This errata document describes corrections to the
MPC5553/5554 Microcontroller Reference Manual,
order number MPC5553_MPC5554_RM. For
convenience, the addenda items are grouped by revision.
Please check our website at http://www.freescale.com/
for the latest updates.
The current version available of the MPC5553/5554 Microcontroller Reference Manual is Revision 5.
The MPC5553 and MPC5554 microcontrollers (MCU) are the first members of the MPC5500 family of
next generation powertrain microcontrollers built on the Power Architecture technology . The MPC5500
family contains a host processor core that complies with the Power Architecture embedded category,
which is 100 percent user mode compatible with the original Power PC user instruction set architecture
(UISA). This family of parts contains many new features coupled with high performance CMOS
technology to provide significant performance improvement over the MPC565.
The e200z6 CPU of the MPC5500 family is part of the family of CPU cores that implement versions built
on the Power Architecture embedded category . This core also has additional instructions, including digital
signal processing (DSP) instructions, beyond the classic PowerPC instruction set.
The MPC5553 and MPC5554 of the MPC5500 family have two levels of memory hierarchy. The fastest
accesses are to the unified cache (32-kilobytes in the MPC5554, 8-kilobytes in the MPC5553). The next
level in the hierarchy contains the 64-kilobyte internal SRAM and internal flash memory (2 MB flash in
the MPC5554, 1.5 MB in the MPC5553). Both the internal SRAM and the flash memory can hold
instructions and data. The external bus interface has been designed to support most of the standard
memories used with the MPC5xx family.
The complex I/O timer functions of the MPC5500 family are performed by an enhanced time processor
unit engines (eTPU) — two in the MPC5554, one in the MPC5553. Each eTPU engine controls 32
hardware channels. The eTPU has been enhanced over the TPU by providing 24-bit timers, double action
hardware channels, variable number of parameters per channel, angle clock hardware, and additional
control and arithmetic instructions. The eTPU can be programmed using a high-level programming
language.
The less complex timer functions of the MPC5500 family are performed by the enhanced modular
input/output system (eMIOS). The eMIOS’ 24 hardware channels are capable of single action, double
action, pulse width modulation (PWM) and modulus counter operation. Motor control capabilities include
edge-aligned and center-aligned PWM.
Off-chip communication is performed by a suite of serial protocols including controller area networks
(FlexCANs) — three FlexCANs in the MPC5554 and two in the MPC5553, an enhanced deserial/serial
peripheral interface (DSPI) — four in the MPC5554 and three in the MPC5553, and enhanced serial
communications interfaces (eSCIs). The DSPIs support pin reduction through hardware serialization and
deserialization of timer channels and general-purpose input/output (GPIO) signals.
The MCU of the MPC5553 and MPC5554 has an on-chip 40-channel enhanced queued dual analog to
digital converter (eQADC).
The system integration unit (SIU) performs several chip-wide configuration functions. Pad configuration
and general-purpose input and output (GPIO) are controlled from the SIU. External interrupts and reset
control are also found in the SIU. The internal multiplexer submodule (SIU_DISR) provides multiplexing
of eQADC trigger sources, daisy chaining the DSPIs, and external interrupt signal multiplexing.
The MPC5553 has a fast Ethernet controller (FEC) with a built-in FIFO and a DMA controller.
Figure 1-1 is a block diagram of the MPC5554 (MPC5500 family MCU), and Figure 1-2 is a block
This section provides a high-level description of the features found in the MPC5553 and MPC5554:
•Operating parameters
— Fully static operation, up to 132 MHz
— –40 to 150 C junction temperature
— Low power design
– Less than 1.2 Watts power dissipation
– Designed for dynamic power management of core and peripherals
– Software-controlled clock gating of peripherals
– Separate power supply for stand-by operation for portion of internal SRAM
— Fabricated in 0.13 m process
— 1.5V internal logic
— Input and output pins with 3.0V–5.5V range
– 35%/65% V
– Selectable hysteresis
– Selectable slew rate control
— External bus and Nexus pins support 1.62V–3.6V operation
– Selectable drive strength control
CMOS switch levels (with hysteresis)
DDE
– Unused pins configurable as GPIO
— Designed with EMI reduction techniques
– Frequency modulated phase-locked loop
– On-chip bypass capacitance
– Selectable slew rate and drive strength
•High performance e200z6 core processor
— 32-bit CPU built on Power Architecture
— Thirty-two 64-bit general-purpose registers (GPRs)
— Memory management unit (MMU) with 32-entry fully-associative translation look-aside
buffer (TLB)
— Branch processing unit
— Fully pipelined load/store unit
— 32 kilobyte unified cache (in the MPC5554), 8 kilobyte unified cache (in the MPC5553) with
line locking
– 8-way set associative in the MPC5554, 2-way set associative in the MPC5553
– Two 32-bit fetches per clock
– 8-entry store buffer
– Way locking
– Supports assigning cache as instruction or data only on a per way basis
– Supports tag and data parity
— Vectored interrupt support
— Interrupt latency < 70 ns @132MHz (measured from interrupt request to execution of first
instruction of interrupt exception handler)
— Reservation instructions for implementing read-modify-write constructs (internal SRAM and
flash)
— Signal processing engine (SPE) auxiliary processing unit (APU) operating on 64-bit GPRs
— Floating point
–IEEE 754 compatible with software wrapper
– Single precision in hardware, double precision with software library
– Conversion instructions between single precision floating point and fixed point
— Long cycle time instructions, except for guarded loads, do not increase interrupt latency in the
MPC5554/MPC5553. To reduce latency in both the MPC5553 and the MPC5554, long cycle
time instructions are aborted upon interrupt requests.
— Extensive system development support through Nexus debug module
•System bus crossbar switch (XBAR)
— 3 master ports in the MPC5554, 4 master ports in the MPC5553; 5 slave ports
— 32-bit address bus, 64-bit data bus
— Simultaneous accesses from different masters to different slaves (there is no clock penalty
when a parked master accesses a slave)
•Enhanced direct memory access (eDMA) controller
— 64 channels (MPC5554) or 32 channels (MPC5553) support independent 8-, 16-, 32-, or 64-bit
single value or block transfers.
— Supports variable sized queues and circular queues.
— Source and destination address registers are independently configured to post-increment or
remain constant.
— Each transfer is initiated by a peripheral, CPU, or eDMA channel request.
— Each eDMA channel can optionally send an interrupt request to the CPU on completion of a
single value or block transfer.
•Interrupt controller (INTC)
— 308 total interrupt vectors (MPC5554) or 212 total interrupt vectors (MPC5553)
– 278 (MPC5554) or 191 (MPC5553) peripheral interrupt requests
– plus 8 software setable sources
– plus 22 reserved interrupts in the MPC5554, 13 reserved in the MPC5553
— Unique 9-bit vector per interrupt source
— 16 priority levels with fixed hardware arbitration within priority levels for each interrupt source
— Priority elevation for shared resources
•Frequency modulated phase-locked loop (FMPLL)
— Input clock frequency from 8 MHz to 20 MHz
— Current controlled oscillator (ICO) range from 50 MHz to maximum device frequency
— Reduced frequency divider (RFD) for reduced frequency operation without re-lock
— Four selectable modes of operation
— Programmable frequency modulation
— Lock detect circuitry continuously monitors lock status
— Loss of clock (LOC) detection for reference and feedback clocks
— Self-clocked mode (SCM) operation
— On-chip loop filter (reduces number of external components required)
— Engineering clock output
•External bus interface (EBI)
— 1.8V–3.3V nominal I/O voltage
— Memory controller with support for various memory types
— MPC5554 specifications:
– 32-bit data bus, 24-bit address bus with transfer size indication
— MPC5553 specifications:
– 416 BGA: 32-bit data bus, 24-bit address bus without transfer size indication
– 324 BGA: 16-bit data bus, 20-bit address bus (configurable to 24-bit address bus)
– 208 MAPBGA: no external bus
— Selectable drive strengths through pad control in SIU
— Configurable bus speed modes
— Support for external master accesses to internal addresses
— Burst support
— Bus monitor
– User selectable
– Programmable timeout period (with 8 external bus clock resolution)
— Chip selects
– In both the MPC5553 and MPC5554, four chip select (CS
has no CS
signals in the 208 MAPBGA package.
[0:3]) signals; but the MPC5553
– In the MPC5553 only, support for dynamic calibration with up to three calibration chip
selects (CAL_CS
[0] and CAL_CS[2:3])
— Configurable wait states
•System integration unit (SIU)
— Centralized GPIO control of 214 (MPC5554) or 198 (MPC5553) I/O and bus pins
— Centralized pad control on a per-pin basis
— System reset monitoring and generation
— External interrupt inputs, filtering and control
— Internal multiplexer submodule (SIU_DISR, SIU_ETISR, SIU_EIISR)
— Configurable error-correcting codes (ECC) reporting for internal SRAM and flash memories
•On-chip flash
— 2 Mbytes (MPC5554) or 1.5 Mbytes (MPC5553) burst flash memory
— 256K 64-bit (MPC5554) or 196K 64-bit (MPC5553) configuration
— Censorship protection scheme to prevent flash content visibility
— Hardware read-while-write feature that allows blocks to be erased/programmed while other
blocks are being read (used for EEPROM emulation and data calibration)
— 20 blocks (MPC5554) or 16 blocks (MPC5553) with sizes ranging from 16 Kbytes to
128 Kbytes to support features such as boot block, operating system block, and EEPROM
emulation
— Read while write with multiple partitions
— Page programming mode to support rapid end of line programming
— Hardware programming state machine
•Configurable cache memory, 32 kilobyte (MPC5554) / 8 kilobyte (MPC5553)
— 8-way set-associative, unified (instruction and data) cache in the MPC5554
— 2-way set-associative unified (instruction and data) cache in the MPC5553
•On-chip internal static RAM (SRAM)
— 64 kilobyte general-purpose RAM of which 32 kilobytes can be configured for standby
operation
— ECC performs single bit correction, double bit error detection
•Boot assist module (BAM)
— Enables and manages the transition of MCU from reset to user code execution in the following
configurations:
– User application can boot from internal or external flash memory
– Download and execution of code via FlexCAN or eSCI
•Enhanced modular I/O system (eMIOS)
— 24 orthogonal channels with double action, PWM, and modulus counter functionality
— Supports all DASM and PWM modes of MIOS14 (MPC5xx)
— Four selectable time bases plus shared time or angle counter bus
— DMA and interrupt request support
— Motor control capability
•Enhanced time processor unit (eTPU)
— MPC5554 has two eTPU engines, MPC5553 has one engine
— Each eTPU engine is an event-triggered timer subsystem
— High level assembler/compiler
— 32 channels per engine
— 24-bit timer resolution
— 16 kilobyte shared code memory in the MPC5554, 12 kilobyte shared code memory in the
MPC5553
— 3 kilobyte (MPC5554) or 2.5 kilobyte (MPC5553)Shared data memory
— Variable number of parameters allocatable per channel
— Double match/capture channels
— Angle clock hardware support
— Shared time or angle counter bus for all eTPU and eMIOS modules
— DMA and interrupt request support
— Nexus class 3 debug support (with some class 4 support)
•Enhanced queued analog/digital converter (eQADC)
— Two independent ADCs with 12-bit A/D resolution
— Common mode conversion range of 0–5 V
— 40 single-ended inputs channels, expandable to 65 channels with external multiplexers on 416
and 324 BGA packages
— 34 single-ended inputs channels, expandable to 57 channels with external multiplexers on
208 BGA packages
— Eight channels can be used as four pairs of differential analog input channels
— 10-bit accuracy at 400 ksamples/s, 8-bit accuracy at 800 ksamples/s
— Supports six FIFO queues with fixed priority.
— Queue modes with priority-based preemption; initiated by software command, internal (eTPU
and eMIOS), or external triggers
— DMA and interrupt request support
— Supports all functional modes from QADC (MPC5xx family)
•Four (MPC5554) or three (MPC5553) deserial serial peripheral interface modules (DSPI)
— SPI
– Full-duplex communication ports with interrupt and eDMA request support
– Supports all functional modes from QSPI submodule of QSMCM (MPC5xx family)
– Support for queues in RAM
– Six chip selects, expandable to 64 with external demultiplexers
– Programmable frame size, baud rate, clock delay, and clock phase on a per-frame basis
– Modified SPI mode for interfacing to peripherals with longer setup time requirements
— Deserial serial interface (DSI)
– Pin reduction by hardware serialization and deserialization of eTPU and eMIOS channels
– Chaining of DSI submodules
– Triggered transfer control and change in data transfer control (for reduced EMI)
•Two enhanced serial communication interface (eSCI) modules
— UAR T mode provides NRZ format and half or full-duplex interface
— eSCI bit rate up to 1 Mbps
— Advanced error detection, and optional parity generation and detection
— Word length programmable as 8 or 9 bits
— Separately enabled transmitter and receiver
— LIN Support
— DMA support
— Interrupt request support
•Three (MPC5554) or two (MPC5553) FlexCANs
— 64 message buffers each
— Full implementation of the CAN protocol specification, Version 2.0B
— Based on and including all existing features of the Freescale TouCAN module
— Programmable acceptance filters
— Short latency time for high priority transmit messages
— Arbitration scheme according to message ID or message buffer number
— Listen only mode capabilities
— Programmable clock source: system clock or oscillator clock
•Nexus development interface (NDI)
— Per IEEE-ISTO 5001-2003
— Real time development support for Power Architecture core and eTPU engines through Nexus
class 3 (some Class 4 support)
— Data trace of eDMA accesses
— Read and write access
— Configured via the IEEE 1149.1 (JTAG) port
— High bandwidth mode for fast message transmission
— Reduced bandwidth mode for reduced pin usage
•IEEE 1149.1 JTAG controller (JTAGC)
—IEEE 1149.1-2001 test access port (TAP) interface
— A JCOMP input that provides the ability to share the TAP. Selectable modes of operation
include JTAGC/debug or normal system operation.
— A 5-bit instruction register that supports IEEE 1149.1-2001 defined instructions.
— A 5-bit instruction register that supports additional public instructions.
— Three test data registers: a bypass register, a boundary scan regist er , and a device identification
register.
— A TAP controller state machine that controls the operation of the data registers, instruction
register and associated circuitry.
•Voltage regulator controller
— Provides a low cost solution to power the core logic. It reduces the number of power supplies
•POR block
— Provides initial reset condition up to the voltage at which pins (RESET) can be read safely. It
does not guarantee the safe operation of the chip at specified minimum operating voltages.
1.3MPC5553-Specific Modules
The MPC5553 has two modules not found on the MPC5554, a fast Ethernet controller (FEC) module and
a calibration bus:
•Fast Ethernet controller (MPC5553 only)
— Built-in FIFO and DMA controller
— Fully software compatible to the FEC module of Freescale's industry standard PowerQUICC
communications controller
—IEEE 802.3 MAC (compliant with IEEE 802.3 1998 edition)
— Built-in FIFO and DMA controller
— Support for different Ethernet physical interfaces:
– 100Mbps IEEE 802.3 MII
– 10Mbps IEEE 802.3 MII
– 10Mbps 7-wire interface (industry standard)
— MII management interface for control and status
— Large on-chip transmit and receive Fifes to support a variety of bus latencies
— Retransmission from the transmit FIFO after a collision
— Automatic internal flushing of the receive FIFO for runts and collisions
— External BD tables of user-definable size allow nearly unlimited flexibility in management of
transmit and receive buffer memory
— Address recognition for broadcast, single-station address, promiscuous mode, and multicast
hashing
— Ethernet channel uses DMA burst transactions to transfer data to and from external/system
— Memory controller shared with EBI
— 16-bit calibration data bus shared with the upper 16 bits of the data bus
— 21-bit address bus with the least significant address bit (ADDR31) being not supported:
– CAL_ADDR[10:11] shared with CAL_CS[2:3]
– CAL_ADDR[12:26] shared with ADDR[12:26]
– CAL_ADDR[27:30]
— Up to 22 bit address space providing a 4 Mbyte addressing range (the most significant two bits
Fast Ethernet Controller (FEC)NoNoYes
FlexRayNoNoNoNoNoNoYes
FlexRay NexusNoNoNoNoNoNoClass 3
Phase Lock Loop (PLL)FMFMFMFMFMFMFM
Maximum System Frequency
Crystal Range8-20 MHz 8-20 MHz 8-20 MHz 8-20 MHz 8-20 MHz8-20 MHz8-20 MHz
V oltage Regulator Controller (VRC)YesYesYesYesYesYesYes
1
Two-way associative
2
Eight-way associative
3
Four-way associative
4
16-byte flash page size for programming
5
32-byte flash page size for programming
6
May not be externally available in some package configurations
7
Either ADDR[8:31] or ADDR[6:29] can be selected.
8
Updated FlexCAN module with optional individual receive filters
9
The FEC signals are shared with data bus pins DATA[16:31].
10
The FEC signals are shared with the calibration bus.
11
Initial automotive temperature range qualification.
11
80 MHz80 MHz132 MHz132 MHz132 MHz132 MHz132 MHz
210
channel
40
channel
210
channel
40
channel
9
300
channel
40
channel
NoNoYes
231
channel
40
channel
329
channel
40
channel
9
281
channel
40
channel
10
Yes
40 MHz
1.5Detailed Features
The following sections provided detailed information about each of the on-chip modules.
1.5.1e200z6 Core Overview
The MPC5553 and MPC5554 use the e200z6 core explained in detail in the e200z6 PowerPCTM Core
Reference Manual. The e200z6 CPU utilizes a seven stage pipeline for instruction execution. The
instruction fetch 1, instruction fetch 2, instruction decode/register file read, execute1, execute2/memory
access1, execute3/memory access2, and register writeback stages operate in an overlapped fashion,
allowing single clock instruction execution for most instructions.
The integer execution unit consists of a 32-bit arithmetic unit (AU), a logic unit (LU), a 32-bit barrel
shifter, a mask-insertion unit (MIU), a condition register manipulation unit (CRU), a count-leading-zeros
unit (CLZ), a 32x32 hardware multiplier array, result feed-forward hardware, and support hardware for
division.
Most arithmetic and logical operations are executed in a single cycle with the exception of multiply , which
is implemented with a pipelined hardware array, and the divide instructions. The CLZ unit operates in a
single clock cycle.
The instruction unit contains a program counter (PC) incrementer and a dedicated branch address adder to
minimize delays during change of flow operations. Sequential prefetching is performed to ensure a supply
of instructions into the execution pipeline. Branch target prefetching is performed to accelerate taken
branches. Prefetched instructions are placed into an instruction buffer capable of holding six sequential
instructions and two branch target instructions.
Branch target addresses are calculated in parallel with branch instruction decode, resulting in execution
time of three clocks. Conditional branches which are not taken execute in a single clock. Branches with
successful lookahead and target prefetching have an effective execution time of one clock.
Memory load and store operations are provided for byte, halfword, word (32-bit), and doubleword data
with automatic zero or sign extension of byte and halfword load data. These instructions can be pipelined
to allow effective single cycle throughput. Load and store multiple word instructions allow low overhead
context save and restore operations. The load/store unit contains a dedicated effective address adder to
allow effective address generation to be optimized.
The condition register unit supports the condition register (CR) and condition register operations defined
by the Power Architecture technology. The condition register consists of eight 4-bit fields that reflect the
results of certain operations, such as move, integer and floating-point compare, arithmetic, and logical
instructions, and provide a mechanism for testing and branching.
Vectored and auto-vectored interrupts are supported by the CPU. V ectored interrupt support is provided to
allow multiple interrupt sources to have unique interrupt handlers invoked with no software overhead.
The signal processing extension (SPE) APU supports vector instructions (SIMD) operating on 16- and
32-bit fixed-point data types, as well as 32-bit IEEE-754 single-precision floating-point formats, and
supports single-precision floating-point operations in a pipelined fashion. The 64-bit general-purpose
register file is used for source and destination operands, and there is a unified storage model for
single-precision floating-point data types of 32-bits and the normal integer type. Low latency fixed-point
and floating-point add, subtract, multiply, divide, compare, and conversion operations are provided, and
most operations can be pipelined.
1.5.2System Bus Crossbar Switch
The system bus’s XBAR multi-port crossbar switch supports simultaneous connections between
three(MPC5554) or four (MPC5553) master ports and five slave ports. The crossbar supports a 32-bit
address bus width and a 64-bit data bus width at all master and slave ports.
The crossbar allows for concurrent transactions to occur from any master port to any slave port. It is
possible for all master ports and slave ports to be in use at the same time as a result of independent master
requests. If a slave port is simultaneously requested by more than one master port, arbitration logic will
select the higher priority master and grant it ownership of the slave port. All other masters requesting that
slave port will be stalled until the higher priority master completes its transactions. By default, requesting
masters will be treated with equal priority and will be granted access to a slave port in round-robin fashion,
based upon the ID of the last master to be granted access.
The enhanced direct memory access (eDMA) controller is a second-generation module capable of
performing complex data movements via 64 (MPC5554) or 32 (MPC5553) programmable channels, with
minimal intervention from the CPU. The hardware micro architecture includes a DMA engine which
performs source and destination address calculations, and the actual data movement operations, along with
an SRAM-based memory containing the transfer control descriptors (TCD) for the channels. This
implementation is utilized to minimize the overall module size.
1.5.4INTC
The interrupt controller (INTC) provides priority-based preemptive scheduling of interrupt requests,
suitable for statically scheduled real-time systems. The INTC allows interrupt request servicing from 308
(MPC5554)/212(MPC5553) interrupt sources.
For high priority interrupt requests, the time from the assertion of the interrupt request from the peripheral
to when the processor is executing the interrupt service routine (ISR) has been minimized. The INTC
provides a unique vector for each interrupt request source for quick determination of which ISR needs to
be executed. It also provides an ample number of priorities so that lower priority ISRs do not delay the
execution of higher priority ISRs. T o allow the appropriate prior ities for e ach source of interrupt request,
the priority of each interrupt request is software configurable.
When multiple tasks share a resource, coherent accesses to that resource must be supported. The INTC
supports the priority ceiling protocol for coherent accesses. By providing a modifiable priority mask, the
priority level can be raised temporarily so that no task can preempt another task that shares the same
resource.
Multiple processors can assert interrupt requests to each other through software settable interrupt requests
(by using application software to assert requests). These maskable interrupt requests can be used to split
the software into a high priority portion and a low priority portion for servicing the interrupt requests. The
high priority portion is initiated by a peripheral interrupt request, but then the ISR asserts a software
settable interrupt request to finish the servicing in a lower priority ISR.
1.5.5FMPLL
The frequency modulated PLL (FMPLL) allows the user to generate high speed system clocks from an
8 MHz to 20 MHz crystal oscillator or external clock generator. Further, the FMPLL supports
programmable frequency modulation of the system clock. The PLL multiplication factor, output clock
divider ratio, modulation depth, and modulation rate are all software configurable.
1.5.6EBI
The external bus interface (EBI) controls data transfer across the crossbar switch to/from memories or
peripherals in the external address space. The EBI also enables an external master to access internal
address space. The EBI includes a memory controller that generates interface signals to support a variety
of external memories. The EBI memory controller supports single data rate (SDR) burst mode flash,
external SRAM, and asynchronous memories. In addition, the EBI supports up to four regions (via chip
selects), along with programmed region-specific attributes.
1.5.7SIU
The MPC5553/MPC5554 system integration unit (SIU) controls MCU reset configuration, pad
configuration, external interrupt, general-purpose I/O (GPIO), internal peripheral multiplexing, and the
system reset operation. The reset configuration module contains the external pin boot configuration logic.
The pad configuration module controls the static electrical characteristics of I/O pins. The GPIO module
provides uniform and discrete input/output control of the I/O pins of the MCU. The reset controller
performs reset monitoring of internal and external reset sources, and drives the RSTOUT pin. The SIU is
accessed by the e200z6 core through the crossbar switch.
1.5.8ECSM
The error correction status module (ECSM) provides status information regarding platform memory errors
reported by error-correcting codes.
1.5.9Flash
The MPC5554 provides 2 Mbytes of programmable, non-volatile, flash memory storage. The MPC5553
provides 1.5 Mbytes of flash memory . The non-volatile memory (NVM) can be used for instruction and/or
data storage.
The MPC5553/MPC5554 flash also contains a flash bus interface unit (FBIU) that interfaces the system
bus to a dedicated flash memory array controller . The FBIU supports a 64-bit data bus width at the system
bus port, and a 256-bit read data interface to flash memory. The FBIU contains two 256-bit prefetch
buffers, and a prefetch controller that prefetches sequential lines of data from the flash array into the buffer .
Prefetch buffer hits allow no-wait responses. Normal flash array accesses are registered in the FBIU and
are forwarded to the system bus on the following cycle, incurring three wait-states. Prefetch operations
may be automatically controlled, and may be restricted to servicing a single bus master. Prefetches may
also be restricted to being triggered for instruction or data accesses.
1.5.10Cache
The e200z6 core supports a 32-Kbyte (MPC5554) / 8-Kbyte (MPC5553), 8-way (MPC5554) / 2-way
(MPC5553) set-associative, unified (instruction and data) cache with a 32-byte line size. The cache
improves system performance by providing low-latency data to the e200z6 instruction and data pipelines,
which decouples processor performance from system memory performance. The cache is virtually indexed
and physically tagged. The e200z6 does not provide hardware support for cache coherency in a
multi-master environment. Software must be used to maintain cache coherency with other possible bus
masters.
Both instruction and data accesses are performed using a single bus connected to the cache. Addresses
from the processor to the cache are virtual addresses used to index the cache array. The memory
management unit (MMU) provides the virtual to physical translation for use in performing the cache tag
compare. The MMU may also be configured so that virtual addresses are passed through to the cache as
the physical address untranslated. If the physical address matches a valid cache tag entry, the access hits
in the cache. For a read operation, the cache supplies the data to the processor, and for a write operation,
the data from the processor updates the cache. If the access does not match a valid cache tag entry (misses
in the cache) or a write access must be written through to memory, the cache performs a bus cycle on the
system bus.
1.5.11SRAM
The MPC5500 family’ s internal SRAM module provides a general-purpose 64-Kbyte memory block that
supports mapped read/write accesses from any master. Included within the 64-Kbyte SRAM block is a
32-Kbyte block powered by a separate supply for standby operation, and ECC error correction and
detection.
1.5.12BAM
The boot assist module (BAM) is a block of read-only memory that is programmed by Freescale and is
identical for all MCUs with an e200z6 core. The BAM program is executed every time the MCU is
powered-on or reset in normal mode. The BAM supports the following four modes of booting:
•Booting from internal flash memory
•Single master booting from external memory
•Multi master booting from external memory with either no arbitration or external arbitration
•Serial boot loading (a program is downloaded into RAM via eSCI or the FlexCAN and then
executed).
The BAM also reads the reset configuration halfword (RCHW) from flash memory (either internal or
external) and configures the MPC5553 and MPC5554 hardware accordingly.
1.5.13eMIOS
The enhanced modular I/O system (eMIOS) module provides the functionality to generate or measure time
events. A unified channel (UC) module is employed that provides a superset of the functionality of all the
MIOS channels, while providing a consistent user interface. This allows more flexibility as each unified
channel can be programmed for different functions in different applications. In order to identify up to two
timed events, each UC contains two comparators, a time base selector and registers. This structure is able
to produce match events, which can be configured to measure or generate a waveform. Alternatively , input
events can be used to capture the time base, allowing measurement of an input signal.
1.5.14eTPU
The enhanced time processing unit (eTPU) is an enhanced co-processor designed for timing control.
Operating in parallel with the CPU, the eTPU processes instructions and real-time input events, performs
output waveform generation, and accesses shared data without host intervention. Consequently, for each
timer event, the CPU setup and service times are minimized or eliminated. In the MPC5554 MCU, two
eTPU engines are grouped together with shared instruction and data RAM to form a powerful time
processing subsystem. The MPC5553 has one eTPU engine. High-level assembler/compiler and
documentation allows customers to develop their own functions on the eTPU. The eTPU supports several
features of older TPU versions, making it easy to port older applications.
1.5.15eQADC
The enhanced queued analog to digital converter (eQADC) module provides accurate and fast conversions
for a wide range of applications. The eQADC provides a parallel interface to two on-chip analog to digital
converters (ADCs), and a single master-to-single slave serial interface to an off-chip external device. The
two on-chip ADCs are architected to allow access to all the analog channels.
The eQADC transfers commands from multiple command FIFOs (CFIFOs) to the on-chip ADCs or to the
external device. The module can also receive data from the on-chip ADCs or from an off-chip external
device into multiple result FIFOs (RFIFOs) in parallel, independently of the CFIFOs. The eQADC
supports software and external hardware triggers from other modules to initiate transfers of commands
from the CFIFOs to the on-chip ADCs or to the external device. It also monitors the fullness of CFIFOs
and RFIFOs, and accordingly generates eDMA or interrupt requests to control data movement between the
FIFOs and the system memory, which is external to the eQADC.
1.5.16DSPI
The deserial serial peripheral interface (DSPI) module provides a synchronous serial interface for
communication between the MCU and external devices. The DSPI supports pin count reduction through
serialization and deserialization of eTPU channels, eMIOS channels and memory-mapped registers. The
channels and register content are transmitted using a SPI-like protocol. There are four identical DSPI
modules (DSPI_A, DSPI_B, DSPI_C, and DSPI_D) on the MPC5554 MCU. The MPC5553 has three
DSPI modules (DSPI_B, DSPI_C, and DSPI_D).
The DSPIs have three configurations:
•Serial peripheral interface (SPI) configuration where the DSPI operates as a SPI with support for
queues
•Deserial serial interface (DSI) configuration where the DSPI serializes eTPU and eMIOS output
channels and deserializes the received data by placing it on the eTPU and eMIOS input channels
•Combined serial interface (CSI) configuration where the DSPI operates in both SPI and DSI
configurations interleaving DSI frames with SPI frames, giving priority to SPI frames
For queued operations, the SPI queues reside in system memory external to the DSPI. Data transfers
between the memory and the DSPI FIFOs are accomplished through the use of the eDMA controller or
through host software.
1.5.17eSCI
The enhanced serial communications interface (eSCI) allows asynchronous serial communications with
peripheral devices and other MCUs. It includes special support to interface to local interconnect network
(LIN) slave devices.
The MCU contains three (MPC5554) or two (MPC5553) controller area network (FlexCAN) modules.
Each FlexCAN module is a communication controller implementing the CAN protocol according to CAN
Specification version 2.0B. The CAN protocol was designed to be used primarily as a vehicle serial data
bus, meeting the specific requirements of this field: real-time processing, reliable operation in the EMI
environment of a vehicle, cost-effectiveness and required bandwidth. Each FlexCAN module contains 64
message buffers (MB).
1.5.19NDI
The Nexus development interface (NDI) module provides real-time development support capabilities for
the MPC5500 family’s MCU built on the Power Architecture in compliance with the IEEE-ISTO
5001-2003 standard. This development support is supplied for MCUs without requiring external address
and data pins for internal visibility . The NDI module is an integration of several individual Nexus modules
that are selected to provide the development support interface for the MPC5500 family. The NDI module
interfaces to the host processor, to one or dual eTPU processors, and internal buses to provide development
support as per the IEEE-ISTO 5001-2003 standard. The development support provided includes
program trace, data trace, watchpoint trace, ownership trace, run-time access to the MCU’s internal
memory map, and access to the Power Architecture and eTPU internal registers during halt, via the
auxiliary port. The Nexus interface also supports a JTAG only mode using only the JTAG pins.
1.5.20JTAGC
The JT AG controller (JT AGC) module provides the means to test chip functionality and connectivity while
remaining transparent to system logic when not in test mode. Testing is performed via a boundary scan
technique, as defined in the IEEE 1149.1-2001 standard. All data input to and output from the JTAGC
module is communicated in serial format. The JT AGC module is compliant with the IEEE 1149.1-2001
standard.
1.5.21FEC (MPC5553 Only)
The fast Ethernet controller (FEC) of the MPC5553 supports several standard MAC-PHY interfaces to
connect to an external Ethernet transceiver:
•10/100 Mbps MII interface
•10 Mbps 7-Wire interface that uses a subset of the MII pins
•Built-in FIFO and DMA controller
•Fully software compatible to the FEC module of Freescale's industry standard PowerQUICC
communications controller
•IEEE 802.3 MAC (compliant with IEEE 802.3 1998 edition)
•Built-in FIFO and DMA controller
•Support for different Ethernet physical interfaces:
— 100 Mbps IEEE 802.3 MII
— 10 Mbps IEEE 802.3 MII
•Large on-chip transmit and receive FIFOs to support a variety of bus latencies
•Retransmission from the transmit FIFO after a collision
•Automatic internal flushing of the receive FIFO for runts and collisions
•Address recognition
— Frames with broadcast address may be always accepted or always rejected
— Exact match for single 48-bit individual (unicast) address
— Hash (64-bit hash) check of individual (unicast) addresses
— Hash (64-bit hash) check of group (multicast) addresses
— Promiscuous mode
•External BD tables of user-definable size allow nearly unlimited flexibility in management of
transmit and receive buffer memory
•Ethernet channel uses DMA burst transactions to transfer data to and from external/system
memory
•Interrupts for network activity and error conditions
1.5.22Calibration Bus (MPC5553 Only)
The calibration bus controls data transfer across the crossbar switch to/from memories or peripherals. The
bus shares the memory controller and most of the control logic with the EBI but the two buses come out
on two completely independent sets of pads. The calibration bus memory controller supports single data
rate (SDR) non-burst mode flash, SRAM, and asynchronous memories. In addition, the bus supports up to
three regions via dedicated calibration chip selects (two chip selects multiplexed with two address bits),
along with programmed region-specific attributes.
1.6MPC5500 Family Memory Map
This section describes the MPC5500 family memory map. All addresses in the device, including those that
are reserved, are identified in the tables. The addresses represent the physical addresses assigned to each
module. Logical addresses are translated by the MMU into physical addresses.
Under software control of the MMU, the logical addresses allocated to modules may be changed on a
minimum of a 4-Kbyte boundary . Peripheral modules may be redundantly mapped. The customer must use
the MMU to prevent corruption.
Reserved register bits may be used for features in future family members. The default value of reserved
bits is zero. When writing to a register, the reserved bits default values should be written to that register.
As a general rule, when a feature is added bit field will need a non-zero value to activate it.
Reserved memory also may be used in future family members. These areas should not be used if reserved.
Table 1-2. Detailed MPC5554/MPC5553 Family Memory Map (Continued)
Address Range
1
Allocated Size
(bytes)
0xFFFC_4000–0xFFFC_7FFF16 Kbytes1152Controller Area Network (FlexCAN_B)
1
Used Size
(bytes)
Use
3
0xFFFC_8000–0xFFFC_BFFF16 Kbytes1152Controller Area Network (FlexCAN_C)
0xFFFC_C000–0xFFFF_BFFF192 KbytesN/AReserved
0xFFFF_C000–0xFFFF_FFFF
1
If allocated size used size, then the base address for the module is the lowest address of the listed address range, unless
4
16 Kbytes16 KbytesBoot Assist Module (BAM)
noted otherwise.
2
MPC5553 only, not in MPC5554
3
MPC5554 only, not in MPC5553
4
BAM address range is configured so that 4Kbyte BAM occupies 0xFFFF_F000–0xFFFF_FFFF
1.7Multi-Master Operation Memory Map
When the MPC5553/MPC5554 MCU acts as a slave in a multi-master system, the external bus interface
(EBI) translates the 24-bit external address to a 32-bit internal address. Table 1-3 lists the translation
parameters.
Table 1-3. External to Internal Memory Map Translation Table for Slave Mode
0x6000_0000–0x600F_FFFF
0b11100b1100_0011_11111 MbyteBridge A Peripherals0xC3F0_0000–0xC3FF_FFFF
0b11110b1111_1111_11111 MbyteBridge B Peripherals0xFFF0_0000–0xFFFF_FFFF
1
Only the lower 24 address signals (addr[8:31]) are available off-chip.
2
Reserved for a future module that requires its own crossbar slave port.
Table 1-4 shows the memory map for the MPC5553/MPC5554 MCU acting as a slave in a multi-master
system from the point of view of the external master.
Table 1-4. MPC5500 Family Slave Memory Map as Seen from an External Master
External Address Range
2
0x00_0000
–0x7F_FFFF8 MbytesN/A–Used for off-chip memory accesses
0xF0_0000–0xFF_FFFF1 MbytesSlave Bridge B Peripherals
1
Only the lower 24 address signals (addr[8:31]) are available off-chip.
2
This address range is not part of the MPC5500 family slav e memory map, rather it is shown to illustrate the addressing scheme
for off-chip accesses in multi-master mode.
3
The shadow row of the slave FLASH is not accessible by an external master.
Table 1-5 shows the memory map for the MPC5553 and MPC5554 family MCU configured as a master
in multi-master system with another MPC5500 family MCU acting as the slave.
Table 1-5. MPC5500 Family Master Memory Map (Multi Master Mode)
Table 1-5. MPC5500 Family Master Memory Map (Multi Mast er Mode) (Continued)
Base AddressSize (bytes)Use
0xC3F0_00001 MbytesBridge A peripherals
0xC400_0000(1024 Mbytes–128 Mbytes)Reserved
0xFC00_000063 MbytesReserved
0xFFF0_00001 MbyteBridge B Peripherals
1
By using the 4 chip select signals, 32 Mbytes of external memory can be accessed by the
master in a multi-master system.
1.8Revision History
Table 1-6. Changes to MPC5553/5554 RM for Rev. 4.0 Release
Description of Change
• Added wording for Power Architecture throughout chapter. Removed PowerPC ter m inology.
• In Features List, added section for Calibration interface
• In Features List, beefed up the section titled “MPC5553-Specific Modules” by adding more information about the FEC.
• In the MPC5553-Specific Modules section, added a section titled “Calibration Bus”
• In the Detailed Features section, beefed up the section titled FEC (MPC5553 Only).
• In the MPC5500 Family Master Memory Map (Multi-Master Mode) table, corrected SRAM values to 64 Kbytes from 96
Kbytes.
Table 1-7. Changes to MPC5553/5554 RM for Rev. 5.0 Release
Description of Change
• In table 1-2, in the address range 0x0100_0000–0x1FFF_FFFF(emulation mapping of FLASH Array), updated the Used
Size (bytes) cell as “2 Mbytes (MPC5554) and 1.5 Mbytes (MPC5553)”.
This chapter describes the signals of the MPC5553 and the MPC5554 that connect off chip. It includes a
table of signal properties, detailed descriptions of signals, and the I/O pin power/ground segmentation.
2.1Block Diagram
Figure 2-1 shows the signals of the MPC5553, and Figure 2-2 shows the signals of the MPC5554.
This section summarizes the external signal functions, their static electrical characteristics, and pad
configuration settings for this device. Table 2-1 gives a summary of the MPC5553 external signals, and
Table 2-2 provides a summary of the MPC5554 external signals. The signal properties and their electrical
characteristics are set in the system integration unit (SIU) pad configuration registers (PCR).
Signal functions are multiplexed to each ball on the BGA in a function hierarchy: primary , main primary,
alternate, second alternate, and general-purpose input/output (I/O). For example, in the signal
PCSA[3]_SIND_GPIO[99], the primary signal function is PCSA[3], the first alternate signal function is
SIND, and the GPIO function is a generic general-purpose I/O signal. Multiplexing signal functions allows
for more flexibility when configuring the device, as well as providing compatibility with other devices in
the MPC5500 product family.
The primary signal function name is used in the ball grid array (BGA) map to identify the location of the
ball; however, the primary signal function is not always va lid for all devices. As shown in Figure 2-3, when
the primary signal function is not available on the device, a dash appears in the following signal table
columns: signal functions, P/A/G, and I/O type.
The P/A/G column designates the position in the signal function hierarchy for multiplexed functions.
These symbols correspond to binary values for the pin assignment (P A) field in the SIU_PCR registers that
determine the active signal function. The PA field is from 1- to 3-bits wide, depending on the PCR register .
Figure 2-4 explains the symbol definitions used in the P/A/G column for Table 2-1 and Table 2-2.
2-4Freescale Semiconductor
Figure 2-3. Primary Function Not Available on Device
Figure 2-4. Understanding the P/A/G Column Entries
Because more than one signal is often multiplexed to one pin, each line in the signal name column is a separate function. For all MPC5553 I/O pins the
selection of the primary pin function, alternate function, or GPIO is determined in the SIU_PCR registers.
Each line in the signal name column corresponds to a separate signal function on the pin. For all device I/O pins, the primary, alternate, or GPIO signal
functions are designated in the PA field of the system integration unit (SIU) PCR registers except where explicitly noted.
3
V
(fast I/O) and V
DDE
3.3–5.0 V (5%/–10%) power supply input. Each segment of V
V
and V
DDE2
Refer to Table 2-5 for a definition of the I/O pins that are powered by each segment.
4
The pad type is indicated by one of the abbreviations; F for fast, MH for medium (high voltage), SH for slow (high voltage), A for analog, AE for analog with
ESD protection circuitry. Some pads may have two types, depending on which pad function is selected.
5
The Status During Reset pin is sampled after the internal POR is negated. Prior to exiting POR, the signal has a high impedance. Terminology is O — output,
segments that are shorted together and must use the same power supply input. This segment is labeled V
DDE3
(slow I/O) power supply inputs are grouped into segments. Each segment of V
DDEH
pins can connect to a separate 1.8–3.3 V (10%) power supply, with the exception of the
DDE
pins can connect to a separate
DDEH
in the BGA map.
DDE2
I — input, up — weak pullup enabled, down — weak pulldown enabled, low — output driven low, high — output driven high. A dash on the left side of the
slash denotes that both the input and output buffers for the pin are off. A dash on the right side of the slash denotes that there is no weak pull up/down enabled
on the pin. The signal name to the left or right of the slash indicates the pin is enabled.
6
Function after reset of GPI is general-purpose input. A dash on the left side of the slash denotes that both the input and output buffers for the pin are off. A
dash on the right side of the slash denotes that there is no weak pull up/down enabled on the pin.
7
The 496 assembly is only available as an internal component of the 416, 324, and 208 VertiCal base devices and is not available directly to customers.
8
The calibration signal functions are not available on the 416 package because it does not have a calibration bus. The fast Ethernet controller (FEC) signals
are available on the 416 package as alternate functions muxed with the primary EBI signal functions.
9
Availability currently not planned. Consult factory for availability.
10
BOOTCFG[0] is not available and will always be read as 0 in the 208 package of the MPC5553.
11
The EBI is specified and tested at 1.8 V and 3.3 V.
12
The 32-bit external bus interface (EBI) can be configured as: a 32-bit external I/O data bus for the EBI; a 16-bit ex ternal I/O data b us for the EBI which uses
the lower 16-bits, and a 16-bit FEC, which uses the upper 16-bits; and the calibration bus interface (CBI), which uses 21 address pins [10:30] and 16 data
pins [0:15].
13
Do not configure both the primary function in ADDR[8:11]_GPIO[4:7] and the secondary function in CS[0:3]_ADDR[8:11]_GPIO[0:3] pins as input. Only
configure one set of pins for the address input.
14
When using the EBI functions, select the function in the SIU_PCR register and enable the EBI functions in the EBI for these pins. Both the SIU and EBI
configurations must match for proper operation.
15
The function and state of these pins after execution of the BAM (Boot Assist Module) program is determined by the BOO TCFG[1:0] pins . Ref er to Table 16-6
for detail on the EBI configuration after execution of the BAM program.
16
Because the CBI and the EBI share the same bus, the CBI uses EBI signals ADDR[12:26] in addition to the CAL_ADDR[10:11, 27:30] signals for calibration
addressing. Set the PA field in the SUI_PCR register to 0b1 to use the CBI or EBI.
17
V
and V
DDE3
18
Because the CBI and the EBI share the same external bus, RD_WR is used for both the CBI and the EBI.
19
The function for the WE/BE[0:1]_GPIO[64:65] and WE/BE[2:3]_CAL_WE/BE[0:1]_GPIO[66:67] pins is specified in the SIU. When configured for EBI, the
are shorted together in this device.
DDE2
write enable or byte enable operation is specified in the EBI_BR0 through EBI_BR3 registers. When configured for the Calibration bus, the write enable or
byte enable operation is specified in the EBI_CAL_BR0 through EBI_CAL_BR3 registers for each chip select region.
20
Because the CBI and the EBI share the same external bus, OE is used for both the CBI and the EBI.
21
Because the CBI and the EBI share the same external bus, TS is used for both the CBI and the EBI.
22
The BR and BG functions are not implemented on the MPC5553 and are replaced by FEC and calibration functions. The pin name on the ball map, however,
does remain BR
23
MCKO is only enabled if debug mode is enabled. Debug mode can be enabled before or after exiting System Reset (RSTOUT negated).
24
MDO[0] is driven high following a power-on-reset (POR) until the system clock achie v es lock, at which time it is then negated. There is an internal pull up on
MDO[0].
25
The function of the MDO[11:4]_GPIO[82:75] pins is selected during a debug port reset by the EVTI pin or by selecting FPM in the NPC_PCR. When
and BG. The primary functions for these pins are CAL_ADDR[10] and CAL_ADDR[11], respectively.
functioning as MDO[11:4] the pad configuration specified by the SIU does not apply. Refer to Section 2.3.4.5, “Nexus Message Data Out / GPIO
MDO[11:4]_GPIO[82:75]” for more detail on MDO[11:4] pin operation.
26
The pullup on TDO is functional only when not in JTAG mode (JCOMP negated).
27
The function and state of the FlexCAN A and eSCI A pins after execution of the BAM program is determined by the BOOTCFG[0:1] pins. Ref er to Table 16-9
for details on the FlexCAN A and eSCI A pin configurations after execution of the BAM program.
28
The primary signal is not available on this device and is listed only for reference to the pin label in the BGA map.
29
To allow one DSPI to operate at a different operating voltage than another DSPI, connect V
connecting V
30
For compatibility to the MPC5554, power V
31
All analog input channels are connected to both ADC blocks. The supply designation for this pin(s) specifies only the ESD rail used.
32
Because the primary signal function designations for the analog functions AN[12] through AN[15] are internally reserved, the PA field of the corresponding
SIU_PCR registers must be set to the main primary function value of 0b011 to use analog functions AN[12] through AN[15].
33
To use the serial data strobe functions, the P A field in the SIU_PCR registers must be set to 0b00. Because SDS, SDO , SDI, and FCK use the GPIO setting,
DDEH6
and V
to separate power supplies is not compatible with the MPC5554.
DDEH10
DDEH6
and V
from the same power supply (3–5.25 V).
DDEH10
DDEH6
and V
to separate power supplies. However,
DDEH10
a G is shown in the P/A/G column. However, these signals do not support true GPIO functionality.
34
If analog features are used, tie V
35
Because other balls are already named EMIOS[14:15] on the BGA map, the ball names used for these signals are named GPIO[203:204].
36
The GPIO[205] pin is a protect-for pin for configuring an external boot for a double data rate memory.
37
The GPIO[206:207] pins are protect-for pins for double data rate memory data strobes. These pins can source the ADC trigger in SIU_ETISR.
The function after reset of the XTAL pin is determined by the value of the signal on the PLLCFG[1] pin. The XTAL pin has no function when bypass mode is
selected and must be grounded.
39
When the FMPLL is configured for external reference mode, the V
“External Reference Mode.”
40
The function after reset of the EXTAL_EXTCLK pin is determined by the value of the signal on the PLLCFG[0:1] pins. If the EXTCLK function is chosen, the
valid operating voltage for the pin is 1.6–3.6 V. If the EXTAL function is chosen, the valid operating voltage is 3.3 V. Refer to Table 11-1.
41
V
is the 3.3 V input for the voltage regulator control.
RC33
42
V
is connected internally to V
RCVSS
43
Each VDDAn and VSSAn connects to one ADC engine to provide isolation.
44
V
is not available on the 208 package; it is connected inside the package to VDD33.
FLASH
45
VPP can be tied to 5.0 V for both the read operation and program/erase operation.
46
Tie the V
47
The V
analog input function.
48
All pins with pad type pad_fc are driven to the high state if their V
49
The pins are reserved for the clock and inv erted clock outputs for the DDR memory interface. In the MPC5553 416-pin package, the two NC pins are isolated
pin to V
STBY
segment can be powered from 3.0–5.0 V for MUX addresses or SSI functions, but must meet the V
DDEH9
if the battery-backed internal SRAM is not used.
SSA0
SSSYN
. V
is not available on the 208 package.
RCVSS
supply affects the signal levels for the external reference. Refer to Section11.1.4.2,
DDE5
specifications of 4.5 V to 5.25 V for
DDA1
segment is powered before V
DDE
DD33
.
(not shorted together in the package substrate).
2.2.2MPC5554 Signals Summary
Table 2-2 gives a summary of the MPC5554 external signals and properties.
Table 2-2. MPC5554 Signal Properties
P/
Signal Names
1
Signal Functions
2
I/O
A/
Type
G
Reset / Configuration Signals
RESETExternal Reset InputPIV
RSTOUT
PLLCFG[0]_
IRQ
[4]_
GPIO[208]
PLLCFG[1]_
IRQ
[5]_
SOUTD_
GPIO[209]
RSTCFG
_
GPIO[210]
BOOTCFG[0:1]_
IRQ
[2:3]_
GPIO[211:212]
WKPCFG_
GPIO[213]
External Reset OutputPOV
I
FMPLL Mode Selection
External Interrupt Request
General Purpose I/O
FMPLL Mode Selection
External Interrupt Request
DSPI D Data Out
General Purpose I/O
Reset Configuration Input
General Purpose I/O
Boot Configuration Input
External Interrupt Request
General Purpose I/O
External I/O High Supply InputPI
External I/O High Supply InputPI
External I/O High Supply InputPI
External I/O High Supply InputPI
External I/O High Supply InputPI
External I/O High Supply InputPI
Because more than one signal is often multiplexed to one pin, each line in the signal name column is a separate function. For all MPC5554 I/O
pins the selection of the primary pin function, alternate function, or GPIO is determined in the SIU_PCR registers.
2
Each line in the signal name column corresponds to a separate signal function on the pin. For all device I/O pins, the primary, alternate, or GPIO
signal functions are designated in the PA field of the system integration unit (SIU) PCR registers except where explicitly noted.
3
V
(fast I/O) and V
DDE
3.3–5.0 V ( 5%/–10%) power supply input. Each segment of V
exception of the V
DDE2
(slow I/O) power supply inputs are grouped into segments. Each segment of V
DDEH
and V
segments that are shorted together and must use the same power supply input. This segment is labelled V
DDE3
pins can connect to a separate 1.8–3.3 V ( 10%) power supply, with the
DDE
pins can connect to a separate
DDEH
in the BGA map.
Refer to Table 2-3 for a definition of the I/O pins that are powered by each segment.
The pad type is indicated by one of the abbreviations; F for fast, MH for medium (high voltage), SH for slow (high voltage), A for analog, AE for
analog with ESD protection circuitry. Some pads may have two types, depending on which pad function is selected.
5
The Status During Reset pin is sampled after the internal POR is negated. Prior to exiting POR, the signal has a high impedance.
T erminology is O — output, I — input, up — weak pullup enabled, do wn — weak pulldown enabled, low — output driven lo w, High — output driv en
high. A dash on the left side of the slash denotes that both the input and output buffers for the pin are off. A dash on the right side of the slash
denotes that there is no weak pull up/down enabled on the pin. The signal name to the left or right of the slash indicates the pin is enabled.
6
Function after reset of GPI is general-purpose input. A dash on the left side of the slash denotes that both the input and output buffers for the pin
are off. A dash on the right side of the slash denotes that there is no weak pull up/down enabled on the pin.
7
The 496 assembly contains the VertiCal base and includes all of the 416 package pins.
8
The EBI is specified and tested at 1.8 V and 3.3 V.
9
To provide more flexibility in configuring the device, the ADDR[8:11] pins are muxed to several signal functions, such as the primary function in
ADDR[8:31]_GPIO[4:27] and the alternate function in signal CS
address input.
10
The function and state of this pin after execution of the BAM program is determined by the BOO TCFG[0:1] pins. Ref er to Table 16-6 for detail on
the external bus interface (EBI) configuration after execution of the BAM program.
11
Although GPIO versus EBI function is specified in the SIU, when EBI function is chosen, the function must also be enabled in the EBI for these
pins. The SIU and EBI configurations must match for proper operation.
12
The active function for the WE/BE[0:3]_GPIO[64:65] is specified in the PA field of the SIU_PCR register. When configured for WE/BE[0:3], specify
the write enable or byte enable operation in the EBI_BR0 through EBI_BR3 registers.
13
MCKO is only enabled if debug mode is enabled. Debug mode can be enabled before or after exiting System Reset (RSTOUT negated).
14
MDO[0] is driven high following a power-on reset until the system clock achieves lock, at which time it is then negated. There is an internal pull
up on MDO[0].
15
The function of the MDO[11:4]_GPIO[82:75] pins is selected during a debug port reset by the EVTI pin or by selecting FPM in the NPC_PCR.
When functioning as MDO[11:4] the pad configuration specified by the SIU does not apply.
16
The pullup on TDO is only functional when not in JTAG mode, that is with JCOMP negated.
17
The function and state of the FlexCAN A and eSCI A pins after execution of the BAM program is determined by the BOOTCFG[0:1] pins. Refer
to Table 16-9 for detail on the FlexCAN and eSCI pin configuration after execution of the BAM program.
18
All analog input channels are connected to both ADC blocks. These pins must only use an ESD rail supply.
19
Because the primary signal function designations for the analog functions AN[12] through AN[15] are internally reserved, the PA field of the
corresponding SIU_PCR register must be set to the Main Primary function value of 0b011 to use analog functions AN[12] through AN[15].
20
To use the Serial Data Strobe functions, the PA fields of the corresponding SIU_PCR registers must be set to the GPIO setting of 0b00. Because
SDS
, SDO, SDI, and FCK use the GPIO setting, a G is shown in the P/A/G column. However , these signals do not support true GPIO functionality.
21
If the analog features are used, tie V
22
Because other balls already are named EMIOS[14:15], the balls for these signals are named GPIO[203:204].
23
The GPIO[205] pin is a protect-for pin for configuring an external boot for a double data rate (DDR) memory.
24
The GPIO[206:207] pins are protect-for pins for double data rate memory data strobes.
25
GPIO[206:207] can be selected as the source for the eQADC trigger in the eQADC Trigger Input Select Register (SIU_ETISR).
26
The function after reset of the XT AL pin is determined by the value of the signal on the PLLCFG[1] pin. When bypass mode is chosen, XTAL has
no function and must be grounded.
27
When the FMPLL is configured for external reference mode, the V
Refer to Section 11.1.4.2, “External Reference Mode.”
28
The function after reset of the EXTAL_EXTCLK pin is determined by the value of the signal on the PLLCFG[0:1] pins. If the EXTCLK function is
chosen, the valid operating voltage for the pin is 1.6–3.6 V. If the EXT AL function is chosen, the valid operating v oltage is 3.3 V . Ref er to Table 1 1-2.
29
V
is the 3.3 V input for the voltage regulator control.
RC33
30
V
is connected internally to V
RCVSS
31
The V
provides isolation between the analog and digital sections within each ADC.
32
VPP can be tied to 5.0 V for both the read operation and program/erase operation.
33
If the battery backed SRAM is not used, tie the V
34
The V
5.25 V for analog input function.
35
All pins with pad type F are driven to the high state if their V
36
The No Connect (NC) pins are reserved for the clock and inverted clock outputs for the DDR memory interface. In the MPC5554 416-pin package,
and V
DDAn
segment can be powered from 3.0–5.0 V for mux addressing or SSI functions, but must meet the V
DDEH9
supply inputs are separate traces in the package substrate. Each trace is bonded to a separate pad location, which
SSAn
DDEH9
SSSYN
to V
.
.
DDA1
pin to VSS ground.
STBY
[0:3]_ADDR[8:11]_GPIO[0:3]. Only configure one set of ADDR[8:11] pins for the
supply affects the acceptable signal levels for the external reference.
DDE5
specifications of 4.5 V to
DDA1
segment is powered on before V
DDE
DD33
.
the two No Connect (NC) pins are isolated (not shorted together in the package substrate).
This section describes the signals for the MPC5553/MPC5554.
2.3.1Reset / Configuration Signals
2.3.1.1External Reset Input
RESET
The RESET input is asserted by an external device to reset the all modules of the MPC5553/MPC5554
MCU. The RESET pin must be asserted during a power-on reset. Refer to Section 4.2.1, “Reset Input
(RESET).”
2.3.1.2External Reset Output
RSTOUT
The RSTOUT output is a push/pull output asserted during an internal MPC5553/MPC5554 reset. The
RSTOUT can also be asserted by software without causing an internal reset of the MPC5553/MPC5554
MCU. Refer to Section 4.2.2, “Reset Output (RSTOUT).”
NOTE
During an internal power-on reset (POR), RSTOUT is tri-stated.
PLLCFG[0]_IRQ[4]_GPIO[208] are sampled on the negation of the RESET input pin, if the RSTCFG pin
is asserted at that time. The values are used to configure the FMPLL mode of operation. The alternate
function is external interrupt request input.
[4]_GPIO[208]
2.3.1.4PLL Configuration 1 / External Interrupt Request / DSPI D Data Out / GPIO
PLLCFG[1]_IRQ
PLLCFG[1]_IRQ[5]_SOUTD_GPIO[209] are sampled on the negation of the RESET input pin, if the
RSTCFG pin is asserted at that time. The values are used to configure the FMPLL mode of operation. The
alternate functions are external interrupt request input, and data output for the DSPI module D.
[5]_SOUTD_GPIO[209]
2.3.1.5Reset Configuration Input / GPIO
RSTCFG
The RSTCFG input is used to enable the BOOTCFG[0:1] and PLLCFG[0:1] pins during reset. If RSTCFG
is negated during reset, the BOOTCFG and PLLCFG pins are not sampled at the negation of RSTOUT . In
that case, the default values for BOOTCFG and PLLCFG are used. If RSTCFG is asserted during reset,
the values on the BOOTCFG and PLLCFG pins are sampled and configure the boot and FMPLL modes.
BOOTCFG[0:1]_IRQ[2:3]_GPIO[211:212] are sampled on the negation of the RSTOUT pin, if the
RSTCFG pin is asserted at that time. The values are used by the BAM program to determine the boot
configuration of the MPC5553/MPC5554. The alternate function is external interrupt request input.
BOOTCFG[0] does not function in the 208 package of the MPC5553.
CS[0:3]_ADDR[8:11]_GPIO[0:3] are the external bus interface (EBI) chip select output signals. These
balls can be individually configured as chip selects or GPIO. Because ADDR[8:11] is multiplexed to mo re
than one set of balls, only assign ADDR[8:11] to one set of balls for external address input. Read the
following functions that include ADDR[8:11] in this section.
NOTE
CS[1:3]_ADDR[9:11]_GPIO[1:3] are not pinned out in the 208 PBGA of
the MPC5553.
ADDR[8:11]_CAL_ADDR[27:30]_GPIO[4:7] are the EBI address and calibration signals. Because
ADDR[8:11] is multiplexed to more than one set of pins, ADDR[8:1 1] must be assigned to only one set of
pins for external address input. Refer to the previous and following functions. The alternate function is
used for the calibration bus addressing and is only available on the MPC5553. The calibration function is
not available on the MPC5554. These pins can be used as GPIO signals.
The MPC5553/MPC5554 can be configured for 16-bit or 32-bit data bus operation.
2.3.3.0.1External Data / GPIO
DATA[0:15]_GPIO[28:43]
DAT A[0:15]_GPIO[28:43] are the EBI data signals. For 16-bit data bus operation, the data signals can be
divided into 0 through 7 for data, and 28 through 35 GPIO. These pins can be used as GPIO signals.
2.3.3.0.2External Data / Ethernet Transmit Clock / Calibration Data / GPIO
DATA[16]_FEC_TX_CLK_CAL_DATA[0]_GPIO[44]
DATA[16]_FEC_TX_CLK_CAL_DATA[0]_GPIO[44] has the external data bus as the primary signal
function. The FEC transmit clock signal is the first alternate function, and the calibration data function is
the second alternate function. The FEC and calibration signals are mapped to the same ball, therefore
either the FEC or calibration function can be used, but not both. The FEC and calibration functions are not
available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.3External Data / Ethernet Carrier Sense / Calibration Data / GPIO
DATA[17]_FEC_CRS_CAL_DATA[1]_GPIO[45]
DATA[17]_FEC_CRS_CAL_DATA[1]_GPIO[45] has the external data bus as the primary signal
function. The FEC carrier sense signal is the first alternate function, and the calibration data function is the
second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals are
mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.4External Data / Ethernet Transmit Error / Calibration Data / GPIO
DATA[18]_FEC_TX_ER_CAL_DATA[2]_GPIO[46]
DATA[18]_FEC_TX_ER_CAL_DATA[2]_GPIO[46] has the external data bus as the primary signal
function. The FEC transmit error signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.5External Data / Ethernet Receive Clock / Calibration Data / GPIO
DATA[19]_FEC_RX_CLK_CAL_DATA[3]_GPIO[47]
DATA[19]_FEC_RX_CLK_CAL_DATA[3]_GPIO[47] has the external data bus as the primary signal
function. The FEC receive clock signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.6External Data / Ethernet Transmit Data / Calibration Data / GPIO
DATA[20]_FEC_TXD[0]_CAL_DATA[4]_GPIO[48]
DATA[20]_FEC_TXD[0]_CAL_DATA[4]_GPIO[48] has the external data bus as the primary signal
function. The FEC transmit data signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.7External Data / Ethernet Receive Error / Calibration Data / GPIO
DATA[21]_FEC_RX_ER_CAL_DATA[5]_GPIO[49]
DATA[21]_FEC_RX_ER_CAL_DATA[5]_GPIO[49] has the external data bus as the primary signal
function. The FEC receive error signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.8External Data / Ethernet Receive Data / Calibration Data / GPIO
DATA[22]_FEC_RXD[0]_CAL_DATA[6]_GPIO[50]
DATA[22]_FEC_RXD[0]_CAL_DATA[6]_GPIO[50] has the external data bus as the primary signal
function. The FEC receive data signal is the first alternate function, and the calibration data function is the
second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals are
mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.9External Data / Ethernet Transmit Data / Calibration Data / GPIO
DATA[23]_FEC_TXD[3]_CAL_DATA[7]_GPIO[51]
DATA[23]_FEC_TXD[3]_CAL_DATA[7]_GPIO[51] has the external data bus as the primary signal
function. The FEC transmit data signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.10External Data / Ethernet Collision Detect / Calibration Data / GPIO
DATA[24]_FEC_COL_CAL_DATA[8]_GPIO[52]
DATA[24]_FEC_COL_CAL_DATA[8]_GPIO[52] has the external data bus as the primary signal
function. The FEC collision detect signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.11External Data / Ethernet Receive Data Valid / Calibration Data / GPIO
DATA[25]_FEC_RX_DV_CAL_DATA[9]_GPIO[53]
DATA[25]_FEC_RX_DV_CAL_DATA[9]_GPIO[53] has the external data bus as the primary signal
function. The FEC receive data valid signal is the first alternate function, and the calibration data function
is the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration
signals are mapped to the same ball, therefore either the FEC or calibration function can be used, but not
both. The FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO
signal.
2.3.3.0.12External Data / Ethernet Transmit Enable / Calibration Data / GPIO
DATA[26]_FEC_TX_EN_CAL_DATA[10]_GPIO[54]
DATA[26]_FEC_TX_EN_CAL_DATA[10]_GPIO[54] has the external data bus as the primary signal
function. The FEC transmit enable signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.13External Data / Ethernet Transmit Data / Calibration Data / GPIO
DATA[27]_FEC_TXD[2]_CAL_DATA[11]_GPIO[55]
DATA[27]_FEC_TXD[2]_CAL_DATA[11]_GPIO[55] has the external data bus as the primary signal
function. The FEC transmit data signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.14External Data / Ethernet Transmit Data / Calibration Data / GPIO
DATA[28]_FEC_TXD[1]_CAL_DATA[12]_GPIO[56]
DATA[28]_FEC_TXD[1]_CAL_DATA[12]_GPIO[56] has the external data bus as the primary signal
function. The FEC transmit data signal is the first alternate function, and the calibration data function is
the second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals
are mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.15External Data / Ethernet Receive Data / Calibra tion Data / GPIO
DATA[29]_FEC_RXD[1]_CAL_DATA[13]_GPIO[57]
DATA[29]_FEC_RXD[1]_CAL_DATA[13]_GPIO[57] has the external data bus as the primary signal
function. The FEC receive data signal is the first alternate function, and the calibration data function is the
second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals are
mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.16External Data / Ethernet Receive Data / Calibra tion Data / GPIO
DATA[30]_FEC_RXD[2]_CAL_DATA[14]_GPIO[58]
DATA[30]_FEC_RXD[2]_CAL_DATA[14]_GPIO[58] has the external data bus as the primary signal
function. The FEC receive data signal is the first alternate function, and the calibration data function is the
second alternate function. The FEC and calibration signals are mapped to the same ball, therefore either
the FEC or calibration function can be used, but not both. The FEC and calibration functions are not
available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.0.17External Data / Ethernet Receive Data / Calibra tion Data / GPIO
DATA[31]_FEC_RXD[3]_CAL_DATA[15]_GPIO[59]
DATA[31]_FEC_RXD[3]_CAL_DATA[15]_GPIO[59] has the external data bus as the primary signal
function. The FEC receive data signal is the first alternate function, and the calibration data function is the
second alternate function. This pin can also be used as a GPIO signal. The FEC and calibration signals are
mapped to the same ball, therefore either the FEC or calibration function can be used, but not both. The
FEC and calibration functions are not available on the MPC5554. This pin can be used as a GPIO signal.
2.3.3.1External Transfer Size / GPIO MPC5554 Only
TSIZ[0:1]_GPIO[60:61]
TSIZ[0:1]_GPIO[60:61] indicates the size of an external bus transfer when in external master operation or
in slave mode. The TSIZ[0:1] signals are not driven by the EBI in single master operation. The TSIZ[0:1]
signal function is not available on the MPC5553. These pins can also be used as GPIO signals for the
MPC5554 only.
2.3.3.2External Read/Write / GPIO
RD_WR
RD_WR_GPIO[62] has a primary signal function of RD_WR for an external bus read or write operation.
The MPC5553 and MPC5554 use the RD_WR primary function for reads and writes to the external bus.
Because the MPC5553 calibration bus interface (CBI) shares the bus with the external bus interface (EBI),
the RD_WR primary function is also used for the calibration read/write function. The MPC5554 does not
have a calibration bus. This pin can be used as a GPIO signal on either the MPC5553 or MPC5554.
_GPIO[62]
2.3.3.3External Burst Data In Progress / GPIO
BDIP
_GPIO[63]
BDIP_GPIO[63] has a primary signal function of external burst data in progress. This signal indicates that
the EBI is currently transferring a burst of data. This pin can be used as a GPIO signal.
2.3.3.4Write/Byte Enable Signals
2.3.3.4.1External Write/Byte Enable / GPIO
WE/BE[0:1]_GPIO[64:65]
WE/BE[0:1]_GPIO[64:65] has the write-enable/byte-enable signal as the primary signal function. This
signal specifies which data pins contain valid data for an external bus transfer. These pins can be used as
GPIO signals.
/BE[2:3]_CAL_WE/BE[0:1]_GPIO[66:67] has the write-enable/byte-enable signal as the primary
WE
signal function. This signal specifies which data pins contain valid data for an external bus transfer. The
alternate signal function is the calibration write-enable/byte-enable signal to provide write/byte enables for
the calibration bus and is only available on the MPC5553. The calibration function is not available on the
MPC5554. These pins can be used as GPIO signals.
2.3.3.5External Bus Output Enable / GPIO
OE
_GPIO[68]
OE_GPIO[68] has a primary signal function of OE for the external bus output enable. It indicates the
calibration bus is enabled to accept read data. The MPC5553 or MPC5554 use the OE primary function to
enable the output on the external bus. Because the MPC5553 calibration bus interface (CBI) shares the bus
with the external bus interface (EBI), the OE primary function is also used for the calibration output enable
function. The MPC5554 does not have a calibration bus. This pin can be used as a GPIO signal on the
MPC5553 or MPC5554.
2.3.3.6External Transfer Start / GPIO
TS
_GPIO[69]
TS_GPIO[69] has a primary signal function of TS that indicates the start of an external bus transfer. The
MPC5553 and MPC5554 use the TS primary function for external bus transfers. Because the MPC5553
calibration bus interface (CBI) shares the bus with the external bus interface (EBI), the TS primary
function is also used for the calibration transmit start function. The MPC5554 does not use the calibration
bus. This pin can be used as a GPIO signal on either the MPC5553 or MPC5554.
2.3.3.7External Transfer Acknowledge / GPIO
TA
_GPIO[70]
TA_GPIO[70] has a primary signal function of external transfer acknowledge. This signal is asserted by
the EBI owner to acknowledge that the slave has completed the current transfer.
TEA_CAL_CS[0]_GPIO[71] has a primary signal function of external transfer error acknowledge. This
signal indicates that an error has occurred in the current external bus transfer . The alternate signal function
CAL_CS[0] is only available on the MPC5553 and provides a calibration chip select function. The
calibration function CAL_CS[0] is not available on the MPC5554. This pin can be used as a GPIO signal
on either the MPC5553 or MPC5554.
2.3.3.9External Bus Request / Calibration Address / Ethernet Manage Data
Clock / Calibration
BR
_CAL_ADDR[10]_FEC_MDC_CAL_CS[2]_GPIO[72]
BR_CAL_ADDR[10]_FEC_MDC_CAL_CS[2]_GPIO[72] has a primary signal function of an external
bus request that is only available on the MPC5554. The external bus request function BR
external bus master to request ownership of the EBI from the arbiter. The external bus request function is
not available on the MPC5553. The MPC5553 has a primary signal function of CAL_ADDR[10]. The
alternate signal function FEC_MDC provides a fast Ethernet data clock management to manage the output
signals. The second alternate signal function CAL_CS[2] provides a calibration chip select function. The
FEC function FEC_MDC and the calibration function CAL_CS[2] are not available on the MPC5554.
This pin can be used as a GPIO signal on either the MPC5553 or MPC5554.
Chip Select / GPIO
used by an
2.3.3.10External Bus Grant / Calibration Address / Ethernet Manage Data I/O /
Calibration
BG
_CAL_ADDR[11]_FEC_MDIO_CAL_CS[3]_GPIO[73]
BG_CAL_ADDR[11]_FEC_MDIO_CAL_CS[3]_GPIO[73] has a primary signal function of external bus
grant that is used by the external bus arbiter to give ownership of the EBI to the requesting master. The
external bus grant function is not available on the MPC5553.
The MPC5553 has a primary signal function of CAL_ADDR[11]. The alternate signal function
FEC_MDIO provides a fast Ethernet data management I/O to manage the data output. The second alternate
signal function CAL_CS[3] provides a calibration chip select function. The FEC function FEC_MDIO and
the calibration function CAL_CS[3] are not available on the MPC5554. This pin can also be used as a
GPIO signal.
2.3.3.11External Bus Busy / GPIO - MPC5554 Only
BB
_GPIO[74]
BB_GPIO[74] has a primary function of BB that indicates the external bus interface (EBI) is busy. The
BB_GPIO[74] signal function is not available on the MPC5553. This pin can be used as a GPIO signal for
the MPC5554 only.
2.3.4Nexus Signals
2.3.4.1Nexus Event In
EVTI
EVTI is an input that is read during a debug port reset to enable or disable the Nexus Auxiliary port (for
trace). After reset, the EVTI pin is used to initiate program and data trace synchronization messages or
generate a breakpoint.
2.3.4.2Nexus Event Out
EVTO
EVTO is an output that provides timing to a development tool for a single watchpoint or breakpoint
occurrence.
2.3.4.3Nexus Message Clock Out
MCKO
MCKO is a free running clock output to the development tools which is used for timing of the MDO and
MSEO signals.
2.3.4.4Nexus Message Data Out
MDO[3:0]
MDO[3:0] are the trace message outputs to the development tools.
In addition to being a trace output, MDO[0] indicates the lock status of the system clock following a
power-on reset. MDO[0] is driven high following a power-on reset until the system clock achieves lock,
at which time it is then negated. There is an internal pullup on MDO[0].
2.3.4.5Nexus Message Data Out / GPIO
MDO[11:4]_GPIO[82:75]
MDO[11:4]_GPIO[82:75] are the trace message outputs to the development tools for full port mode. These
pins function as GPIO when the Nexus port controller (NPC) operates in reduced port mode.
CNTXA_GPIO[83] has a primary signal function of FlexCAN A transmit for the FlexCAN A module.
This pin can also be used as a GPIO signal.
2.3.6.2FlexCAN A Receive / GPIO
CNRXA_GPIO[84]
CNRXA_GPIO[84] has a primary signal function of FlexCAN A receive for the FlexCAN A module. This
pin can also be used as a GPIO signal.
2.3.6.3FlexCAN B Transmit / DSPI C Chip Select / GPIO
CNTXB_PCSC[3]_GPIO[85]
CNTXB_PCSC[3]_GPIO[85] has a primary signal function for the FlexCAN B transmit and is only
available on the MPC5554. Because the MPC5553 has FlexCAN A and C only, the FlexCAN B signal
function CNTXB is not available on the MPC5553. The alternate signal function is a peripheral chip select
output for the DSPI C module. This pin can also be used as a GPIO signal.
2.3.6.4FlexCAN B Receive / DSPI C Chip Select / GPIO
CNRXB_PCSC[4]_GPIO[86]
CNRXB_PCSC[4]_GPIO[86] has a primary signal function of FlexCAN B receive for the FlexCAN B
module and is only available on the MPC5554. Because the MPC5553 has FlexCAN A and C only, the
FlexCAN B signal function CNRXB is not available on the MPC5553. The alternate signal function is a
peripheral chip select output for the DSPI C module. This pin can also be used as a GPIO signal.
2.3.6.5FlexCAN C Transmit / DSPI D Chip Select / GPIO
CNTXC_PCSD[3]_GPIO[87]
CNTXC_PCSD[3]_GPIO[87] has a primary signal function of FlexCAN C transmit for the FlexCAN C
module. The alternate function is a peripheral chip select for the DSPI D module. This pin can also be used
as a GPIO signal.
2.3.6.6FlexCAN C Receive / DSPI D Chip Select / GPIO
CNRXC_PCSD[4]_GPIO[88]
CNRXC_PCSD[4]_GPIO[88] has a primary signal function of FlexCAN C receive for the FlexCAN C
module. The alternate function is a peripheral chip select for the DSPI D module. This pin can also be used
as a GPIO signal.
TXDA_GPIO[89] has a primary signal function of eSCI A transmit for the eSCI A module. This pin can
also be used as a GPIO signal.
2.3.7.2eSCI A Receive / GPIO
RXDA_GPIO[90]
RXDA_GPIO[90] has a primary signal function of eSCI A receive for the eSCI A module. The pin
functions as input only for the RXD function, but as the GPIO function the pin is input or output based on
the SIU_PCR register configuration.
2.3.7.3eSCI B Transmit / DSPI D Chip Select / GPIO
TXDB_PCSD[1]_GPIO[91]
TXDB_PCSD[1]_GPIO[91] has a primary signal function of eSCI A transmit for the eSCI B module. The
alternate function is a peripheral chip select output for the DSPI D module. This pin can also be used as a
GPIO signal.
2.3.7.4eSCI B Receive / DSPI D Chip Select / GPIO
RXDB_PCSD[5]_GPIO[92]
RXDB_PCSD[5]_GPIO[92] has a primary signal function of eSCI B receive for the eSCI B module. The
secondary function is a peripheral chip select for the DSPI D module. This pin can also be used as a GPIO
signal.
2.3.8DSPI Signals
Only the MPC5554 has the DSPI A module. Therefore, all muxed DSPI A signal functions are not
available on the MPC5553 device.
2.3.8.1DSPI A Clock / DSPI C Chip Select 1 / GPIO
SCKA_PCSC[1]_GPIO[93]
SCKA_PCSC[1]_GPIO[93] has a primary signal function of the DSPI clock SCKA for the DSPI A
module and is only available on the MPC5554. Because the MPC5553 does not have a DSPI A module,
the primary signal function SCKA is not available on the MPC5553. The peripheral chip select PCSC[1]
for the DSPI C module is the alternate signal function. This pin can also be used as a GPIO signal.
2.3.8.2DSPI A Data Input / DSPI C Chip Select 2 / GPIO
SINA_PCSC[2]_GPIO[94]
SINA_PCSC[2]_GPIO[94] has a primary signal function of SPI data input SINA for the DSPI A module
and is only available on the MPC5554. Because the MPC5553 does not have a DSPI A module, the
primary signal function SINA is not available on the MPC5553. The peripheral chip select PCSC[2] for
the DSPI C module is the alternate signal function. This pin can also be used as a GPIO signal.
2.3.8.3DSPI A Data Output / DSPI C Chip Select / GPIO
SOUTA_PCSC[5]_GPIO[95]
SOUT A_PCSC[5]_GPIO[95] has a prim ary signal function of source data output SOUTA for the DSPI A
module and is only available on the MPC5554. Because the MPC5553 does not have a DSPI A module,
the primary signal function SOUTA is not available on the MPC5553. The peripheral chip select output
for the DSPI C module PCSC[5] is the alternate signal function. This pin can also be used as a GPIO signal.
2.3.8.4DSPI A Chip Select / DSPI D Chip Select / GPIO
PCSA[0]_PCSD[2]_GPIO[96]
PCSA[0]_PCSD[2]_GPIO[96] has a primary signal function of peripheral chip select output for the DSPI
A module for the MPC5554, PCSA[0] also serves as the slave select input (SS) of the DSPI A module.
Because the MPC5553 does not have a DSPI A module, the primary signal function PCSA[0] is not
available on the MPC5553. The peripheral chip select output for the DSPI D module PCSD[2] is the
alternate signal function. This pin can also be used as a GPIO signal.
2.3.8.5DSPI A Chip Select / DSPI B Chip Select / GPIO
PCSA[1]_PCSB[2]_GPIO[97]
PCSA[1]_PCSB[2]_GPIO[97] has a primary signal function of PCSA[1] that is a peripheral select output
for the DSPI A module for the MPC5554. Because the MPC5553 does not have a DSPI A module, the
primary signal function PCSA[1] is not available on the MPC5553. The peripheral chip select output for
the DSPI B module PCSB[2] is the alternate signal function. This pin can also be used as a GPIO signal.
2.3.8.6DSPI A Chip Select / DSPI D Clock / GPIO
PCSA[2]_SCKD_GPIO[98]
PCSA[2]_SCKD_GPIO[98] has a primary signal function of PCSA[2] that is a peripheral select output for
the DSPI A module for the MPC5554. Because the MPC5553 does not have a DSPI A module, the primary
signal function PCSA[2] is not available on the MPC5553. SCKD is the alternate signal function and is
the SPI clock for the DSPI D module. This pin can also be used as a GPIO signal.
2.3.8.7DSPI A Chip Select / DSPI D Data Input / GPIO
PCSA[3]_SIND_GPIO[99]
PCSA[3]_SIND_GPIO[99] has a primary function of PCSA[3] that is a peripheral select output pin for the
DSPI A module for the MPC5554. Because the MPC5553 does not have a DSPI A module, the primary
signal function PCSA[3] is not available on the MPC5553. The SPI input for the DSPI D module SIND is
the alternate function and is the SPI input. This pin can also be used as a GPIO signal.
2.3.8.8DSPI A Chip Select / DSPI D Data Output / GPIO
PCSA[4]_SOUTD_GPIO[100]
PCSA[4]_SOUTD_GPIO[100] has a primary function of a peripheral chip select output pin for the DSPI
A module and is only available on the MPC5554. Because the MPC5553 does not have a DSPI A module,
the primary signal function PCSA[4] is not available on the MPC5553. The SPI output for the DSPI D
module is the alternate function.
2.3.8.9DSPI A Chip Select / DSPI B Chip Select / GPIO
PCSA[5]_PCSB[3]_GPIO[101]
PCSA[5]_PCSB[3]_GPIO[101] is a peripheral chip select output pin for the DSPI A module and is only
available on the MPC5554. Because the MPC5553 does not have a DSPI A module, the primary signal
function PCSA[5] is not available on the MPC5553. The SPI output for the DSPI B module is the alternate
function. This pin can also be used as a GPIO signal.
2.3.8.10DSPI B Clock / DSPI C Chip Select / GPIO
SCKB_PCSC[1]_GPIO[102]
SCKB_PCSC[1]_GPIO[102] is the SPI clock pin for the DSPI B module. The alternate function is a chip
select output for the DSPI C module. This pin can also be used as a GPIO signal.
2.3.8.11DSPI B Data Input / DSPI C Chip Select / GPIO
SINB_PCSC[2]_GPIO[103]
SINB_PCSC[2]_GPIO[103] is the data input pin for the DSPI B module. The alternate function is a chip
select output for the DSPI C module. This pin can also be used as a GPIO signal.
2.3.8.12DSPI B Data Output / DSPI C Chip Select / GPIO
SOUTB_PCSC[5]_GPIO[104]
SOUTB_PCSC[5]_GPIO[104] is the data output pin for the DSPI B module. The alternate function is a
chip select output for the DSPI C module. This pin can also be used as a GPIO signal.
2.3.8.13DSPI B Chip Select / DSPI D Chip Select / GPIO
PCSB[0]_PCSD[2]_GPIO[105]
PCSB[0]_PCSD[2]_GPIO[105] is a peripheral chip select output pin (slave select input pin for slave
operation) for the DSPI B module. The alternate function is a chip select output for the DSPI D module.
This pin can also be used as a GPIO signal.
2.3.8.14DSPI B Chip Select / DSPI D Chip Select / GPIO
PCSB[1]_PCSD[0]_GPIO[106]
PCSB[1]_PCSD[0]_GPIO[106] is a peripheral chip select output pin for the DSPI B module. The alternate
function is a chip select output (slave select input pin for slave operation) for the DSPI D module. This pin
can also be used as a GPIO signal.
2.3.8.15DSPI B Chip Select / DSPI C Data Output / GPIO
PCSB[2]_SOUTC_GPIO[107]
PCSB[2]_SOUTC_GPIO[107] is a peripheral chip select output pin for the DSPI B module. The alternate
function is the data output for the DSPI C module. This pin can also be used as a GPIO signal.
2.3.8.16DSPI B Chip Select / DSPI C Data Input / GPIO
PCSB[3]_SINC_GPIO[108]
PCSB[3]_SINC_GPIO[108] is a peripheral chip select output pin for the DSPI B module. The alternate
function is the data input for the DSPI C module. This pin can also be used as a GPIO signal.
2.3.8.17DSPI B Chip Select / DSPI C Clock / GPIO
PCSB[4]_SCKC_GPIO[109]
PCSB[4]_SCKC_GPIO[109] is a peripheral chip select output pin for the DSPI B module. The alternate
function is the SPI clock for the DSPI C module. This pin can also be used as a GPIO signal.
2.3.8.18DSPI B Chip Select / DSPI C Chip Select / GPIO
PCSB[5]_PCSC[0]_GPIO[110]
PCSB[5]_PCSC[0]_GPIO[110] is a peripheral chip select output pin for the DSPI B module. The alternate
function is a chip select output (slave select input in slave mode) for the DSPI C module. This pin can also
be used as a GPIO signal.
2.3.9eQADC Signals
2.3.9.1Analog Input / Differential Analog Input
AN[0]_DAN0+
AN[0] is a single-ended analog input to the two on-chip ADCs. DAN0+ is the positive terminal of the
differential analog input DAN0 (DAN0+ to DAN0–).
2.3.9.2Analog Input / Differential Analog Input
AN[1]_DAN0–
AN[1] is a single-ended analog input to the two on-chip ADCs. DAN0– is the negative terminal of the
differential analog input DAN0 (DAN0+ to DAN0–).
2.3.9.3Analog Input / Differential Analog Input
AN[2]_DAN1+
AN[2] is a single-ended analog input to the two on-chip ADCs. DAN1+ is the positive terminal of the
differential analog input DAN1 (DAN1+ to DAN1–).
2.3.9.4Analog Input / Differential Analog Input
AN[3]_DAN1–
AN[3] is a single-ended analog input to the two on-chip ADCs. DAN1– is the negative terminal of the
differential analog input DAN1 (DAN1+ to DAN1–).
2.3.9.5Analog Input / Differential Analog Input
AN[4]_DAN2+
AN[4] is a single-ended analog input to the two on-chip ADCs. DAN2+ is the positive terminal of the
differential analog input DAN2 (DAN2+ to DAN2–).
2.3.9.6Analog Input / Differential Analog Input
AN[5]_DAN2–
AN[5] is a single-ended analog input to the two on-chip ADCs. DAN2– is the negative terminal of the
differential analog input DAN2 (DAN2+ to DAN2–).
2.3.9.7Analog Input / Differential Analog Input
AN[6]_DAN3+
AN[6] is a single-ended analog input to the two on-chip ADCs. DAN3+ is the positive terminal of the
differential analog input DAN3 (DAN3+ to DAN3–).
2.3.9.8Analog Input / Differential Analog Input
AN[7]_DAN3–
AN[7] is a single-ended analog input to the two on-chip ADCs. DAN3– is the negative terminal of the
differential analog input DAN3 (DAN3+ to DAN3–).
2.3.9.9Analog Input / Multiplexed Analog Input
AN[8]_ANW
AN[8] is an analog input pin. ANW is an analog input in external multiplexed mode.
2.3.9.10Analog Input / Multiplexed Analog Input
AN[9]_ANX
AN[9] is an analog input pin. ANX is an analog input in external multiplexed mode.
2.3.9.11Analog Input / Multiplexed Analog Input
AN[10]_ANY
AN[10] is an analog input pin. ANY is an analog input in external multiplexed mode.
2.3.9.12Analog Input / Multiplexed Analog Input
AN[11]_ANZ
AN[11] is an analog input pin. ANZ is an analog input in external multiplexed mode.
2.3.9.13Analog Input / Mux Address 0 / eQADC Serial Data Strobe
AN[12]_MA[0]_SDS
AN[12]_MA[0]_SDS is an analog input pin. The alternate function, MA[0], is a MUX address pin. SDS
is the serial data strobe for the eQADC SSI; select this function by setting the PA field of SIU_PCR215 to
the GPIO setting 0b00. Although the SDS signal uses the GPIO setting, there is no GPIO functionality on
this pin. This pin has reduced analog to digital conversion accuracy as compared to the AN[0:7] and
AN[16:39] analog input pins.
SDS is the serial data select output that is muxed with AN[12] and MA[0]. It indicates to the external
(slave) device when it can latch incoming serial data, when it can output its own serial data, and when it
must terminate a data transmission. SDS corresponds to the chip select signal in a conventional SPI
interface.
2.3.9.14Analog Input / Mux Address 1 / eQADC Serial Data Out
AN[13]_MA[1]_SDO
AN[13]_MA[1]_SDO is an analog input pin. The alternate function, MA[1], is a MUX address pin. SDO
is the serial data output for the eQADC SSI; select this function by setting the PA field of SIU_PCR216 to
the GPIO setting 0b00. Although the SDO signal uses the GPIO setting, there is no GPIO functionality on
this pin. This pin has reduced analog to digital conversion accuracy as compared to the AN[0:7] and
AN[16:39] analog input pins.
2.3.9.15Analog Input / Mux Address 2 / eQADC Serial Data In
AN[14]_MA[2]_SDI
AN[14]_MA[2]_SDI is an analog input pin. The alternate function, MA[2], is a MUX address pin. SDI is
the serial data input for the eQADC SSI; select this function by setting the P A field of SIU_PCR217 to the
GPIO setting 0b00. Although the SDI signal uses the GPIO setting, there is no GPIO functionality on this
pin. This pin has reduced analog to digital conversion accuracy as compared to the AN[0:7] and AN[16:39]
analog input pins.
AN[15]_FCK is an analog input pin. The alternate function is the free running clock for the eQADC SSI.
This pin has reduced analog to digital conversion accuracy as compared to the AN[0:7] and AN[16:39]
analog input pins.
This pin is configured by setting the pad configuration register SIU_PCR218.
VRL is the voltage reference low input pin for the eQADC.
2.3.9.21Reference Bypass Capacitor
REFBYPC
REFBYPC is a bypass capacitor input for the eQADC. The REFBYPC pin is used to connect an external
bias capacitor between the REFBYPC pin and VRL. The value of this capacitor should be 100 nF.
2.3.10eTPU Signals
The MPC5553 and MPC5554 support eTPU A signals. Only the MPC5554 supports eTPU B signals.
TCRCLKA_IRQ[7]_GPIO[113] is the TCR A clock input for the eTPU module. The alternate function is
an external interrupt request input for the SIU module. This pin can also be used as a GPIO signal.
2.3.10.2eTPU A Channel / eTPU A Channel (Output Only) / GPIO
ETPUA[0:11]_ETPUA[12:23]_GPIO[114:125]
[7]_GPIO[113]
ETPUA[0:11]_ETPUA[12:23]_GPIO[114:125] are input/output channel pins for the eTPU A module.
The primary functions are for the ETPU A module [0:11] and the alternate functions are for ETPU A
module [12:23]. The eTPU A alternate function is for output channels only; when configured as
ETPUA[12:23], the pins function as output only. These pins can be used as GPIO signals.
2.3.10.3eTPU A Channel / DSPI B Chip Select / GPIO
ETPUA[12]_PCSB[1]_GPIO[126]
ETPUA[12]_PCSB[1]_GPIO[126] is an input/output channel pin for the eTPU A module muxed with the
DSPI B signal. The primary function is ETPUA[12] for the ETPU A module, and the alternate function is
PCSB[1] used for as a peripheral select for the DSPI B module. This pin can be used as a GPIO signal.
2.3.10.4eTPU A Channel / DSPI B Chip Select / GPIO
ETPUA[13:15]_PCSB[3:5]_GPIO[127:129]
ETPUA[13:15]_PCSB[3:5]_GPIO[126:129] are input/output channel pins for the eTPU A module muxed
with DSPI B and D pins. The primary functions are for the ETPU A module and the alternate functions
are for DSPI B. These pins can also be used as GPIO signals.
2.3.10.5eTPU A Channel / DSPI D Chip Select / GPIO
ETPUA[16:19]_PCSD[1:4]_GPIO[130:133]
ETPUA[16:19]_PCSD[1:4]_GPIO[130:133] are input/output channel pins for the eTPU A module muxed
with DSPI B and D pins. The primary function is ETPUA[16:19] for the ETPU A module, and the alternate
function is PCSD[1:4] used as a peripheral select for the DSPI D module. These pins can be used as GPIO
signals.
2.3.10.6eTPU A Channel / External Interrupt Request / GPIO
ETPUA[20:27]_IRQ[8:15]_GPIO[134:141]
ETPUA[20:27]_IRQ[8:15]_GPIO[134:141] are input/output channel pins for the eTPU A module muxed
with interrupt request pins. The primary functions are for the ETPU A module and the alternate functions
are external interrupt requests (IRQs). These pins can be used as GPIO signals.
2.3.10.7eTPU A Channel / DSPI C Chip Select / GPIO
ETPUA[28:31]_PCSC[1:4]_GPIO[142:145]
ETPUA[28:31]_PCSC[1:4]_GPIO[142:145] has a primary signal functions of input/output channels for
the eTPU A module. The alternate functions are PCSC[1:4] for the DSPI C module. These pins can be used
as GPIO signals.
TCRCLKB_IRQ[6]_GPIO[146] is the TCR B clock input for the eTPU module. The alternate function is
an external interrupt request input for the SIU module. This pin can be used by the MPC5554 as a GPIO
signal. The TCRCLKB primary signal function is used by the eTPU B module that is not available on the
MPC5553.
[6]_GPIO[146]
2.3.10.9MPC5554: eTPU B Channel / eTPU B Channel (Output Only) / GPIO
ETPUB[0:15]_ETPUB[16:31]_GPIO[147:162]
ETPUB[0:15]_ETPUB[16:31]_GPIO[147:162] are 16 input/output channel pins for the eTPU B module.
The alternate functions are the output channels for the eTPU B module; meaning that the pins function as
outputs only when ETPUB[16:31] is configured. These pins can be used by the MPC5554 as GPIO signals.
ETPUB signal functions are not available on the MPC5553.
2.3.10.10 MPC5554: eTPU B Channel / DSPI A Chip Select / GPIO
ETPUB[16:19]_PCSA[1:4]_GPIO[163:166]
ETPUB[16:19]_PCSA[1:4]_GPIO[163:166] are input/output channel pins for the eTPU B module and
DSPI A functionality is the alternate. These pins can be used by the MPC5554 as GPIO signals. ETPUB
signal functions are not available on the MPC5553.
2.3.10.11 MPC5554: eTPU B Channel / GPIO
ETPUB[20:31]_GPIO[167:178]
ETPUB[20:31]_GPIO[167:178] are input/output channel pins for the eTPU B module. These pins can be
used by the MPC5554 as GPIO signals. ETPUB signal functions are not available on the MPC5553.