Fuji Electric 7MBR50VA060-50 Data Sheet

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http://www.fujielectric.com/products/semiconductor/
7MBR50VA060-50
IGBT Modules
IGBT MODULE (V series) 600V / 50A / PIM
Features
Low VCE(sat) Compact Package P.C.Board Mount Module Converter Diode Bridge Dynamic Brake Circuit RoHS compliant product
Applications
Inverter for Motor Drive AC and DC Servo Drive Amplier Uninterruptible Power Supply
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at TC=25°C unless otherwise specied)
Items Symbols Conditions
Collector-Emitter voltage VCES 600 V
Gate-Emitter voltage V
Collector current
Inverter
Collector power dissipation P
GES ±20 V
I
C Continuous TC=80°C 50
I
cp 1ms TC=80°C 100
-I
C 50
-I
c pulse 1ms 100
C 1 device 200 W
Collector-Emitter voltage VCES 600 V
Gate-Emitter voltage V
Collector current
Brake
Collector power dissipation P
Repetitive peak reverse voltage (Diode) V
GES ±20 V
I
C Continuous TC=80°C 50
I
CP 1ms TC =80°C 100
C 1 device 200 W
RRM 600 V
Repetitive peak reverse voltage VRRM 800 V
Average output current I
Surge current (Non-Repetitive) I
2
Converter
I
t (Non-Repetitive) I2t 221 A2s
Junction temperature T
Operating junciton temperature (under switching conditions)
Case temperature T
Storage temperature T
Isolation voltage
between terminal and copper base (*1) between thermistor and others (*2)
O 50Hz/60Hz, sine wave 50 A
FSM
10ms, Tj=150°C half sine wave
j
jop
T
C 125
stg -40 ~ +125
Inverter, Brake 175
Converter 150
Inverter, Brake 150
Converter 150
Viso AC : 1min. 2500 VAC
Screw torque Mounting (*3) - M5 3.5 N m
Note *1: All terminals should be connected together during the test. Note *2: Two thermistor terminals should be connected together, other terminals should be connected together and shorted to base plate during the test. Note *3: Recommendable value : 2.5 -3.5 Nm (M5)
Maximum
ratings
210 A
Units
°C
A
A
1
1384a
MARCH 2014
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7MBR50VA060-50
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IGBT Modules
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Electrical characteristics (at Tj= 25°C unless otherwise specied)
Items Symbols Conditions
Zero gate voltage collector current ICES VGE = 0V, VCE = 600V - - 1.0 mA
Gate-Emitter leakage current I
Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
GES VGE = 0V, VGE = ±20V - - 200 nA
GE (th) VCE = 20V, IC = 50mA 6.2 6.7 7.2 V
T
CE (sat)
V (terminal)
CE (sat)
V (chip)
VGE = 15V IC = 50A
VGE = 15V IC = 50A
j=25°C - 1.95 2.40
T
j=125°C - 2.25 -
T
j=150°C - 2.35 -
T
j=25°C - 1.60 2.05
T
j=125°C - 1.90 -
T
j=150°C - 2.00 -
Internal gate resistance Rg(int) - - 0 - Ω
Input capacitance C
Inverter
Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time t
Zero gate voltage collector current ICES
Gate-Emitter leakage current I
Collector-Emitter saturation voltage
Brake
ies VCE
t
on
t
r - 0.25 0.60
t
r (i) - 0.07 -
t
off - 0.52 1.20
t
f - 0.03 0.45
F
V (terminal)
F
V (chip)
rr IF = 50A - - 0.35 µs
= 10V, VGE = 0V, f = 1MHz - 3.3 - nF
VCC = 300V IC = 50A VGE = +15 / -15V RG = 43Ω
j=25°C - 1.95 2.40
T
F = 50A
I
F = 50A
I
T
j=125°C - 1.85 -
T
j=150°C - 1.80 -
j=25°C - 1.60 2.05
T
T
j=125°C - 1.50 -
T
j=150°C - 1.45 -
VGE = 0V VCE = 600V
GES
CE (sat)
V (terminal)
CE (sat)
V (chip)
VCE = 0V VGE = +20 / -20V
VGE = 15V IC = 50A
VGE = 15V IC = 50A
T
j=25°C - 1.95 2.40
T
j=125°C - 2.25 -
T
j=150°C - 2.35 -
T
j=25°C - 1.60 2.05
T
j=125°C - 1.90 -
T
j=150°C - 2.00 -
Internal gate resistance Rg(int) - - 0 - Ω
t
Turn-on time
Turn-off time
Reverse current I
Forward on voltage
Converter
Reverse current I
on
t
r - 0.25 0.60
t
off - 0.52 1.20
t
f - 0.03 0.45
RRM VR = 600V - - 1.00 mA
FM
V (chip)
RRM VR = 800V - - 1.0 mA
Resistance R
Thermistor
B value B T = 25 / 50°C
VCE = 300V IC = 50A VGE = +15 / -15V RG = 43Ω
F = 50A
I
terminal - 1.65 2.10
chip - 1.30 -
T = 25°C - 5000 -
T = 100°C 465 495 520
Characteristics
min. typ. max.
- 0.36 1.20
- - 1.0 mA
- - 200 nA
- 0.36 1.20
3305 3375 3450 K
Units
V
µs
V
V
µs
V
Thermal resistance characteristics
Items Symbols Conditions
Inverter IGBT - - 0.71
Thermal resistance (1device) R
Contact thermal resistance (1device) (*4) R
th(j- c)
th(c-f) with Thermal Compound - 0.05 -
Note *4: This is the value which is dened mounting on the additional cooling n with thermal compound.
Inverter FWD - - 1.15
Brake IGBT - - 0.71
Converter Diode - - 1.20
2
Characteristics
min. typ. max.
Units
°C/W
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7MBR50VA060-50
0
Characteristics (Representative)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
[ Inverter ]
Collector current vs. Collector-Emitter voltage (typ.)
j= 25°C / chip
T
100
V
GE
=20V
15V
12V
75
50
25
Collector current: IC [A]
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
[ Inverter ]
Collector current vs. Collector-Emitter voltage (typ.)
V
GE=15V / chip
100
T
j=25°C
75
[A]
Tj=150°C
j=125°C
T
10V
[ Inverter ]
Collector current vs. Collector-Emitter voltage (typ.)
j= 150°C / chip
T
100
V
GE
=20V
15V
12V
75
50
25
Collector current: IC [A]
1
V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: V
CE[V]
[ Inverter ]
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
T
j= 25°C / chip
8
CE [V]
6
50
25
Collector current: IC
0
0 1 2 3 4 5
Collector-Emitter voltage: V
[ Inverter ]
Capacitance vs. Collector-Emitter voltage (typ.)
V
GE=0V, f= 1MHz, Tj= 25°C
100.0
10.0
1.0
0.1
C
Cres
Coes
ies
CE[V]
4
2
Collector - Emitter voltage: V
I I I
0
5 10 15 20 25
Gate - Emitter voltage: V
GE [V]
[ Inverter ]
Dynamic gate charge (typ.)
V
CC=300V, IC=50A, Tj= 25°C
GE [5V/div]
0
V
CE
V
C=100A C=50A C=25A
GE
Capacitance: Cies, Coes, Cres [nF]
0.0
0 10 20 30
Collector - Emitter voltage: VCE [V]
Gate - Emitter voltage: V
Collector - Emitter voltage: VCE [200V/div]
-400 0 400
Gate charge: Qg [nC]
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IGBT Modules
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Switching time : ton, tr, toff, tf [ nsec ]
Switching time : ton, tr, toff, tf [ nsec ]
[ Inverter ]
Switching time vs. Collector current (typ.)
CC=300V, VGE=±15V, RG=43Ω, Tj= 125°C
V
10000
1000
t
off
tr
100
10
0 50 100 150
Collector current: IC [A]
[ Inverter ]
Switching time vs. gate resistance (typ.)
CC=300V, IC=50A, VGE=±15V, Tj= 125°C
V
10000
1000
100
10
10 100 1000
Gate resistance : R
G [Ω]
[ Inverter ]
Switching time vs. Collector current (typ.)
V
CC=300V, VGE=±15V, RG=43Ω, Tj= 150°C
10000
1000
ton
t
off
ton
tr
100
tf
tf
Switching time : ton, tr, toff, tf [ nsec ]
10
0 50 100 150
Collector current: I
C [A]
[ Inverter ]
Switching loss vs. Collector current (typ.)
CC=300V, VGE=±15V, RG=43Ω
V
8
on(150°C)
toff ton
r
t
6
4
on, Eoff, Err [mJ/pulse ]
E
on(125°C)
E
off(150°C)
E
E
off(125°C)
tf
2
rr(150°C)
E
rr(125°C)
E
0
Switching loss : E
0 50 100 150
Collector current: IC [A]
[ Inverter ]
Switching loss vs. gate resistance (typ.)
CC=300V, IC=50A, VGE=±15V
V
15
E
E
10
5
0
Switching loss : Eon, Eoff, Err [mJ/pulse ]
10 100 1000
Gate resistance : R
E
E
E Err(125°C)
G [Ω]
on(150°C)
on(125°C)
off(150°C)
off(125°C)
rr(150°C)
[ Inverter ]
Reverse bias safe operating area (max.)
GE=15V,-VGE <= 15V, RG >= 43Ω ,Tj=150°C
+V
150
100
RBSOA (Repetitive pulse)
50
Collector current: IC [A]
0
0 200 400 600 800
Collector-Emitter voltage : VCE [V]
(Main terminals)
4
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7MBR50VA060-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
[ Inverter ]
Forward current vs. forward on voltage (typ.)
chip
100
50
Tj=150°C
Tj=125°C
Forward current : IF [A]
j=25°C
T
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Forward on voltage : VF [V]
[ Converter ]
Forward current vs. forward on voltage (typ.)
chip
100
[ Inverter ]
Reverse recovery characteristics (typ.)
V
CC=300V, VGE=±15V, RG=43Ω
1000
t
rr(150°C)
rr(125°C)
t
100
Irr(150°C) I
rr(125°C)
Reverse recovery current : Irr [ A ]
Reverse recovery time : trr [ nsec ]
10
0 50 100 150
Forward current : I
F [A]
75
50
j=125°
T
25
Forward current : IF [A]
j=25°C
T
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Forward on voltage : V
FM [V]
Transient thermal resistance (max.)
10.00
1.00
IGBT[Inverter], IGBT[Brake]
=
0.10
Thermal resistanse : Rth(j-c) [ °C/W ]
0.01
n 1 2 3 4
[sec] 0.0023 0.0301 0.0598 0.0708
n
T r
IGBT 0.07616 0.19308 0.27277 0.16800
n
[°C/W] FWD 0.12335 0.31274 0.44181 0.27211
B-IGBT 0.07616 0.19308 0.27277 0.16800
Conv 0.12871 0.32633 0.46102 0.28394
0.001 0.010 0.100 1.000
Pulse width : P
n
W [sec]
Conv. Diode
FWD[Inverter]
4
rZth
n
1
=
1
[ Thermistor ]
Temperature characteristic (typ.)
100
10
t
n
e
1
Resistance : R [k]
0.1
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
Temperature [°C ]
5
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7MBR50VA060-50
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0
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
[ Brake ]
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 25°C / chip
100
V
GE
=20V 15V
12V
75
50
25
Collector current: IC [A]
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE[V]
[ Brake ]
Collector current vs. Collector-Emitter voltage (typ.)
GE=15V / chip
V
100
75
[A]
T
j=25°C
Tj=150°C
j=125°C
T
10V
[ Brake ]
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 150°C / chip
100
V
GE
=20V
15V
12V
75
V
50
25
Collector current: IC [A]
1
8V
0
0 1 2 3 4 5
[V]
Collector-Emitter voltage: V
CE
[ Brake ]
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
j= 25°C / chip
T
8
CE [V]
6
50
25
Collector current: IC
0
0 1 2 3 4 5
Collector-Emitter voltage: V
[ Brake ]
Capacitance vs. Collector-Emitter voltage (typ.)
V
GE=0V, f= 1MHz, Tj= 25°C
10.0
ies
C
1.0
Coes
Cres
Capacitance: Cies, Coes, Cres [nF]
0.1
0 10 20 30
Collector - Emitter voltage: V
CE [V]
CE [V]
4
I
2
C=100A C=50A
I I
C=25A
Collector - Emitter voltage: V
0
5 10 15 20 25
Gate - Emitter voltage: VGE [V]
[ Brake ]
Dynamic gate charge (typ.)
V
CC=300V, IC=50A, Tj= 25°C
V
CE
0
Gate - Emitter voltage: VGE [5V/div]
Collector - Emitter voltage: VCE [200V/div]
-400 0 400
Gate charge: Qg [nC]
GE
V
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7MBR50VA060-50
Outline Drawings(Unit:mm)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Equivalent Circuit
[ Con ve rt er ] [ Bra ke ] [ Inver te r ]
22(P1)
21(P)
20 (Gu)
2(S) 3(T)1(R)
7(B)
14(Gb)
23(N)
24(N1)
19(Eu)
13(Gx)
18 (Gv)
17(Ev)
4(U)
12(Gy) 11(Gz)
Weig ht : 180g( ty p.)
16 (Gw)
15(Ew)
5(V)
[ The rm is tor ]
98
6(W)
10(En)
7
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7MBR50VA060-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
WARNING
1. This Catalog c ontains the product specications, charac teristics, data, materials, and structures as of March 2014. The contents are subject to change without notice for specication changes or other reasons. When using a product listed in this Catalog, be sur to obtain the latest specications.
2. All applications descr ibed in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Elec tric Co., Ltd. is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual proper ty rights which may arise from the use of the applications described herein.
3. Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injur y, re, or other problem if any of the products become fault y. It is recommended to make your design failsafe, ame retardant, and free of malfunction.
4. The products introduced in this Catalog are intended for use in the following electronic and electric al equipment which has nor mal reliabilit y requirements.
• Computers • OA equipment • Communications equipment (terminal devices) • Measurement equipment
• Machine tools • Audiovisual equipment • Electrical home appliances • Personal equipment • Industrial robots etc.
5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electr ic Co., Ltd. to obtain pr ior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty.
• Transportation equipment (mounted on cars and ships) • Trunk communications equipment
• Trafc-signal control equipment • Gas leakage detectors with an auto-shut-off feature
• Emergency equipment for responding to disasters and anti-burglar y devices • Safety devices
• Medical equipment
6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation).
• Space equipment • Aeronautic equipment • Nuclear c ontrol equipment
• Submarine repeater equipment
7. Copyright ©1996 -2014 by Fuji Electric Co., Ltd. All rights reserved. No part of this Cat alog may be reproduced in any form or by any means without the express permission of Fuji Electric Co., Ltd.
8. If you have any question about any por tion in this Catalog, ask Fuji Electric Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein.
8
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Technical Information
Please refer to URLs below for futher information about products, application manuals and technical documents.
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IGBT Modules
FUJI ELECTRIC Power Semiconductor WEB site
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Information
日本
1
半導体総合カタログ
2
製品情報
3
アプリケーションマニュアル
4
技術資料
5
マウンティングインストラクション
6
IGBT 損失シミュレーションソフト
7
AT-NPC 3-Level 損失シュミレーションソフト
8
富士電機技報
9
製品のお問い合わせ
10
改廃のお知らせ
Global
1
Semiconductors General Catalog
2
Product Information
3
Application Manuals
4
Technical Documents
5
Mounting Instructions
6
IGBT Loss Simulation Software
7
AT-NPC 3-Level Loss Simulation Software www.fujielectric.com/products/semiconductor/model/igbt/simulation_3level/
8
Fuji Electric Journal
9
Contact
10
Revised and discontinued product information www.fujielectric.com/products/semiconductor/discontinued/
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中国
1
半导体综合目录
2
产品信息
3
应用手册
4
技术资料
5
安装说明书
6
IGBT 损耗模拟软件
7
AT-NPC 3-Level 损耗模拟软件
8
富士电机技报
9
产品咨询
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产品更改和停产信息
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2015 -10
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