Fujitsu F2 MC-8FX Family, MB2146-261 Operation Manual
FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM
SS01-26015-1E
F2MC-8FX Family
LQFP-52P (0.65 mm pitch) HEADER BOARD
MB2146-261
OPERATION MANUAL
PREFACE
Thank you for purchasing the LQFP-52P (0.65 mm pitch) *1 header board (model number :
MB2146-261) for the F
2
MC *2 -8FX family.
MB2146-261 is a header board used to connect the MCU board (model number : MB2146-301,
MB2146-303) which mounts the F
2
MC-8FX family evaluation MCU to a user system.
This manual explains the handling of the MB2146-261. Before using MB2146-261, be sure to read
this manual.
Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-produced MCUs and evaluation MCUs which correspond on MB2146-261.
MB2146-261 is an object about MCU with a built-in LCD controller.
*1 : The lead pitch of package (FPT-52P-M01) is 0.65 mm and the body size is 10 mm × 10 mm.
*2 : F
2
MC is the abbreviation used for FUJITSU Flexible Microcontroller.
■ Caution of the products described in this document
The following precautions apply to the product described in this manual.
CAUTION
The wrong use of a device will give an injury and may cause malfunction on customers system.
Cuts
This product has parts with sharp points that are exposed.
Do not touch an edge of the product with your bare hands.
Damage
When connecting the header board to the user system, correctly position the index
mark (▲) on the NQPACK mounted on the user system with the 1 pin direction(1)
on the header board, otherwise the MCU board and user system might be damaged.
Damage
When mounting a mass production MCU, correctly position pin 1, otherwise the
mass production MCU and user system might be damaged.
i
Copyright ©2006 FUJITSU LIMITED All rights reserved
• The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
• If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.
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1
1. Product Outline
■ Product outline
MB2146-261 is a header board (referred to as header board) used to connect the MCU board (model
number : MB2146-301, MB2146-303) which mounts an evaluation MCU in the F
2
MC-8FX family
of Fujitsu 8-bit microcontrollers to a user system. To build an F
2
MC-8FX evaluation environment,
combine the three products as shown in Figure 1: the header board, a MCU board, and a BGM adapter (model number : MB2146-09).
Figure 1 System Configuration
■ Product configuration
Table 1 lists the product configuration in the header board, and Table 2 lists options.
Table 1 Product Cofiguration
Table 2 Options
* : Multiple types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies
the service conditions.
Name Description Remarks
F
2
MC-8FX
LQFP-52P (0.65 mm pitch)
header board
[Model number : MB2146-261]
Connector/LQFP52pin
(0.65 mm pitch) Package conversion
-
[Model number : YQPACK052SB]
(Tokyo Eletech Corporation)
I/F between header board and NQPACK Accessory (connected)
[Model number : NQPACK052SB]
(Tokyo Eletech Corporation)
For mounted on user system Accessory
[Model number : HQPACK052SB]
(Tokyo Eletech Corporation)
Used when mounting mass production MCU
to NQPACK.
Accessory
Name Description Remarks
BGM adapter
[Model number : MB2146-09]
ICE unit for F
2
MC-8FX
-
MCU board
[Model number : MB2146-301, MB2146-303]
Built-in MB95FV100B-101,
MB95FV100B-103
Built-in F
2
MC-8FX evaluation MCU *
㪤㪙㪉㪈㪋㪍㪄㪇㪐
MCU board
BGM adapter
Header board
2
2. Checking the Delivered Product
Before using the MB2146-261, confirm that the following components are included
in the box:
• LQFP-52P (0.65 mm pitch) header board *
1
: 1
• Screws for securing header board (M2 × 10 mm, 0.4 mm pitch) : 4
• NQPACK052SB *
2
: 1
• HQPACK052SB *
3
: 1
• Operation manual (English version, this manual) : 1
*1 : Header board manufactured by Tokyo Eletech Corporation, referred to as “YQPACK”, mounts
YQPACK052SB.
*2 : IC socket manufactured by Tokyo Eletech Coporation, referred to as “NQPACK”, is supplied
with a special screwdriver and 2 guide pins. A socket offering higher reliability,
NQPACK052SB-SL (manufactured by Tokyo Eletech Corporation and sold separately) , can
be used by making an IC socket mounting hole on the user system board. For more information,
contact Tokyo Eletech Corporation.
*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, is
supplied with 4 screws for securing HQPACK (M2 × 6 mm, 0.4 mm pitch) .
3. Handling Precautions
The header board is precision-manufactured to improve the dimensional accuracy and to ensure a
reliable contact. The header board is therefore sensitive to mechanical shocks. To ensure a correct
use of the header board in the proper environment, observe the following:
• Avoid placing a stress on the NQPACK mounted on the user system board when connecting
the header board.
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