Fujitsu D3081, CPUMEMR D3131, PCIR D3082 Technical Manual
Technical Manual - English
Baseboard D3081, CPUMEMR D3131,
PCIR D3082 for PRIMERGY RX900 S1
Technical Manual
Edition August 2010
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Copyright and Trademarks
Copyright © 2010 Fujitsu Technology Solutions GmbH.
All rights reserved.
Delivery subject to availability; right of technical modifications reserved.
All hardware and software names used are trademarks of their respective manufacturers.
– The contents of this manual may be revised without prior notice.
– Fujitsu assumes no liability for damages to third party copyrights or other
rights arising from the use of any information in this manual.
– No part of this manual may be reproduced in any form without the prior written
permission of Fujitsu.
Microsoft, Windows, Windows Server, and Hyper V are trademarks or registered trademarks of
Microsoft Corporation in the USA and other countries.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries
in the USA and other countries.
D3081, D3131, D3082 (RX900 S1) Technical Manual
Before reading this manual
For your safety
This manual contains important information for safely and correctly using this
product.
Carefully read the manual before using this product. Pay particular attention to
the accompanying manual "Safety Notes and Regulations" and ensure these
safety notes are understood before using the product. Keep this manual and the
manual "Safety Notes and Regulations" in a safe place for easy reference while
using this product.
Radio interference
This product is a "Class A" ITE (Information Technology Equipment). In a
domestic environment this product may cause radio interference, in which case
the user may be required to take appropriate measures. VCCI-A
Aluminum electrolytic capacitors
The aluminum electrolytic capacitors used in the product's printed circuit board
assemblies and in the mouse and keyboard are limited-life components. Use of
these components beyond their operating life may result in electrolyte leakage
or depletion, potentially causing emission of foul odor or smoke.
As a guideline, in a normal office environment (25°C) operating life is not
expected to be reached within the maintenance support period (5 years).
However, operating life may be reached more quickly if, for example, the product
is used in a hot environment. The customer shall bear the cost of replacing
replaceable components which have exceeded their operating life. Note that
these are only guidelines, and do not constitute a guarantee of trouble-free
operation during the maintenance support period.
High safety use
This product has been designed and manufactured for general uses such as
general office use, personal use, domestic use and normal industrial use. It has
not been designed or manufactured for uses which demand an extremely high
level of safety and carry a direct and serious risk to life or body if such safety
cannot be ensured.
Technical Manual D3081, D3131, D3082 (RX900 S1)
These uses include control of nuclear reactions in nuclear power plants,
automatic airplane flight control, air traffic control, traffic control in mass
transport systems, medical devices for life support, and missile guidance control
in weapons systems (hereafter, "high safety use"). Customers should not use
this product for high safety use unless measures are in place for ensuring the
level of safety demanded of such use. Please consult the sales staff of Fujitsu if
intending to use this product for high safety use.
Measures against momentary voltage drop
This product may be affected by a momentary voltage drop in the power supply
caused by lightning. To prevent a momentary voltage drop, use of an AC
uninterruptible power supply is recommended.
(This notice follows the guidelines of Voltage Dip Immunity of Personal
Computer issued by JEITA, the Japan Electronics and Information Technology
Industries Association.)
Technology controlled by the Foreign Exchange and Foreign Trade
Control Law of Japan
Documents produced by Fujitsu may contain technology controlled by the
Foreign Exchange and Foreign Trade Control Law of Japan. Documents which
contain such technology should not be exported from Japan or transferred to
non-residents of Japan without first obtaining authorization in accordance with
the above law.
Harmonic Current Standards
This product conforms to harmonic current standard JIS C 61000-3-2.
Only for the Japanese market:
About SATA hard disk drives
The SATA version of this server supports hard disk drives with SATA / BC-SATA
storage interfaces. Please note that the usage and operation conditions differ
depending on the type of hard disk drive used.
Please refer to the following internet address for further information on the
usage and operation conditions of each available type of hard disk drive:
http://primeserver.fujitsu.com/primergy/harddisk/
D3081, D3131, D3082 (RX900 S1) Technical Manual
Only for the Japanese market:
I Although described in this manual, some sections do not apply to the
Japanese market. These options and routines include:
– USB Flash Module (UFM)
– CSS (Customer Self Service)
– Replacing the lithium battery
Technical Manual D3081, D3131, D3082 (RX900 S1)
D3081, D3131, D3082 (RX900 S1) Technical Manual
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2 Important information . . . . . . . . . . . . . . . . . . . . . 11
2.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.2 CE certificate of conformity . . . . . . . . . . . . . . . . . . 14
2.3 Environmental protection . . . . . . . . . . . . . . . . . . . 15
3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2 Main memory . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.2.1 CPU Memory Riser (CPUMEMR) configuration . . . . . . . . . 23
3.2.1.1 DIMM slot population order . . . . . . . . . . . . . . . . . 24
3.2.1.2 DIMM slot population rules for mixed DIMM RANK . . . . . 25
3.2.1.3 QPI topology . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.2.2 Memory configuration modes . . . . . . . . . . . . . . . . . . 30
3.2.2.1 Memory mirroring . . . . . . . . . . . . . . . . . . . . . . 30
3.2.2.2 Hemisphere mode . . . . . . . . . . . . . . . . . . . . . . 33
3.2.2.3 Memory interleaving . . . . . . . . . . . . . . . . . . . . . 34
3.2.3 Memory board configuration table . . . . . . . . . . . . . . . . 34
3.3 PCIe slots . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.3.1 PCI interrupt assignment . . . . . . . . . . . . . . . . . . . . 37
3.3.2 PCIe slot to CPUMEMR assignment . . . . . . . . . . . . . . 37
3.3.3 Expansion card configuration table . . . . . . . . . . . . . . . 40
3.4 I/O space . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.4.1 I/O space requirements . . . . . . . . . . . . . . . . . . . . . 42
3.4.2 I/O space limitation . . . . . . . . . . . . . . . . . . . . . . . 43
3.5 Screen resolutions . . . . . . . . . . . . . . . . . . . . . . . 48
3.6 Temperature / System monitoring . . . . . . . . . . . . . . . 48
Technical Manual D3081, D3131, D3082 (RX900 S1)
Contents
3.7 Connectors and indicators . . . . . . . . . . . . . . . . . . . 49
3.7.1 Onboard connectors and indicators . . . . . . . . . . . . . . . . 50
3.7.1.1 Baseboard D3081 . . . . . . . . . . . . . . . . . . . . . . 50
3.7.1.2 CPU Memory Riser (CPUMEMR) D3131 . . . . . . . . . . . 53
3.7.1.3 PCI Riser (PCIR) D3082 . . . . . . . . . . . . . . . . . . . 54
3.7.1.4 I/O board . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.7.2 Onboard DIP switch . . . . . . . . . . . . . . . . . . . . . . . . 55
3.7.3 External connectors and indicators . . . . . . . . . . . . . . . . 57
3.7.3.1 Baseboard D3081 . . . . . . . . . . . . . . . . . . . . . . . 57
3.7.3.2 I/O board . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4 Replacing the lithium battery . . . . . . . . . . . . . . . . . . 63
D3081, D3131, D3082 (RX900 S1) Technical Manual 9
1 Introduction
This technical manual describes the key characteristics and the board layout of
the boards for the PRIMERGY RX900 S1 server. The basic elements of this
server are the Baseboard D3081, 4 to 8 CPU Memory Risers (CPUMEMR)
D3131, and the PCI Riser (PCIR) D3082.
For additional driver information (if available), refer to the Readme files located
on the server hard disk and on the supplied DVDs, see Installation DVD of
ServerView Suite - ServerView Software Products.
You will find detailed information about the BIOS setup in the "D3081 BIOS
Setup Utility for RX900 S1" manual.
I PRIMERGY manuals are available in PDF format on the
ServerView Suite DVD 2. The ServerView Suite DVD 2 is part of the
ServerView Suite supplied with every server.
PRIMERGY Abbreviations and Glossary can also be found on the
ServerView Suite DVD 2.
Notational conventions
The following notational conventions are used in this manual:
Text in italics indicates commands or menu items.
"Quotation marks" indicate names of chapters and terms that are being
emphasized.
Ê describes activities that must be performed in the order
shown.
V CAUTION! pay particular attention to texts marked with this symbol.
Failure to observe this warning may endanger your life,
destroy the system or lead to the loss of data.
I indicates additional information, notes and tips.
10 Technical Manual D3081, D3131, D3082 (RX900 S1)
Introduction
D3081, D3131, D3082 (RX900 S1) Technical Manual 11
2 Important information
In this chapter you will find essential information regarding safety when working
with your server.
V CAUTION!
With the system board installed you must open the system to access the
system board. How to access the system board of your system is
described in the appropriate maintenance manual (except for the
Japanese market).
When handling the system board, refer to the specific notes on safety in
the operating manual and/or maintenance manual for the respective
server.
2.1 Notes on safety
V CAUTION!
● The actions described in these instructions should only be performed
by authorized, qualified personnel. Equipment repairs should only be
performed by qualified staff. Any failure to observe the guidelines in
this manual, and any unauthorized openings and improper repairs
could expose the user to risks (electric shock, fire hazards) and could
also damage the equipment. Please note that any unauthorized
openings of the device will result in the invalidation of the warranty
and exclusion from all liability.
● Transport the device only in the antistatic original packaging or in
packaging that protects it from knocks and jolts.
● Only install expansions that are allowed for the system board. If you
install other expansions, you may damage the requirements and rules
governing safety and electromagnetic compatibility or your system.
Information on which system expansions are approved for installation
can be obtained from our customer service center or your sales
outlet.
● The warranty expires if the device is damaged during the installation
or replacement of system expansions.
12 Technical Manual D3081, D3131, D3082 (RX900 S1)
Important information
V CAUTION!
● Components can become very hot during operation. Ensure you do
not touch components when making extensions to the system board.
There is a danger of burns!
● Transmission lines to peripheral devices must be adequately
shielded.
● Ethernet cabling has to comply with EN 50173 and EN 50174-1/2
standards or ISO/IEC 11801 standard respectively. The minimum
requirement is a Category 5 shielded cable for 10/100 Ethernet, or
Category 5e for Gigabit Ethernet.
● Never connect or disconnect data transmission lines during a storm
(risk of lightning hazard).
Batteries
V CAUTION!
● Incorrect replacement of batteries may lead to a risk of explosion. The
batteries may only be replaced with identical batteries or with a type
recommended by the manufacturer (this information doesn’t apply to
the Japanese market).
It is essential to observe the instructions in the chapter "Replacing the
lithium battery".
D3081, D3131, D3082 (RX900 S1) Technical Manual 13
Important information
Modules with Electrostatic-Sensitive Devices
Modules with electrostatic-sensitive devices are identified by the following
sticker:
Figure 1: ESD label
When you handle components fitted with ESDs, you must always observe the
following points:
● Switch off the system and remove the power plugs from the power outlets
before installing or removing components with ESDs.
● You must always discharge static build-up (e.g. by touching a grounded
object) before working with such components.
● Any devices or tools that are used must be free of electrostatic charge.
● Wear a suitable grounding cable that connects you to the external chassis of
the system unit.
● Always hold components with ESDs at the edges or at the points marked
green (touch points).
● Do not touch any connectors or conduction paths on an ESD.
● Place all the components on a pad which is free of electrostatic charge.
I For a detailed description of how to handle ESD components, see the
relevant European or international standards (EN 61340-5-1,
ANSI/ESD S20.20).
14 Technical Manual D3081, D3131, D3082 (RX900 S1)
Important information
Notes about boards
● During installation/deinstallation of the board, observe the specific
instructions described in the maintenance manual for the respective server.
● Shut down the server and disconnect the power plug, before you make
modifications on an installed board.
● To prevent damage to the board, the components and conductors on it,
please take great care when you insert or remove boards. Take great care
to ensure that extension boards are slotted in straight, without damaging
components or conductors on the board, or any other components, for
example EMI spring contacts.
● Be careful with the locking mechanisms (catches, centring pins etc.) when
you replace the system board or components on it, for example memory
modules or processors.
● Never use sharp objects (screw drivers) for leverage.
● Do not damage or modify internal cables or devices. Doing so may cause a
device failure, fire, or electric shock.
● Do not touch the circuitry on boards or soldered parts. Hold the metallic
areas or the edges of the circuit boards.
2.2 CE certificate of conformity
The board complies with the requirements of the EC directives
2004/108/EC regarding “Electromagnetic Compatibility” and
2006/95/EC “Low Voltage Directive”. This is indicated by the CE
marking (CE = Communauté Européenne).
Compliance was tested in a typical PRIMERGY configuration.
D3081, D3131, D3082 (RX900 S1) Technical Manual 15
Important information
2.3 Environmental protection
Environmentally-friendly product design and development
This product has been designed in accordance with the Fujitsu standard for
"environmentally friendly product design and development". This means that
key factors such as durability, selection and labeling of materials, emissions,
packaging, ease of dismantling and recycling have been taken into account.
This saves resources and thus reduces the harm done to the environment.
Further information can be found at:
– http://ts.fujitsu.com/products/standard_servers/index.html (for the EMEA
market)
– http://primeserver.fujitsu.com/primergy/concept/ (for the Japanese market)
Energy-saving information
Devices that do not need to be constantly switched on should be switched off
until they are needed as well as during long breaks and after completion of work.
Packaging information
This packaging information doesn’t apply to the Japanese market.
Do not throw away the packaging. You may need it later for transporting the
system. If possible, the equipment should only be transported in its original
packaging.
Information on handling consumables
Please dispose of printer consumables and batteries in accordance with the
applicable national regulations.
In accordance with EU directives, batteries must not be disposed of with
unsorted domestic waste. They can be returned free of charge to the
manufacturer, dealer or an authorized agent for recycling or disposal.
16 Technical Manual D3081, D3131, D3082 (RX900 S1)
Important information
All batteries containing pollutants are marked with a symbol (a crossed-out
garbage can). They are also marked with the chemical symbol for the heavy
metal that causes them to be categorized as containing pollutants:
Cd Cadmium
Hg Mercury
Pb Lead
Labels on plastic casing parts
Please avoid sticking your own labels on plastic parts wherever possible, since
this makes it difficult to recycle them.
Returns, recycling and disposal
Please handle returns, recycling and disposal in accordance with local
regulations.
Details regarding the return and recycling of devices and consumables within
Europe can also be found in the "Returning used devices" manual, via your local
Fujitsu branch or from our recycling center in Paderborn:
Fujitsu Technology Solutions
Recycling Center
D-33106 Paderborn
Tel. +49 5251 8 18010
Fax +49 5251 8 333 18010
The device must not be disposed of with domestic waste. This
device is labeled in compliance with European directive
2002/96/EC on waste electrical and electronic equipment (WEEE).
This directive sets the framework for returning and recycling used
equipment and is valid across the EU. When returning your used
device, please use the return and collection systems available to
you. Further information can be found at
http://ts.fujitsu.com/recycling.
D3081, D3131, D3082 (RX900 S1) Technical Manual 17
3 Features
3.1 Overview
This section provides an overview of the key characteristics for the baseboard
D3081, the CPU Memory Risers (CPUMEMRs) D3131, and the PCI Riser
(PCIR) D3082.
Processors
● Up to 8 Intel Xeon® X7500/E7500 series processors (up to 130 W); one
processor per CPUMEMR
● 4 Intel QuickPath Interconnects; up to 6,4 GT/s in each direction
● Hyper-Threading technology; except X7542 processors
● Up to 2.0 MB L2 cache and 24 MB L3 cache (Nehalem-EX)
Main memory
● Up to 128 slots for DDR3 memory modules (1333 MHz) with 2 GB, 4 GB,
8 GB, and 16 GB capacity; 16 slots per CPUMEMR
● 4 SMI links per CPU and up to 4 DDR3 DIMM memory modules per SMI link;
memory modules connected to CPU via memory buffer named Millbrook;
Intel® Scalable Memory Interconnect (SMI) link connects CPU and
Millbrook
● Maximum configuration: 2 TB memory with availability of 16 GB memory
modules
● Basic configuration: 32 GB memory; 4 CPUMEMRs with 4 memory modules
per CPUMEMR
● Maximum 32 Gbit/s band width (DDR3)
● Hardware memory scrubbing
● Single Device Data Correction (SDDC) function (Chipkill™)
● Memory interleaving function
● Memory mirroring function
18 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
Chipset devices on the baseboard
● Intel Xeon® 7500 platform:
– 4x Boxboro-EX® I/O Hubs
– Intel Southbridge ICH10R
– ServerEngines® Pilot II®
– 3x GbE dual channel LAN controller (Kawela)
– 1x 10 GbE dual channel LAN controller (Niantec)
Internal connectors
● 1x SATA connector
● 1x USB 2.0 connector
● 1x Trusted Platform Module (TPM)
● 1x USB Flash Module (UFM)
External connectors
● Front side:
– 1x video connector
– 3x USB 2.0 connectors
● Rear side:
– 2x 10 GB SFP+ System LAN connectors
– 5x 1 GB 1000Base-T System LAN connectors
– 1x 1 GB 1000Base-T Shared LAN connector
– 1x 100 MB 100Base-TX Management LAN connector
– I/O board:
– 1x serial connector
– 4x USB 2.0 connectors
– 1x video connector
D3081, D3131, D3082 (RX900 S1) Technical Manual 19
Features
PCIe slots
● Baseboard
– 4x PCI Express 2.0 slots (x8 connector) with PCI Hot-Plug (PHP)
capability
– 4x PCI Express 2.0 slots (x8 connector) without PHP capability
– 1x PCI Express 2.0 slots (x4 connector) without PHP capability
– 1x PCI Express 2.0 slots (x8 connector) without PHP capability for a
Modular RAID controller
● PCI Riser
– 6x PCI Express 2.0 slots (x8 connector) without PHP capability
– 1x PCI Express 2.0 slots (x4) without PHP capability
Server management controller iRMC S2
The following features are integrated into iRMC S2:
● Server class Super I/O (SIO)
● Remote KVMS
● Baseboard Management Controller (BMC) including the following
functionality:
– 250MHz 32-bit ARM9 processor
–IPMI 2.0
–6x I2C SMBus
– Two 10/100 Ethernet controllers with RMII support
– LPC ROM interface
– SPI Flash interface
– USB Device
– One Serial Port
– Three UART interfaces
– DDR2 16-bit 667 MHz memory
– Chassis intrusion logic
– PWM Control and Fan Tach Monitor
– Voltage Level Monitor and Temperature Monitor
– Real-Time Clock (RTC)
– Two Watchdog Timers
– System and Clock Control
– Three Multi-Purpose Timers
– Interrupt Controller
–JTAG interface
20 Technical Manual D3081, D3131, D3082 (RX900 S1)
Features
● Graphics controller including the following features:
– Integrated Graphics Core
– 2D hardware graphics acceleration
– DDR2 memory interface supports up to 128 MB of memory
– Supports all display resolutions up to 1600x1200 16bpp @ 75Hz
– High-speed integrated 24-bit RAMDAC
– Single-lane PCI Express host interface
LAN GbE controller Intel 82576
This controller supports the following features:
● Two connector standard IEEE 802.3 Ethernet interface for 10BASE-T,
100BASE-TX, and 1000BASE-T (802.3, 802.3u, and 802.3ab) applications.
● Serializer-Deserializer (SerDes) to support 1000BASE-SX/LX (optical fiber)
and gigabit backplane applications.
● SGMII for external PHY or SFP module.
● Management of MAC and PHY Ethernet layer functions.
● Management of PCI Express packet traffic across its transaction, link, and
physical/logical layers.
● External SPI (4-wire) serial interface to Flash EEPROM devices up to 8 MB
memory.
● NI-SI / SMBus interface to BMC
● Wake on LAN
● SR-IOV for virtulization on Intel NIC
10 GbE LAN controller Intel 82599
This controller supports the following features:
● Remote PXE boot
● iSCSI/iBOOT(SW) support as standard
● VT-c support as standard
● Adapter fault tolerance, Load Balancing and Switch fault tolerance in
combination with existing GB PCIe card is supported, based on the
functionality (SW Kit) of onboard GB LAN controllers.
● Single root I/O virtualization (SR-IOV) for virtualization on Intel NIC.
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