The MB91401 is a network security LSI incorporating a Fujitsu’s 32-bit, FR-family RISC microcontroller with 10/
100Base-T MAC Controller, encr yption function and authentication function. The LSI contains an encryption
authentication hardware accelerator that boosts the LSI’ s perf ormance for encryption and authentication communication (IKE/IPsec/SSL) to be demanded further.
The MAC controller has a packet filtering function that reduces the load on the CPU for an increasing amount of
packet processing. In addition, the board has the External interface for high-speed data communication with
various external hosts, USB ports as general-purpose interfaces, and various card interfaces.
FEATURES
■■■■
••••
Encryption and authentication processing by hardware accelerator function
The LSI performs processing five times f aster than b y the con v entional combination of encryption/authentication
hardware macros and software or about 400 times f aster than by softw are only. In addition, CPU processing load
factor to be involved in the encryption and the authentication processing can be decreased to 1/5 or less.
Also, the LSI uses the embedded accelerator to execute that public-key encr yption algorithm about 100 times
faster than by software processing, which generally puts an extremely heavy load microcontrollers.
(Continued)
PACKAGE
■■■■
244-pin plastic FBGA
(BGA-240P-M01)
MB91401
Prelminary
2004.11.12
• For DES-ECB/DES-CBC/3DES-ECB/3DES-CBC mode*
• For MD5/SHA-1/HMAC-MD5/HMAC-SHA-1 mode
• DH group: for 1 (MODP 768 bit) /2 (1024 bit)
For the encryption/authentication macros, a software library is available by contacting the Fujitsu sales repre-
sentative as required.
* : Encryption function (DES/3DES)
Method to encrypt, and to decrypt plainte xt in 64 bits with code and decoding ke y to 56 bits . (3DES is repeated
three times. The key can be set by 168 bits or less.)
•
Packet filtering function
The internal feature for L3/L4 packet filtering lets specific data pass or halts them based on address (IP/MAC
address) settings. Moreover, the function (multicast address filter function) to receive the data is provided in
case of the multicast address registered besides my address, too.
• IEEE 802.3 compliant 10/100M MAC
• MII interface (for full-duplex/half-duplex)
• SMI interface for PHY device control
Note : The filtering function of layer 3/4 (mount on hardware).
This feature determines whether to pass or discard packets when this la yer 3 (network layer) IP addresses
or layer 4 (tra nsport layer) TCP/UDP port numbers match conditions.
••••
Outside interface with telecommunication facility (EXTERNAL INTERFACE)
MB91401 is equipped it with the register for the communication and with mass sending and receiving FIFO that
achieves a large amount of data sending and receiving. Host functions include processing of data stored in a
3 KByte receive buff er and a 1.5 KByte transmit b uff er and stopping of data reception. when the buff ers become
full.
This enables communication control even during data transmission and reception, thereby improving communication efficiency while reducing the CPU load.
• 8/16 bit data port
• Equipped with sending and receiving data port control function
• Transfer rate : 133 Mbps (Max)
••••
General Purpose IO (GPIO)
The interruption can be generated in the I/O port in eight bits according to changing the input signal. Moreover,
the I/O setting can be done in each bit.
••••
Memory Interface
It is possible to connect it with an external memory.
••••
2
USB Function Controller
It can not operate as host USB.
• For USB FUNCTION Rev2.0FS
• Double Buffer Specification
(Continued)
MB91401
Prelminary
2004.11.12
(Continued)
••••
CARD Interface (CompactFlash)
The CompactFlash interface is a memory and I/O mode correspondence. It corresponds to the I/O of data such
as not only the memory card but also the communication cards.
Clock input pin
Input pin of clock generated in clock generator. 10 MHz to
50 MHz frequency can be input.
Reset input pin
This pin inputs a signal to initialize the LSI.
When turning on the power supply, apply “0” to the pin until
the clock signal input to the CLKIN pin becomes stable.
All built-in registers and external pins are initialized, and the
built-in PLL is stopped when “0” is asserted to INITXI.
NMI input pin
Non-Maskable Interrupt signal
External interrupt input pins
These pins input an external interrupt request signal.
For external interrupt detection, set the ENIR, EIRR and
ELVR registers of the FR core.
Mode pins
These pins determine the operation mode of the LSI.
Always set this bit to “001”.
OSCILLATOR (3 pin)
Pin namePin no.
OSCEA12ING
OSCC145
OSCEB10OUTG
PLL CONTROL (5 pin)
Pin namePin no.
PLLS147IND
PLLSET1144IND
PLLSET081IND
PLLBYPAS9IND
CLKSEL77IND
Polarity
Nega-
tive
Polarity
Circuit
I/O
IND
Circuit
I/O
Function/application
Crystal oscillation input pin
Input pin of crystal oscillation cell.
Crystal oscillation control input pin
Oscillation control pin of crystal oscillation cell.
“0” : Oscillation
“1” : Oscillation stop
Crystal oscillation output pin
Output pin of crystal oscillation cell.
Input clock division ratio select input pin
“0” : Input clock direct
“1” : Input clock divided by 2
Division ratio select input to PLL FB pin
“0” : Two dividing frequency is input to the terminal FB.
“1” : Four dividing frequency is input to the terminal FB.
Emulator break request pin
This pin inputs the emulator break request when an ICE is
connected.
ICS2
ICS1
ICS0
ICLK3I/OB
ICD3
ICD2
ICD1
ICD0
JTAG (5 pin)
Pin namePin no.
TCK146INE
TRST78INE
TMS7INE
TDI5INE
74
75
4
140
194
139
138
OUTF
I/OB
Polarity
I/O
Circuit
Emulator chip status pins
These pins output the emulator status when an ICE is
connected.
Emulator clock pin
This pin serves as the emulator clock pin when an ICE is
connected.
Emulator data pins
These pins serve as the emulator data bus when an ICE is
connected.
Function/application
JTAG test clock pin
Note : Please input “1” when unused.
JTAG test reset pin
Note : Please input “0” when unused.
TAP controller mode select pin
Note : Please input “1” when unused.
JTAG test data input pin
JTAG test serial data input pin.
Note : Please input “1” when unused.
TEST (5 pin)
8
TDO141OUTF
Pin namePin no.
VPD143IN
TEST3
TEST2
TEST1
TEST0
84
13
82
11
Polarity
IND
I/O
Circuit
JTAG test data output pin
JTAG test serial data output pin
Data input/output pins
32 bits data input/output signal pin.
10
CSX6
CSX1
CSX0
RDX27
WRX3
WRX2
WRX1
WRX0
MCLKO25OUTF
RDY157
159
98
29
96
28
97
158
Nega-
tive
Nega-
tive
Nega-
tive
Posi-
tive
OUTB
OUTB
OUTB
IND
Chip select output pins
3-bit chip select signal pin.
Output the “L” level when accessing to external memory.
Read strobe output pin
Read strobing signal pin.
Output the “L” level when read accessing.
Write strobing output pins
Write strobing signal pin.
Output the “L” level when write accessing.
Memory clock output pin
Clock for peripheral resources pin.
External RDY input pin
When the external bus is not completed, the bus cycle can
be extended by inputting “0”.
ETHERNET MAC CONTROLLER (17 pin)
Prelminary
2004.11.12
Pin namePin no.
RXCLK48IND
Polarity
I/O
Circuit
MB91401
Function/application
Clock input for reception pin
MII sync signal during reception. The frequency is 2.5 MHz
at 10 Mbps and 25 MHz at 100 Mbps.
RXER113
RXDV172
RXCRS115
RXD3
RXD2
RXD1
RXD0
COL173
TXCLK46IND
TXEN43
TXD3
TXD2
TXD1
TXD0
114
47
112
45
171
170
111
44
Posi-
tive
Posi-
tive
Posi-
tive
IND
Posi-
tive
Posi-
tive
OUTF
IND
IND
IND
IND
OUTF
Receive error input pin
It is recognized that there is an error in the reception packet
when “1” is input from the PHY device at receiving.
Receive data valid input pin
It is recognized that receive data is effective.
Career sense input pin
The state that the reception or the transmission is done is
recognized.
Receive data input pins
4-bit data input from PHY device.
Collision detection input pin
When TXEN signal is active and “1”, the collision is
recognized. The collision is not recognized without these
conditions.
Clock input for transfer pin
It becomes synchronous of MII when transmitting. The
frequency is 2.5 MHz at 10 Mbps and 25 MHz at 100 Mbps.
Transfer enable output pin
It is shown that effective data is on the TXD bus. It is output
synchronizing with TXCLK.
Transfer data output pins
4-bit data bus sent to the PHY device. It is output
synchronizing with TXCLK.
MDCLK222OUTF
MDIO224I/OB
SMI clock output pin
SMI IF clock pin
Connect to SMI clock input pin of PHY device.
SMI data input/output pin
Connect to SMI data of PHY device.
External address input pin
Address input pin from external host.
“0” : Register select
“1” : FIFO data select
External data input/output pins
The I/O terminal of data bus bit of bit15 to bit8 with an
external host.
External data/GPIO input/output pins
The I/O terminal of data bus bit of bit7 to bit0 with an
external host.
Note : When EXIS16 “0” input, it becomes the I/O terminal
of GPIO7 to GPIO0.
External data bus width select input pin
Bit width select pin of EXD
“0” : 8 bit
(Note : EXD15 to EXD8 are enabled.)
“1” : 16 bit
External reception data request output pin
Recordable data to reception FIFO is shown.
External transfer data request output pin
It is shown that there are data in transmission register and
transmission FIFO.
12
USB IF (5 pin)
Prelminary
2004.11.12
Pin namePin no.
UDP61I/OC
UDM183I/OC
USBINS182IND
UCLK486IND
Polarity
I/O
Circuit
MB91401
Function/application
USB data D + (differential) pin
I/O signal pin on the plus side of the USB data.
Use the LSI with 25 Ω to 30 Ω (27 Ω recommended)
external series load resistors, 1.5 kΩ pull-up resistors and
about 100 kΩ resistors. Input “0” when the USB macro is
unused.
USB data D − (differential) pin
I/O signal pin on the minus side of the USB data.
Use the LSI with 25 Ω to 30 Ω (27 Ω recommended)
external series load resistors, 1.5 kΩ pull-up resistors and
about 100 kΩ resistors. Input “0” when the USB macro is
unused.
USB insert input pin
USB socket input detection pin. Be sure to input “0” when
not using USB macro.
48 MHz input (external clock input) pin
This pin inputs an external 48-MHz clock signal.
The USB macro operates based on this clock. Input the
clock with high accuracy (as not only LSI but also a device)
more than 2500 ppm. Input “0” when the USB macro is unused.
UCLKSEL124IND
USB clock select pin
Clock select pin using for USB macro
“0” : Using internal clock
“1” : Using UCLK48
CF data input/output pins
I/O data/status/command signal pin to CompactFlash card
side
CF address 10 to 0 output pins
Address output CFA10 to CFA0 pins to CompactFlash card
side
CF card enable output pin
Byte access output pin to CompactFlash card side
Note : Supported for access to CFD7 to CFD0.
When “L” level is output, odd number byte access of the
word is shown.
CF card enable output pin
Byte access output pin to CompactFlash card side
Note : Supported for access to CFD7 to CFD0.
When “L” level is output at word access, even number byte
access of the word is shown.
When the byte is accessed, the even number byte and odd
number byte access become possible because CFA0 and
CFCE2X are combined and used by it.
CF Attribute/Common switching output pin
Attribute/Common switching output pin to CompactFlash
card side
“H” : Common Memory select
“L” : Attribute Memory select
Card connection detect input pin : CFCD2X
Checking connection pin of the socket and CompactFlash
card. It is shown that the CompactFlash card was connected
when this signal and CFCD1X are both input by “0”.
(Continued)
(Continued)
Prelminary
2004.11.12
Pin namePin no.
CFCD1X58
CFVS1X230
CFRDY
(CFIREQ)
60
Polarity
Nega-
tive
Nega-
tive
Posi-
tive
(Nega-
tive)
Circuit
I/O
INE
INE
INE
MB91401
Function/application
Card connection detect input pin : CFCD1X
Checking connection pin of the socket and CompactFlash
card. It is shown that the CompactFlash card was connected
when this signal and CFCD2X are both input by “0”.
CF side GND input pin
GND level detection pin from CompactFlash side.
The “0” input to the pin assumes that the CompactFlash
card can operate at 3.3 V, setting the CFVCC3EX pin to the
“L” level.
CF ready input pin : memory card
Ready input pin from CompactFlash memory card side
“1” : Ready
“0” : Busy
(CF interrupt : I/O card)
Interrupt request pin of CompactFlash I/O card. It is shown
the interrupt request was done from the I/O card when input
to this signal by “0”.
CFWAITX125
CFVCC3EX234
CFRESET184
CFOEX127
CFWEX62
CFIORDX64
Nega-
tive
Nega-
tive
Posi-
tive
Nega-
tive
Nega-
tive
Nega-
tive
INE
OUTB
OUTA
OUTB
OUTB
OUTB
Cycle wait input pin during CF execution
Cycle wait input pin from CompactFlash card side
“0” : It is shown that there is a wait demand at the cycle
under ex ecution.
“1” : It is shown that there is no wait demand at the cycle
under execution.
CF3.3 V power enable output pin
Outputs “L” level when the CompactFlash card is operable
at 3.3 V.
The output signal enables 3.3-volt power supply to the
CompactFlash card. The pin outputs “L” level only when the
CFVS1X pin detects “0”; otherwise, the pin outputs “H”.
CF reset output pin
Reset output pin to CompactFlash card side.
CompactFlash is reset at “H” output.
CF read strobe output pin
Read strove output pin to CompactFlash card (memory
mode and Attribute memory area)
CF register write output pin
Write clock output pin to CompactFlash card (register write
and Card Configuration Register area).
The register write is executed at the rising edge from “L” to
“H”.
APLL dedicated power supply pin
This pin is for 1.8 V power supply pin.
PLLVSS197GNDV-SAPLL dedicated GND Pin
83
196
202
VDDE
208
214
220
Power
supply
V-E3.3 V power supply pin
226
232
238
195
200
203
207
211
VDDI
215
219
Power
supply
V-E1.8 V power supply pin
223
227
231
235
239
1
19
37
55
193
198
201
VSS
205
209
GNDV-SGND Pin
213
217
221
225
229
233
237
16
I/O CIRCUIT TYPE
Prelminary
2004.11.12
■■■■
TypeCircuitRemarks
MB91401
Digital output
• With pull/down
• CMOS level output
A
Digital output
• CMOS level input
• Value of pull-down resistance =
approx. 33 kΩ (Typ)
Digital input
Digital output]
B
Digital output
• CMOS level output
• CMOS level input
Digital input
+
input
D
−
D
D+
input
Differential input
D−
Full D
+
output
CUSB I/O
−
Full D
output
+
Low D
Low D
output
−
output
Direction
Speed
(Continued)
17
MB91401
Prelminary
2004.11.12
(Continued)
TypeCircuitRemarks
DCMOS level input
E
FCMOS level output
Digital input
Digital input
Digital output
Digital output
• With pull-up
• CMOS level input
• Value of pull-up resistance =
approx. 33 kΩ (Typ)
18
Oscillation output
Control
GOscillation circuit
MB91401
Prelminary
2004.11.12
HANDLING DEVICES
■■■■
Preventing Latch-up
When a voltage that is higher than V
and the output terminal in CMOS IC or the voltage that exceeds ratings between V
latch-up phenomenon might be caused. If latch-up occurs, the supply current increases rapidly, sometimes
resulting in thermal breakdown of the device. Use meticulous care not to let any voltage exceed the maximum
rating during device operation.
Separation of power supply pattern
Analog PLL (APLL at the following) is installed in this LSI. The po wer supply f or VCO and for digital is separ ated
in LSI so that the oscillation characteristic of APLL may receive the influence of power supply variation.
Therefore, the power supply is recommended to be separated also on the mounting base.
•••• Separation of power supply pattern (recommended)
Take measures to reduce impedance, for example, by using as wide a power pattern as possible.
The recommendation example is shown as follows.
• For two power supplies (for digital and for VCO)
It is advisable to provide a digital power-supply (a) and VCO power-supply (b) and connect them to the LSI’s
equivalents, respectively.
DDE and a voltage that is lower than VSS are impressed to the input terminal
DDE to VSS is impressed, the
Figure For 2-power supply (for digital and for VCO)
Power
supply
(a)
VDD (for digital)
PLLVDD (for VCO)
Power
supply
(b)
PLLVSS
VSS
APLL
Logic part
LSI
• For the common power supply
To share a single power-supply for digital and VCO uses, it is advisable to separate the output into the digital
and VCO wiring patternsand connect them to the LSI.
19
MB91401
Prelminary
2004.11.12
Figure When you share the power suppl y for digital and for VCO
VDD (for digital)
PLLVDD (for VCO)
Power
supply
(a)
Treatment of the unused pins
Leaving unused input pins open results in a malfunction, so process the pull-up or pull-down.
Treatment of OPEN pins
Be sure to use open pins in open state.
Treatment of output pins
A large current may flow to an output pin left connected to the power-supply, another output pin, or to a high
capacitance load. Leaving the output pin that way for an extended period of time degrades the device. Use
meticulous care in using the device not to exceed the absolute maximum rating.
PLLVSS
VSS
APLL
Logic part
LSI
About Mode (MDI2 to MDI0, VPD) pin and Test (TEST3 to TEST0) pin
Connect these pins directly to VDDE or VSS. To prevent the device from entering test mode accidentally due to
noise, minimize the lengths of the patterns between individual mode pins and VDDE or VSS on the PC board
as possible and connect them with as low an impedance as possible.
About power supply pins
In products with multiple VDDE, VDDI or VSS pins, the pins of the same potential are internally connected in
the device to av oid abnormal operations including latch-up. Howe ver you must connect the pins to e xternal power
supply and a ground line to lower the electro-magnetic emission level to prevent abnormal operation strobe
signals caused by the rise in the ground level, and to conform to the total output current rating.
The power pins should be connected to VDDE, VDDI and VSS of this device at the lowest possible impedance
from the current supply source.
It is also advisable to connect a ceramic bypass capacitor of approximately 0.1 µF between VDDE and VSS,
and between VDDI and VSS near this device.
Crystal Oscillator Circuit
Noise near the OSCEA terminal may cause the MB91401 to malfunction.
Design the circuit board so that OSCEA terminal, OSCEB terminal and the cr ystal oscillator, and the bypass
capacitor to ground are located as close to the device as possible.
It is strongly recommended to design the PC board artwork with the OSCEA ter minal and OSCEB terminal
surrounded by ground plane because stable operation can be expected with such a layout.
20
MB91401
Prelminary
2004.11.12
CONNECTED SPECIFICATION OF MB91401 AND ICE
■■■■
Recommended type and circuit configuration of the emulator interface connector mounting on the user system,
attention when designing and wiring regulation are shown.
When the flat cable is used, the combination of the connectors with housing should be selected.
Recommended connector type
Attached cablePart numberRemarks
FPC cableFH10A-30S-1SH (Maker : Hirose Electric Co., Ltd.) With latch
• Circuit composition
Please put the dumping resistance 15 Ω in the series in the ICLK terminal signal because of the stability of
operation when connecting it with ICE. Resistance must be mounted near the terminal ICLK of this LSI when
you design the printed wiring board.
Emulator interface connector
MB2198-0 and MB2197-01 side
UVCC
ICLK
ICS2 to ICS0
ICD3 to ICD0
BREAKI
RST
xRSTIN
(Open)
FR
∗1
FUSE
∗2
Reset output
V
CC
15 Ω
10 kΩ
MCU for evaluation
MB91401
CC
V
∗3
ICLK
ICS2 to ICS0
ICD3 to ICD0
BREAKI
INITXI
circuit
GND
VSS
*1 : Use the line (inter connect) to flow the rating current or more.
*2 : The change circuit might become necessary, and refer to “Precaution when designing”.
*3 : Mount resistance near the terminal ICLK of MB91401.
21
MB91401
Prelminary
2004.11.12
• Precaution when designing
When evaluation MCU on the user system is operated in the state that the emulator is not connected, should
be treated as follow each input terminal of evaluation MCU connected with the emulator interface on the user
system.
Therefore, note that the switch circuit etc, might become necessary in the user system when you design.
The terminal processing in each emulator interface is shown as follows.
Pin treatment of emulator interface (DSU-3)
Evaluation MCU terminal namePin treatment
RST
OthersTo open.
Emulator interface wiring regulations
Signal line nameWiring regulations
ICLK
ICS2 to ICS0
ICD3 to ICD0
BREAKI
UV
CC
GND• Connect directly with a power supply system pattern such as grandopran.
• Reference document
Please match and refer to the following manual for the connection with ICE.
• DSU-FR Emulator MB2198-01 Hardware Manual
• FR20/30 series MB2197-01 Hardware Manual
To be connected the RST terminal with the reset output circuit in the
user system.
• The total wiring length of each signal (From evaluation MCU pin to the
emulator interface connector pin) is made within 50 mm.
• The difference of the total wiring length of each signal makes within 2 cm
and the total wiring length of ICLK is the shortest.
• Wire the pattern with capacity more than the ratings current.
• Each power supply and GND may cause a short-circuit or reverse connec-
tion in between by a wrong connection of a probe. Insert a protection circuit
such as a fuse into each power supply pattern to safeguard it.
22
JTAG
Prelminary
2004.11.12
The JTAG function is installed in this LSI.
Note that the terminal INITXI should be input in "L" when using JTAG.
Notes when quartz vibrator is mounted
The crystal oscillation circuit built into this LSI operates by the following compositions.
MB91401
OSC
MB91401
• Pin description
Pin nameFunction
OSCCOscillation control terminal of crystal oscillation cell (OSC)
OSCEAInput terminal of crystal oscillation cell (OSC)
OSCEBOutput terminal of crystal oscillation cell (OSC)
OSCCOSCEA
C1C2C3
Quartz
vibrator
OSCEB
Rr
Installation
when over tone
oscillates
L
• Circuit constant on external substrate
When OSCCL is input, the OSCEA and OSCEB oscillate at the natural frequency of the crystal oscillator and
propagated into the LSI.
Circuit constantsDescription
C1, C2, C3External load capacity
LInductance
RrDumping resistance (addition if necessary)
23
MB91401
Prelminary
2004.11.12
• Reference Value
Oscillation frequencyC1, C2C3LRr
to 30 MHz5 pF to 33 pFNoneNoneNone
20 MHz to 50 MHz5 pF to 15 pF10 nF approx.1 µH approx.None
It is necessary to add C3/L depending on a basic wave and the over tone characteristic of the oscillator of the
20 MHz to 30 MHz belt.
Note : These reference v alues are standards. The constant changes according to the characteristic of the quartz
vibrator used. Therefore, we will recommend the initial evaluation that uses the evaluation sample to the
decision of the circuit constant. Please contact FUJITSU representatives about the evaluation sample.
••••
Notes when encryption/authentication accelarator is used
When using the encryption/authentication installed in this LSI, it is necessary to the following notes.
32-bit data bus
The encryption/authentication accelerator fetches data from the area storing data to be subject to encryption/
authentication and encrypts or authenticates the data without CPU inter vention. In the encryption processing,
write is done in the area where it wants to store the data after the encryption is processed.
MB91401
32bit
encryption/
authentication
accelerator
Holding request withdrawal demand function OFF
When accessing to the storage destination of encryption/authentication processing data, the encryption/authentication accelerator should hold an internal bus of this LSI.
Therefore, when the encryption/authentication accelerator are used, it should be set that the holding request
withdrawal doesn’t demand.
Please set the HRCL register that sets the interrupt level that becomes the standard of the holding request
withdrawal demand generation to "10000" in the FR core.
Data Bus
RAM
At the storage destination of
encryption/authentication
processing data
24
For NMIs, the hold request cancel request occurs regardless of the HRCL register setting. When the encryption/
authentication accelerator is used, therefore, NMI input may cause encr yption/authentication to fail to result
correctly. In that case, the correspondence said that it will execute the encryption/authentication processing
under execution again is necessary.
MB91401
Prelminary
2004.11.12
••••
Notes as device
Treatment of Unused Input Pins
It causes the malfunction that the unused input terminal is made open, and do the processing such as 1 stack
or 0 stacks.
About Mode pins (MDI2 to MDI0)
Connect these pins with the input buffer by 1 to 1 to prevent the malfunction by the noise, and connect directly
to VDD or VSS outside of ASIC.
Operation at start-up
Specify set initialization reset (INIT) with the terminal INITXI when you turn on the power supply.
Moreover, connect "L" level input to the terminal INITXI until the input clock is steady.
About watch dog timer
The watchdog timer function of this macro monitors a program to check whether it dela ys a reset within a certain
period of time. If the program runs out of control and fails to dela y the reset, the w atchdog timer function resets
the CPU.
Therefore, it keeps operating until reset is specified when the watchdog timer function is made effective once.
Exceptionally, the reset postponement is automatically done under the condition that the program execution of
CPU stops. Refer to the parag raph of the function explanation of the w atchdog timer for the condition of applying
to this exception.
There is a possibility that watchdog reset is not generated when entering the above-mentioned state by the
reckless driving of the system. In that case, please specify reset (INIT) from external INITX terminal.
Restrictions
• Clock control block
• Secure the clock stability waiting time at "L" input to INITXI.
• When entering the standby mode, use the following sequences after using the synchronous standby mode
(TBCR:set at the bit8 SYNCS bit of timebase counter control register).
(LDI#value_of_standby, R0) ; Value_of standby is write data to STCR.
(LDI#_STCR, R12) ; _STCR is address (481H) of STCR.
STBR0, @R12; Write to standby control register (STCR).
LDUB@R12, R0; STCR read for synchronous standby
LDUB@R12, R0; Dummy re-read of STCR
NOP
NOP
NOP
NOP
NOP
In addition, set the I-flag and the ILM and ICR registers to branch to an interrupt handler when the interrupt
handler triggers the microcontroller to return from the standby mode.
• Please do not do the following when the monitor debugger is used.
• Please do not set the break point to the above-mentioned instruction row.
25
MB91401
Prelminary
2004.11.12
CPU
• The instruction fetch is not done from D-bus, and does not set the code area on D-bus RAM.
• Set neither stack area nor the vector table on the instruction RAM.
• The following operations may be performed when the instruction immediately followed by a DIVOU/DIVOS
instruction is (a) halted by a user interrupt or NMI, (b) single-stepped, or (c) breaks in response to a data event
or emulator menu:
(1) The D0 and D1 flags are updated in advance.
(2) An EIT handling routine (user interrupt, NMI, or emulator) is executed.
(3) Upon returning from the EIT, the DIVOU/DIVOS instruction is executed and the D0 and D1 flags are
updated to the same values as in (1) .
• The following operations are performed when the ORCCR/STILM/MOVRi and PS instructions are executed.
(1) The PS register is updated in advance.
(2) Executing of EIT processing routine (user interrupt • NMI)
(3) Upon returning from the EIT, the above instructions are executed and the PS register is updated to the
same value as in (1) .
• Since some instructions manipulate the PS register earlier, the following exceptions may cause the interrupt
handler to break or the PS flag to update its display setting when the debugger is being used. As the microcontroller is designed to carry out reprocessing correctly upon returning from such an EIT event in either case,
it performs operations before and after the EIT as specified.
1. When (a) user interrupt and NMI are accepted or (b) step is executed or (c) break is done by the data
event or the menu of the emulator in the instruction immediately before the instruction of DIV0U/DIV0S,
the following operation might be done.
(1) The D0 and D1 flags are updated in advance.
(2) An EIT handling routine (user interrupt, NMI, or emulator) is executed.
(1) Upon returning from the EIT, the DIVOU/DIVOS instruction is executed and the D0 and D1 flags are
updated to the same values as in (3) .
2. When ORCCR, STILM, MOV Ri, and PS each instruction is executed to permit interrupt with the user
interrupt and the NMI factor generated, the following operation is done.
(1) The PS register is updated in advance.
(2) The EIT processing routine (user interrupt, NMI or emulator) is executed.
(3) Upon returning from the EIT, the above instructions are executed and the PS register is updated to
the same value as in (1).
• Do not access the data to the cache memory at the control register of the instruction cash and RAM mode
immediately before the instruction of RETI.
• If one of the instructions listed below is executed, the SSP or USP* value is not used as the R15 value and,
as a result, an incorrect value is written to memory.
• Only ten following kinds of instructions that specify R15 as Ri correspond.
* : As for R15, there are no realities. When R15 is accessed from the program, SSP or USP is accessed by the
state of "S" flag of the PS register. Please specify gener al registers other than R15 when ten abov e-mentioned
instructions are described by the assembler.
26
MB91401
Prelminary
2004.11.12
• External bus interface
• When the bus width of the area set up as little endian is 32-bit, confine to word (32-bit) access when accessing
the relevant area.
• When enabling prefetch to the area set to the Little endian, giv e the access to the corresponding area as word
(32 bits) access limitation. In the byte and the half word access, it is not possible to access it correctly.
• DMA
• Do not transfer DMA to instruction RAM.
• Bit Search Module
• BSD0, BSD1, and the BDSC register are only the word accesses.
27
MB91401
Prelminary
2004.11.12
NOTES OF DEBUG
■■■■
Step execution of RETI instruction
In an environment where interrupts frequently occur during single-step execution, only the relevant interrupt
processing routines are ex ecuted repeatedly during single-step execution of the RETI instruction. This will prevent
the main routine and low-interrupt-level programs from being executed.
Do not execute step of RETI instruction for escape.
When the relevant interrupt routine no longer requires being debugged, disab le the relevant interrupt and perf orm
debugging.
Operand break
Do not set the access which is used for area, including the address of system stack pointer, to the target of data
event br eak.
Interrupt handler to NMI request (tool)
To prevent the malfunction because of the noise problem of DSU pin when ICE is unconnected, the following
programs are added to the interrupt handler by the cause flag, which is only set by the break request from ICE.
ICE can be used even if this program is added.
Location to added
The following interrupt handler
Interrupt resource : NMI request (tool)
Interrupt number : 13 (decimal), 0D (hexadecimal)
Offset : 3C8
TBR is default address. : 000FFFC8H
If the trace mode is set to "Full trace mode" during debug (in full trace mode, built-in FIFO is used as output
buffer, the trace memory of the main body of ICE is used, and the trace data lost is not occurred), the electric
current is increased and D-busDMA access may be lost.
Also, the trace data lost may be occurred.
To take the measures, do not set full trace mode.
Simultaneous generation of a software break and a user interrupt/NMI
When a software break and a user interrupt/NMI occur simultaneously, the emulator debugger may react as
follows.
• The debugger stops pointing to a location other than the programmed breakpoints.
• The halted program is not re-executed correctly.
H, R0 ; B00H is address of the break resource register.
H
28
When these problems are occurred, not only the software break, the hardware break should also be used. Do
not set the break to the corresponding location when using monitor debugger.
Peripheral resources : LAN, External_IF, GPIO , Card, Encryption/Authentication, I
2
C, USB (P eripheral resource
is connected to bus of bus controller. )
29
MB91401
Prelminary
2004.11.12
MEMORY SPACE
■■■■
• Memory space
32
The FR family has 4 GByte of logical addresses (2
Direct Addressing Areas
The following address space areas are used as I/O areas.
These areas are called direct addressing areas, in which the address of an operand can be specified directly
during an instruction.
The direct addressing area varies as shown below depending on the size of access data:
→ byte data access : 0-0FF
H
→ half word data access : 0-1FFH
→ word data access : 0-3FFH
• Memory Map
The memory space of the macro consists of the following areas.
address) which can be linearly accessed by the CPU.
Direct Addressing Areas
Refer to I/O Map
I/O
I/O
I-bus RAM 4 KB
(and its mirror)
Access disallowed area
D-bus RAM 8 KByte
External area
0000 0000
0000 0400H
0001 0000H
0002 0000H
0003 F800H
0004 0000H
H
30
FFFF FFFFH
GENERAL PURPOSE REGISTERS
Prelminary
2004.11.12
■■■■
R0
R1
R12
R13
R14
R15
32 bits
AC
FP
SP
Initial Value:
XXXX XXXX
XXXX XXXXH
0000 0000H
MB91401
H
Registers R0 to R15 are general-purpose registers. The registers are used as the accumulator and memory
access pointers for CPU operations.
Of these 16 registers, the registers listed below are intended f or special applications, for which some instructions
are enhanced.
The initial values of R0 to R14 after a reset are indeterminate. R15 is initialized to 00000000
H (SSP value).
31
MB91401
Prelminary
2004.11.12
MODE SETTINGS
■■■■
The FR family uses the mode pins (MDI2 to MDI0) and the mode register (MODR) to set the operation mode.
••••
Mode Pins
Three mode pins MDI[2], MDI[1], and MDI[0] are used to specify a mode vector fetch or test mode.
Mode pins
Mode name
MDI2 to MDI0
0 0 0Reserved
0 0 1external ROM mode vectorExternalBus width is set by the mode data.
0 1 0User circuit testFR stops (with clock signal supplied).
0 1 1Reserved
1 0 0Reserved
1 0 1Reserved
1 1 0Reserved
1 1 1Reserved
Reset vector
access area
Remarks
Setting MDI2 to MDI0 to "010", USRTEST is set to "1" and the de vice operates in the user circuit test mode. The
FR71 core is suspended in the user circuit test mode while SYSCLK and MCLKO are operating. The reserved
modes include the FR71 core test mode. In this case, the signal at the FR TEST pin becomes "1" and enters the
FR71 core test mode. If the FRTEST pin = "1", that circuit configuration is required which allows the separately
defined pins of the FR71 core to be controlled and monitored from the outside of the chip.
••••
Mode Register (MODR)
The data written to the mode register (MODR) by hardware using a mode vector fetch is called mode data.
When this register is set by hardware, the CPU operates in the operation mode corresponding to the register
setting.
The mode register is set only by an INIT-level reset cause. The user program cannot access this register.
However, as an exception, when the macro shifts to emulation mode by INTE instruction, or shifts to emulation
mode by a break at a debug using ICE, this register is mapped at 0000_07FD
ICE, perform the mode data setting before the program loading by writing a appropriate value to this register.
Note : No data is existed in the address (0000_07FFH ) in the mode register of the FR family.
••••
Register
76543210
MODRXXXXXXXX
000000WTH1WTH0
H. Select this function when using
Initial Value
B
[bit7 to bit2] Reserved bit
32
Operation mode setting bits
Be sure to set this bit to “000000”. Setting them to any other value may result in an unpredictable operation.
MB91401
Prelminary
2004.11.12
[bit1, bit0] WTH1, WTH0 (Bus width setting bits)
These bits specify the bus width. The value of the bits is set in the DBW1 and DBW0 bits in ACR0 (CSO area).
Set these bits to a value other than “11”.
WTH1WTH0FunctionRemarks
008-bit bus widthExternal bus mode
0116-bit bus widthExternal bus mode
1032-bit bus widthExternal bus mode
11Setting disabled
••••
Operation mode
In the operation mode, there are a bus mode and an access mode.
Bus modeAccess mode
32-bit bus width
External ROM
bus
16-bit bus width
8-bit bus width
Bus mode
In bus mode, the operations of internal ROM and the external access functions are controlled according to the
mode setting pins (MD2 to MD0) and the values of mode data.
Although the FR71 architecture supports this bus mode, this macro cannot use the single-chip or internal ROM/
external bus mode but can use the external ROM/external bus mode only.
Access mode
Access mode indicates the mode that controls the external data bus width, and is specified by the WTH1/WTH0
bits, and the DBW1/DBW0 bits within ACR0 to ACR7 (Area Configuration Registers).
Bus mode
The FR family has three bus modes described below. Please refer to “■ MEMORY SPACE” for details.
33
MB91401
Prelminary
2004.11.12
I/O MAP
■■■■
This shows the location of the various peripheral resource registers in the memory space.
[How to read the table]
Address
Register
0000_0000
|
0000_003C
0000_0040
H
H
H
++++
0
EIRR [R/W]
00000000
++++
1
ENIR [R/W]
00000000
Reserved
Read/Write attribute
Initial value after a reset
Register name (First-column register at address 4n; second-column register
at address 4n + 2)
Left most register address (When accessing it by word, the register of
column 1 is positioned on the MSB side of data.)
Note : Initial values of register bits are represented as follows :
*1 : An initial value is a different register at the reset level. The display is the one at the INIT level.
*2 : An initial value is a different register at the reset level. The display is due to the INIT level by INITX.
*3 : An initial value is set by the WTH bit of the mode vector.
Register
Address
0000_1000
0000_1004
0000_1008
++++
0
H
H
H
XXXXXXXX XXXXXXXX
XXXXXXXX XXXXXXXX
XXXXXXXX XXXXXXXX
++++
1
DMASA0
[R/W]
XXXXXXXX XXXXXXXX
DMADA0
[R/W]
XXXXXXXX XXXXXXXX
DMASA1
[R/W]
XXXXXXXX XXXXXXXX
++++
2
++++
3
Block
0000_100C
0000_1010
0000_1014
0000_1018
0000_101C
0000_1020
0000_1024
0000_1028H
to
0000_FFFC
H
H
XXXXXXXX XXXXXXXX
XXXXXXXX XXXXXXXX
DMADA1
DMASA2
[R/W]
XXXXXXXX XXXXXXXX
[R/W]
XXXXXXXX XXXXXXXX
DMAC
H
H
H
H
H
XXXXXXXX XXXXXXXX
XXXXXXXX XXXXXXXX
XXXXXXXX XXXXXXXX
XXXXXXXX XXXXXXXX
XXXXXXXX XXXXXXXX
DMADA2
DMASA3
DMADA3
DMASA4
DMADA4
[R/W]
XXXXXXXX XXXXXXXX
[R/W]
XXXXXXXX XXXXXXXX
[R/W]
XXXXXXXX XXXXXXXX
[R/W]
XXXXXXXX XXXXXXXX
[R/W]
XXXXXXXX XXXXXXXX
Reserved
H
38
MB91401
Prelminary
2004.11.12
Address
010F_0000
010F_0004H
010F_0008
to
010F_FFFF
Address
0110_0000
0110_0004
0110_0008
0110_000C
0110_0008
0110_000C
0110_0008
0110_000C
0110_0010
0110_0014
0110_0018
0110_001C
0110_0020
0110_0024
++++
0
H
BSR[R]
00000000
DAR[R/W]
XXXXXXXX
H
H
++++
0
H
H
H
H
H
H
H
H
H
DLCR0*
0X000000
DLCR4*
00000010
DLCR8[R/W]
00000000
DLCR12[R/W]
00000000
MAR8[R/W]
00000000
MAR12[R/W]
00000000
BMPR12*
00000000
00000000-00000000
FILTER_CMD
H
[R/W]
XXXXXXXX
FILTER_STATUS
H
[R]
XXXXXXXX
FILTER_DATA
H
[R/W]
XXXXXXXX
FL_CONTROL
H
[R/W]
XXXXXXXX
FL_SUBNET
H
[R/W]
XXXXXXXX
BMPR8
Register
++++
1
BCR[R/W]
00000000
(Reserved)
++++
1
DLCR1[R, W]
00000000
DLCR5*
01000001
DLCR9[R/W]
00000000
DLCR13[R/W]
00000000
MAR9[R/W]
00000000
MAR13[R/W]
00000000
Register
DLCR10[R/W]
++++
2
CCR[R/W]
10000000
++++
2
DLCR2*
00000000
DLCR6*
10000000
00000000
MAR10[R/W]
00000000
MAR14[R/W]
00000000
BMPR10*
00000000
BMPR14*
00000000
00000000-00000000
1XXXXXXX
BC2R[R/W]
DLCR3[R/W]
DLCR11[R/W]
MAR11[R/W]
MAR15[R/W]
[R/W]
++++
3
ADR[R/W]
00XX0000
++++
3
00000000
DLCR7*
00000000
00000000
00000000
00000000
BMPR11*
00000111
Block
2
C
I
Block
LAN controller
Bank 0
Bank 1
Bank 2
(Continued)
39
MB91401
Prelminary
2004.11.12
(Continued)
Address
0110_0028
0110_002C
0110_0030
0110_0034
0110_0038
0110_003C
0110_0040
0110_0044
0110_0048
H
SMI_CMD_ST
H
H
H
SMI_PHY_ADD
H
SMI_CONTROL
H
SMI_STATUS[R]
H
SMI_INTENABLE
H
SMI_MDCDIV
H
++++
0
SMI_CMD[R/W]
00000000-00000000
[R/W]
00XXXXXX
SMI_DATA [R/W]
00000000-00000000
SMI_POLLINTVL [R/W]
00000000-00000000
[R/W]
00000XXX
[R/W]
111XXXXX
XXXXXXXX
[R/W]
0XXXXXXX
[R/W]
01011XXX
Register
++++
1
++++
2
++++
3
SIM IF
SIM IF
Block
* : The attribute is different according to the bit.
40
MB91401
Prelminary
2004.11.12
Address
0114_0000
0114_0004
0114_0008
0114_000C
0114_0010
0114_0014
0114_0018
0114_001C
0114_0020
0114_0024
Register
++++
0
H
H
H
H
H
H
H
H
H
H
00000000-00000000
00000000-00000000
00000000-0XXXXXXX
00000000-00XXXXXX
00000000-00000000
00000000-00000000
EXIFRXR[R]
EXIFTXR[W]
EXIFCR[W]
EXIFSR[R]
00000000-00000000
00000000-00000000
++++
1
EXIFRXDR
[R]
00000000-00000000
EXIFTXDR
[W]
00000000-00000000
EXIFRXSR
[R]
00000000-00000000
EXIFTXSR
[R]
00000000-00000000
++++
2
PIOCR[R/W]
00000000
PIODR[R/W]
Connecting
destination
++++
3
External IF
GPIO
Block
Address
0500_03E0
0501_0000
to
0501_07FF
0501_1000
to
0501_17FF
Register
Block
++++
0
H
H
H
H
H
IR[R/W]
00000000
(Attribute Memory Area : window 0)
(Common Memory Area : window 1)
++++
1
DR[R/W]
10000011
AMR
CMR
++++
2
(Reserved)
++++
3
RR[R/W]
00000000
Compact FLASH
IF
41
MB91401
Prelminary
2004.11.12
Address
0540_0000
0540_0004
0540_0008
0540_000C
to
0540_001F
0540_0020
0540_0024
0540_0028
0540_002C
0540_0030
Register
Block
++++
0
H
H
H
H
H
H
H
H
FIFO0out[R]
XXXXXXXX-XXXXXXXX
FIFO1[R]
XXXXXXXX-XXXXXXXX
FIFO3[W]
XXXXXXXX-XXXXXXXX
CONT2[R/W]
XXXXXXXX_XXX00000
CONT4[R/W]
XXXXXXXX_XXX00000
++++
1
(Reserved)
++++
2
++++
3
FIFO0in[W]
XXXXXXXX-XXXXXXXX
FIFO2[W]
XXXXXXXX-XXXXXXXX
CONT1[R/W]
XXXXX0XX-XXX00000
CONT3[R/W]
XXXXXXXX_XXX00000
CONT5[R/W]
XXXXXXXX_XXXX00XX
USB
H
H
CONT6[R/W]
XXXXXXXX_XXXX00XX
CONT8[R/W]
XXXXXXXX_XXX00000
CONT7[R/W]
XXXXXXXX_XXX00000
CONT9[R/W]
XXXXXXXX_0XXX0000
0540_0034
0540_0038
0540_003C
to
0540_003F
0540_0040
0540_0044
0540_0048
to
0540_005F
0540_0060
0540_0064
H
H
H
H
H
H
H
H
H
H
CONT10[R/W]
XXXX0000_X000000X
TRSIZE[R/W]
00010001-00010001
(Reserved)
RSIZE0[R]
XXXXXXXX-XXXX0000
RSIZE1[R]
XXXXXXXX-X0000000
(Reserved)
TTSIZE[R/W]
00010001-00010001
ST1[R/W]
XXXXXX00-00000000
USB
(Continued)
42
(Continued)
Prelminary
2004.11.12
Address
++++
0
Register
++++
1
++++
2
MB91401
++++
3
Block
0540_0068
0540_006C
0540_0070H
to
0540_007B
0540_007C
0540_0080
to
0540_FFFF
Address
0580_0000
0580_0008
H
H
H
H
H
H
H
H
H
XXXXXXXX-X0000000
XXXXX000-00000000
++++
00000000-00000001
00000000-00000000
00000000-00000000
ST2[R]
ST4[R]
0
MACRORR[W/R]
CARDIMR[R/W]
USBPLLRP[R/W]
(Reserved)
(Reserved)
Register
++++
1
ST3[R/W]
XXXXXXXX-XXX00000
ST5[R/W]
XXXX0XXX-XX000000
RESET[R/W]
XXXXXXXX-XXXXXX00
++++
2
++++
3
CARDSR[R/W]
00000000-00000000
CARDISR[R]
00000000-00000000
USB
Block
Chip Register0580_0004
43
MB91401
Prelminary
2004.11.12
INTERRUPT VECTOR
■■■■
Interrupt source
Interrupt number
Decimal
Hexa-
decimal
Interrupt
level
Offset
Address of TBR
default
RN
Reset0003FCH000FFFFCH
Mode vector1013F8
H000FFFF8H
System reserved2023F4H000FFFF4H
System reserved3033F0
System reserved4043EC
H000FFFF0H
H000FFFECH
System reserved5053E8H000FFFE8H
System reserved6063E4
Coprocessor absent trap7073E0
H000FFFE4H
H000FFFE0H
Coprocessor error trap8083DCH000FFFDCH
INTE instruction9093D8
Instruction break exception100A3D4
DMAC3 (end, error)3422ICR18374H000FFF74H
DMAC4 (end, error)3523ICR19370
System reserved3624ICR2036C
H000FFF70H
H000FFF6CH
System reserved3725ICR21368H000FFF68H
System reserved3826ICR22364
System reserved3927ICR23360
H000FFF64H
H000FFF60H
System reserved4028ICR2435CH000FFF5CH
System reserved4129ICR25358
System reserved422AICR26354
H000FFF58H
H000FFF54H
System reserved432BICR27350H000FFF50H
System reserved442CICR2834C
U-TIMER0452DICR29348
H000FFF4CH
H000FFF48H
U-TIMER1462EICR30344H000FFF44H
Timebase timer overflow472FICR31340
System reserved4830ICR3233C
H000FFF40H
H000FFF3CH
System reserved4931ICR33338H000FFF38H
System reserved5032ICR34334
System reserved5133ICR35330
System reserved5234ICR3632C
H000FFF34H
H000FFF30H
H000FFF2CH
System reserved5335ICR37328H000FFF28H
System reserved5436ICR38324
System reserved5537ICR39320
H000FFF24H
H000FFF20H
System reserved5638ICR4031CH000FFF1CH
System reserved5739ICR41318
System reserved583AICR42314
H000FFF18H
H000FFF14H
System reserved593BICR43310H000FFF10H
System reserved603CICR4430C
System reserved613DICR45308
H000FFF0CH
H000FFF08H
System reserved623EICR46304H000FFF04H
Delay interrupt source bit633FICR47300
System reserved (Used by REALOS*)64402FC
System reserved (Used by REALOS*)65412F8
H000FFF00H
H000FFEFCH
H000FFEF8H
System reserved66422F4H000FFEF4H
System reserved67432F0
H000FFEF0H
(Continued)
45
MB91401
Prelminary
2004.11.12
(Continued)
Interrupt source
Interrupt number
Decimal
Hexa-
decimal
Interrupt
level
Offset
System reserved68442ECH000FFEECH
Address of TBR
default
RN
System reserved69452E8
H000FFEE8H
System reserved70462E4H000FFEE4H
System reserved71472E0
System reserved72482DC
H000FFEE0H
H000FFEDCH
System reserved73492D8H000FFED8H
System reserved744A2D4
System reserved754B2D0
H000FFED4H
H000FFED0H
System reserved764C2CCH000FFECCH
System reserved774D2C8
System reserved784E2C4
H000FFEC8H
H000FFEC4H
System reserved794F2C0H000FFEC0H
Used by INT instruction
80
to
255
50
to
FF
2BC
to
000
H
000FFEBCH
to
H
000FFC00
H
(2) NMI (Non Maskable Interrupt)
NMIs have the highest priority among the interrupt sources handled by this module.
An NMI is always selected whenever other types of interrupt sources occur at the same time.
• If an NMI occurs, the interrupt controller passes the information to the CPU :
Interrupt level : 15 (01111
B)
Interrupt number : 15 (0001111B)
• NMI detection
NMIs are set and detected by the external interrupt/NMI controller. This module only generates an interr upt
level, interrupt number, and MHALTI upon NMI request.
• Suppressing DMA transfer upon NMI request
When an NMI request occurs, the MHALTI bit in the HRCL register is set to "1", suppressing DMA transfer. To
permit DMA transfer, clear the MHALTI bit to "0" at the end of the NMI routine.
46
MB91401
Prelminary
2004.11.12
ELECTRICAL CHARACTERISTICS
■■■■
1.Absolute Maximum Ratings
ParameterSymbol
Power supply
voltage*
1
I/OVDDEVSS − 0.3VSS + 4.0V
InternalV
DDIVSS − 0.3VSS + 2.5V
Analog power supply voltagePLLVDDVSS − 0.3VSS + 4.0V*2
Input voltage*
Output voltage*
“L” level maximum output currentI
“L” level average output currentI
“L” level total maximum output currentΣI
“L” level total average output cur rentΣI
“H” level maximum output currentI
“H” level average output currentI
“H” level total maximum output currentΣI
“H” level total average output cur rentΣI
Power consumptionP
*1 : This parameter is based on VSS = PLLVSS = 0 V.
*2 : Note that analog power supply voltage and input voltage do not exceed VDDE + 0.3 V at power on.
*3 : The maximum output current is the peak value for a single pin.
*4 : The average output current is the average current for a single pin over a period of 100 ms.
*5 : The total average output current is the average current for all pins over a period of 100 ms.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
Notes : • Apply equal potential to all of the VDDE pins.
• Apply equal potential to all of the VDDI pins.
• Fix all of the VSS pins at 0 V.
• Leave N.C. pins open.
47
MB91401
Prelminary
2004.11.12
2.Recommended Operating Conditions
(VSS = PLLVSS = 0 V)
ParameterSymbol
Power supply voltage
I/OV
InternalV
Analog power supply voltagePLLVDDVSS + 3.0VDDEV
Operating temperatureTa− 1070.0 °C
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
DDE3.03.33.6V
DDI1.651.81.95V
MinTypMax
Value
Unit
48
3.DC Characteristics
Prelminary
2004.11.12
• Other than USB
Parameter
“H” level input
voltage
“L” level input
voltage
“H” level output
voltage
“L” level output
voltage
Input leak currentI
Pull-up resistanceR
Pull-down
resistance
Power supply
current
Input capacitanceC
Symbol
V
V
V
V
R
I
MB91401
(VSS = PLLVSS = 0 V)
PinConditions
MinTypMax
IH2.0
IL
OH
OL
LI
VDDE= 3.0 V,
I
OH= 4.0 mA
VDDE= 3.0 V,
I
OH= 4.0 mA
VDDE= 3.6 V,
V
SS < VI < VDDE
VSS − 0.3
VDDE − 0.5
0.4V
± 5µA
TCK/TRST/TMS/
TDI/TDO/
PULU
CFCD2X/
CFCD1X/
103380kΩ
CFVS1X/CFRDY/
CFWAITX
PULDCFRESET103380kΩ
VDDEVDDI= 1.8 V,
CC
VDDIT.B.DmA
Without power
IN
supply
V
DDE= 3.3 V,
fc = 50 MHz
18pF
T.B.DmA
Value
VDDE + 0.3
0.8V
V
Unit
V
49
MB91401
Prelminary
2004.11.12
• USB
Parameter
Symbol
PinConditions
(VSS = PLLVSS = 0 V)
Value
MinTypMax
Unit
Remarks
“H” level output
voltage
“L” level output
voltage
“H” level output
current
“L” level output
current
output short circuit
current
Input leak currentI
V
OHIOH=− 100 µAVDDE − 0.2VDDEV
V
OLIOL= 100 µA00.2V
I
OHVOH= VDDE− 0.4 V− 20mA
IOLVOL= 0.4 V20mA
I
OS 300mA *1
LZ ± 5µA*2
*1 : <About the output short-circuit current>
Output short-circuit current I
or V
SS (within the maximum rating) . The current is “the short-circuit current per differential output pin.” As the
OS is the maximum current that flows when the output pin is connected to VDDE
USB I/O buffer is a diff erential output, the short-circuit current should be considered for both of the output pins.
Monitor the short-circuit current
“L” level
“H” output
Short-circuited at GND level
3-State Enable "L"
“H” level
3-State Enable "L"
“H” output
*2 : <About Measurement of Z leakage current I
Input leakage current I
or V
SS voltage is applied to the bidirectional pin.
LZ is measured with the USB I/O buffer in the high-impedance state when the VDDE
Z output
3-State Enable "H"
Short-circuited at VDDE level
Monitor the short-circuit current
LZ>
Monitor the leakage current
0 V, VDD level applied to output pin
50
USB Specification Revision 1.1
Prelminary
2004.11.12
ParameterSymbol
Input Levels
MB91401
Value
UnitRemarks
MinMax
High (driven) V
LowV
IH2.0V*1
IL0.8V*1
Diffential Input SensitivityVDI0.2V*2
Differential Common Mode RangeV
CM0.82.5V*2
Output Levels
High (driven) V
LowV
Output Signal Crossover VoltageV
OH0.00.3V*3
OL2.83.6V*3
CRS1.32.0V*4
Terminations
Bus Pull-up Resistor on Upstream PortR
Termination Voltage for Upstream Port
Pull-up
*1 : <Input Levels V
IH, VIL>
PU1.4251.575kΩ1.5 kΩ ± 5%
V
TERM3.03.6V*5
The switching threshold voltage of the USB I/O buffer’s single-end receiver is set within the range from
V
IL (Max) = 0.8 V to VIH (Min) = 2.0 V (TTL input standard) .
For V
IH and VIL, the LSI has some hysteresis to reduce noise susceptibility.
*2 : <Input Levels V
DI, VCM>
A differential receiver is used to receive USB differential data signals.
The differential receiver has a diff erential input sensitivity of 200 mV when the diff erential data input falls within
the range from 0.8 V to 2.5 V with respect to the local ground reference level.
The above voltage range is referred to as common-mode input voltage range.
*3 : <Output Levels V
1.0
sensitivity (V)
0.2
Minimum operating input
0.8
2.5
Common mode input voltage (V)
OL, VOH>
The output driving performance levels of the driver are 0.3 V or less (to 3.6-V, 1.5 kΩ load) in the low
state (V
OL) and 2.8 V or more (to ground, 1.5 kΩ load) in the high state (VOH) .
51
MB91401
Prelminary
2004.11.12
*4 : <Output Levels V
CRS>
The cross voltage of the external diff erential output signals (D+ and D−) falls within the range from 1.3 V to 2.0 V.
D+
Max 2.0 V
VCRS standard range
Max 1.3 V
D−
*5 : <Terminations V
V
TERM indicates the pull-up voltage at the upstream port.
TERM>
52
MB91401
Prelminary
2004.11.12
4.AC Characteristics
The following measurement conditions depending on the supply voltage apply to the MB91401 unless otherwise
specified.
• AC measurement condition
0 V
InputOutput
VIH
IL
V
IHVDDE× 0.8VOHVDDE/2
V
V
ILVDDE× 0.2VOLVDDE/2
VCC
0 V
VOH
OL
V
VCC
• Load condition
C = 55 pF
(1) Clock
Value
ParameterSymbolPinConditions
UnitRemarks
MinMax
FclkcycXINIExternal clock10.050.0MHz
Input clock frequency
Internal operating clock frequency
(FR70E/peripheral module)
Internal operating clock frequency
(USBC)
Internal operating clock frequency
2
C IF)
(I
Fclkcyc
Fclkin50.0MHz*
Fusop48.0MHz
Fi2op12.5MHz
OSCEA,
OSCEB
Oscillation10.050.0MHz
External memory clock frequencyMCLKO50.0MHz
* : The clock frequency must be set to over 25 MHz for the Ethernet MAC interface to perform 100 Base
communication.
Fclkcyc
XINI
OSCEA/OSCEB
53
MB91401
Prelminary
2004.11.12
(2) Reset
Parameter
Symbol
PinConditions
Value
Unit Remarks
MinMax
Reset input timetrstlINITXI
PLL reset input timetprstlPLLSAt using of PLL1µs
Note : tcp is internal CPU and clock cycle period for peripheral module.
INITXI
PLLS
After power
supply &
input clock
stabilization
At unusing of PLL5 tcpns
At using of PLL600 + 1µs
trstl, tprstl
54
MB91401
Prelminary
2004.11.12
(3) Normal memory access
ParameterSymbolPinTypical timing
Address delay timetchavA23 to A0MCLKO ↑0tcycp / 2 + 7ns
CSX delay timetchcslCSX2 to CSX0MCLKO ↑0tcycp / 2 + 7ns
CSX delay timetchcshCSX2 to CSX0MCLKO ↑0tcycp / 2 + 7ns
WRX delay timetchwrlWRX3 to WRX0MCLKO ↑ − 19ns
WRX delay timetchwrhWRX3 to WRX0MCLKO ↑ − 19ns
Data delay timetchdvD31 to D0MCLKO ↑0tcycp / 2 + 7ns
RDX delay timetchrdlRDXMCLKO ↑ − 19ns
RDX delay timetchrdhRDXMCLKO ↑ − 19ns
Data setuptdsrhD31 to D0MCLKO ↑19ns
Data holdtrhdxD31 to D0MCLKO ↑ − 1ns
Note : tcycp is external memory clock cycle period.
EX Read Cycle timetexrcEXA, EXCSX6 × tcpns
EXA to Data ValidtexadvEXA, EXD5 × tcpns
EXCSX to Data ValidtexcsdvEXCSX, EXD5 × tcpns
EXRDX to Data Out EnabletexdoeEXRDX, EXD5 × tcpns
EXRDX “H” to High ZtexdhzEXRDX, EXD5 × tcp + 8ns
Note : tcp is internal CPU and operational clock period for peripheral module.
texrc
texadv
EXA
Value
UnitRemarks
MinMax
EXCSX
EXWRX
EXRDX
EXD15: to EXD0
texcsdv
texdoe
texdhz
62
• Write access
Prelminary
2004.11.12
Value
ParameterSymbolPin
UnitRemarks
MinMax
EX Write Cycle timetexwcEXA, EXCSX5 × tcpns
EXA to Data Setup timetexadsEXA, EXD4 × tcpns
EXCSX to Data Setup timetexcsdsEXCSX, EXD4 × tcpns
EXWRX “L” Pulse widthtexwpEXRDX, EXD4 × tcpns
EXD Setup timetexdsEXRDX, EXD11ns
EXD Hold timetexdhEXRDX, EXD0ns
Note : tcp is internal CPU and operational clock period for peripheral module.
texwc
texads
EXA
MB91401
EXCSX
EXWRX
EXD15 to EXD0
EXRDX
tchdv
texcsds
texwp
texds
texdhz
63
MB91401
Prelminary
2004.11.12
(9) USB interface
ParameterSymbolPin
MinTypMax
Input clocktucycUCLK4848*
RISE TimetutfrUDP, UDM420ns*2
Fall TimetutffUDP, UDM420ns*2
Differential Rise and Fall
Timing Matching
tutfrfmUDP, UDM90111.11%*2
Driver Output ResistancetzdrvUDP, UDM2844Ω*3
tucyc
UCLK48
Value
UnitRemarks
1
MHz 2500ppm accuracy*
1
UDP
UDM
10%10%
90%90%
tutfftutfr
*1 : The AC characteristics of the USB interface conform to USB Specification Revision 1.1.
*2 : <Driver Characteristics TFR, TFF, TFRFM>
These items specify the differential data signal rise (trise) and fall (tfall) times.
These are defined as the times between 10% to 90% of the output signal voltage.
For the full-speed buff er , trise and tf all are specified such that the tr/tf ratio f alls within ± 10% to minimize RFI
radiation.
*3 : <Driver Characteristics ZDRV>
USB full-speed connection is performed via a shielded twisted-pair cable at a characteristic impedance of
90 Ω ± 15%. The USB Standard stipulates that the USB driv er’ s output impedance m ust be within the range
of 28 Ω to 44Ω. The USB Standard also stipulates that a discrete serial resistor (R
S) must be added to have
balance while satisfying the above standard.
The output impedance of the USB I/O buffer on this LSI is about 3 Ω to 19 Ω. Serial resistor R
must be 25 Ω to 30 Ω (27 Ω recommended) .
Capacitor CL of 50 pF must be added as well.
FUJITSU MICROELECTRONICS AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale , CA 94088-3470, U.S.A.
Tel: +1-408-737-5600
Fax: +1-408-737-5999
http://www.fma.fujitsu.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Am Siebenstein 6-10,
D-63303 Dreieich-Buchschlag,
Germany
Tel: +49-6103-690-0
Fax: +49-6103-690-122
http://www.fme.fujitsu.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE LTD.
#05-08, 151 Lorong Chuan,
New Tech Park,
Singapore 556741
Tel: +65-6281-0770
Fax: +65-6281-0220
http://www.fmal.fujitsu.com/
Korea
FUJITSU MICROELECTRONICS K OREA LTD.
1702 KOSMO TOWER, 1002 Daechi-Dong,
Kangnam-Gu,Seoul 135-280
Korea
Tel: +82-2-3484-7100
Fax: +82-2-3484-7111
http://www.fmk.fujitsu.com/
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
patent right or copyright, or any other right of Fujitsu or any third
party or does Fujitsu warrant non-infringement of any third-party’s
intellectual property right or other right by using such information.
Fujitsu assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
2004 FUJITSU LIMITED Printed in Japan
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.