FUJIFILM FinePix V10 TROUBLESHOOTING GUIDE
DIGITAL CAMERA
FinePix V10
TROUBLESHOOTING GUIDE
CAUTION
BECAUSE THIS PRODUCTIS RoHS LEAD-FREE COMPLIANT, USE THE
DESIGNATED AFTER-SELES PARTS AND THE DESIGNATED LEAD-FREE SOLDER
WHEN PERFORMING REPAIRS. (Refer to page 3 to page 5)
WARNING
THE COMPONENTS IDENTIFIED WITH THE MARK “ ” ON THE SCHEMATIC
DIAGRAM AND IN THE PARTS LIST ARE CRITICAL FOR SAFETY.
PLEASE REPLACE ONLY WITH THE COMPONENTS SPECIFIED ON THE SCHEMATIC
DIAGRAM AND IN THE PARTS LIST.
IF YOU USE PARTS NOT SPECIFIED, IT MAY RESULT IN A FIRE AND AN
ELECTRICAL SHOCK.
FUJI PHOTO FILM CO., LTD.
Ref.No.:ZM00621-400
Printed in Japan 2006.03
FinePix V10 TROUBLESHOOTING GUIDE
SAFETY CHECK-OUT
After correcting the original problem, perform the following
safety check before return the product to the customer.
1. Check the area of your repair for unsoldered or poorly
soldered connections. Check the entire board surface
for solder splasher and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair.
Point them out to the customer and recommend their
replacement.
4. Look for parts which, though functioning, show obvious
signs of deterioration. Point them out to the customer
and recommend their replacement.
5. Check the B + voltage to see it is at the values
specified.
6. Make leakage - current measurements to determine
that exposed parts are acceptably insulated from the
supply circuit before returning the product to the
customer.
7. CAUTION: FOR CONTINUED
PROTECTION AGAINST FIRE
HAZARD, REPLACE ONLY WITH
SAME TYPE 2.5 AMPERES 125V
FUSE.
2.5A 125V
2.5A 125V
8. WARNING:
RISK OF FIREREPLACE FUSE
AS MARKED
ATTENTION: AFIN D'ASSURER
UNE PROTECTION
PERMANENTE CONTRE LES
RISQUES D'INCENDIE,
REMPLACER UNIQUEMENT
PAR UN FUSIBLE DE MEME,
TYPE 2.5 AMPERES, 125 VOLTS.
TO REDUCE THE ELECTRIC
SHOCK, BE CAREFUL TO
TOUCH THE PARTS.
WARNING!
HIGH VOLTAGE
2
FinePix V10 TROUBLESHOOTING GUIDE
RoHS lead-free compliance
Because this product is RoHS lead-free compliant, use the designated after-sales parts and the designated lead-free solder
when performing repairs.
<Background & Overview>
With the exception of parts and materials expressly excluded from the RoHS directive (*1), all the internal connections and
component parts and materials used in this product are lead-free compliant (*2) under the European RoHS directive.
*1: Excluded items (list of the main lead-related items)
• Lead included in glass used in fluorescent tubes, electronic components and cathode-ray tubes
• Lead in high-melting-point solder (i.e. tin-lead solder alloys that contain 85% lead or more)
• Lead in ceramic electronic parts (piezo-electronic devices)
• Mercury contained in fluorescent tubes is also excluded.
*2: Definition of lead-free
A lead content ratio of 0.1 wt% or less in the applicable locations (solder, terminals, electronic components, etc.)
<Reference>
RoHS: The name of a directive issued by the European Parliament aimed at restricting the use of
certain designated hazardous substances included in electrical and electronic equipment.
Designated substances (6): Lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBs) and
polybrominated diphenyl ether (PBDE)
<Lead-free soldering>
When carrying out repairs, use a designated lead-free solder, bearing in mind the differing work practices for conventional
solder (eutectic) and lead-free solder.
Differences in the soldering work for lead-free and eutectic solder
When the soldering work practices for eutectic solder and lead-free solder are compared, the main differences are as shown
below. In particular, when lead-free solder is used, the solder tends to be less workable than when eutectic solder is used.
Accordingly, the soldering techniques used must take that into account.
Difference
The solder starts melting later.
1
Poor wetting
2
Solder feed rate is difficult to control.
3
Wetting the insides of through holes is especially
4
difficult.
5
During repairs (or modifications) removing solder
from inside through holes is difficult.
6
There is serious carbonization of the soldering iron.
The surface is not glossy.
7
The initial melting point of lead-free solder is high, so you
have to get used to it.
Move the tip of the soldering iron around to heat the entire
connection to the melting temperature and assist wetting.
Use the solder (wire) diameter and soldering iron that are
best suited to connection being soldered.
First apply solder to the area immediately around the
through hold and then feed the solder into the hole.
Use a suitable wicking wire (with a suitable method and
heating) and a suction tool.
Either put solder onto the soldering iron tip after completing
the work, or turn the iron off frequently.
Learn to recognize the appearance of the surface.
Countermeasure
3
FinePix V10 TROUBLESHOOTING GUIDE
Setting temperature during lead-free soldering
• Lead-free solder melting temperature
The melting point of eutectic (Sn-Pb) solder is 183°C, while the melting point of lead-free solder (Sn-Ag-Cu) is 30°C higher
at 220°C.
• Soldering iron tip temperature
The temperature setting for the soldering iron used should be such that the tip of the soldering iron is at the correct
bonding temperature for the connection. This temperature is normally set at around 100°C higher than the melting point of
the solder.
However, the actual temperature should take into account the shape and size of the soldering iron tip, the heat tolerance
of the connection and the workability of that temperature.
• Correct bonding temperature
The correct bonding temperature refers not to the temperature of the heat source, but to the bonding temperature that will
give the best bond strength.
Precautions when soldering with lead-free solder
• Soldering iron maintenance
Because of the high soldering iron temperature in lead-free soldering, there is rapid carbonization of the flux adhering to
the tip of the soldering iron.
(1) Always cover the tip of the soldering iron with solder when it is not being used.
(2) If the tip is black from carbonization, wipe it gently with a paper towel soaked in alcohol until the solder will wet.
• Uniform heating of the board and components
To ensure that the lead-free solder wets the entire surface of the pattern and the lands despite its poor wetting
characteristics, you must move the tip of the soldering iron over a wide area to raise the temperature of the entire
connection.
Soldering iron
A soldering iron with a temperature control is best.
4
FinePix V10 TROUBLESHOOTING GUIDE
Solder wire (thread)
Use the lead-free solders specified below.
Solder type: Sn96.5Ag3Cu0.5 (Displayed symbol: SnAgCu)
Wire diameter: 0.6, 0.8 or 1.0 mm
Sample:
lead-free
Wire diameter 0.8mm
Solder type (Displayed symbol)
SnAgCu
Flux
Conventional flux can be used.
Solder application wires (mesh, wicking wire, etc.)
Conventional application wires can be used.
5
MEMO
FinePix V10 TROUBLESHOOTING GUIDE
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FinePix V10 TROUBLESHOOTING GUIDE
CONTENTS
CONTENTS
1. Names of internal Components .................................................................................. 8
2. Overall connection Diagram........................................................................................ 9
3. Mounted Parts Diagrams (MAIN PWB ASSY) .......................................................... 10
4. Mounted Parts Diagrams (SUB PWB ASSY) ............................................................ 11
5. Information on problems identified in production during inspection.......................... 13
6. Information on problems arising in production during adjustment ............................ 17
7
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