Cycle Timing Chart ..................................................................... 171
Figure 4.17-15 Example of External Wait Cycle Timing Chart ........................................................................ 172
Figure 4.17-16 Example of Usual DRAM Interface Read Timing Chart .......................................................... 173
Figure 4.17-17 Example of Usual DRAM Interface Write Timing Chart .......................................................... 175
Figure 4.17-18 Example 1 of Usual DRAM Read Cycle Timing Chart ............................................................ 177
Figure 4.17-19 Example 2 of Usual DRAM Read Cycle Timing Chart ............................................................ 178
Figure 4.17-20 Example 3 of Usual DRAM Read Cycle Timing Chart ............................................................ 178
Figure 4.17-21 Example 1 of Usual DRAM Write Cycle Timing Chart ............................................................ 179
Figure 4.17-22 Example 2 of Usual DRAM Write Cycle Timing Chart ............................................................ 180
Figure 4.17-23 Example 3 of Usual DRAM Write Cycle Timing Chart ............................................................ 180
Figure 4.17-24 Example of Automatic Wait Cycle Timing Chart in Usual DRAM Interface ............................ 181
Figure 4.17-25 Example 1 of DRAM Interface Timing Chart in High-Speed Page Mode ............................... 182
Figure 4.17-26 Example 2 of DRAM Interface Timing Chart in High-Speed Page Mode ............................... 182
Figure 4.17-27 Example 3 of DRAM Interface Timing Chart in High-Speed Page Mode ............................... 183
Figure 4.17-28 Example 4 of DRAM Interface Timing Chart in High-Speed Page Mode ............................... 184
Figure 4.17-29 Example of Single DRAM Interface Read Timing Chart ......................................................... 185
Figure 4.17-30 Example of Single DRAM Interface Write Timing Chart ......................................................... 186
Figure 4.17-31 Example of Single DRAM Interface Timing Chart ................................................................... 187
Figure 4.17-32 Example of Hyper DRAM Interface Read Timing Chart ......................................................... 188
Figure 4.17-33 Example of Hyper DRAM Interface Write Timing Chart .......................................................... 189
Figure 4.17-34 Example of Hyper DRAM Interface Timing Chart ................................................................... 190
Figure 4.17-35 Example of CAS before RAS (CBR) Refresh Timing Chart .................................................... 191
Figure 4.17-36 Example of Timing Chart of CBR Refresh Automatic Wait Cycle ........................................... 192
Figure 4.17-37 Example of Selfrefresh Timing Chart . ....... ...... ....... ...... ...... ....... ...... ....... ................................. 192
Figure 4.17-38 Example of Bus Control Release Timing Chart ...................................................................... 193
Figure 4.17-39 Example of Bus Control Acquisition Timing ............................................................................ 193
Figure 4.18-1Example of Timing Chart for 2X Clock (BW-16bit, Access-Word Read) ................................ 194
Figure 4.18-2Example of Timing for 1X Clock (BW-16bit, Access-Word Read) .......................................... 195
Figure 5.1-1Basic I/O Port Block Diagram ................................................................................................. 202
Figure 6.6-1Clearing the Interrupt Cause Hold Circuit at Level Setting for the Interrupt Request Mode ... 217
Figure 6.6-2Input of an Interrupt Cause in Interrupt Enable Mode and a Request Issued to the Interrupt
Figure 8.2-1Block Diagram of the Interrupt Controller ................................................................................ 227
Figure 8.8-1Example of Hardware Configuration for Using the Hold Request Cancel Request Function .. 236
Figure 8.8-2Example of Timing for Hold Request Cancel Request Sequence (Interrupt Level: HRCL > a) 237
Figure 8.8-3Example of Timing for Hold Request Cancel Request Sequence
(Interrupt Level: HRCL > a > b) ............................................................................................... 237
Table E.1-20Coprocessor Control Instructions ........................................................................................... 423
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CHAPTER 1OVERVIEW
This chapter provides basic general information on the MB91F109, including its
characteristics, block diagram, and function overview.
1.1 MB91F109 Characteristics
1.2 General Block Diagram of MB91F 109
1.3 Outside Dimensions
1.4 Pin Arrangement Diagrams
1.5 Pin Functions
1.6 I/O Circuit Format
1.7 Memory Address Space
1.8 Handling of Devices
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CHAPTER 1 OVERVIEW
1.1MB91F109 Characteristics
The MB91F109 is a standard single-chip microcontroller using a 32-bit RISC CPU
(FR30 series) as its core. It contains various I/O resources and bus control
mechanisms for embedded control applications that require high-speed CPU
processing.
This microcontroller contains 254-kilobyte flash ROM and 4-kilobyte RAM.
It has optimal specifications for embedding applications such as navigation systems,
high-performance facsimiles, and printer controls, which require high CPU processing
power.
•Up to 16 priority levels are programmable for interrupts other than nonmaskable interrupts.
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Reset types
•Power-on reset, watchdog timer reset, software reset, and external reset
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Power save mode
•Sleep/stop mode
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Clock control
•Gear func tion: Desired oper ating clock fre quencies can be s et for the CPU and per ipherals
independently.
A gear clock can be selected from 1/1, 1/2, 1/4, and 1/8 (or 1/2, 1/4, 1/8, and 1/16).
However, the operating clock frequency for peripherals cannot exceed 25 MHz.
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Others
•Packages: QFP-100, LQFP-100, FBGA-112
•CMOS technology: 0.5 µm
•Power supply: 3.3 V plus or minus 0.3 V
•254-kilobyte f lash ROM: Can be r ead, written, and erased by a single power supply.