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Revision History
Date
June 3,
2005
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
This product incorporates SuperFlash® technology licensed from SST.
The MC68HC908QB8 is a member of the low-cost, high-performance M68HC08 Family of 8-bit
microcontroller units (MCUs). All MCUs in the family use the enhanced M68HC08 central processor unit
(CPU08) and are available with a variety of modules, memory sizes and types, and package types.
•Fully upward-compatible object code with M68HC05 Family
•5-V and 3-V operating voltages (V
•8-MHz internal bus operation at 5 V, 4-MHz at 3 V
•Trimmable internal oscillator
–Software selectable 1 MHz, 2 MHz, or 3.2 MHz internal bus operation
–8-bit trim capability
–± 25% untrimmed
–Trimmable to approximately 0.4%
•Up to 13 bidirectional input/output (I/O) lines and one input only:
–Six shared with KBI
–Ten shared with ADC
–Four shared with TIM
–Two shared with ESCI
–Four shared with SPI
–One input only shared with IRQ
–High current sink/source capability on all port pins
–Selectable pullups on all ports, selectable on an individual bit basis
–Three-state ability on all port pins
•6-bit keyboard interrupt with wakeup feature (KBI)
–Programmable for rising/falling or high/low level detect
•Low-voltage inhibit (LVI) module features:
–Software selectable trip point
•System protection features:
–Computer operating properly (COP) watchdog
–Low-voltage detection with reset
–Illegal opcode detection with reset
–Illegal address detection with reset
•External asynchronous interrupt pin with internal pullup (IRQ
) shared with general-purpose input
pin
•Master asynchronous reset pin with internal pullup (RST
) shared with general-purpose input/output
(I/O) pin
•Memory mapped I/O registers
•Power saving stop and wait modes
•MC68HC908QB8, MC68HC908QB4 and MC68HC908QY8 are available in these packages:
–16-pin plastic dual in-line package (PDIP)
–16-pin small outline integrated circuit (SOIC) package
–16-pin thin shrink small outline packages (TSSOP)
Features of the CPU08 include the following:
•Enhanced HC05 programming model
•Extensive loop control functions
•16 addressing modes (eight more than the HC05)
•16-bit index register and stack pointer
•Memory-to-memory data transfers
•Fast 8 × 8 multiply instruction
•Fast 16/8 divide instruction
•Binary-coded decimal (BCD) instructions
•Optimization for controller applications
•Efficient C language support
MC68HC908QB8 Data Sheet, Rev. 1
18Freescale Semiconductor
1.3 MCU Block Diagram
Figure 1-1 shows the structure of the MC68HC908QB8.
PTA0/TCH0/AD0/KBI0
PTA1/TCH1/AD1/KBI1
PTA2/IRQ
/KBI2/TCLK
PTA
PTA3/RST
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
PTB0/SPSCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
/KBI3
PTB3/SS
PTB4/RxD/AD8
PTB5/TxD/AD9
/AD7
PTB6/TCH2
PTB7/TCH3
DDRA
M68HC08 CPU
PTB
DDRB
MCU Block Diagram
CLOCK
GENERATOR
KEYBOARD INTERRUPT
MODULE
SINGLE INTERRUPT
MODULE
AUTO WAKEUP
MODULE
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
256 BYTES
USER RAM
V
DD
POWER SUPPLY
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
V
SS
Figure 1-1. Block Diagram
MC68HC908QB8
8192 BYTES
USER FLASH
COP
MODULE
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor19
General Description
1.4 Pin Assignments
The MC68HC908QB8, MC68HC908QB4, and MC68HC908QY8 are available in 16-pin packages.
Figure 1-2 shows the pin assignment for these packages.
Table 1-2 provides a description of the pin functions.
MC68HC908QB8 Data Sheet, Rev. 1
20Freescale Semiconductor
Table 1-2. Pin Functions
Pin Functions
Pin
Name
V
DD
V
SS
PTA0
PTA1
PTA2
PTA3
PTA4
PTA5
PTB0
PTB1
PTB2
PTB3
DescriptionInput/Output
Power supplyPower
Power supply groundPower
PTA0 — General purpose I/O portInput/Output
TCH0 — Timer Channel 0 I/OInput/Output
AD0 — A/D channel 0 inputInput
KBI0 — Keyboard interrupt input 0Input
PTA1 — General purpose I/O portInput/Output
TCH1 — Timer Channel 1 I/OInput/Output
AD1 — A/D channel 1 inputInput
KBI1 — Keyboard interrupt input 1Input
PTA2 — General purpose input-only portInput
— External interrupt with programmable pullup and Schmitt trigger inputInput
IRQ
KBI2 — Keyboard interrupt input 2Input
TCLK — Timer clock inputInput
PTA3 — General purpose I/O portInput/Output
— Reset input, active low with internal pullup and Schmitt triggerInput
RST
KBI3 — Keyboard interrupt input 3Input
PTA4 — General purpose I/O portInput/Output
OSC2 —XTAL oscillator output (XTAL option only)
RC or internal oscillator output (OSC2EN = 1 in PTAPUE register)
Output
Output
AD2 — A/D channel 2 inputInput
KBI4 — Keyboard interrupt input 4Input
PTA5 — General purpose I/O portInput/Output
OSC1 — XTAL, RC, or external oscillator inputInput
AD3 — A/D channel 3 inputInput
KBI5 — Keyboard interrupt input 5Input
PTB0 — General-purpose I/O portInput/Output
SPSCK — SPI serial clockInput/Output
AD4 — A/D channel 4 inputInput
PTB1 — General-purpose I/O portInput/Output
MOSI — SPI Master out Slave inInput/Output
AD5 — A/D channel 5 inputInput
PTB2 — General-purpose I/O portInput/Output
MISO — SPI Master in Slave outInput/Output
AD6 — A/D channel 6 inputInput
PTB3 — General-purpose I/O portInput/Output
— SPI slave selectInput
SS
AD7 — A/D channel 7 inputInput
— Continued on next page
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor21
General Description
Table 1-2. Pin Functions (Continued)
Pin
Name
DescriptionInput/Output
PTB4 — General-purpose I/O portInput/Output
PTB4
RxD — ESCI receive data I/OInput/Output
AD8 — A/D channel 8 inputInput
PTB5 — General-purpose I/O portInput/Output
PTB5
TxD — ESCI transmit data I/OOutput
AD9 — A/D channel 9 inputInput
PTB6 — General-purpose I/O portInput/Output
PTB6
TCH2 — Timer channel 2 I/OInput/Output
PTB7 — General-purpose I/O portInput/Output
PTB7
TCH3 — Timer channel 3 I/OInput/Output
1.6 Pin Function Priority
Table 1-3 is meant to resolve the priority if multiple functions are enabled on a single pin.
NOTE
Upon reset all pins come up as input ports regardless of the priority table.
Table 1-3. Function Priority in Shared Pins
Pin NameHighest-to-Lowest Priority Sequence
PTA0
PTA1
(1)
(1)
AD0 → TCH0 → KBI0 → PTA0
AD1 → TCH1 → KBI1 → PTA1
PTA2IRQ → TCLK → KBI2 → PTA2
PTA3RST
(1)
PTA4
(1)
PTA5
(1)
PTB0
(1)
PTB1
(1)
PTB2
(1)
PTB3
(1)
PTB4
(1)
PTB5
→ KBI3 → PTA3
OSC2 → AD2 → KBI4 → PTA4
OSC1 → AD3 → KBI5 → PTA5
AD4 → SPSCK → PTB0
AD5 → MOSI → PTB1
AD6 → MISO → PTB2
AD7 → SS → PTB3
AD8 → RxD → PTB4
AD9 → TxD → PTB5
PTB6TCH2 → PTB6
PTB7TCH3 → PTB7
1. When a pin is to be used as an ADC pin, the I/O port function should be left as
an input and all other shared modules should be disabled. The ADC does not
override additional modules using the pin.
MC68HC908QB8 Data Sheet, Rev. 1
22Freescale Semiconductor
Chapter 2
Memory
2.1 Introduction
The central processor unit (CPU08) can address 64 Kbytes of memory space. The memory map, shown
in Figure 2-1.
2.2 Unimplemented Memory Locations
Executing code from an unimplemented location will cause an illegal address reset. In Figure 2-1,
unimplemented locations are shaded.
2.3 Reserved Memory Locations
Accessing a reserved location can have unpredictable effects on MCU operation. In Figure 2-1, register
locations are marked with the word Reserved or with the letter R.
2.4 Direct Page Registers
Figure 2-2 shows the memory mapped registers of the MC68HC908QB8. Registers with addresses
between $0000 and $00FF are considered direct page registers and all instructions including those with
direct page addressing modes can access them. Registers between $0100 and $FFFF require non-direct
page addressing modes. See Chapter 7 Central Processor Unit (CPU) for more information on
addressing modes.
Figure 2-2. Control, Status, and Data Registers (Sheet 2 of 5)
MC68HC908QB8 Data Sheet, Rev. 1
26Freescale Semiconductor
Direct Page Registers
Addr.Register NameBit 7654321Bit 0
Read:Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
Write:
Reset:00000000
Read:
Write:
Reset:11111111
Read:
Write:
Reset:11111111
Read:CH0F
Write:0
Reset:00000000
Read:
Write:
Reset:Indeterminate after reset
Read:
Write:
Reset:Indeterminate after reset
Read:CH1F
Write:0
Reset:00000000
Read:
Write:
Reset:Indeterminate after reset
Read:
Write:
Reset:Indeterminate after reset
Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8
Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
CH0IEMS0BMS0AELS0BELS0ATOV0CH0MAX
Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8
Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
CH1IE
Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8
Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
0
MS1AELS1BELS1ATOV1CH1MAX
$0022
$0023
$0024
$0025
$0026
$0027
$0028
$0029
$002A
$002B
↓
$002F
TIM Counter Register Low
(TCNTL)
See page 185.
TIM Counter Modulo
Register High (TMODH)
See page 185.
TIM Counter Modulo
Register Low (TMODL)
See page 185.
TIM Channel 0 Status and
Control Register (TSC0)
See page 186.
TIM Channel 0
Register High (TCH0H)
See page 189.
TIM Channel 0
Register Low (TCH0L)
See page 189.
TIM Channel 1 Status and
Control Register (TSC1)
See page 186.
TIM Channel 1
Register High (TCH1H)
See page 189.
TIM Channel 1
Register Low (TCH1L)
See page 189.
Reserved
$0030
$0031
$0032
$0033
$0034
$0035
TIM Channel 2 Status and
Control Register (TSC2)
See page 186.
TIM Channel 2
Register High (TCH2H)
See page 189.
TIM Channel 2
Register Low (TCH2L)
See page 189.
TIM Channel 3 Status and
Control Register (TSC3)
See page 186.
TIM Channel 3
Register High (TCH3H)
See page 189.
TIM Channel 3
Register Low (TCH3L)
See page 189.
Read:CH2F
Write:0
Reset:00000000
Read:
Write:
Reset:Indeterminate after reset
Read:
Write:
Reset:Indeterminate after reset
Read:CH3F
Write:0
Reset:00000000
Read:
Write:
Reset:Indeterminate after reset
Read:
Write:
Reset:Indeterminate after reset
Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8
Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8
Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
CH2IE
CH3IE
= UnimplementedR= ReservedU = Unaffected
0
0
MS2AELS2BELS2ATOV2CH2MAX
MS3AELS3BELS3ATOV3CH3MAX
Figure 2-2. Control, Status, and Data Registers (Sheet 3 of 5)
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor27
Memory
Addr.Register NameBit 7654321Bit 0
Oscillator Status and
$0036
$0037Reserved
Control Register (OSCSC)
See page 100.
Read:
OSCOPT1 OSCOPT0ICFS1ICFS0ECFS1ECFS0ECGON
Write:
Reset:00000000
ECGST
$0038
$0039
↓
$003B
$003C
$003D
$003E
$003F
$FE00
$FE01
$FE02
$FE03
$FE04
$FE05
$FE06
Oscillator Trim Register
(OSCTRIM)
See page 101.
Reserved
ADC10 Status and Control
Register (ADSCR)
See page 46.
ADC10 Data Register High
(ADRH)
See page 48.
ADC10 Data Register Low
(ADRL)
See page 48.
ADC10 Clock Register
(ADCLK)
See page 49.
Break Status Register
(BSR)
See page 195.
SIM Reset Status Register
(SRSR)
See page 152.
Break Auxiliary
Register (BRKAR)
See page 195.
Break Flag Control
Register (BFCR)
See page 195.
Interrupt Status Register 1
(INT1)
See page 149.
Interrupt Status Register 2
(INT2)
See page 149.
Interrupt Status Register 3
(INT3)
See page 149.
Read:
Write:
Reset:10000000
Read:COCO
Write:
Reset:00011111
Read:000000AD9AD8
Write:RRRRRRRR
Reset:00000000
Read:AD7AD6AD5AD4AD3AD2AD1AD0
Write:RRRRRRRR
Reset:00000000
Read:
Write:
Reset:00000000
Read:
Write:0
Reset:0
Read:PORPINCOPILOPILADMODRSTLVI0
Write:
POR:10000000
Read:0000000
Write:
Reset:00000000
Read:
Write:
Reset:0
Read:IF6IF5IF4IF3IF2IF100
Write:RRRRRRRR
Reset:00000000
Read:IF14IF13IF12IF11IF10IF9IF8IF7
Write:RRRRRRRR
Reset:00000000
Read:IF22IF21IF20IF19IF18IF17IF16IF15
Write:RRRRRRRR
Reset:00000000
TRIM7TRIM6TRIM5TRIM4TRIM3TRIM2TRIM1TRIM0
AIENADCOADCH4ADCH3ADCH2ADCH1ADCH0
ADLPCADIV1ADIV0ADICLKMODE1MODE0ADLSMPACLKEN
RRRRRR
BCFERRRRRRR
= UnimplementedR= ReservedU = Unaffected
SBSW
R
BDCOP
Figure 2-2. Control, Status, and Data Registers (Sheet 4 of 5)
MC68HC908QB8 Data Sheet, Rev. 1
28Freescale Semiconductor
Direct Page Registers
Addr.Register NameBit 7654321Bit 0
$FE07Reserved
FLASH Control Register
$FE08
Break Address High
$FE09
$FE0A
$FE0B
$FE0C
$FE0D
↓
$FE0F
$FFBE
$FFBFReserved
Register (BRKH)
Break Address low
Break Status and Control
Register (BRKSCR)
LVI Status Register
FLASH Block Protect
Register (FLBPR)
(FLCR)
See page 31.
See page 194.
Register (BRKL)
See page 194.
See page 194.
(LVISR)
See page 91.
Reserved
See page 36.
Read:0000
Write:
Reset:00000000
Read:
Write:
Reset:00000000
Read:
Write:
Reset:00000000
Read:
Write:
Reset:00000000
Read:LVIOUT000000R
Write:
Reset:00000000
Read:
Write:
Reset:Unaffected by reset
Bit 15Bit 14Bit 13Bit 12Bit 11Bit 10Bit 9Bit 8
Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
BRKEBRKA
BPR7BPR6BPR5BPR4BPR3BPR2BPR1BPR0
000000
HVENMASSERASEPGM
$FFC0
$FFC1Reserved
$FFFF
Internal Oscillator
Trim Value
COP Control Register
(COPCTL)
See page 63.
Figure 2-2. Control, Status, and Data Registers (Sheet 5 of 5)
Read:
Write:
Reset:Resets to factory programmed value
Read:LOW BYTE OF RESET VECTOR
Write:WRITING CLEARS COP COUNTER (ANY VALUE)
Reset:Unaffected by reset
TRIM7TRIM6TRIM5TRIM4TRIM3TRIM2TRIM1TRIM0
= UnimplementedR= ReservedU = Unaffected
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor29
Memory
Table 2-1. Vector Addresses
Vector PriorityVectorAddressVector
Lowest
IF22–
IF16
IF15$FFDE,FADC conversion complete vector
IF14$FFE0,1Keyboard vector
IF13$FFE2,3SPI transmit vector
IF12$FFE4,5SPI receive vector
IF11$FFE6,7ESCI transmit vector
IF10$FFE8,9ESCI receive vector
IF9$FFEA,BESCI error vector
IF8—Not used
IF7$FFEE,FTIM1 Channel 3 vector
IF6$FFF0,1TIM1 Channel 2 vector
IF5$FFF2,3TIM1 overflow vector
IF4$FFF4,5TIM1 Channel 1 vector
IF3$FFF6,7TIM1 Channel 0 vector
IF2—Not used
$FFD0–
$FFDC
Not used
vector
Highest
IF1$FFFA,BIRQ
—$FFFC,DSWI vector
—$FFFE,FReset vector
2.5 Random-Access Memory (RAM)
This MCU includes static RAM. The locations in RAM below $0100 can be accessed using the more
efficient direct addressing mode, and any single bit in this area can be accessed with the bit manipulation
instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed program
variables in this area of RAM is preferred.
The RAM retains data when the MCU is in low-power wait or stop mode. At power-on, the contents of
RAM are uninitialized. RAM data is unaffected by any reset provided that the supply voltage does not drop
below the minimum value for RAM retention.
For compatibility with older M68HC05 MCUs, the HC08 resets the stack pointer to $00FF. In the devices
that have RAM above $00FF, it is usually best to reinitialize the stack pointer to the top of the RAM so the
direct page RAM can be used for frequently accessed RAM variables and bit-addressable program
variables. Include the following 2-instruction sequence in your reset initialization routine (where RamLast
is equated to the highest address of the RAM).
LDHX #RamLast+1 ;point one past RAM
TXS ;SP<-(H:X-1)
MC68HC908QB8 Data Sheet, Rev. 1
30Freescale Semiconductor
FLASH Memory (FLASH)
2.6 FLASH Memory (FLASH)
The FLASH memory is intended primarily for program storage. In-circuit programming allows the
operating program to be loaded into the FLASH memory after final assembly of the application product.
It is possible to program the entire array through the single-wire monitor mode interface. Because no
special voltages are needed for FLASH erase and programming operations, in-application programming
is also possible through other software-controlled communication paths.
This subsection describes the operation of the embedded FLASH memory. The FLASH memory can be
read, programmed, and erased from the internal V
enabled through the use of an internal charge pump.
The minimum size of FLASH memory that can be erased is 64 bytes; and the maximum size of FLASH
memory that can be programmed in a program cycle is 32 bytes (a row). Program and erase operations
are facilitated through control bits in the FLASH control register (FLCR). Details for these operations
appear later in this section.
An erased bit reads as a 1 and a programmed bit reads as a 0. A security
feature prevents viewing of the FLASH contents.
2.6.1 FLASH Control Register
supply. The program and erase operations are
DD
NOTE
(1)
The FLASH control register (FLCR) controls FLASH program and erase operations.
Bit 7654321Bit 0
Read:0000
Write:
Reset:00000000
= Unimplemented
HVENMASSERASEPGM
Figure 2-3. FLASH Control Register (FLCR)
HVEN — High Voltage Enable Bit
This read/write bit enables high voltage from the charge pump to the memory for either program or
erase operation. It can only be set if either PGM =1 or ERASE = 1 and the proper sequence for
program or erase is followed.
1 = High voltage enabled to array and charge pump on
0 = High voltage disabled to array and charge pump off
MASS — Mass Erase Control Bit
This read/write bit configures the memory for mass erase operation.
1 = Mass erase operation selected
0 = Mass erase operation unselected
1. No security feature is absolutely secure. However, Freescale’s strategy is to make reading or copying the FLASH difficult
for unauthorized users.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor31
Memory
ERASE — Erase Control Bit
This read/write bit configures the memory for erase operation. ERASE is interlocked with the PGM bit
such that both bits cannot be equal to 1 or set to 1 at the same time.
This read/write bit configures the memory for program operation. PGM is interlocked with the ERASE
bit such that both bits cannot be equal to 1 or set to 1 at the same time.
1 = Program operation selected
0 = Program operation unselected
2.6.2 FLASH Page Erase Operation
Use the following procedure to erase a page of FLASH memory. A page consists of 64 consecutive bytes
starting from addresses $XX00, $XX40, $XX80, or $XXC0. The 48-byte user interrupt vectors area also
forms a page. Any FLASH memory page can be erased alone.
1.Set the ERASE bit and clear the MASS bit in the FLASH control register.
2.Read the FLASH block protect register.
3.Write any data to any FLASH location within the address range of the block to be erased.
4.Wait for a time, t
5.Set the HVEN bit.
6.Wait for a time, t
7.Clear the ERASE bit.
8.Wait for a time, t
9.Clear the HVEN bit.
10.After time, t
RCV,
The COP register at location $FFFF should not be written between steps
5-9, when the HVEN bit is set. Since this register is located at a valid
FLASH address, unpredictable behavior may occur if this location is written
while HVEN is set.
.
NVS
.
Erase
.
NVH
the memory can be accessed in read mode again.
NOTE
NOTE
Programming and erasing of FLASH locations cannot be performed by
code being executed from the FLASH memory. While these operations
must be performed in the order as shown, other unrelated operations may
occur between the steps.
CAUTION
A page erase of the vector page will erase the internal oscillator trim value
at $FFC0.
MC68HC908QB8 Data Sheet, Rev. 1
32Freescale Semiconductor
2.6.3 FLASH Mass Erase Operation
Use the following procedure to erase the entire FLASH memory to read as a 1:
1.Set both the ERASE bit and the MASS bit in the FLASH control register.
2.Read the FLASH block protect register.
3.Write any data to any FLASH address
4.Wait for a time, t
NVS
.
5.Set the HVEN bit.
6.Wait for a time, t
MErase
.
7.Clear the ERASE and MASS bits.
Mass erase is disabled whenever any block is protected (FLBPR does not
equal $FF).
(1)
within the FLASH memory address range.
NOTE
FLASH Memory (FLASH)
8.Wait for a time, t
NVHL
.
9.Clear the HVEN bit.
10.After time, t
the memory can be accessed in read mode again.
RCV,
NOTE
Programming and erasing of FLASH locations cannot be performed by
code being executed from the FLASH memory. While these operations
must be performed in the order as shown, other unrelated operations may
occur between the steps.
CAUTION
A mass erase will erase the internal oscillator trim value at $FFC0.
2.6.4 FLASH Program Operation
Programming of the FLASH memory is done on a row basis. A row consists of 32 consecutive bytes
starting from addresses $XX00, $XX20, $XX40, $XX60, $XX80, $XXA0, $XXC0, or $XXE0. Use the
following step-by-step procedure to program a row of FLASH memory
Figure 2-4 shows a flowchart of the programming algorithm.
NOTE
Do not program any byte in the FLASH more than once after a successful
erase operation. Reprogramming bits to a byte which is already
programmed is not allowed without first erasing the page in which the byte
resides or mass erasing the entire FLASH memory. Programming without
first erasing may disturb data stored in the FLASH.
1.Set the PGM bit. This configures the memory for program operation and enables the latching of
address and data for programming.
2.Read the FLASH block protect register.
3.Write any data to any FLASH location within the address range desired.
4.Wait for a time, t
NVS
.
5.Set the HVEN bit.
1. When in monitor mode, with security sequence failed (see 17.3.2 Security), write to the FLASH block protect register instead of any FLASH address.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor33
Memory
6.Wait for a time, t
7.Write data to the FLASH address being programmed
8.Wait for time, t
PGS
PROG
.
(1)
.
.
9.Repeat step 7 and 8 until all desired bytes within the row are programmed.
NVH
(1)
.
.
10.Clear the PGM bit
11.Wait for time, t
12.Clear the HVEN bit.
13.After time, t
, the memory can be accessed in read mode again.
RCV
NOTE
The COP register at location $FFFF should not be written between steps
5-12, when the HVEN bit is set. Since this register is located at a valid
FLASH address, unpredictable behavior may occur if this location is written
while HVEN is set.
This program sequence is repeated throughout the memory until all data is programmed.
NOTE
Programming and erasing of FLASH locations cannot be performed by
code being executed from the FLASH memory. While these operations
must be performed in the order shown, other unrelated operations may
occur between the steps. Do not exceed t
maximum, see18.17
PROG
Memory Characteristics.
2.6.5 FLASH Protection
Due to the ability of the on-board charge pump to erase and program the FLASH memory in the target
application, provision is made to protect blocks of memory from unintentional erase or program operations
due to system malfunction. This protection is done by use of a FLASH block protect register (FLBPR).
The FLBPR determines the range of the FLASH memory which is to be protected. The range of the
protected area starts from a location defined by FLBPR and ends to the bottom of the FLASH memory
($FFFF). When the memory is protected, the HVEN bit cannot be set in either ERASE or PROGRAM
operations.
NOTE
In performing a program or erase operation, the FLASH block protect
register must be read after setting the PGM or ERASE bit and before
asserting the HVEN bit.
When the FLBPR is programmed with all 0 s, the entire memory is protected from being programmed and
erased. When all the bits are erased (all 1’s), the entire memory is accessible for program and erase.
When bits within the FLBPR are programmed, they lock a block of memory. The address ranges are
shown in 2.6.6 FLASH Block Protect Register. Once the FLBPR is programmed with a value other than
$FF, any erase or program of the FLBPR or the protected block of FLASH memory is prohibited. Mass
erase is disabled whenever any block is protected (FLBPR does not equal $FF). The FLBPR itself can be
erased or programmed only with an external voltage, V
allows entry from reset into the monitor mode.
, present on the IRQ pin. This voltage also
TST
1. The time between each FLASH address change, or the time between the last FLASH address programmed to clearing
PGM bit, must not exceed the maximum programming time, t
MC68HC908QB8 Data Sheet, Rev. 1
34Freescale Semiconductor
PROG
maximum.
FLASH Memory (FLASH)
Algorithm for Programming
a Row (32 Bytes) of FLASH Memory
1
2
READ THE FLASH BLOCK PROTECT REGISTER
3
WRITE ANY DATA TO ANY FLASH ADDRESS
WITHIN THE ROW ADDRESS RANGE DESIRED
4
5
6
7
WRITE DATA TO THE FLASH ADDRESS
8
SET PGM BIT
WAIT FOR A TIME, t
SET HVEN BIT
WAIT FOR A TIME, t
TO BE PROGRAMMED
WAIT FOR A TIME, t
NVS
PGS
PROG
9
PROGRAMMING
NOTES:
The time between each FLASH address change (step 7 to step 7 loop),
or the time between the last FLASH address programmed
to clearing PGM bit (step 7 to step 10)
must not exceed the maximum programming
PROG
max.
time, t
This row program algorithm assumes the row/s
to be programmed are initially erased.
Figure 2-4. FLASH Programming Flowchart
COMPLETED
THIS ROW?
N
Y
10
11
12
13
CLEAR PGM BIT
WAIT FOR A TIME, t
CLEAR HVEN BIT
WAIT FOR A TIME, t
END OF PROGRAMMING
NVH
RCV
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor35
Memory
2.6.6 FLASH Block Protect Register
The FLASH block protect register is implemented as a byte within the FLASH memory, and therefore can
only be written during a programming sequence of the FLASH memory. The value in this register
determines the starting address of the protected range within the FLASH memory.
Bit 7654321Bit 0
Read:
Write:
Reset:Unaffected by reset. Initial value from factory is 1.
Write to this register is by a programming sequence to the FLASH memory.
BPR[7:0] — FLASH Protection Register Bits [7:0]
These eight bits in FLBPR represent bits [13:6] of a 16-bit memory address. Bits [15:14] are 1s and
bits [5:0] are 0s.
The resultant 16-bit address is used for specifying the start address of the FLASH memory for block
protection. The FLASH is protected from this start address to the end of FLASH memory, at $FFFF.
With this mechanism, the protect start address can be XX00, XX40, XX80, or XXC0 within the FLASH
memory. See Figure 2-6 and Table 2-2.
This section describes the 10-bit successive approximation analog-to-digital converter (ADC10).
The ADC10 module shares its pins with general-purpose input/output (I/O) port pins. See Figure 3-1 for
port location of these shared pins. The ADC10 on this MCU uses V
pins. This MCU uses BUSCLKX4 as its alternate clock source for the ADC. This MCU does not have a
hardware conversion trigger.
3.2 Features
Features of the ADC10 module include:
•Linear successive approximation algorithm with 10-bit resolution
•Output formatted in 10- or 8-bit right-justified format
•Single or continuous conversion (automatic power-down in single conversion mode)
•Configurable sample time and conversion speed (to save power)
•Conversion complete flag and interrupt
•Input clock selectable from up to three sources
•Operation in wait and stop modes for lower noise operation
The ADC10 uses successive approximation to convert the input sample taken from ADVIN to a digital
representation. The approximation is taken and then rounded to the nearest 10- or 8-bit value to provide
greater accuracy and to provide a more robust mechanism for achieving the ideal code-transition voltage.
Figure 3-2 shows a block diagram of the ADC10
For proper conversion, the voltage on ADVIN must fall between V
or exceeds V
a 8-bit representation. If ADVIN is equal to or less than V
Input voltages between V
Freescale Semiconductor37
, the converter circuit converts the signal to $3FF for a 10-bit representation or $FF for
REFH
the converter circuit converts it to $000.
REFL,
and V
REFH
Input voltage must not exceed the analog supply voltages.
are straight-line linear conversions.
REFL
NOTE
MC68HC908QB8 Data Sheet, Rev. 1
REFH
and V
. If ADVIN is equal to
REFL
Analog-to-Digital Converter (ADC10) Module
PTA0/TCH0/AD0/KBI0
PTA1/TCH1/AD1/KBI1
PTA2/IRQ
/KBI2/TCLK
PTA
PTA3/RST
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB4/RxD/AD8
/KBI3
PTB3/SS
/AD7
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
DDRA
PTB
DDRB
M68HC08 CPU
CLOCK
GENERATOR
KEYBOARD INTERRUPT
MODULE
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
256 BYTES
USER RAM
V
DD
POWER SUPPLY
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
V
SS
Figure 3-1. Block Diagram Highlighting ADC10 Block and Pins
MC68HC908QB8
8192 BYTES
USER FLASH
COP
MODULE
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
MC68HC908QB8 Data Sheet, Rev. 1
38Freescale Semiconductor
Functional Description
ADCLK
ADLPC
ADCK
ADIV
CLOCK
DIVIDE
AIEN
COCO
ADICLK
1
2
ACLKEN
ACLK
ASYNC
CLOCK
GENERATOR
BUS CLOCK
ALTERNATE CLOCK SOURCE
INTERRUPT
MCU STOP
ADHWT
AD0
ADn
V
REFH
V
REFL
ADCSC
AIEN
1 2
ADCH
• • •
ADVIN
ADCO
COCO
COMPLETE
CONTROL SEQUENCER
INITIALIZE
MODE
ADLSMP
SAMPLE
DATA REGISTERS ADRH:ADRL
ABORT
CONVERT
TRANSFER
SAR CONVERTER
Figure 3-2. ADC10 Block Diagram
The ADC10 can perform an analog-to-digital conversion on one of the software selectable channels. The
output of the input multiplexer (ADVIN) is converted by a successive approximation algorithm into a 10-bit
digital result. When the conversion is completed, the result is placed in the data registers (ADRH and
ADRL). In 8-bit mode, the result is rounded to 8 bits and placed in ADRL. The conversion complete flag
is then set and an interrupt is generated if the interrupt has been enabled.
3.3.1 Clock Select and Divide Circuit
The clock select and divide circuit selects one of three clock sources and divides it by a configurable value
to generate the input clock to the converter (ADCK). The clock can be selected from one of the following
sources:
•The asynchronous clock source (ACLK) — This clock source is generated from a dedicated clock
source which is enabled when the ADC10 is converting and the clock source is selected by setting
the ACLKEN bit. When the ADLPC bit is clear, this clock operates from 1–2 MHz; when ADLPC is
set it operates at 0.5–1 MHz. This clock is not disabled in STOP and allows conversions in stop
mode for lower noise operation.
•Alternate Clock Source — This clock source is equal to the external oscillator clock or a four times
the bus clock. The alternate clock source is MCU specific, see 3.1 Introduction to determine source
and availability of this clock source option. This clock is selected when ADICLK and ACLKEN are
both low.
•The bus clock — This clock source is equal to the bus frequency. This clock is selected when
ADICLK is high and ACLKEN is low.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor39
Analog-to-Digital Converter (ADC10) Module
Whichever clock is selected, its frequency must fall within the acceptable frequency range for ADCK. If
the available clocks are too slow, the ADC10 will not perform according to specifications. If the available
clocks are too fast, then the clock must be divided to the appropriate frequency. This divider is specified
by the ADIV[1:0] bits and can be divide-by 1, 2, 4, or 8.
3.3.2 Input Select and Pin Control
Only one analog input may be used for conversion at any given time. The channel select bits in ADCSC
are used to select the input signal for conversion.
3.3.3 Conversion Control
Conversions can be performed in either 10-bit mode or 8-bit mode as determined by the MODE bits.
Conversions can be initiated by either a software or hardware trigger. In addition, the ADC10 module can
be configured for low power operation, long sample time, and continuous conversion.
3.3.3.1 Initiating Conversions
A conversion is initiated:
•Following a write to ADCSC (with ADCH bits not all 1s) if software triggered operation is selected.
•Following a hardware trigger event if hardware triggered operation is selected.
•Following the transfer of the result to the data registers when continuous conversion is enabled.
If continuous conversions are enabled a new conversion is automatically initiated after the completion of
the current conversion. In software triggered operation, continuous conversions begin after ADCSC is
written and continue until aborted. In hardware triggered operation, continuous conversions begin after a
hardware trigger event and continue until aborted.
3.3.3.2 Completing Conversions
A conversion is completed when the result of the conversion is transferred into the data result registers,
ADRH and ADRL. This is indicated by the setting of the COCO bit. An interrupt is generated if AIEN is
high at the time that COCO is set.
A blocking mechanism prevents a new result from overwriting previous data in ADRH and ADRL if the
previous data is in the process of being read while in 10-bit mode (ADRH has been read but ADRL has
not). In this case the data transfer is blocked, COCO is not set, and the new result is lost. When a data
transfer is blocked, another conversion is initiated regardless of the state of ADCO (single or continuous
conversions enabled). If single conversions are enabled, this could result in several discarded
conversions and excess power consumption. To avoid this issue, the data registers must not be read after
initiating a single conversion until the conversion completes.
3.3.3.3 Aborting Conversions
Any conversion in progress will be aborted when:
•A write to ADCSC occurs (the current conversion will be aborted and a new conversion will be
initiated, if ADCH are not all 1s).
•A write to ADCLK occurs.
•The MCU is reset.
•The MCU enters stop mode with ACLK not enabled.
MC68HC908QB8 Data Sheet, Rev. 1
40Freescale Semiconductor
Functional Description
When a conversion is aborted, the contents of the data registers, ADRH and ADRL, are not altered but
continue to be the values transferred after the completion of the last successful conversion. In the case
that the conversion was aborted by a reset, ADRH and ADRL return to their reset states.
Upon reset or when a conversion is otherwise aborted, the ADC10 module will enter a low power, inactive
state. In this state, all internal clocks and references are disabled. This state is entered asynchronously
and immediately upon aborting of a conversion.
3.3.3.4 Total Conversion Time
The total conversion time depends on many factors such as sample time, bus frequency, whether
ACLKEN is set, and synchronization time. The total conversion time is summarized in Table 3-1.
Table 3-1. Total Conversion Time versus Control Conditions
Conversion ModeACLKENMaximum Conversion Time
8-Bit Mode (short sample — ADLSMP = 0):
Single or 1st continuous
Single or 1st continuous
Subsequent continuous (f
8-Bit Mode (long sample — ADLSMP = 1):
Single or 1st continuous
Single or 1st continuous
Subsequent continuous (f
10-Bit Mode (short sample — ADLSMP = 0):
Single or 1st continuous
Single or 1st continuous
Subsequent continuous (f
10-Bit Mode (long sample — ADLSMP = 1):
Single or 1st continuous
Single or 1st continuous
Subsequent continuous (f
Bus
Bus
Bus
Bus
≥ f
≥ f
≥ f
≥ f
ADCK
ADCK
ADCK
ADCK
)
)
)
)
0
1
X
0
1
X
0
1
X
0
1
X
18 ADCK + 3 bus clock
18 ADCK + 3 bus clock + 5 µs
16 ADCK
38 ADCK + 3 bus clock
38 ADCK + 3 bus clock + 5 µs
36 ADCK
21 ADCK + 3 bus clock
21 ADCK + 3 bus clock + 5 µs
19 ADCK
41 ADCK + 3 bus clock
41 ADCK + 3 bus clock + 5 µs
39 ADCK
The maximum total conversion time for a single conversion or the first conversion in continuous
conversion mode is determined by the clock source chosen and the divide ratio selected. The clock
source is selectable by the ADICLK and ACLKEN bits, and the divide ratio is specified by the ADIV bits.
For example, if the alternate clock source is 16 MHz and is selected as the input clock source, the input
clock divide-by-8 ratio is selected and the bus frequency is 4 MHz, then the conversion time for a single
10-bit conversion is:
Maximum Conversion time =
21 ADCK cycles
16 MHz/8
3 bus cycles
+
4 MHz
= 11.25 µs
Number of bus cycles = 11.25 µs x 4 MHz = 45 cycles
NOTE
The ADCK frequency must be between f
minimum and f
ADCK
ADCK
maximum to meet A/D specifications.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor41
Analog-to-Digital Converter (ADC10) Module
3.3.4 Sources of Error
Several sources of error exist for ADC conversions. These are discussed in the following sections.
3.3.4.1 Sampling Error
For proper conversions, the input must be sampled long enough to achieve the proper accuracy. Given
the maximum input resistance of approximately 15 kΩ and input capacitance of approximately 10 pF,
sampling to within 1/4
(3.5 cycles / 2 MHz maximum ADCK frequency) provided the resistance of the external analog source
(R
) is kept below 10 kΩ. Higher source resistances or higher-accuracy sampling is possible by setting
AS
ADLSMP (to increase the sample window to 23.5 cycles) or decreasing ADCK frequency to increase
sample time.
3.3.4.2 Pin Leakage Error
LSB (at 10-bit resolution) can be achieved within the minimum sample window
Leakage on the I/O pins can cause conversion error if the external analog source resistance (R
If this error cannot be tolerated by the application, keep R
LSB leakage error (at 10-bit resolution).
1/4
lower than V
AS
ADVIN
/ (4096*I
Leak
) is high.
AS
) for less than
3.3.4.3 Noise-Induced Errors
System noise which occurs during the sample or conversion process can affect the accuracy of the
conversion. The ADC10 accuracy numbers are guaranteed as specified only if the following conditions
are met:
•There is a 0.1µF low-ESR capacitor from V
•There is a 0.1µF low-ESR capacitor from V
REFH
DDA
to V
to V
(if available).
REFL
(if available).
SSA
•If inductive isolation is used from the primary supply, an additional 1µF capacitor is placed from
V
DDA
•V
SSA
to V
and V
(if available).
SSA
(if available) is connected to VSS at a quiet point in the ground plane.
REFL
•The MCU is placed in wait mode immediately after initiating the conversion (next instruction after
write to ADCSC).
•There is no I/O switching, input or output, on the MCU during the conversion.
There are some situations where external system activity causes radiated or conducted noise emissions
or excessive V
noise is coupled into the ADC10. In these cases, or when the MCU cannot be placed
DD
in wait or I/O activity cannot be halted, the following recommendations may reduce the effect of noise on
the accuracy:
•Place a 0.01 µF capacitor on the selected input channel to V
REFL
or V
(if available). This will
SSA
improve noise issues but will affect sample rate based on the external analog source resistance.
•Operate the ADC10 in stop mode by setting ACLKEN, selecting the channel in ADCSC, and
executing a STOP instruction. This will reduce V
noise but will increase effective conversion time
DD
due to stop recovery.
•Average the input by converting the output many times in succession and dividing the sum of the
results. Four samples are required to eliminate the effect of a 1
LSB, one-time error.
•Reduce the effect of synchronous noise by operating off the asynchronous clock (ACLKEN=1) and
averaging. Noise that is synchronous to the ADCK cannot be averaged out.
MC68HC908QB8 Data Sheet, Rev. 1
42Freescale Semiconductor
Functional Description
3.3.4.4 Code Width and Quantization Error
The ADC10 quantizes the ideal straight-line transfer function into 1024 steps (in 10-bit mode). Each step
ideally has the same height (1 code) and width. The width is defined as the delta between the transition
points from one code to the next. The ideal code width for an N bit converter (in this case N can be 8 or
10), defined as 1
LSB, is:
1
LSB = (V
REFH–VREFL
) / 2
N
Because of this quantization, there is an inherent quantization error. Because the converter performs a
conversion and then rounds to 8 or 10 bits, the code will transition when the voltage is at the midpoint
between the points where the straight line transfer function is exactly represented by the actual transfer
function. Therefore, the quantization error will be ± 1/2
however, the code width of the first ($000) conversion is only 1/2
or $3FF) is 1.5
LSB.
LSB in 8- or 10-bit mode. As a consequence,
LSB and the code width of the last ($FF
3.3.4.5 Linearity Errors
The ADC10 may also exhibit non-linearity of several forms. Every effort has been made to reduce these
errors but the user should be aware of them because they affect overall accuracy. These errors are:
•Zero-Scale Error (E
the actual code width of the first conversion and the ideal code width (1/2
conversion is $001, then the difference between the actual $001 code width and its ideal (1
) (sometimes called offset) — This error is defined as the difference between
ZS
LSB). Note, if the first
LSB) is
used.
•Full-Scale Error (E
the last conversion and the ideal code width (1.5
difference between the actual $3FE code width and its ideal (1
) — This error is defined as the difference between the actual code width of
FS
LSB). Note, if the last conversion is $3FE, then the
LSB) is used.
•Differential Non-Linearity (DNL) — This error is defined as the worst-case difference between the
actual code width and the ideal code width for all conversions.
•Integral Non-Linearity (INL) — This error is defined as the highest-value the (absolute value of the)
running sum of DNL achieves. More simply, this is the worst-case difference of the actual transition
voltage to a given code and its corresponding ideal transition voltage, for all codes.
•Total Unadjusted Error (TUE) — This error is defined as the difference between the actual transfer
function and the ideal straight-line transfer function, and therefore includes all forms of error.
3.3.4.6 Code Jitter, Non-Monotonicity and Missing Codes
Analog-to-digital converters are susceptible to three special forms of error. These are code jitter,
non-monotonicity, and missing codes.
•Code jitter is when, at certain points, a given input voltage converts to one of two values when
sampled repeatedly. Ideally, when the input voltage is infinitesimally smaller than the transition
voltage, the converter yields the lower code (and vice-versa). However, even very small amounts
of system noise can cause the converter to be indeterminate (between two codes) for a range of
input voltages around the transition voltage. This range is normally around ±1/2
LSB but will
increase with noise.
•Non-monotonicity is defined as when, except for code jitter, the converter converts to a lower code
for a higher input voltage.
•Missing codes are those which are never converted for any input value. In 8-bit or 10-bit mode, the
ADC10 is guaranteed to be monotonic and to have no missing codes.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor43
Analog-to-Digital Converter (ADC10) Module
3.4 Interrupts
When AIEN is set, the ADC10 is capable of generating a CPU interrupt after each conversion. A CPU
interrupt is generated when the conversion completes (indicated by COCO being set). COCO will set at
the end of a conversion regardless of the state of AIEN.
3.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
3.5.1 Wait Mode
The ADC10 will continue the conversion process and will generate an interrupt following a conversion if
AIEN is set. If the ADC10 is not required to bring the MCU out of wait mode, ensure that the ADC10 is not
in continuous conversion mode by clearing ADCO in the ADC10 status and control register before
executing the WAIT instruction. In single conversion mode the ADC10 automatically enters a low-power
state when the conversion is complete. It is not necessary to set the channel select bits (ADCH[4:0]) to
all 1s to enter a low power state.
3.5.2 Stop Mode
If ACLKEN is clear, executing a STOP instruction will abort the current conversion and place the ADC10
in a low-power state. Upon return from stop mode, a write to ADCSC is required to resume conversions,
and the result stored in ADRH and ADRL will represent the last completed conversion until the new
conversion completes.
If ACLKEN is set, the ADC10 continues normal operation during stop mode. The ADC10 will continue the
conversion process and will generate an interrupt following a conversion if AIEN is set. If the ADC10 is
not required to bring the MCU out of stop mode, ensure that the ADC10 is not in continuous conversion
mode by clearing ADCO in the ADC10 status and control register before executing the STOP instruction.
In single conversion mode the ADC10 automatically enters a low-power state when the conversion is
complete. It is not necessary to set the channel select bits (ADCH[4:0]) to all 1s to enter a low-power state.
If ACLKEN is set, a conversion can be initiated while in stop using the external hardware trigger
ADEXTCO when in external convert mode. The ADC10 will operate in a low-power mode until the trigger
is asserted, at which point it will perform a conversion and assert the interrupt when complete (if AIEN is
set).
3.6 ADC10 During Break Interrupts
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. BCFE in the break flag control register (BFCR) enables software to clear status bits during
the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
MC68HC908QB8 Data Sheet, Rev. 1
44Freescale Semiconductor
I/O Signals
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
3.7 I/O Signals
The ADC10 module shares its pins with general-purpose input/output (I/O) port pins. See Figure 3-1 for
port location of these shared pins. The ADC10 on this MCU uses V
pins. This MCU does not have an external trigger source.
and VSS as its supply and reference
DD
3.7.1 ADC10 Analog Power Pin (V
The ADC10 analog portion uses V
to V
. If externally available, connect the V
DD
may be necessary to ensure clean V
DDA
DDA
)
DDA
as its power pin. In some packages, V
pin to the same voltage potential as VDD. External filtering
DDA
for good results.
is connected internally
DDA
NOTE
If externally available, route V
carefully for maximum noise immunity
DDA
and place bypass capacitors as near as possible to the package.
3.7.2 ADC10 Analog Ground Pin (V
The ADC10 analog portion uses V
to V
. If externally available, connect the V
SS
as its ground pin. In some packages, V
SSA
)
SSA
pin to the same voltage potential as VSS.
SSA
is connected internally
SSA
In cases where separate power supplies are used for analog and digital power, the ground connection
between these supplies should be at the V
these supplies if possible. The V
pin makes a good single point ground location.
SSA
3.7.3 ADC10 Voltage Reference High Pin (V
V
V
potential as V
the V
is the power supply for setting the high-reference voltage for the converter. In some packages,
REFH
is connected internally to V
REFH
, or may be driven by an external source that is between the minimum V
DDA
potential (V
DDA
REFH
must never exceed V
. If externally available, V
DDA
pin. This should be the only ground connection between
SSA
)
REFH
may be connected to the same
REFH
spec and
DDA
).
DDA
NOTE
Route V
carefully for maximum noise immunity and place bypass
REFH
capacitors as near as possible to the package.
AC current in the form of current spikes required to supply charge to the capacitor array at each
successive approximation step is drawn through the V
REFH
and V
loop. The best external component
REFL
to meet this current demand is a 0.1 µF capacitor with good high frequency characteristics. This capacitor
is connected between V
REFH
and V
and must be placed as close as possible to the package pins.
REFL
Resistance in the path is not recommended because the current will cause a voltage drop which could
result in conversion errors. Inductance in this path must be minimum (parasitic only).
3.7.4 ADC10 Voltage Reference Low Pin (V
V
is the power supply for setting the low-reference voltage for the converter. In some packages,
REFL
is connected internally to V
V
REFL
potential as V
Freescale Semiconductor45
. There will be a brief current associated with V
SSA
. If externally available, connect the V
SSA
MC68HC908QB8 Data Sheet, Rev. 1
REFL
)
pin to the same voltage
REFL
when the sampling capacitor is
REFL
Analog-to-Digital Converter (ADC10) Module
charging. If externally available, connect the V
pin to the same potential as V
REFL
at the single point
SSA
ground location.
3.7.5 ADC10 Channel Pins (ADn)
The ADC10 has multiple input channels. Empirical data shows that capacitors on the analog inputs
improve performance in the presence of noise or when the source impedance is high. 0.01 µF capacitors
with good high-frequency characteristics are sufficient. These capacitors are not necessary in all cases,
but when used they must be placed as close as possible to the package pins and be referenced to V
SSA
3.8 Registers
These registers control and monitor operation of the ADC10:
•ADC10 status and control register, ADCSC
•ADC10 data registers, ADRH and ADRL
•ADC10 clock register, ADCLK
3.8.1 ADC10 Status and Control Register
This section describes the function of the ADC10 status and control register (ADCSC). Writing ADCSC
aborts the current conversion and initiates a new conversion (if the ADCH[4:0] bits are equal to a value
other than all 1s).
.
Bit 7654321Bit 0
Read:COCO
Write:
Reset:00011111
AIENADCOADCH4ADCH3ADCH2ADCH1ADCH0
= Unimplemented
Figure 3-3. ADC10 Status and Control Register (ADCSC)
COCO — Conversion Complete Bit
COCO is a read-only bit which is set each time a conversion is completed. This bit is cleared whenever
the status and control register is written or whenever the data register (low) is read.
1 = Conversion completed
0 = Conversion not completed
AIEN — ADC10 Interrupt Enable Bit
When this bit is set, an interrupt is generated at the end of a conversion. The interrupt signal is cleared
when the data register is read or the status/control register is written.
When this bit is set, the ADC10 will begin to convert samples continuously (continuous conversion
mode) and update the result registers at the end of each conversion, provided the ADCH[4:0] bits do
not decode to all 1s. The ADC10 will continue to convert until the MCU enters reset, the MCU enters
stop mode (if ACLKEN is clear), ADCLK is written, or until ADCSC is written again. If stop is entered
MC68HC908QB8 Data Sheet, Rev. 1
46Freescale Semiconductor
Registers
(with ACLKEN low), continuous conversions will cease and can be restarted only with a write to
ADCSC. Any write to ADCSC with ADCO set and the ADCH bits not all 1s will abort the current
conversion and begin continuous conversions.
If the bus frequency is less than the ADCK frequency, precise sample time for continuous conversions
cannot be guaranteed in short-sample mode (ADLSMP = 0). If the bus frequency is less than 1/11th
of the ADCK frequency, precise sample time for continuous conversions cannot be guaranteed in
long-sample mode (ADLSMP = 1).
When clear, the ADC10 will perform a single conversion (single conversion mode) each time ADCSC
is written (assuming the ADCH[4:0] bits do not decode all 1s).
1 = Continuous conversion following a write to ADCSC
0 = One conversion following a write to ADCSC
ADCH[4:0] — Channel Select Bits
The ADCH[4:0] bits form a 5-bit field that is used to select one of the input channels. The input
channels are detailed in Table 3-2. The successive approximation converter subsystem is turned off
when the channel select bits are all set to 1. This feature allows explicit disabling of the ADC10 and
isolation of the input channel from the I/O pad. Terminating continuous conversion mode this way will
prevent an additional, single conversion from being performed. It is not necessary to set the channel
select bits to all 1s to place the ADC10 in a low-power state, however, because the module is
automatically placed in a low-power state when a conversion completes.
Table 3-2. Input Channel Select
ADCH4ADCH3ADCH2ADCH1ADCH0
00000AD0
00001AD1
00010AD2
00011AD3
00100AD4
00101AD5
00110AD6
00111AD7
01000 Unused
Continuing throughUnused
10111 Unused
11000AD8
11001AD9
11010
11011 Reserved
11100 Reserved
11101
11110
11111Low-power state
Input Select
BANDGAP REF
V
V
(1)
(2)
REFH
REFL
1. If any unused or reserved channels are selected, the resulting conversion will
be unknown.
2. Requires LVI to be powered (LVIPWRD =0, in CONFIG1)
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor47
Analog-to-Digital Converter (ADC10) Module
3.8.2 ADC10 Result High Register (ADRH)
This register holds the MSBs of the result and is updated each time a conversion completes. All other bits
read as 0s. Reading ADRH prevents the ADC10 from transferring subsequent conversion results into the
result registers until ADRL is read. If ADRL is not read until the after next conversion is completed, then
the intermediate conversion result will be lost. In 8-bit mode, this register contains no interlocking with
ADRL.
Bit 7654321Bit 0
Read:00000000
Write:
Reset:00000000
= Unimplemented
Figure 3-4. ADC10 Data Register High (ADRH), 8-Bit Mode
Bit 7654321Bit 0
Read:000000AD9AD8
Write:
Reset:00000000
= Unimplemented
Figure 3-5. ADC10 Data Register High (ADRH), 10-Bit Mode
3.8.3 ADC10 Result Low Register (ADRL)
This register holds the LSBs of the result. This register is updated each time a conversion completes.
Reading ADRH prevents the ADC10 from transferring subsequent conversion results into the result
registers until ADRL is read. If ADRL is not read until the after next conversion is completed, then the
intermediate conversion result will be lost. In 8-bit mode, there is no interlocking with ADRH.
Bit 7654321Bit 0
Read:AD7AD6AD5AD4AD3AD2AD1AD0
Write:
Reset:00000000
= Unimplemented
Figure 3-6. ADC10 Data Register Low (ADRL)
MC68HC908QB8 Data Sheet, Rev. 1
48Freescale Semiconductor
Registers
3.8.4 ADC10 Clock Register (ADCLK)
This register selects the clock frequency for the ADC10 and the modes of operation.
Bit 7654321Bit 0
Read:
Write:
Reset:00000000
ADLPC — ADC10 Low-Power Configuration Bit
ADLPC controls the speed and power configuration of the successive approximation converter. This
is used to optimize power consumption when higher sample rates are not required.
1 = Low-power configuration: The power is reduced at the expense of maximum clock speed.
0 = High-speed configuration
ADIV[1:0] — ADC10 Clock Divider Bits
ADIV1 and ADIV0 select the divide ratio used by the ADC10 to generate the internal clock ADCK.
Table 3-3 shows the available clock configurations.
ADLPCADIV1ADIV0ADICLKMODE1MODE0ADLSMPACLKEN
Figure 3-7. ADC10 Clock Register (ADCLK)
Table 3-3. ADC10 Clock Divide Ratio
ADIV1ADIV0Divide Ratio (ADIV) Clock Rate
001Input clock ÷ 1
012Input clock ÷ 2
104Input clock ÷ 4
118Input clock ÷ 8
ADICLK — Input Clock Select Bit
If ACLKEN is clear, ADICLK selects either the bus clock or an alternate clock source as the input clock
source to generate the internal clock ADCK. If the alternate clock source is less than the minimum
clock speed, use the internally-generated bus clock as the clock source. As long as the internal clock
ADCK, which is equal to the selected input clock divided by ADIV, is at a frequency (f
ADCK
) between
the minimum and maximum clock speeds (considering ALPC), correct operation can be guaranteed.
1 = The internal bus clock is selected as the input clock source
0 = The alternate clock source IS SELECTED
MODE[1:0] — 10- or 8-Bit or Hardware Triggered Mode Selection
These bits select 10- or 8-bit operation. The successive approximation converter generates a result
that is rounded to 8- or 10-bit value based on the mode selection. This rounding process sets the
transfer function to transition at the midpoint between the ideal code voltages, causing a quantization
error of ± 1/2
This bit configures the sample time of the ADC10 to either 3.5 or 23.5 ADCK clock cycles. This adjusts
the sample period to allow higher impedance inputs to be accurately sampled or to maximize
conversion speed for lower impedance inputs. Longer sample times can also be used to lower overall
power consumption in continuous conversion mode if high conversion rates are not required.
1 = Long sample time (23.5 cycles)
0 = Short sample time (3.5 cycles)
ACLKEN — Asynchronous Clock Source Enable
This bit enables the asynchronous clock source as the input clock to generate the internal clock ADCK,
and allows operation in stop mode. The asynchronous clock source will operate between 1 MHz and
2 MHz if ADLPC is clear, and between 0.5 MHz and 1 MHz if ADLPC is set.
1 = The asynchronous clock is selected as the input clock source (the clock generator is only
enabled during the conversion)
0 = ADICLK specifies the input clock source and conversions will not continue in stop mode
MC68HC908QB8 Data Sheet, Rev. 1
50Freescale Semiconductor
Chapter 4
Auto Wakeup Module (AWU)
4.1 Introduction
This section describes the auto wakeup module (AWU). The AWU generates a periodic interrupt during
stop mode to wake the part up without requiring an external signal. Figure 4-1 is a block diagram of the
AWU.
COPRS (FROM CONFIG1)
OSCENINSTOP (FROM CONFIG2)
BUSCLKX4
EN32 kHz
INT RC OSC
CLRLOGIC
(CGMXCLK)
BUSCLKX4
RESET
CLK
RST
Figure 4-1. Auto Wakeup Interrupt Request Generation Logic
CLEAR
M
U
X
RESET
AUTOW UGEN
SHORT
CLK
AWUI E
1 = DIV 2
0 = DIV 2
OVERFLOW
RST
ISTOP
V
DD
9
14
RESET
ACKK
D
Q
E
R
TO PTA READ, BIT 6
AWUL
AWUIREQ
TO KBI INTERRUPT LOGIC
(SEE Figure 9-2)
4.2 Features
Features of the auto wakeup module include:
•One internal interrupt with separate interrupt enable bit, sharing the same keyboard interrupt vector
and keyboard interrupt mask bit
•Exit from low-power stop mode without external signals
•Selectable timeout periods
•Dedicated low-power internal oscillator separate from the main system clock sources
•Option to allow bus clock source to run the AWU if enabled in STOP
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor51
Auto Wakeup Module (AWU)
4.3 Functional Description
The function of the auto wakeup logic is to generate periodic wakeup requests to bring the microcontroller
unit (MCU) out of stop mode. The wakeup requests are treated as regular keyboard interrupt requests,
with the difference that instead of a pin, the interrupt signal is generated by an internal logic.
Writing the AWUIE bit in the keyboard interrupt enable register enables or disables the auto wakeup
interrupt input (see Figure 4-1). A 1 applied to the AWUIREQ input with auto wakeup interrupt request
enabled, latches an auto wakeup interrupt request.
Auto wakeup latch, AWUL, can be read directly from the bit 6 position of port A data register (PTA). This
is a read-only bit which is occupying an empty bit position on PTA. No PTA associated registers, such as
PTA6 data direction or PTA6 pullup exist for this bit.
There exists two clock sources for the AWU. An internal RC oscillator (exclusive for the auto wakeup
feature, AWU oscillator) drives the wakeup request generator provided the OSCENINSTOP bit in the
CONFIG2 register Figure 4-1is cleared. If the application employs a crystal, for example, by setting the
OSCENINSTOP bit the BUSCLKX4 will drive the wakeup request generator to allow a more accurate
wakeup.
Entering stop mode will enable the auto wakeup generation logic.
Once the overflow count is reached in the generator counter, a wakeup request, AWUIREQ, is latched
and sent to the KBI logic. See Figure 4-1.
Wakeup interrupt requests will only be serviced if the associated interrupt enable bit, AWUIE, in KBIER
is set. The AWU shares the keyboard interrupt vector.
The overflow count can be selected from two options defined by the COPRS bit in CONFIG1. This bit was
“borrowed” from the computer operating properly (COP) using the fact that the COP feature is idle (no
MCU clock available) in stop mode.
The auto wakeup RC oscillator is highly dependent on operating voltage and temperature. This feature is
not recommended for use as a time-keeping function.
The wakeup request is latched to allow the interrupt source identification. The latched value, AWUL, can
be read directly from the bit 6 position of PTA data register. This is a read-only bit which is occupying an
empty bit position on PTA. No PTA associated registers, such as PTA6 data, PTA6 direction, and PTA6
pullup exist for this bit. The latch can be cleared by writing to the ACKK bit in the KBSCR register. Reset
also clears the latch. AWUIE bit in KBI interrupt enable register (see Figure 4-1) has no effect on AWUL
reading.
The AWU oscillator and counters are inactive in normal operating mode and become active only upon
entering stop mode.
4.4 Interrupts
The AWU can generate an interrupt requests:.
AWU Latch (AWUL) — The AWUL bit is set when the AWU counter overflows. The auto wakeup interrupt
mask bit, AWUIE, is used to enable or disable AWU interrupt requests.
The AWU shares its interrupt with the KBI vector.
MC68HC908QB8 Data Sheet, Rev. 1
52Freescale Semiconductor
Low-Power Modes
4.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
4.5.1 Wait Mode
The AWU module remains inactive in wait mode.
4.5.2 Stop Mode
When the AWU module is enabled (AWUIE = 1 in the keyboard interrupt enable register) it is activated
automatically upon entering stop mode. Clearing the IMASKK bit in the keyboard status and control
register enables keyboard interrupt requests to bring the MCU out of stop mode. The AWU counters start
from 0 each time stop mode is entered.
4.6 Registers
The AWU shares registers with the keyboard interrupt (KBI) module, the port A I/O module and
configuration register 2. The following I/O registers control and monitor operation of the AWU:
•Port A data register (PTA)
•Keyboard interrupt status and control register (KBSCR)
•Keyboard interrupt enable register (KBIER)
•Configuration register 1 (CONFIG1)
•Configuration register 2 (CONFIG2)
4.6.1 Port A I/O Register
The port A data register (PTA) contains a data latch for the state of the AWU interrupt request, in addition
to the data latches for port A.
Bit 7654321Bit 0
Read:0AWUL
Write:
Reset:00Unaffected by reset
= Unimplemented
PTA5PTA4PTA3
Figure 4-2. Port A Data Register (PTA)
AWUL — Auto Wakeup Latch
This is a read-only bit which has the value of the auto wakeup interrupt request latch. The wakeup
request signal is generated internally. There is no PTA6 port or any of the associated bits such as
PTA6 data direction or pullup bits.
1 = Auto wakeup interrupt request is pending
0 = Auto wakeup interrupt request is not pending
NOTE
PTA5–PTA0 bits are not used in conjuction with the auto wakeup feature.
To see a description of these bits, see 12.2.1 Port A Data Register.
Writing a 1 to this write-only bit clears the keyboard/auto wakeup interrupt request on port A and auto
wakeup logic. ACKK always reads as 0. Reset clears ACKK.
IMASKK— Keyboard Interrupt Mask Bit
Writing a 1 to this read/write bit prevents the output of the keyboard interrupt mask from generating
interrupt requests on port A or auto wakeup. Reset clears the IMASKK bit.
This read/write bit enables the auto wakeup interrupt input to latch interrupt requests. Reset clears
AWUIE.
1 = Auto wakeup enabled as interrupt input
0 = Auto wakeup not enabled as interrupt input
NOTE
KBIE5–KBIE0 bits are not used in conjuction with the auto wakeup feature.
To see a description of these bits, see 9.8.2 Keyboard Interrupt Enable
Register (KBIER).
4.6.4 Configuration Register 2
The configuration register 2 (CONFIG2), is used to allow the bus clock source to run in STOP. In this case,
the clock, BUSCLKX4 will be used to drive the AWU request generator.
Bit 76543 21 Bit 0
Read:
IRQPUDIRQENRRRESCI-BDSRC OSCENINSTOPRSTEN
Write:
Reset:00000 00 0
Figure 4-5. Configuration Register 2 (CONFIG2)
OSCENINSTOP — Oscillator Enable in Stop Mode Bit
OSCENINSTOP, when set, will allow the bus clock source (BUSCLKX4) to generate clocks for the
AWU in stop mode. See 11.8.1 Oscillator Status and Control Register for information on enabling the
external clock sources.
1 = Oscillator enabled to operate during stop mode
0 = Oscillator disabled during stop mode
NOTE
IRQPUD, IRQEN, ESCIBDSRC, and RSTEN bits are not used in conjuction
with the auto wakeup feature. To see a description of these bits, see
Chapter 5 Configuration Register (CONFIG).
4.6.5 Configuration Register 1
The configuration register 1 (CONFIG1), is used to select the period for the AWU. The timeout will be
based on the COPRS bit along with the clock source for the AWU.
Bit 7654321Bit 0
Read:
Write:
Reset: POR:
COPRSLVISTOPLVIRSTDLVIPWRDLVITRIPSSRECSTOPCOPD
0
0
U = Unaffected
0
0
0
0
0
0
U
0
0
0
0
0
0
0
Figure 4-6. Configuration Register 1 (CONFIG1)
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor55
Auto Wakeup Module (AWU)
COPRS (In Stop Mode) — Auto Wakeup Period Selection Bit, depends on OSCSTOPEN in
CONFIG2 and bus clock source (BUSCLKX4).
1 = Auto wakeup short cycle = 512 × (INTRCOSC or BUSCLKX4)
0 = Auto wakeup long cycle = 16,384 × (INTRCOSC or BUSCLKX4)
NOTE
LVISTOP, LVIRST, LVIPWRD, LVITRIP, SSREC and COPD bits are not
used in conjuction with the auto wakeup feature. To see a description of
these bits, see Chapter 5 Configuration Register (CONFIG)
MC68HC908QB8 Data Sheet, Rev. 1
56Freescale Semiconductor
Chapter 5
Configuration Register (CONFIG)
5.1 Introduction
This section describes the configuration registers (CONFIG1 and CONFIG2). The configuration registers
enable or disable the following options:
•Stop mode recovery time (32 × BUSCLKX4 cycles or 4096 × BUSCLKX4 cycles)
•STOP instruction
•Computer operating properly module (COP)
•COP reset period (COPRS): 8176 × BUSCLKX4 or 262,128 × BUSCLKX4
•Low-voltage inhibit (LVI) enable and trip voltage selection
•Auto wakeup timeout period
•Allow clock source to remain enabled in STOP
•Enable IRQ
•Disable IRQ
•Enable RST
•Clock source selection for the enhanced serial communication interface (ESCI) module
5.2 Functional Description
pin
pin pullup device
pin
The configuration registers are used in the initialization of various options. The configuration registers can
be written once after each reset. Most of the configuration register bits are cleared during reset. Since the
various options affect the operation of the microcontroller unit (MCU) it is recommended that this register
be written immediately after reset. The configuration registers are located at $001E and $001F, and may
be read at anytime.
NOTE
The CONFIG registers are one-time writable by the user after each reset.
Upon a reset, the CONFIG registers default to predetermined settings as
shown in Figure 5-1 and Figure 5-2.
Bit 7654321Bit 0
Read:
IRQPUDIRQENRRRESCIBDSRC OSCENINSTOPRSTEN
Write:
Reset:000 0 0 00 U
POR:000 0 0 00 0
= Reserved U = Unaffected
R
Figure 5-1. Configuration Register 2 (CONFIG2)
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor57
Configuration Register (CONFIG)
IRQPUD — IRQ Pin Pullup Control Bit
1 = Internal pullup is disconnected
0 = Internal pullup is connected between IRQ
pin and V
DD
IRQEN — IRQ Pin Function Selection Bit
1 = Interrupt request function active in pin
0 = Interrupt request function inactive in pin
ESCIBDSRC — ESCI Baud Rate Clock Source Bit
ESCIBDSRC controls the clock source used for the ESCI. The setting of the bit affects the frequency
at which the ESCI operates.
1 = Internal data bus clock used as clock source for ESCI
0 = CGMXCLK used as clock source for ESCI
OSCENINSTOP— Oscillator Enable in Stop Mode Bit
OSCENINSTOP, when set, will allow the clock source to continue to generate clocks in stop mode.
This function can be used to keep the auto-wakeup running while the rest of the microcontroller stops.
When clear, the clock source is disabled when the microcontroller enters stop mode.
1 = Oscillator enabled to operate during stop mode
0 = Oscillator disabled during stop mode
RSTEN — RST
Pin Function Selection
1 = Reset function active in pin
0 = Reset function inactive in pin
NOTE
The RSTEN bit is cleared by a power-on reset (POR) only. Other resets will
leave this bit unaffected.
Bit 7654321Bit 0
Read:
Write:
Reset:0000U000
COPRSLVISTOPLVIRSTDLVIPWRDLVITRIPSSRECSTOPCOPD
POR:000 00000
U = Unaffected
Figure 5-2. Configuration Register 1 (CONFIG1)
COPRS (Out of Stop Mode) — COP Reset Period Selection Bit
1 = COP reset short cycle = 8176 × BUSCLKX4
0 = COP reset long cycle = 262,128 × BUSCLKX4
COPRS (In Stop Mode) — Auto Wakeup Period Selection Bit, depends on OSCSTOPEN in
CONFIG2 and external clock source
1 = Auto wakeup short cycle = 512 × (INTRCOSC or BUSCLKX4)
0 = Auto wakeup long cycle = 16,384 × (INTRCOSC or BUSCLKX4)
LVISTOP — LVI Enable in Stop Mode Bit
When the LVIPWRD bit is clear, setting the LVISTOP bit enables the LVI to operate during stop mode.
Reset clears LVISTOP.
1 = LVI enabled during stop mode
0 = LVI disabled during stop mode
MC68HC908QB8 Data Sheet, Rev. 1
58Freescale Semiconductor
Functional Description
LVIRSTD — LVI Reset Disable Bit
LVIRSTD disables the reset signal from the LVI module.
1 = LVI module power disabled
0 = LVI module power enabled
LVITRIP — LVI Trip Point Selection Bit
LVITRIP selects the voltage operating mode of the LVI module. The voltage mode selected for the LVI
should match the operating V
for the LVI’s voltage trip points for each of the modes.
DD
1 = LVI operates for a 5-V protection
0 = LVI operates for a 3-V protection
NOTE
The LVITRIP bit is cleared by a power-on reset (POR) only. Other resets
will leave this bit unaffected.
SSREC — Short Stop Recovery Bit
SSREC enables the CPU to exit stop mode with a delay of 32 BUSCLKX4 cycles instead of a 4096
BUSCLKX4 cycle delay.
1 = Stop mode recovery after 32 BUSCLKX4 cycles
0 = Stop mode recovery after 4096 BUSCLKX4 cycles
NOTE
Exiting stop mode by an LVI reset will result in the long stop recovery.
When using the LVI during normal operation but disabling during stop mode, the LVI will have an
enable time of t
. The system stabilization time for power-on reset and long stop recovery (both 4096
EN
BUSCLKX4 cycles) gives a delay longer than the LVI enable time for these startup scenarios. There
is no period where the MCU is not protected from a low-power condition. However, when using the
short stop recovery configuration option, the 32 BUSCLKX4 delay must be greater than the LVI’s turn
on time to avoid a period in startup where the LVI is not protecting the MCU.
The computer operating properly (COP) module contains a free-running counter that generates a reset if
allowed to overflow. The COP module helps software recover from runaway code. Prevent a COP reset
by clearing the COP counter periodically. The COP module can be disabled through the COPD bit in the
configuration 1 (CONFIG1) register.
6.2 Functional Description
SIM MODULE
BUSCLKX4
INTERNAL RESET SOURCES
STOP INSTRUCTION
COPCTL WRITE
COPEN (FROM SIM)
COPD (FROM CONFIG1)
RESET
COPCTL WRITE
COP RATE SELECT
(COPRS FROM CONFIG1)
12-BIT SIM COUNTER
(1)
CLEAR ALL STAGES
COP CLOCK
CLEAR STAGES 5–12
COP TIMEOUT
COP MODULE
6-BIT COP COUNTER
CLEAR
COP COUNTER
SIM RESET CIRCUIT
RESET STATUS REGISTER
1. See Chapter 14 System Integration Module (SIM) for more details.
Figure 6-1. COP Block Diagram
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor61
Computer Operating Properly (COP)
The COP counter is a free-running 6-bit counter preceded by the 12-bit system integration module (SIM)
counter. If not cleared by software, the COP counter overflows and generates an asynchronous reset after
8176 or 262,128 BUSCLKX4 cycles; depending on the state of the COP rate select bit, COPRS, in
configuration register 1. With a 262,128 BUSCLKX4 cycle overflow option, the internal 12.8-MHz
oscillator gives a COP timeout period of 20.48 ms. Writing any value to location $FFFF before an overflow
occurs prevents a COP reset by clearing the COP counter and stages 12–5 of the SIM counter.
NOTE
Service the COP immediately after reset and before entering or after exiting
stop mode to guarantee the maximum time before the first COP counter
overflow.
A COP reset pulls the RST
cycles and sets the COP bit in the reset status register (RSR). See 14.8.1 SIM Reset Status Register.
Place COP clearing instructions in the main program and not in an interrupt
subroutine. Such an interrupt subroutine could keep the COP from
generating a reset even while the main program is not working properly.
pin low (if the RSTEN bit is set in the CONFIG1 register) for 32 × BUSCLKX4
NOTE
6.3 I/O Signals
The following paragraphs describe the signals shown in Figure 6-1.
6.3.1 BUSCLKX4
BUSCLKX4 is the oscillator output signal. BUSCLKX4 frequency is equal to the internal oscillator
frequency, the crystal frequency, or the RC-oscillator frequency.
6.3.2 STOP Instruction
The STOP instruction clears the SIM counter.
6.3.3 COPCTL Write
Writing any value to the COP control register (COPCTL) (see Figure 6-2) clears the COP counter and
clears stages 12–5 of the SIM counter. Reading the COP control register returns the low byte of the reset
vector.
6.3.4 Power-On Reset
The power-on reset (POR) circuit in the SIM clears the SIM counter 4096 × BUSCLKX4 cycles after power
up.
6.3.5 Internal Reset
An internal reset clears the SIM counter and the COP counter.
6.3.6 COPD (COP Disable)
The COPD signal reflects the state of the COP disable bit (COPD) in the configuration register (CONFIG).
See Chapter 5 Configuration Register (CONFIG).
MC68HC908QB8 Data Sheet, Rev. 1
62Freescale Semiconductor
Interrupts
6.3.7 COPRS (COP Rate Select)
The COPRS signal reflects the state of the COP rate select bit (COPRS) in the configuration register 1
(CONFIG1). See Chapter 5 Configuration Register (CONFIG).
6.4 Interrupts
The COP does not generate CPU interrupt requests.
6.5 Monitor Mode
The COP is disabled in monitor mode when V
is present on the IRQ pin.
TST
6.6 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
6.6.1 Wait Mode
The COP continues to operate during wait mode. To prevent a COP reset during wait mode, periodically
clear the COP counter.
6.6.2 Stop Mode
Stop mode turns off the BUSCLKX4 input to the COP and clears the SIM counter. Service the COP
immediately before entering or after exiting stop mode to ensure a full COP timeout period after entering
or exiting stop mode.
6.7 COP Module During Break Mode
The COP is disabled during a break interrupt with monitor mode when BDCOP bit is set in break auxiliary
register (BRKAR).
6.8 Register
The COP control register (COPCTL) is located at address $FFFF and overlaps the reset vector. Writing
any value to $FFFF clears the COP counter and starts a new timeout period. Reading location $FFFF
returns the low byte of the reset vector.
Bit 7654321Bit 0
Read:LOW BYTE OF RESET VECTOR
Write:CLEAR COP COUNTER
Reset:Unaffected by reset
Figure 6-2. COP Control Register (COPCTL)
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor63
Computer Operating Properly (COP)
MC68HC908QB8 Data Sheet, Rev. 1
64Freescale Semiconductor
Chapter 7
Central Processor Unit (CPU)
7.1 Introduction
The M68HC08 CPU (central processor unit) is an enhanced and fully object-code-compatible version of
the M68HC05 CPU. The CPU08 Reference Manual (document order number CPU08RM/AD) contains a
description of the CPU instruction set, addressing modes, and architecture.
7.2 Features
Features of the CPU include:
•Object code fully upward-compatible with M68HC05 Family
•16-bit stack pointer with stack manipulation instructions
•16-bit index register with x-register manipulation instructions
•8-MHz CPU internal bus frequency
•64-Kbyte program/data memory space
•16 addressing modes
•Memory-to-memory data moves without using accumulator
•Fast 8-bit by 8-bit multiply and 16-bit by 8-bit divide instructions
•Enhanced binary-coded decimal (BCD) data handling
•Modular architecture with expandable internal bus definition for extension of addressing range
beyond 64 Kbytes
•Low-power stop and wait modes
7.3 CPU Registers
Figure 7-1 shows the five CPU registers. CPU registers are not part of the memory map.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor65
Central Processor Unit (CPU)
7
15
HX
15
15
70
V11H I NZC
0
ACCUMULATOR (A)
0
INDEX REGISTER (H:X)
0
STACK POINTER (SP)
0
PROGRAM COUNTER (PC)
CONDITION CODE REGISTER (CCR)
CARRY/BORROW FLAG
ZERO FLAG
NEGATIVE FLAG
INTERRUPT MASK
HALF-CARRY FLAG
TWO’S COMPLEMENT OVERFLOW FLAG
Figure 7-1. CPU Registers
7.3.1 Accumulator
The accumulator is a general-purpose 8-bit register. The CPU uses the accumulator to hold operands and
the results of arithmetic/logic operations.
Bit 7654321Bit 0
Read:
Write:
Reset:Unaffected by reset
Figure 7-2. Accumulator (A)
7.3.2 Index Register
The 16-bit index register allows indexed addressing of a 64-Kbyte memory space. H is the upper byte of
the index register, and X is the lower byte. H:X is the concatenated 16-bit index register.
In the indexed addressing modes, the CPU uses the contents of the index register to determine the
conditional address of the operand.
The index register can serve also as a temporary data storage location.
Bit
151413121110987654321
Read:
Write:
Reset:00000000XXXXXXXX
X = Indeterminate
Figure 7-3. Index Register (H:X)
Bit
0
MC68HC908QB8 Data Sheet, Rev. 1
66Freescale Semiconductor
CPU Registers
7.3.3 Stack Pointer
The stack pointer is a 16-bit register that contains the address of the next location on the stack. During a
reset, the stack pointer is preset to $00FF. The reset stack pointer (RSP) instruction sets the least
significant byte to $FF and does not affect the most significant byte. The stack pointer decrements as data
is pushed onto the stack and increments as data is pulled from the stack.
In the stack pointer 8-bit offset and 16-bit offset addressing modes, the stack pointer can function as an
index register to access data on the stack. The CPU uses the contents of the stack pointer to determine
the conditional address of the operand.
Bit
151413121110987654321
Read:
Write:
Reset:0000000011111111
Bit
0
Figure 7-4. Stack Pointer (SP)
NOTE
The location of the stack is arbitrary and may be relocated anywhere in
random-access memory (RAM). Moving the SP out of page 0 ($0000 to
$00FF) frees direct address (page 0) space. For correct operation, the
stack pointer must point only to RAM locations.
7.3.4 Program Counter
The program counter is a 16-bit register that contains the address of the next instruction or operand to be
fetched.
Normally, the program counter automatically increments to the next sequential memory location every
time an instruction or operand is fetched. Jump, branch, and interrupt operations load the program
counter with an address other than that of the next sequential location.
During reset, the program counter is loaded with the reset vector address located at $FFFE and $FFFF.
The vector address is the address of the first instruction to be executed after exiting the reset state.
Bit
151413121110987654321
Read:
Write:
Reset:Loaded with vector from $FFFE and $FFFF
Bit
0
Figure 7-5. Program Counter (PC)
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor67
Central Processor Unit (CPU)
7.3.5 Condition Code Register
The 8-bit condition code register contains the interrupt mask and five flags that indicate the results of the
instruction just executed. Bits 6 and 5 are set permanently to 1. The following paragraphs describe the
functions of the condition code register.
Bit 7654321Bit 0
Read:
Write:
Reset:X11X1XXX
V — Overflow Flag
The CPU sets the overflow flag when a two's complement overflow occurs. The signed branch
instructions BGT, BGE, BLE, and BLT use the overflow flag.
1 = Overflow
0 = No overflow
H — Half-Carry Flag
The CPU sets the half-carry flag when a carry occurs between accumulator bits 3 and 4 during an
add-without-carry (ADD) or add-with-carry (ADC) operation. The half-carry flag is required for
binary-coded decimal (BCD) arithmetic operations. The DAA instruction uses the states of the H and
C flags to determine the appropriate correction factor.
1 = Carry between bits 3 and 4
0 = No carry between bits 3 and 4
V11H I NZC
X = Indeterminate
Figure 7-6. Condition Code Register (CCR)
I — Interrupt Mask
When the interrupt mask is set, all maskable CPU interrupts are disabled. CPU interrupts are enabled
when the interrupt mask is cleared. When a CPU interrupt occurs, the interrupt mask is set
automatically after the CPU registers are saved on the stack, but before the interrupt vector is fetched.
1 = Interrupts disabled
0 = Interrupts enabled
NOTE
To maintain M6805 Family compatibility, the upper byte of the index
register (H) is not stacked automatically. If the interrupt service routine
modifies H, then the user must stack and unstack H using the PSHH and
PULH instructions.
After the I bit is cleared, the highest-priority interrupt request is serviced first.
A return-from-interrupt (RTI) instruction pulls the CPU registers from the stack and restores the
interrupt mask from the stack. After any reset, the interrupt mask is set and can be cleared only by the
clear interrupt mask software instruction (CLI).
N — Negative Flag
The CPU sets the negative flag when an arithmetic operation, logic operation, or data manipulation
produces a negative result, setting bit 7 of the result.
1 = Negative result
0 = Non-negative result
MC68HC908QB8 Data Sheet, Rev. 1
68Freescale Semiconductor
Arithmetic/Logic Unit (ALU)
Z — Zero Flag
The CPU sets the zero flag when an arithmetic operation, logic operation, or data manipulation
produces a result of $00.
1 = Zero result
0 = Non-zero result
C — Carry/Borrow Flag
The CPU sets the carry/borrow flag when an addition operation produces a carry out of bit 7 of the
accumulator or when a subtraction operation requires a borrow. Some instructions — such as bit test
and branch, shift, and rotate — also clear or set the carry/borrow flag.
1 = Carry out of bit 7
0 = No carry out of bit 7
7.4 Arithmetic/Logic Unit (ALU)
The ALU performs the arithmetic and logic operations defined by the instruction set.
Refer to the CPU08 Reference Manual (document order number CPU08RM/AD) for a description of the
instructions and addressing modes and more detail about the architecture of the CPU.
7.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
7.5.1 Wait Mode
The WAIT instruction:
•Clears the interrupt mask (I bit) in the condition code register, enabling interrupts. After exit from
wait mode by interrupt, the I bit remains clear. After exit by reset, the I bit is set.
•Disables the CPU clock
7.5.2 Stop Mode
The STOP instruction:
•Clears the interrupt mask (I bit) in the condition code register, enabling external interrupts. After
exit from stop mode by external interrupt, the I bit remains clear. After exit by reset, the I bit is set.
•Disables the CPU clock
After exiting stop mode, the CPU clock begins running after the oscillator stabilization delay.
7.6 CPU During Break Interrupts
If a break module is present on the MCU, the CPU starts a break interrupt by:
•Loading the instruction register with the SWI instruction
•Loading the program counter with $FFFC:$FFFD or with $FEFC:$FEFD in monitor mode
The break interrupt begins after completion of the CPU instruction in progress. If the break address
register match occurs on the last cycle of a CPU instruction, the break interrupt begins immediately.
A return-from-interrupt instruction (RTI) in the break routine ends the break interrupt and returns the MCU
to normal operation if the break interrupt has been deasserted.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor69
Central Processor Unit (CPU)
7.7 Instruction Set Summary
Table 7-1 provides a summary of the M68HC08 instruction set.
X ← –(X) = $00 – (X)
M ← –(M) = $00 – (M)
M ← –(M) = $00 – (M)
← (M)
0
b0
C0
b0
Source
on CCR
VH I NZC
––––––
––
0–––
––
DIR
EXT
IX2
IX1
IX
DIR
EXT
IX2
IX1
IX
IMM
DIR
EXT
IX2
IX1
IX
SP1
SP2
IMM
DIR
IMM
DIR
EXT
IX2
IX1
IX
SP1
SP2
DIR
INH
INH
IX1
IX
SP1
DIR
INH
INH
IX1
IX
SP1
DD
DIX+
IMD
IX+D
DIR
INH
INH
IX1
IX
SP1
IMM
DIR
EXT
IX2
IX1
IX
SP1
SP2
Address
Mode
Opcode
Operand
BC
dd
CC
hh ll
DC
ee ff
EC
ff
FC
BD
dd
CD
hh ll
DD
ee ff
ED
ff
FD
A6
ii
B6
dd
C6
hh ll
D6
ee ff
E6
ff
F6
9EE6
ff
9ED6
ee ff
4555ii jjdd3
AE
ii
BE
dd
CE
hh ll
DE
ee ff
EE
ff
FE
9EEE
ff
9EDE
ee ff
38
dd
48
58
68
ff
78
9E68
ff
34
dd
44
54
64
ff
74
9E64
ff
4E
dd dd
5E
dd
6E
ii dd
7E
dd
30
dd
40
50
60
ff
70
9E60
ff
AA
ii
BA
dd
hh ll
CA
ee ff
DA
ff
EA
FA
ff
9EEA
ee ff
9EDA
2
3
4
3
2
4
5
6
5
4
2
3
4
4
3
2
4
5
4
2
3
4
4
3
2
4
5
4
1
1
4
3
5
4
1
1
4
3
5
5
4
4
4
4
1
1
4
3
5
2
3
4
4
3
2
4
5
Cycles
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor73
Central Processor Unit (CPU)
Table 7-1. Instruction Set Summary (Sheet 5 of 6)
Effect
Source
Form
PULAPull A from StackSP ← (SP + 1); Pull (A)––––––INH862
PULHPull H from StackSP ← (SP + 1); Pull (H)––––––INH8A2
PULXPull X from StackSP ← (SP + 1); Pull (X)––––––INH882
ROL opr
SUB #opr
SUB opr
SUB opr
SUB opr,X
SUB opr,X
SUB ,X
SUB opr,SP
SUB opr,SP
Rotate Left through Carry ––
Rotate Right through Carry ––
Subtract with Carry A ← (A) – (M) – (C) ––
Store A in MM ← (A)0–––
Enable Interrupts, Stop Processing,
Refer to MCU Documentation
Store X in MM ← (X)0–––
Subtract A ← (A) – (M) ––
OperationDescription
C
b7
b7
SP ← (SP) + 1; Pull (CCR)
SP ← (SP) + 1; Pull (A)
SP ← (SP) + 1; Pull (X)
SP ←
(SP) + 1; Pull (PCH)
SP ← (SP) + 1; Pull (PCL)
SP ← SP + 1; Pull (PCH)
SP ← SP + 1; Pull (PCL)
I ← 0; Stop Processing––0–––INH8E1
b0
b0
C
on CCR
VH I NZC
INH807
––––––INH814
DIR
INH
INH
IX1
IX
SP1
DIR
INH
INH
IX1
IX
SP1
IMM
DIR
EXT
IX2
IX1
IX
SP1
SP2
DIR
EXT
IX2
IX1
IX
SP1
SP2
DIR
EXT
IX2
IX1
IX
SP1
SP2
IMM
DIR
EXT
IX2
IX1
IX
SP1
SP2
Address
Mode
9E69
9E66
9EE2
9ED2
9EE7
9ED7
9EEF
9EDF
9EE0
9ED0
39
49
59
69
79
36
46
56
66
76
A2
B2
C2
D2
E2
F2
B7
C7
D7
E7
F7
BF
CF
DF
EF
FF
A0
B0
C0
D0
E0
F0
Opcode
dd
ff
ff
dd
ff
ff
ii
dd
hh ll
ee ff
ff
ff
ee ff
dd
hh ll
ee ff
ff
ff
ee ff
dd
hh ll
ee ff
ff
ff
ee ff
ii
dd
hh ll
ee ff
ff
ff
ee ff
Operand
Cycles
4
1
1
4
3
5
4
1
1
4
3
5
2
3
4
4
3
2
4
5
3
4
4
3
2
4
5
3
4
4
3
2
4
5
2
3
4
4
3
2
4
5
MC68HC908QB8 Data Sheet, Rev. 1
74Freescale Semiconductor
Opcode Map
Table 7-1. Instruction Set Summary (Sheet 6 of 6)
Effect
Source
Form
SWISoftware Interrupt
TAPTransfer A to CCRCCR ← (A)INH842
TAXTransfer A to XX ← (A)––––––INH971
TPATransfer CCR to AA ← (CCR)––––––INH851
TST opr
TSTA
TSTX
TST opr,X
TST ,X
TST opr,SP
TSXTransfer SP to H:XH:X ← (SP) + 1––––––INH952
TXATransfer X to AA ← (X)––––––INH9F1
TXSTransfer H:X to SP(SP) ← (H:X) – 1––––––INH942
WAITEnable Interrupts; Wait for Interrupt
AAccumulatornAny bit
CCarry/borrow bitopr Operand (one or two bytes)
CCRCondition code registerPC Program counter
ddDirect address of operandPCH Program counter high byte
dd rrDirect address of operand and relative offset of branch instructionPCL Program counter low byte
DDDirect to direct addressing modeREL Relative addressing mode
DIRDirect addressing moderelRelative program counter offset byte
DIX+Direct to indexed with post increment addressing moderrRelative program counter offset byte
ee ffHigh and low bytes of offset in indexed, 16-bit offset addressingSP1 Stack pointer, 8-bit offset addressing mode
EXTExtended addressing modeSP2 Stack pointer 16-bit offset addressing mode
ffOffset byte in indexed, 8-bit offset addressingSPStack pointer
HHalf-carry bitUUndefined
HIndex register high byteVOverflow bit
hh llHigh and low bytes of operand address in extended addressingXIndex register low byte
IInterrupt maskZZero bit
iiImmediate operand byte&Logical AND
IMDImmediate source to direct destination addressing mode|Logical OR
IMMImmediate addressing mode
INHInherent addressing mode( )Contents of
IXIndexed, no offset addressing mode–( ) Negation (two’s complement)
IX+Indexed, no offset, post increment addressing mode#Immediate value
IX+DIndexed with post increment to direct addressing mode
IX1Indexed, 8-bit offset addressing mode←Loaded with
IX1+Indexed, 8-bit offset, post increment addressing mode?If
IX2Indexed, 16-bit offset addressing mode:Concatenated with
MMemory locationSet or cleared
NNegative bit—Not affected
Test for Negative or Zero(A) – $00 or (X) – $00 or (M) – $000 – – –
The IRQ (external interrupt) module provides a maskable interrupt input.
functionality is enabled by setting configuration register 2 (CONFIG2) IRQEN bit accordingly. A zero
IRQ
disables the IRQ function and IRQ
function. See Chapter 5 Configuration Register (CONFIG) for more information on enabling the IRQ pin.
The IRQ pin shares its pin with general-purpose input/output (I/O) port pins. See Figure 8-1 for port
location of this shared pin.
8.2 Features
Features of the IRQ module include:
•A dedicated external interrupt pin IRQ
•IRQ interrupt control bits
•Programmable edge-only or edge and level interrupt sensitivity
•Automatic interrupt acknowledge
•Internal pullup device
will assume the other shared functionalities. A one enables the IRQ
8.3 Functional Description
A low level applied to the external interrupt request (IRQ) pin can latch a CPU interrupt request. Figure 8-2
shows the structure of the IRQ module.
Interrupt signals on the IRQ
following actions occurs:
•IRQ vector fetch. An IRQ vector fetch automatically generates an interrupt acknowledge signal that
clears the latch that caused the vector fetch.
•Software clear. Software can clear the IRQ latch by writing a 1 to the ACK bit in the interrupt status
and control register (INTSCR).
•Reset. A reset automatically clears the IRQ latch.
The external IRQ
edge or falling edge and low level sensitive. The MODE bit in INTSCR controls the triggering sensitivity
of the IRQ
pin.
pin is falling edge sensitive out of reset and is software-configurable to be either falling
pin are latched into the IRQ latch. The IRQ latch remains set until one of the
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor77
External Interrupt (IRQ)
PTA0/TCH0/AD0/KBI0
PTA1/TCH1/AD1/KBI1
PTA2/IRQ
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
/KBI2/TCLK
PTA3/RST
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
/KBI3
PTB3/SS
PTB4/RxD/AD8
PTB5/TxD/AD9
/AD7
PTB6/TCH2
PTB7/TCH3
PTA
PTB
DDRA
DDRB
M68HC08 CPU
CLOCK
GENERATOR
KEYBOARD INTERRUPT
MODULE
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
256 BYTES
USER RAM
V
DD
POWER SUPPLY
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
V
SS
MC68HC908QB8
8192 BYTES
USER FLASH
Figure 8-1. Block Diagram Highlighting IRQ Block and Pin
When set, the IMASK bit in INTSCR masks the IRQ
interrupt request. A latched interrupt request is not
presented to the interrupt priority logic unless IMASK is clear.
COP
MODULE
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
NOTE
The interrupt mask (I) in the condition code register (CCR) masks all
interrupt requests, including the IRQ
A falling edge on the IRQ
pin can latch an interrupt request into the IRQ latch. An IRQ vector fetch,
interrupt request.
software clear, or reset clears the IRQ latch.
MC68HC908QB8 Data Sheet, Rev. 1
78Freescale Semiconductor
RESET
ACK
Functional Description
IRQ VECTOR
FETCH
DECODER
INTERNAL ADDRESS BUS
IRQ
V
DD
INTERNAL
PULLUP
DEVICE
V
DD
DQ
IRQ LATCH
MODE
CK
CLR
SYNCHRONIZER
IMASK
HIGH
VOLTAGE
DETECT
IRQF
TO CPU FOR
BIL/BIH
INSTRUCTIONS
IRQ
INTERRUPT
REQUEST
TO MODE
SELECT
LOGIC
Figure 8-2. IRQ Module Block Diagram
8.3.1 MODE = 1
If the MODE bit is set, the IRQ pin is both falling edge sensitive and low level sensitive. With MODE set,
both of the following actions must occur to clear the IRQ
•Return of the IRQ
pin to a high level. As long as the IRQ pin is low, the IRQ request remains active.
•IRQ vector fetch or software clear. An IRQ vector fetch generates an interrupt acknowledge signal
to clear the IRQ latch. Software generates the interrupt acknowledge signal by writing a 1 to ACK
in INTSCR. The ACK bit is useful in applications that poll the IRQ
the IRQ latch. Writing to ACK prior to leaving an interrupt service routine can also prevent spurious
interrupts due to noise. Setting ACK does not affect subsequent transitions on the IRQ
edge that occurs after writing to ACK latches another interrupt request. If the IRQ mask bit, IMASK,
is clear, the CPU loads the program counter with the IRQ vector address.
interrupt request:
pin and require software to clear
pin. A falling
The IRQ vector fetch or software clear and the return of the IRQ
The interrupt request remains pending as long as the IRQ
pin to a high level may occur in any order.
pin is low. A reset will clear the IRQ latch and
the MODE control bit, thereby clearing the interrupt even if the pin stays low.
Use the BIH or BIL instruction to read the logic level on the IRQ
pin.
8.3.2 MODE = 0
If the MODE bit is clear, the IRQ pin is falling edge sensitive only. With MODE clear, an IRQ vector fetch
or software clear immediately clears the IRQ latch.
The IRQF bit in INTSCR can be read to check for pending interrupts. The IRQF bit is not affected by
IMASK, which makes it useful in applications where polling is preferred.
NOTE
When using the level-sensitive interrupt trigger, avoid false IRQ interrupts
by masking interrupt requests in the interrupt routine.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor79
External Interrupt (IRQ)
8.4 Interrupts
The following IRQ source can generate interrupt requests:
•Interrupt flag (IRQF) — The IRQF bit is set when the IRQ
The IRQ interrupt mask bit, IMASK, is used to enable or disable IRQ interrupt requests.
pin is asserted based on the IRQ mode..
8.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
8.5.1 Wait Mode
The IRQ module remains active in wait mode. Clearing IMASK in INTSCR enables IRQ interrupt requests
to bring the MCU out of wait mode.
8.5.2 Stop Mode
The IRQ module remains active in stop mode. Clearing IMASK in INTSCR enables IRQ interrupt requests
to bring the MCU out of stop mode.
8.6 IRQ Module During Break Interrupts
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
8.7 I/O Signals
The IRQ module does not share its pin with any module on this MCU.
8.7.1 IRQ Input Pins (IRQ)
The IRQ pin provides a maskable external interrupt source. The IRQ pin contains an internal pullup
device.
MC68HC908QB8 Data Sheet, Rev. 1
80Freescale Semiconductor
Registers
8.8 Registers
The IRQ status and control register (INTSCR) controls and monitors operation of the IRQ module. The
INTSCR:
•Shows the state of the IRQ flag
•Clears the IRQ latch
•Masks the IRQ interrupt request
•Controls triggering sensitivity of the IRQ
Bit 7654321Bit 0
Read:0000IRQF0
Write:
Reset:00000000
= Unimplemented
Figure 8-3. IRQ Status and Control Register (INTSCR)
IRQF — IRQ Flag Bit
This read-only status bit is set when the IRQ interrupt is pending.
1 = IRQ
0 = IRQ
interrupt pending
interrupt not pending
interrupt pin
ACK
IMASKMODE
ACK — IRQ Interrupt Request Acknowledge Bit
Writing a 1 to this write-only bit clears the IRQ latch. ACK always reads 0.
IMASK — IRQ Interrupt Mask Bit
Writing a 1 to this read/write bit disables the IRQ interrupt request.
This read/write bit controls the triggering sensitivity of the IRQ
1 = IRQ
0 = IRQ
interrupt request on falling edges and low levels
interrupt request on falling edges only
pin.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor81
External Interrupt (IRQ)
MC68HC908QB8 Data Sheet, Rev. 1
82Freescale Semiconductor
Chapter 9
Keyboard Interrupt Module (KBI)
9.1 Introduction
The keyboard interrupt module (KBI) provides independently maskable external interrupts.
The KBI shares its pins with general-purpose input/output (I/O) port pins. See Figure 9-1 for port location
of these shared pins.
9.2 Features
Features of the keyboard interrupt module include:
•Keyboard interrupt pins with separate keyboard interrupt enable bits and one keyboard interrupt
mask
•Programmable edge-only or edge and level interrupt sensitivity
•Edge sensitivity programmable for rising or falling edge
•Level sensitivity programmable for high or low level
•Pullup or pulldown device automatically enabled based on the polarity of edge or level detect
•Exit from low-power modes
9.3 Functional Description
The keyboard interrupt module controls the enabling/disabling of interrupt functions on the KBI pins.
These pins can be enabled/disabled independently of each other. See Figure 9-2.
9.3.1 Keyboard Operation
Writing to the KBIEx bits in the keyboard interrupt enable register (KBIER) independently enables or
disables each KBI pin. The polarity of the keyboard interrupt is controlled using the KBIPx bits in the
keyboard interrupt polarity register (KBIPR). Edge-only or edge and level sensitivity is controlled using the
MODEK bit in the keyboard status and control register (KBISCR).
Enabling a keyboard interrupt pin also enables its internal pullup or pulldown device based on the polarity
enabled. On falling edge or low level detection, a pullup device is configured. On rising edge or high level
detection, a pulldown device is configured.
The keyboard interrupt latch is set when one or more enabled keyboard interrupt inputs are asserted.
•If the keyboard interrupt sensitivity is edge-only, for KBIPx = 0, a falling (for KBIPx = 1, a rising)
edge on a keyboard interrupt input does not latch an interrupt request if another enabled keyboard
pin is already asserted. To prevent losing an interrupt request on one input because another input
remains asserted, software can disable the latter input while it is asserted.
•If the keyboard interrupt is edge and level sensitive, an interrupt request is present as long as any
enabled keyboard interrupt input is asserted.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor83
Keyboard Interrupt Module (KBI)
PTA0/TCH0/AD0/KBI0
PTA1/TCH1/AD1/KBI1
PTA2/IRQ
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
/KBI2/TCLK
PTA3/RST
PTB1/MOSI/AD5
PTB2/MISO/AD6
/KBI3
PTB0/SCK/AD4
PTB3/SS
PTB4/RxD/AD8
/AD7
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTA
PTB
DDRA
DDRB
M68HC08 CPU
CLOCK
GENERATOR
KEYBOARD INTERRUPT
MODULE
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
256 BYTES
USER RAM
V
DD
POWER SUPPLY
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
V
SS
MC68HC908QB8
8192 BYTES
USER FLASH
DEVELOPMENT SUPPORT
COP
MODULE
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
SERIAL PERIPHERAL
INTERFACE
MONITOR ROM
BREAK MODULE
Figure 9-1. Block Diagram Highlighting KBI Block and Pins
9.3.1.1 MODEK = 1
If the MODEK bit is set, the keyboard interrupt inputs are both edge and level sensitive. The KBIPx bit will
determine whether a edge sensitive pin detects rising or falling edges and on level sensitive pins whether
the pin detects low or high levels. With MODEK set, both of the following actions must occur to clear a
keyboard interrupt request:
•Return of all enabled keyboard interrupt inputs to a deasserted level. As long as any enabled
keyboard interrupt pin is asserted, the keyboard interrupt remains active.
MC68HC908QB8 Data Sheet, Rev. 1
84Freescale Semiconductor
INTERNAL BUS
VECTOR FETCH
DECODER
1
Functional Description
ACKK
RESET
AWUIREQ
0
S
KBIE0
TO PULLUP/
PULLDOWN ENABLE
1
0
S
KBIEx
TO PULLUP/
PULLDOWN ENABLE
MODEK
V
DD
DQ
KBI LATCH
CK
CLR
SYNCHRONIZER
IMASKK
KEYF
KEYBOARD
INTERRUPT
REQUEST
KBI0
KBIP0
KBIx
KBIPx
(SEE Figure 4-1)
Figure 9-2. Keyboard Interrupt Block Diagram
•Vector fetch or software clear. A KBI vector fetch generates an interrupt acknowledge signal to
clear the KBI latch. Software generates the interrupt acknowledge signal by writing a 1 to ACKK in
KBSCR. The ACKK bit is useful in applications that poll the keyboard interrupt inputs and require
software to clear the KBI latch. Writing to ACKK prior to leaving an interrupt service routine can
also prevent spurious interrupts due to noise. Setting ACKK does not affect subsequent transitions
on the keyboard interrupt inputs. An edge detect that occurs after writing to ACKK latches another
interrupt request. If the keyboard interrupt mask bit, IMASKK, is clear, the CPU loads the program
counter with the KBI vector address.
The KBI vector fetch or software clear and the return of all enabled keyboard interrupt pins to a deasserted
level may occur in any order.
Reset clears the keyboard interrupt request and the MODEK bit, clearing the interrupt request even if a
keyboard interrupt input stays asserted.
9.3.1.2 MODEK = 0
If the MODEK bit is clear, the keyboard interrupt inputs are edge sensitive. The KBIPx bit will determine
whether an edge sensitive pin detects rising or falling edges. A KBI vector fetch or software clear
immediately clears the KBI latch.
The keyboard flag bit (KEYF) in KBSCR can be read to check for pending interrupts. The KEYF bit is not
affected by IMASKK, which makes it useful in applications where polling is preferred.
NOTE
Setting a keyboard interrupt enable bit (KBIEx) forces the corresponding
keyboard interrupt pin to be an input, overriding the data direction register.
However, the data direction register bit must be a 0 for software to read the
pin.
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor85
Keyboard Interrupt Module (KBI)
9.3.2 Keyboard Initialization
When a keyboard interrupt pin is enabled, it takes time for the internal pullup or pulldown device to pull
the pin to its deasserted level. Therefore a false interrupt can occur as soon as the pin is enabled.
To prevent a false interrupt on keyboard initialization:
1.Mask keyboard interrupts by setting IMASKK in KBSCR.
2.Enable the KBI polarity by setting the appropriate KBIPx bits in KBIPR.
3.Enable the KBI pins by setting the appropriate KBIEx bits in KBIER.
4.Write to ACKK in KBSCR to clear any false interrupts.
5.Clear IMASKK.
An interrupt signal on an edge sensitive pin can be acknowledged immediately after enabling the pin. An
interrupt signal on an edge and level sensitive pin must be acknowledged after a delay that depends on
the external load.
9.4 Interrupts
The following KBI source can generate interrupt requests:
•Keyboard flag (KEYF) — The KEYF bit is set when any enabled KBI pin is asserted based on the
KBI mode and pin polarity. The keyboard interrupt mask bit, IMASKK, is used to enable or disable
KBI interrupt requests.
9.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
9.5.1 Wait Mode
The KBI module remains active in wait mode. Clearing IMASKK in KBSCR enables keyboard interrupt
requests to bring the MCU out of wait mode.
9.5.2 Stop Mode
The KBI module remains active in stop mode. Clearing IMASKK in KBSCR enables keyboard interrupt
requests to bring the MCU out of stop mode.
9.6 KBI During Break Interrupts
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
MC68HC908QB8 Data Sheet, Rev. 1
86Freescale Semiconductor
I/O Signals
9.7 I/O Signals
The KBI module can share its pins with the general-purpose I/O pins. See Figure 9-1 for the port pins that
are shared.
9.7.1 KBI Input Pins (KBIx:KBI0)
Each KBI pin is independently programmable as an external interrupt source. KBI pin polarity can be
controlled independently. Each KBI pin when enabled will automatically configure the appropriate
pullup/pulldown device based on polarity.
9.8 Registers
The following registers control and monitor operation of the KBI module:
•KBSCR (keyboard interrupt status and control register)
•KBIER (keyboard interrupt enable register)
•KBIPR (keyboard interrupt polarity register)
9.8.1 Keyboard Status and Control Register (KBSCR)
Each of these read/write bits enables the polarity of the keyboard interrupt detection.
1 = Keyboard polarity is high level and/or rising edge
0 = Keyboard polarity is low level and/or falling edge
KBIP5KBIP4KBIP3KBIP2KBIP1KBIP0
MC68HC908QB8 Data Sheet, Rev. 1
88Freescale Semiconductor
Chapter 10
Low-Voltage Inhibit (LVI)
10.1 Introduction
The low-voltage inhibit (LVI) module is provided as a system protection mechanism to prevent the MCU
from operating below a certain operating supply voltage level. The module has several configuration
options to allow functionality to be tailored to different system level demands.
The configuration registers (see Chapter 5 Configuration Register (CONFIG)) contain control bits for this
module.
10.2 Features
Features of the LVI module include:
•Programmable LVI reset
•Selectable LVI trip voltage
•Programmable stop mode operation
10.3 Functional Description
Figure 10-1 shows the structure of the LVI module. LVISTOP, LVIPWRD, LVITRIP, and LVIRSTD are
user selectable options found in the configuration register.
V
DD
STOP INSTRUCTION
LVISTOP
FROM CONFIGURATION REGISTER
FROM CONFIGURATION REGISTER
LVIRSTD
LVIPWRD
FROM CONFIGURATION REGISTER
0 IF V
> V
1 IF V
DD
≤ V
DD
LOW V
DD
DETECTOR
LVITRIP
FROM CONFIGURATION REGISTER
TRIPR
TRIPF
LVIOUT
LVI RESET
Figure 10-1. LVI Module Block Diagram
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor89
Low-Voltage Inhibit (LVI)
The LVI module contains a bandgap reference circuit and comparator. When the LVITRIP bit is cleared,
the default state at power-on reset, V
is configured for the lower VDD operating range. The actual
TRIPF
trip points are specified in 18.5 5-V DC Electrical Characteristics and 18.8 3-V DC Electrical
Characteristics.
Because the default LVI trip point after power-on reset is configured for low voltage operation, a system
requiring high voltage LVI operation must set the LVITRIP bit during system initialization. V
above the LVI trip rising voltage, V
, for the high voltage operating range or the MCU will immediately
TRIPR
must be
DD
go into LVI reset.
After an LVI reset occurs, the MCU remains in reset until V
rises above V
DD
. See Chapter 14 System
TRIPR
Integration Module (SIM) for the reset recovery sequence.
The output of the comparator controls the state of the LVIOUT flag in the LVI status register (LVISR) and
can be used for polling LVI operation when the LVI reset is disabled.
The LVI is enabled out of reset. The following bits located in the configuration register can alter the default
conditions.
•Setting the LVI power disable bit, LVIPWRD, disables the LVI.
•Setting the LVI reset disable bit, LVIRSTD, prevents the LVI module from generating a reset.
•Setting the LVI enable in stop mode bit, LVISTOP, enables the LVI to operate in stop mode.
•Setting the LVI trip point bit, LVITRIP, configures the trip point voltage (V
) for the higher VDD
TRIPF
operating range.
10.3.1 Polled LVI Operation
In applications that can operate at VDD levels below the V
the LVIOUT bit. In the configuration register, LVIPWRD must be cleared to enable the LVI module, and
LVIRSTD must be set to disable LVI resets.
level, software can monitor VDD by polling
TRIPF
10.3.2 Forced Reset Operation
In applications that require VDD to remain above the V
module to reset the MCU when V
falls below the V
DD
TRIPF
and LVIRSTD must be cleared to enable the LVI module and to enable LVI resets.
level, enabling LVI resets allows the LVI
TRIPF
level. In the configuration register, LVIPWRD
10.3.3 LVI Hysteresis
The LVI has hysteresis to maintain a stable operating condition. After the LVI has triggered (by having
V
fall below V
DD
V
. This prevents a condition in which the MCU is continually entering and exiting reset if VDD is
TRIPR
approximately equal to V
), the MCU will remain in reset until VDD rises above the rising trip point voltage,
TRIPF
TRIPF
. V
is greater than V
TRIPR
by the typical hysteresis voltage, V
TRIPF
HYS
.
10.3.4 LVI Trip Selection
LVITRIP in the configuration register selects the LVI protection range. The default setting out of reset is
for the low voltage range. Because LVITRIP is in a write-once configuration register, the protection range
cannot be changed after initialization.
NOTE
The MCU is guaranteed to operate at a minimum supply voltage. The trip
point (V
section for the actual trip point voltages.
90Freescale Semiconductor
) may be lower than this. See the Electrical Characteristics
TRIPF
MC68HC908QB8 Data Sheet, Rev. 1
LVI Interrupts
10.4 LVI Interrupts
The LVI module does not generate interrupt requests.
10.5 Low-Power Modes
The STOP and WAIT instructions put the MCU in low power-consumption standby modes.
10.5.1 Wait Mode
If enabled, the LVI module remains active in wait mode. If enabled to generate resets, the LVI module can
generate a reset and bring the MCU out of wait mode.
10.5.2 Stop Mode
If the LVIPWRD bit in the configuration register is cleared and the LVISTOP bit in the configuration
register is set, the LVI module remains active. If enabled to generate resets, the LVI module can generate
a reset and bring the MCU out of stop mode.
10.6 Registers
The LVI status register (LVISR) contains a status bit that is useful when the LVI is enabled and LVI reset
is disabled.
Bit 76 5 4 3 2 1Bit 0
Read:LVIOUT000000R
Write:
Reset:00000000
= UnimplementedR= Reserved
Figure 10-2. LVI Status Register (LVISR)
LVIOUT — LVI Output Bit
This read-only flag becomes set when the V
when V
voltage rises above V
DD
TRIPR
Table 10-1. LVIOUT Bit Indication
VDD > V
V
< V
DD
V
< VDD < V
TRIPF
MC68HC908QB8 Data Sheet, Rev. 1
voltage falls below the V
DD
. (See Table 10-1).
V
DD
TRIPR
TRIPF
TRIPR
LVIOUT
0
1
Previous value
trip voltage and is cleared
TRIPF
Freescale Semiconductor91
Low-Voltage Inhibit (LVI)
MC68HC908QB8 Data Sheet, Rev. 1
92Freescale Semiconductor
Chapter 11
Oscillator Module (OSC)
11.1 Introduction
The oscillator (OSC) module is used to provide a stable clock source for the MCU system and bus.
The OSC shares its pins with general-purpose input/output (I/O) port pins. See Figure 11-1 for port
location of these shared pins. The OSC2EN bit is located in the port A pull enable register (PTAPUEN)
on this MCU. See Chapter 12 Input/Output Ports (PORTS) for information on PTAPUEN register.
11.2 Features
The bus clock frequency is one fourth of any of these clock source options:
1.Internal oscillator: An internally generated, fixed frequency clock, trimmable to ± 0.4%. There are
three choices for the internal oscillator,12.8 MHz, 8 MHz, or 4 MHz. The 4-MHz internal oscillator
is the default option out of reset.
2.External oscillator: An external clock that can be driven directly into OSC1.
3.External RC: A built-in oscillator module (RC oscillator) that requires an external R connection only.
The capacitor is internal to the chip.
4.External crystal: A built-in XTAL oscillator that requires an external crystal or ceramic-resonator.
There are three crystal frequency ranges supported, 8–32 MHz, 1–8 MHz, and 32–100 kHz.
11.3 Functional Description
The oscillator contains these major subsystems:
•Internal oscillator circuit
•Internal or external clock switch control
•External clock circuit
•External crystal circuit
•External RC clock circuit
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor93
Oscillator Module (OSC)
PTA0/TCH0/AD0/KBI0
PTA1/TCH1/AD1/KBI1
PTA2/IRQ
/KBI2/TCLK
PTA3/RST
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
PTB1/MOSI/AD5
PTB2/MISO/AD6
/KBI3
PTB0/SCK/AD4
PTB3/SS
PTB4/RxD/AD8
PTB5/TxD/AD9
/AD7
PTB6/TCH2
PTB7/TCH3
PTA
PTB
DDRA
DDRB
M68HC08 CPU
CLOCK
GENERATOR
KEYBOARD INTERRUPT
MODULE
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
256 BYTES
USER RAM
V
DD
POWER SUPPLY
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
V
SS
Figure 11-1. Block Diagram Highlighting OSC Block and Pins
MC68HC908QB8
8192 BYTES
USER FLASH
COP
MODULE
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
MC68HC908QB8 Data Sheet, Rev. 1
94Freescale Semiconductor
Functional Description
11.3.1 Internal Signal Definitions
The following signals and clocks are used in the functional description and figures of the OSC module.
11.3.1.1 Oscillator Enable Signal (SIMOSCEN)
The SIMOSCEN signal comes from the system integration module (SIM) and disables the XTAL oscillator
circuit, the RC oscillator, or the internal oscillator in stop mode. OSCENINSTOP in the configuration
register can be used to override this signal.
11.3.1.2 XTAL Oscillator Clock (XTALCLK)
XTALCLK is the XTAL oscillator output signal. It runs at the full speed of the crystal (f
) and comes
XCLK
directly from the crystal oscillator circuit. Figure 11-2 shows only the logical relation of XTALCLK to OSC1
and OSC2 and may not represent the actual circuitry. The duty cycle of XTALCLK is unknown and may
depend on the crystal and other external factors. The frequency of XTALCLK can be unstable at start up.
11.3.1.3 RC Oscillator Clock (RCCLK)
RCCLK is the RC oscillator output signal. Its frequency is directly proportional to the time constant of the
external R (R
) and internal C. Figure 11-3 shows only the logical relation of RCCLK to OSC1 and may
EXT
not represent the actual circuitry.
11.3.1.4 Internal Oscillator Clock (INTCLK)
INTCLK is the internal oscillator output signal. INTCLK is software selectable to be nominally 12.8 MHz,
8.0 MHz, or 4.0 MHz. INTCLK can be digitally adjusted using the oscillator trimming feature of the
OSCTRIM register (see 11.3.2.1 Internal Oscillator Trimming).
11.3.1.5 Bus Clock Times 4 (BUSCLKX4)
BUSCLKX4 is the same frequency as the input clock (XTALCLK, RCCLK, or INTCLK). This signal is
driven to the SIM module and is used during recovery from reset and stop and is the clock source for the
COP module.
11.3.1.6 Bus Clock Times 2 (BUSCLKX2)
The frequency of this signal is equal to half of the BUSCLKX4. This signal is driven to the SIM for
generation of the bus clocks used by the CPU and other modules on the MCU. BUSCLKX2 will be divided
by two in the SIM. The internal bus frequency is one fourth of the XTALCLK, RCCLK, or INTCLK
frequency.
11.3.2 Internal Oscillator
The internal oscillator circuit is designed for use with no external components to provide a clock source
with a tolerance of less than ±25% untrimmed. An 8-bit register (OSCTRIM) allows the digital adjustment
to a tolerance of ACC
The internal oscillator is capable of generating clocks of 12.8 MHz, 8.0 MHz, or 4.0 MHz (INTCLK)
resulting in a bus frequency (INTCLK divided by 4) of 3.2 MHz, 2.0 MHz, or 1.0 MHz respectively. The
bus clock is software selectable and defaults to the 1.0-MHz bus out of reset. Users can increase the bus
frequency based on the voltage range of their application.
Freescale Semiconductor95
. See the oscillator characteristics in the Electrical section of this data sheet.
INT
MC68HC908QB8 Data Sheet, Rev. 1
Oscillator Module (OSC)
Figure 11-3 shows how BUSCLKX4 is derived from INTCLK and OSC2 can output BUSCLKX4 by setting
OSC2EN.
11.3.2.1 Internal Oscillator Trimming
OSCTRIM allows a clock period adjustment of +127 and –128 steps. Increasing the OSCTRIM value
increases the clock period, which decreases the clock frequency. Trimming allows the internal clock
frequency to be fine tuned to the target frequency.
All devices are factory programmed with a trim value that is stored in FLASH memory at location $FFC0.
This trim value is not automatically loaded into OSCTRIM register. User software must copy the trim value
from $FFC0 into OSCTRIM if needed. The factory trim value provides the accuracy required for
communication using force monitor mode. Trimming the device in the user application board will provide
the most accurate trim value. See Oscillator Characteristics in the Electrical Chapter of this data book for
additional information on factory trim.
11.3.2.2 Internal to External Clock Switching
When external clock source (external OSC, RC, or XTAL) is desired, the user must perform the following
steps:
1.For external crystal circuits only, configure OSCOPT[1:0] to external crystal. To help precharge an
external crystal oscillator, momentarily configure OSC2 as an output and drive it high for several
cycles. This can help the crystal circuit start more robustly.
2.Configure OSCOPT[1:0] and ECFS[1:0] according to 11.8.1 Oscillator Status and Control Register.
The oscillator module control logic will then enable OSC1 as an external clock input and, if the
external crystal option is selected, OSC2 will also be enabled as the clock output. If RC oscillator
option is selected, enabling the OSC2 output may change the bus frequency.
3.Create a software delay to provide the stabilization time required for the selected clock source
(crystal, resonator, RC). A good rule of thumb for crystal oscillators is to wait 4096 cycles of the
crystal frequency; i.e., for a 4-MHz crystal, wait approximately 1 ms.
4.After the stabilization delay has elapsed, set ECGON.
After ECGON set is detected, the OSC module checks for oscillator activity by waiting two external clock
rising edges. The OSC module then switches to the external clock. Logic provides a coherent transition.
The OSC module first sets ECGST and then stops the internal oscillator.
11.3.2.3 External to Internal Clock Switching
After following the procedures to switch to an external clock source, it is possible to go back to the internal
source. By clearing the OSCOPT[1:0] bits and clearing the ECGON bit, the external circuit will be
disengaged. The bus clock will be derived from the selected internal clock source based on the ICFS[1:0]
bits.
11.3.3 External Oscillator
The external oscillator option is designed for use when a clock signal is available in the application to
provide a clock source to the MCU. The OSC1 pin is enabled as an input by the oscillator module. The
clock signal is used directly to create BUSCLKX4 and also divided by two to create BUSCLKX2.
In this configuration, the OSC2 pin cannot output BUSCLKX4. The OSC2EN bit will be forced clear to
enable alternative functions on the pin.
MC68HC908QB8 Data Sheet, Rev. 1
96Freescale Semiconductor
Functional Description
11.3.4 XTAL Oscillator
The XTAL oscillator circuit is designed for use with an external crystal or ceramic resonator to provide an
accurate clock source. In this configuration, the OSC2 pin is dedicated to the external crystal circuit. The
OSC2EN bit has no effect when this clock mode is selected.
In its typical configuration, the XTAL oscillator is connected in a Pierce oscillator configuration, as shown
in Figure 11-2. This figure shows only the logical representation of the internal components and may not
represent actual circuitry.
The oscillator configuration uses five components:
•Crystal, X
•Fixed capacitor, C
•Tuning capacitor, C2 (can also be a fixed capacitor)
•Feedback resistor, R
•Series resistor, RS (optional)
1
1
B
NOTE
The series resistor (R
) is included in the diagram to follow strict Pierce
S
oscillator guidelines and may not be required for all ranges of operation,
especially with high frequency crystals. Refer to the oscillator
characteristics table in the Electricals section for more information.
SIMOSCEN (INTERNAL SIGNAL) OR
OSCENINSTOP (BIT LOCATED IN
CONFIGURATION REGISTER)
MCU
C
1
XTALCLK
OSC2OSC1
R
R
B
X
1
S
C
2
See the electrical section for details.
BUSCLKX2BUSCLKX4
÷ 2
Figure 11-2. XTAL Oscillator External Connections
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor97
Oscillator Module (OSC)
11.3.5 RC Oscillator
The RC oscillator circuit is designed for use with an external resistor (R
) to provide a clock source with
EXT
a tolerance within 25% of the expected frequency. See Figure 11-3.
The capacitor (C) for the RC oscillator is internal to the MCU. The R
value must have a tolerance of
EXT
1% or less to minimize its effect on the frequency.
In this configuration, the OSC2 pin can be used as general-purpose input/output (I/O) port pins or other
alternative pin function. The OSC2EN bit can be set to enable the OSC2 output function on the pin.
Enabling the OSC2 output can affect the external RC oscillator frequency, f
SIMOSCEN (INTERNAL SIGNAL) OR
OSCENINSTOP (BIT LOCATED IN
CONFIGURATION REGISTER)
EXTERNAL RC
EN
OSCILLATOR
MCU
INTCLK
RCCLK
0
1
OSCOPT = EXTERNAL RC SELECTED
BUSCLKX4
÷ 2
1
0
ALTERNATIVE
PIN FUNTION
RCCLK
BUSCLKX2
.
OSC2EN
OSC1
V
DD
R
EXT
OSC2 — AVAILABLE FOR ALTERNATIVE PIN FUNCTION
See the electricals section for component value.
Figure 11-3. RC Oscillator External Connections
11.4 Interrupts
There are no interrupts associated with the OSC module.
11.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
11.5.1 Wait Mode
The OSC module remains active in wait mode.
11.5.2 Stop Mode
The OSC module can be configured to remain active in stop mode by setting OSCENINSTOP located in
a configuration register.
MC68HC908QB8 Data Sheet, Rev. 1
98Freescale Semiconductor
OSC During Break Interrupts
11.6 OSC During Break Interrupts
There are no status flags associated with the OSC module.
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
11.7 I/O Signals
The OSC shares its pins with general-purpose input/output (I/O) port pins. See Figure 11-1 for port
location of these shared pins.
11.7.1 Oscillator Input Pin (OSC1)
The OSC1 pin is an input to the crystal oscillator amplifier, an input to the RC oscillator circuit, or an input
from an external clock source.
When the OSC is configured for internal oscillator, the OSC1 pin can be used as a general-purpose
input/output (I/O) port pin or other alternative pin function.
11.7.2 Oscillator Output Pin (OSC2)
For the XTAL oscillator option, the OSC2 pin is the output of the crystal oscillator amplifier.
When the OSC is configured for internal oscillator, external clock, or RC, the OSC2 pin can be used as a
general-purpose I/O port pin or other alternative pin function. When the oscillator is configured for internal
or RC, the OSC2 pin can be used to output BUSCLKX4.
Table 11-1. OSC2 Pin Function
Option OSC2 Pin Function
XTAL oscillatorInverting OSC1
External clock General-purpose I/O or alternative pin function
Internal oscillator
or
RC oscillator
Controlled by OSC2EN bit
OSC2EN = 0: General-purpose I/O or alternative pin function
OSC2EN = 1: BUSCLKX4 output
MC68HC908QB8 Data Sheet, Rev. 1
Freescale Semiconductor99
Oscillator Module (OSC)
11.8 Registers
The oscillator module contains two registers:
•Oscillator status and control register (OSCSC)
•Oscillator trim register (OSCTRIM)
11.8.1 Oscillator Status and Control Register
The oscillator status and control register (OSCSC) contains the bits for switching between internal and
external clock sources. If the application uses an external crystal, bits in this register are used to select
the crystal oscillator amplifier necessary for the desired crystal. While running off the internal clock source,
the user can use bits in this register to select the internal clock source frequency.
Bit 7654321Bit 0
Read:
OSCOPT1 OSCOPT0ICFS1ICFS0ECFS1ECFS0ECGON
Write:
Reset:0 0000000
= Unimplemented
Figure 11-4. Oscillator Status and Control Register (OSCSC)
ECGST
OSCOPT1:OSCOPT0 — OSC Option Bits
These read/write bits allow the user to change the clock source for the MCU. The default reset
condition has the bus clock being derived from the internal oscillator. See 11.3.2.2 Internal to External
Clock Switching for information on changing clock sources.
OSCOPT1OSCOPT0 Oscillator Modes
00Internal oscillator (frequency selected using ICFSx bits)
01External oscillator clock
10External RC
11External crystal (range selected using ECFSx bits)
ICFS1:ICFS0 — Internal Clock Frequency Select Bits
These read/write bits enable the frequency to be increased for applications requiring a faster bus clock
when running off the internal oscillator. The WAIT instruction has no effect on the oscillator logic.
BUSCLKX2 and BUSCLKX4 continue to drive to the SIM module.
ICFS1ICFS0Internal Clock Frequency
004.0 MHz — default reset condition
018.0 MHz
1012.8 MHz
11Reserved
MC68HC908QB8 Data Sheet, Rev. 1
100Freescale Semiconductor
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