Pre-release, Alpha customers only
Initial Public Release
Added output voltage maximum value and note to clarify in Table 10-1; also removed overall
life expectancy note, since life expectancy is dependent on customer usage and must be
determined by reliability engineering. Clarified value and unit measure for Maximum allowed
in Table 10-3. Corrected note ab ou t av erag e v alu e for Flash Data Retentio n in Table 10-4.
P
D
Added new RoHS-compliant orderable part numbers in Table 13-1.
Please see http://www.freescale.com for the most current Data Sheet revision.
56F8366 Technical Data, Rev. 2.0
2 Freescale Semiconductor
Preliminary
56F8366/56F8166 Ge neral Description
Note: Features in italics are NOT available in the 56F8166 device.
• Up to 60 MIPS at 60MHz core frequency
• DSP and MCU functionality in a unified,
C-efficient architecture
• Access up to 1MB of off -chip program and data memor y
• Chip Select Logic for glueless interface to ROM and
SRAM
• 512KB of Program Flash
• 4KB of Program RAM
• 32KB of Data Flash
• 32KB of Data RAM
• 32KB of Boot Flash
• Up to two 6-channel PWM modules
• Four 4-channel, 12-bit ADCs
EMI_MODE
6
3
3
6
3
4
4
4
5
4
4
4
4
2
2
PWM Outputs
Current Sense Inpu ts
or GPIOC
Fault Inputs
PWM Outputs
Current Sense Inp uts
or GPIOD
Fault Inputs
AD0
ADCA
AD1
VREF
AD0
AD1
Temp_Sense
Quadrature
Decoder 0 or
Quad
Time r A or
GPIOC
Quadrature
Decoder 1 or
Quad
Timer B or
SPI1 or
GPIOC
Quad
Timer C or
GPIOE
Quad
Timer D or
GPIOE
FlexCAN
Program Memory
ADCB
Decoding
Peripherals
PWMA
PWMB
Memory
256K x 16 Flash
2K x 16 RAM
Boot ROM
16K x 16 Flash
Data Memory
16K x 16 Flash
16K x 16 RAM
SPI0 or
GPIOE
4
RSTO
Program Controller
Hardware Looping Unit
Device Selects
SCI1 or
GPIOD
2
RESET
and
XDB2
XAB1
XAB2
PAB
PDB
CDBR
CDBW
Peripheral
SCI0 or
GPIOE
EXTBOOT
PAB
PDB
CDBR
CDBW
5
JTAG/
EOnCE
Port
Address
Generation Unit
IPBus Bridge (IPBB)
RW
Control
COP/
Watchdog
2
Controller
IRQA
• Temperature Sensor
• Up to two Quadrature Decoders
• Optional On-Chip Regulator
• Up to two FlexCAN modules
• Two Serial Communication Interfaces (SCIs)
• Up to two Serial Peripheral Interfaces (SPIs)
• Up to four General Purpose Quad Timers
• Computer Operating Properly (COP) / Watchdog
• JTAG/Enhanced On-Chip Emulation (OnCE™) for
unobtrusive, real-time debugging
•Four 36-bit accumu l ators, including ext ension bits
•Arithmetic and logic mult i-bit shifter
•Parallel instruction set with unique DSP addressing modes
•Hardware DO and REP loops
•Three internal address buses
•Four internal data bus es
•Instruction set supports both DSP and controller functions
•Controller-style addressing modes and instructions for compact code
•Efficient C compiler and local variable support
•Software subroutine and interrupt stack with depth limited only by memory
•JTAG/EOnCE debug programming interface
56F8366/56F8166 Features
1.1.2Differences Between Devices
Table 1-1 outlines the key differences between the 56F8366 and 56F8166 devices.
Table 1-1 Device Differences
Feature56F836656F8166
Guaranteed Speed60MHz/60 MIPS40MHz/40 MIPS
Program RAM4KBNot Available
Data Flash8KBNot Available
PWM2 x 61 x 6
CAN2Not Available
Quad Timer42
Quadrature Decoder2 x 41 x 4
Temperature Sensor1Not Available
Dedicated GPIO—5
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor5
Preliminary
1.1.3Memory
Note:Features in italics are NOT available in the 56F8166 device.
•Harvard architecture permits as many as three simultaneous accesses to program and data memory
•Flash security protection feature
•On-chip memory, including a low-cost, high-volume Flash solution
— 512KB of Program Flash
— 4KB of Program RAM
— 32KB of Data Flash
—32KB of Data RAM
— 32KB of Boot Flash
•Off-chip memory expansion capabilities programmable for 0 - 30 wait states
— Access up to 1MB of program memory or 1MB of data memory
— Chip select logic for glueless interface to ROM and SRAM
•EEPROM emulation capability
1.1.4Peripheral Circuits for 56F8366
Note:Features in italics are NOT available in the 56F8166 device.
•Pulse Width Modulator:
— In the 56F8366, two Pulse W idth Modulator modules, each with si x PWM outputs, three Cur rent Sense
inputs, and three Fault inputs; fault-tolerant design with dead time insertion; supports both
center-aligned and edge-aligned modes
— In the 56F8166, one Pulse Wid th Modulator module with six PWM outpu ts, three Current Sen se inputs,
and three Fault inp uts ; f ault-tolerant desi gn with dead time inserti on; supports both center -aligned and
edge-align ed modes
•Four 12-bit, Analog-to-Digital Converters (ADCs), which support four simultaneous conversions with
quad, 4-pin multiplexed inputs; ADC and PWM modules can be synchronized through Ti mer C, channels
2 and 3
•Quadrature Decoder:
— In the 56F8366, two four-input Quadrature Decoders or two additional Quad Ti mers
— In the 56F8166, one four-input Quadrature Decoder, which works in conjunction with Quad Timer A
•Temperature Sensor diode can be connect ed, on the boar d , to any of the ADC input s to monitor the on-chip
temperature
•Quad Timer:
— In the 56F8366, four dedicated general-purpose Quad Timers totaling three dedicated pins: Timer C
with one pin and Timer D with two pins
— In the 56F8166, two Quad Timers; Timer A and Timer C both work in conjunction with GPIO
•Optional On-Chip Regulator
•Up to two FlexCAN (CAN Version 2.0 B-compliant ) modules with 2-pin port for transmit and receive
56F8366 Technical Data, Rev. 2.0
6 Freescale Semiconductor
Preliminary
Device Description
•Two Serial Communication Interfaces (SCIs), each with two pins (or four additional GPIO lines)
•Up to two Serial Peripheral Interfaces (SPIs), both with configurable 4-pin port (or eight additional GPIO
lines)
— In the 56F8366, SPI1 can also be used as Quadrature Decoder 1 or Quad Timer B
— In the 56F8166, SPI1 can alternately be used only as GPIO
•JTAG/Enhanced On-Chip Emulation (OnCE) for unobtrusive, processor speed-independent, real-time
debugging
•Software-programmable, Phase Lock Loop (PLL)-based frequency synthesizer for the core clock
1.1.5Energy Information
•Fabricated in high-density CMOS with 5V-tolerant, TTL-compatible digital inputs
•On-board 3.3V down to 2.6V voltage regulator for powering internal logic and memories; can be disabled
•On-chip regulators for digital and analog circuitry to lower cost and reduce noise
•Wait and Stop modes available
•ADC smart power management
•Each peripheral can be individually disabled to save power
1.2 Device Description
The 56F8366 and 56F8166 are members of the 56800E core-based family of controllers. Each combines,
on a single chip, the processing power of a Digital Signal Processor (DSP) and the functionality of a
microcontroller with a flexible set of peripherals to create an extremely cost-effective solution. Because
of its low cost, configuration flexibility, and compact program code, the 56F8366 and 56F8166 are
well-suited for many applications. The devices include many peripherals that are especially useful for
motion control, smart appliances, steppers, encoders, tachometers, limit switches, power supply and
control, automotive control (56F8366 only), engine management, noise suppression, remote utility
metering, industrial control for power, lighting, and automation applications.
The 56800E core is based on a Harvard-style architecture consisting of three execution units operating in
parallel, allowing as many as six operations per instruction cycle. The MCU-style programming model and
optimized instruction set allow straightforward generation of efficient, compact DSP and control code.
The instruction set is also highly efficient for C/C++ Compilers to enable rapid development of optimized
control applications.
The 56F8366 and 56F8166 support program execution from either internal or external memories. Two
data operands can be accessed from the on-chip data RAM per instruction cycle. These devices also
provides two external dedicated interrupt lines and up to 62 General Purpose Input/Output (GPIO) lines,
depending on peripheral configuration.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor7
Preliminary
1.2.156F8366 Features
The 56F8366 hybrid controller includes 512KB of Program Flash and 32KB of Data Flash (each
programmable through the JTAG port) with 4KB of Program RAM and 32KB of Data RAM. It also
supports program execution from external memory.
A total of 32KB of Boot Flash is incorporated for easy customer inclusion of field-programmable software
routines that can be used to program the main Program and Data Flash memory areas. Both Program and
Data Flash memories can be independently bulk erased or erased in pages. Program Flash page erase size
is 1KB. Boot and Data Flash page erase size is 512 bytes. The Boot Flash memory can also be either bulk
or page erased.
A key application-specific feature of the 56F8366 is the inclusion of two Pulse Width Modulator (PWM)
modules. These modules each incorporate three complementary, individually programmable PWM signal
output pairs (each module is also capable of supporting six independent PWM functions, for a total of 12
PWM outputs) to enhance motor control functionality. Complementary operation permits programmable
dead time insertion, distortion correction via current sensing by software, and separate top and bottom
output polarity control. The up-counter value is programmable to support a continuously variable PWM
frequency. Edge-aligned and center-aligned synchronous pulse width control (0% to 100% modulation) is
supported. The device is capable of controlling most motor types: ACIM (AC Induction Motors); both
BDC and BLDC (Brush and Brushless DC motors); SRM and VRM (Switched and Variable Reluctance
Motors); and stepper motors. The PWMs incorporate fault protection and cycle-by-cycle current limiting
with sufficient output drive capability to directly drive standard optoisolators. A “smoke-inhibit”,
write-once protection feature for key para meters is also included. A patented PWM waveform distortion
correction circuit is also provided. Each PWM is double-buffered and includes interrupt controls to permit
integral reload rates to be programmable from 1 to 16. The PWM modules provide reference outputs to
synchronize the Analog-to-Digital Converters through two channels of Quad Timer C.
The 56F8366 incorporates two Quadrature Decoders capable of capturing all four transitions on the
two-phase inputs, permitting generation of a number proportional to actual position. Speed computation
capabilities accommodate both fast- and slow-moving shafts. An integrated watchdog timer in the
Quadrature Decoder can be programmed with a time-out value to alert when no shaft motion is detected.
Each input is filtered to ensure only true transitions are recorded.
This controller also provides a full set of standard programmable peripherals that include two Serial
Communications Interfaces (SCIs), two Serial Peripheral Interfaces (SPIs), and four Quad Timers. Any of
these interfaces can be used as General-P urpose Input/Outputs (GPIOs) if that function is not required.
Two Flex Controller Area Network (FlexCAN) interfaces (CAN Version 2.0 B-compliant) and an internal
interrupt controller are included on the 56F8366.
1.2.256F8166 Features
The 56F8166 hybrid controller includes 512KB of Program Flash, programmable through the JTAG port,
with 32KB of Data RAM. It also supports program execution from external memory.
A total of 32KB of Boot Flash is incorporated for easy customer inclusion of field-programmable software
routines that can be used to program the main Program Flash memory area, which can be independently
56F8366 Technical Data, Rev. 2.0
8 Freescale Semiconductor
Preliminary
Award-Winning Development Environment
bulk erased or erased in pages. Program Flash page erase size is 1KB. Boot Flash page erase size is 512
bytes and the Boot Flash memory can also be either bulk or page erased.
A key application-specific feature of the 56F8166 is the inclusion of one Pulse Width Modulator (PWM)
module. This module incorporates three complementary, individually programmable PWM signal output
pairs and can also support six independent PWM functions to enhance motor control functionality.
Complementary operation permits programmable dead time insertion, distortion correction via current
sensing by software, and separate top and bottom output polarity control. The up-counter value is
programmable to support a continuously variable PWM frequency. Edge-aligned and center-aligned
synchronous pulse width control (0% to 100% modulation) is supported. The device is capable of
controlling most motor types: ACIM (AC Induction Motors); both BDC and BLDC (Brush and Brushless
DC motors); SRM and VRM (Switched and Variable Reluctance Motors); and stepper motors. The PWM
incorporates fault protection and cycle-by-cycle current limiting with sufficient output drive capability to
directly drive standard optoisolators. A “smoke-inhibit”, write-once protection feature for key parameters
is also included. A patented PWM waveform distortion correction circuit is also provided. Each PWM is
double-buffered and includes interrupt controls to permit integral reload rates to be programmable from 1
to 16. The PWM module provides reference outputs to synchronize the Analog-to-Digital Converters
through two channels of Quad Timer C.
The 56F8166 incorporates a Quadrature Decoder capable of capturing all four transitions on the two-phase
inputs, permitting generation of a number proportional to actual position. Speed computation capabilities
accommodate both fast- and slow-moving shafts. An integrated watchdog timer in the Quadrature Decoder
can be programmed with a time-out value to alert when no shaft motion is detected. Each input is filtered
to ensure only true transitions are recorded.
This controller also provides a full set of standard programmable peripherals that include two Serial
Communications Interfaces (SCIs); two Serial Peripheral Interfaces (SPIs); and two Quad Timers. Any of
these interfaces can be used as General Purpose Input/Outputs (GPIOs) if that function is not required. An
internal interrupt controller is also a part of the 56F8166.
1.3 Award-Winning Development Environment
Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use
component-based software application creation with an expert knowledge system.
The CodeWarrior Integrated Development Environment is a sophisticated tool for code navigation,
compiling, and debugging. A complete set of evaluation modules (EVMs) and development system cards
will support concurrent engineering. Together, PE, CodeWarrior and EVMs create a complete, scalable
tools solution for easy, fast, and efficient development.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor9
Preliminary
1.4 Architecture Block Diagram
Note:Features in italics are NOT available in the 56F8166 device and are shaded in the following figures.
The 56F8366/56F8166 architecture is shown in Figure 1-1 and Figure 1-2. Figure 1-1 illustrates how the
56800E system buses communicate with internal memories, the external memory interface and the IPBus
Bridge. Table 1-2 lists the internal buses in the 56800E architecture and provides a brief description of
their function. Figure 1-2 shows the peripherals and control blocks connected to the IPBus Bridge. The
figures do not show the on-board regulator and power and ground signals. They also do not show the
multiplexing between peripherals or the dedicated GPIOs. Please see Part 2, Signal/Connection
Descriptions, to see which signals are multiplexed with those of other peripherals.
Also shown in Figure 1-2 are connections between the PWM, Timer C and ADC blocks. These
connections allow the PWM and/or Timer C to control the timing of the start of ADC conversions. The
Timer C channel indicated can generate periodic start (SYNC) signals to the ADC to start its conversions.
In another operating mode, the PWM load interrupt (SYNC output) signal is routed internally to the Timer
C input channel as indicated. The timer can then be used to introduce a controllable delay before
generating its output signal. The timer output then triggers the ADC. To fully understand this interaction,
please see the 56F8300 Peripheral User Manual for clarification on the opera tion of all three of these
peripherals.
56F8366 Technical Data, Rev. 2.0
10 Freescale Semiconductor
Preliminary
Architecture Block Diagram
5
JTAG / EOnCE
Boot
Flash
CHIP
TAP
Controller
TAP
Linking
Module
External
JTAG
Port
pdb_m[15:0]
pab[20:0]
cdbw[31:0]
56800E
xab1[23:0]
xab2[23:0]
cdbr_m[31:0]
Program
Flash
Program
RAM
EMI
Data RAM
Data Flash
17
16
Address
Data
6
Control
xdb2_m[15:0]
To Flash
IPBus
Con trol Logic
Bridge
NOT available on the 56F8166 device.
Flash
Memory
Module
IPBus
Figure 1-1 System Bus Interfaces
Note:Flash memories are encapsulated within the Flash Memory (FM) Module. Flash control is
accomplished by the I/O to the FM over the peripheral bus, while reads and writes are completed
between the core and the Flash memories.
Note:The primary data RAM port is 32 bits wide. Other data ports are 16 bits.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor11
Preliminary
To/F
rom
IPB
us Bridge
CLKGEN
(OSC/PLL)
Interrupt
Controller
Low Voltage Interrupt
Timer A
POR & LVI
4
2
Quadrature Decoder 0
Timer D
Timer B
4
Quadrature Decoder 1
System POR
SIM
COP Reset
COP
FlexCAN
FlexCAN2
RESET
2
2
SPI 1
PWMA
12
GPIOA
GPIOB
PWMB
13
GPIOC
GPIOD
GPIOE
GPIOF
4
2
2
SPI0
SCI0
SCI1
IPBus
NOT available on the 56F8166 device.
Figure 1-2 Peripheral Subsystem
ch3ich2i
Timer C
ch2och3o
1
8
ADCB
ADCA
TEMP_SENSE
Note: ADCA and ADCB use the same voltage
reference circuit with V
V
, and V
REFN
REFLO
REFH
pins.
8
1
, V
REFP, VREFMID
,
56F8366 Technical Data, Rev. 2.0
12 Freescale Semiconductor
Preliminary
Architecture Block Diagram
Table 1-2 Bus Signal Names
NameFunction
Program Memory Interface
pdb_m[15:0]Program data bus for instruction word fetches or read operations.
cdbw[15:0]Primary core data bus used for program memory writes. (Only these 16 bits of the cdbw[31:0] bus
are used for writes to program memory.)
pab[20:0]Program memory address bus. Data is returned on pdb_m bus.
Primary Data Memory Interface Bus
cdbr_m[31:0] Primary core data bus for memory reads. Addressed via xab1 bus.
cdbw[31:0]Primary core data bus for memory writes. Addressed via xab1 bus.
xab1[23:0]
Primary data address bus. C apable of add ressing bytes
on cdbw and returned on cdbr_m. Also used to access memory-mapped I/O.
Secondary Data Memory Interface
xdb2_m[15:0] Secondary data bus used for secondary data address bus xab2 in the dual memory reads.
xab2[23:0]Secondary data address bus used for the second of two simultaneous accesses. Capable of
addressing only words. Data is returned on xdb2_m.
Peripheral Interface Bus
IPBus [15:0]Peripheral bus accesses all on-chip peripherals registers. This bus operates at the same clock rate
as the Primary Data Memory and therefore generates no delays when accessing the processor.
Write data is obtained from cdbw. Read data is provided to cdbr_m.
1. Byte accesses can only occur in the bottom half of the memory address space. The MSB of the address will be forced
to 0.
1
, words, and long data types. Data is written
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor13
Preliminary
1.5 Product Documentation
The documents in Table 1-3 are required for a complete description and proper design with the
56F8366/56F8166 devices. Documentation is available from local Freescale distributors, Freescale
semiconductor sales offices, Freescale Literature Distribution Centers, or online at
http://www.freescale.com.
Table 1-3 Chip Documentation
TopicDescriptionOrder Number
DSP56800E
Reference Manual
56F8300 Peripheral User ManualDetailed description of peripherals of the 56F8300
56F8300 SCI/CAN Bootloader
User Manual
56F8366/56F8166
Technical Data Sheet
56F8366
Errata
Detailed description of the 56800E family architecture,
and 16-bit controller core processor and the instruction
set
devices
Detailed description of the SCI/CAN Bootloaders
56F8300 family of devices
Electrical and timing specifications, pin descriptions, and
package descriptions (this document)
Details any chip issues that might be presentMC56F8366E
1.6 Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
“asserted”A high true (active high) signal is high or a low true (active low) signal is low.
“deasserted”A high true (active high) signal is low or a low true (active low) signal is high.
This is used to indicate a signal that is active when pulled low. For example, the RESET pin is
active when low.
DSP56800ERM
MC56F8300UM
MC56F83xxBLUM
MC56F8366
MC56F8166E
Examples:Signal/SymbolLogic StateSignal State
PINTrueAssertedVIL/V
PINFalseDeassertedVIH/V
PINTrueAssertedVIH/V
PINFalseDeassertedVIL/V
1. Val ues for VIL, VOL, VIH, and VOH ar e def i ne d by i ndividual product specificati on s.
56F8366 Technical Data, Rev. 2.0
14 Freescale Semiconductor
Voltage
1
OL
OH
OH
OL
Preliminary
Introduction
Part 2 Signal/Connection Descriptions
2.1 Introduction
The input and output signals of the 56F8366 and 5 6F8166 are organized into functional groups, as detailed
in Table 2-1 and as illustrated in Figure 2-1. In Table 2-2, each table row describes the signal or signals
present on a pin.
Table 2-1 Functional Group Pin Allocations
Functional Group
Power (V
Power Option Control11
Ground (VSS or V
Supply Capacitors
PLL and Clock44
Address Bus1717
Data Bus1616
Bus Control66
Interrupt and Program Control66
Pulse Width Modulator (PWM) Ports2513
Serial Peripheral Interface (SPI) Port 044
Serial Peripheral Interface (SPI) Port 1—4
Quadrature Decoder Port 0
Quadrature Decoder Port 1
Serial Communications Interface (SCI) Ports44
DD
or V
)99
DDA
)66
SSA
1
& V
PP
2
3
Number of Pins in Package
56F836656F8166
66
44
4—
CAN Ports2—
Analog to Digital Converter (ADC) Ports2121
Quad Timer Module Ports31
JTAG/Enhanced On-Chip Emulation (EOnCE)55
Temperature Sense1—
Dedicated GPIO—5
1. If the on-chip regulator is disabled, the V
2. Alternately, can function as Quad Timer pins or GPIO
3. Pins in this section can function as Quad Timer, SPI #1, or GPIO
Quadrature
Decoder 1 or
Quad Timer B
or SPI 1 or
GPIO
PWMA or
GPIO
External
Data Bus
or GPIO
External
Bus
Control or
GPIO
SCI 0 or
GPIO
SCI 1
or GPIO
JTAG/
EOnCE
Port
D0 - D6 (GPIOF9 - 15)
D7 - D15 (GPIOF0 - 8)
RD
WR
PS / CS0 (GPIOD8)
DS / CS1 (GPIOD9)
GPIOD0 (CS2, CAN2_TX)
GPIOD1 (CS3
, CAN2_RX
TXD0 (GPIOE0)
RXD0 (GPIOE1)
TXD1 (GPIOD6)
RXD1 (GPIOD7)
TCK
TMS
TDI
TDO
TRST
7
9
PWMB0 - 5
6
ISB0 - 2 (GPIOD10 - 12)
3
FAULTB0 - 3
4
PWMB or
GPIO
1
ANA0 - 7
1
1
1
1
1
1
1
1
8
V
5
8
1
1
1
1
2
REF
ANB0 - 7
TEMP_SENSE
CAN_RX
CAN_TX
TC0 (GPIOE8)
TD0 - 1 (GPIOE10 - 11)
ADCA
ADCB
Temperature
Sensor
FlexCAN
QUAD
TIMER C and
D or GPIO
1
IRQA
1
1
1
1
1
1
1
1
1
1
1
IRQB
EXTBOOT
EMI_MODE
RESET
RSTO
INTERRUPT/
PROGRAM
CONTROL
Figure 2-1 56F8366 Signals Identified by Functional Group1 (144-pin LQFP)
1. Alternate pin functionality is shown in parenthesis; pin direction/type shown is the default functionality.
56F8366 Technical Data, Rev. 2.0
16 Freescale Semiconductor
Preliminary
Power
Power
Power
Ground
Ground
Other
Supply
Ports
PLL
and
Clock
V
V
DDA_ADC
V
DDA_OSC_PLL
V
SSA_ADC
OCR_DIS
V
1 - V
CAP
V
1 & VPP2
PP
CLKMODE
EXTAL
DD_IO
V
SS
CAP
XTAL
CLKO
Introduction
7
1
1
5
PHASEA0 (TA0, GPIOC4)
1
PHASEB0 (TA1, GPIOC5)
1
INDEX0 (TA2, GPIOC6)
1
HOME0 (TA3, GPIOC7)
1
Quadrature
Decoder 0
or Quad
Timer A or
GPIO
1
56F8166
1
4
4
2
1
1
1
1
SCLK0
1
MOSI0
1
MISO0
1
SS0
1
(SCLK1, GPIOC0)
1
(MOSI1, GPIOC1)
1
(MISO1, GPIOC2)
1
(S
1
S1, GPIOC3)
SPI0 or
GPIO
(GPIOE7)
SPI 1 or
GPIO
External
Address
Bus
or GPIO
External
Data Bus
or GPIO
External
Bus
Control
or GPIO
SCI 0 or
GPIO
SCI 1
or GPIO
JTAG/
EOnCE
Port
A0 - A5 (GPIOA8 -
A6 - A7 (GPIOE2 - 3)
A8 - A15 (GPIOA0 - 7)
GPIOB0 (A16)
D0-D6 (GPIOF9 - 15)
D7 - D15 (GPIOF0 -
RD
WR
PS (CS0)(GPIOD8)
DS (CS1) (GPIOD9)
GPIOD0 - 1 (CS2 - 3)
TXD0 (GPIOE0)
RXD0 (GPIOE1)
TXD1 (GPIOD6)
RXD1 (GPIOD7)
TCK
TMS
TDI
TDO
TRST
6
3
(GPIOC8 - 10)
GPIO
2
8
1
7
PWMB0 - 5
6
ISB0 - 2 (GPIOD10 - 12)
3
FAULTB0 - 3
4
PWMB or
GPIO
9
ANA0 - 7
8
V
1
1
5
8
REF
ANB0 - 7
ADCA
ADCB
1
1
2
1
1
TC0 (GPIOE8)
1
1
2
(GPIOE10 - 11)
QUAD
TIMER C or
GPIO
1
IRQA
1
1
1
1
1
1
1
1
1
1
1
IRQB
EXTBOOT
EMI_MODE
RESET
RSTO
Interrupt/
Program
Control
Figure 2-2 56F8166 Signals Identified by Functional Group1 (144-pin LQFP)
1. Alternate pin functionality is shown in parenthesis; pin direction/type shown is the default functionality.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor17
Preliminary
2.2 Signal Pins
After reset, each pin is configured for its primary function (listed first). Any alternate functionality must
be programmed.
Note:Signals in italics are NOT available in the 56F8166 device.
If the “State During Reset” lists more than one state for a pin, the first state is the actual reset state. Other
states show the reset condition of the alternate function, which you get if the alternate pin function is
selected without changing the configuration of the alternate peripheral. For example, the A8/GPIOA0 pin
shows that it is tri-stated during reset. If the GPIOA_PER is changed to select the GPIO function of the
pin, it will become an input if no other registers are changed.
Table 2-2 Signal and Package Information for the 144-Pin LQFP
State
Signal NamePin No.Type
During
Reset
Signal Description
V
DD_IO
V
DD_IO
V
DD_IO
V
DD_IO
V
DD_IO
V
DD_IO
V
DD_IO
V
DDA_ADC
V
DDA_OSC_PLL
V
SS
V
SS
V
SS
1SupplyI/O Power — This pin supplies 3.3V power to the ch ip I/O in terface
and also the Processor core th rought the on-c hip voltage reg ulator,
16
31
38
66
84
119
102SupplyADC Power — This pin supplies 3. 3V po w er to th e ADC m odu le s.
80SupplyOscillator and PLL Power — This pin supplies 3.3V power to the
27SupplyV
37
63
if it is enabled.
It must be connected to a clean analog power supply.
OSC and to the internal regulator that in turn supplies the Phase
Locked Loop. It must be connected to a clean analog power
supply.
— These pins provide ground for chip logic and I/O drivers.
SS
V
SS
V
SS
18 Freescale Semiconductor
69
144
56F8366 Technical Data, Rev. 2.0
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Pins
Signal Description
V
SSA_ADC
103SupplyADC Analog Ground — This pin supplies an analog ground to the
ADC modules.
OCR_DIS79InputInputOn-Chip Regulator Disable —
Tie this pin to V
to enable the on-chip regulator
SS
Tie this pin to VDD to disable the on-chip regulator
This pin is intended to be a static DC signal from power-up to
shut down. Do not try to toggle this pin for power savings
during operation.
151SupplySupplyV
V
CAP
1 - 4 — When OCR_DIS is tied to VSS (regulator enabled),
CAP
connect eachpin to a 2.2µF or greater byp asscapacitor in order t o
2128
V
CAP
V
383
CAP
V
415
CAP
bypass the core logic voltage regulator, required for proper chip
operation. When OCR_DIS is tied to V
these pins become V
DD_CORE
and should be connected to a
(regulator disabled),
DD
regulated 2.5V power supply.
Note: This bypass is required even if the chip is power ed with
an external supply.
V
1125InputInputVPP1 - 2 — These pins should be left unconnected as an open
PP
circuit for normal functionality.
VPP22
CLKMODE87InputInputClock Input Mode Selection — This input det ermines the functi on
of the XTAL and EXTAL pins.
1 = External clock input on XTAL is used to directly drive the input
clock of the chip. The EXTAL pin should be grounded.
0 = A crystal or ceramic resonator should be connected between
XTAL and EXTAL.
EXTAL82InputInputExternal Crystal Oscillator Input — This input can be connected
to an 8MHz external cryst al. Tie this pin l ow if XT AL i s driven by a n
external clock source.
XTAL81Input/
Output
Chip-drivenCrystal Oscillator Output — This output connects the internal
crystal oscillator output to an external crystal.
If an external clock is used, XTAL must be used as the input and
EXTAL connected to GND.
The input clock can be selected to provide the clock directly to the
core. This input clock can also be selected as the input clock for
the on-chip PLL.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor19
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
State
Signal NamePin No.Type
CLKO3OutputTri-StatedClock Output — This pin outputs a buffered clock signal. Using
During
Reset
Signal Description
the SIM CLKO Select Register (SIM_CLKOSR), this pin can be
programmed as any of the following: disabled, CLK_MSTR
(system clock), IPBus clock, oscillator output, prescaler clock and
postscaler clock. O ther si gnals are als o availab le for te st p urposes.
See Part 6.5.7 for details.
A0
(GPIOA8)
A1
(GPIOA9)
A2
(GPIOA10)
A3
(GPIOA11)
A4
(GPIOA12)
A5
(GPIOA13)
138Output
Input/
Output
10
11
12
13
14
Tri-stated
Input
Address Bus — A0 - A5 specify six of the address lines for
external program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), A0–A5 and EMI control signals are tri-stated when the
external bus is inactive.
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
Port A GPIO — These six GPIO pins can be individually
programmed as input or output pins.
After reset, the default state is Address Bus.
To deactivate the internal pull-up resistor, set the appropriate
GPIO bit in the GPIOA_PUR register.
Example: GPIOA8, set bit 8 in the GPIOA_PUR register.
56F8366 Technical Data, Rev. 2.0
20 Freescale Semiconductor
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Pins
Signal Description
A6
(GPIOE2)
A7
(GPIOE3)
A8
17Output
Schmitt
18
19Output
Input/
Output
Tri-stated
Input
Tri-stated
Address Bus — A6 - A7 specify two of the address lines for
external program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), A6–A7 and EMI control signals are tri-stated when the
external bus is inactive.
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
Port E GPIO — These two GPIO pins can be individually
programmed as input or output pins.
After reset, the default state is Address Bus.
To deactivate the internal pull-up resistor, set the appropriate
GPIO bit in the GPIOE_PUR register.
Example: GPIOE2, set bit 2 in the GPIOE_PUR register.
Address Bus— A8 - A15 specify eight of the address lines for
external program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), A8–A15 and EMI control signals are tri-stated when
the external bus is inactive.
(GPIOA0)
A9
(GPIOA1)
A10
(GPIOA2)
A11
(GPIOA3)
A12
(GPIOA4)
A13
(GPIOA5)
A14
(GPIOA6)
A15
(GPIOA7)
20
21
22
23
24
25
26
Schmitt
Input/
Output
Input
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
Port A GPIO — These eight GPIO pins can be individually
programmed as input or output pins.
After reset, the default state is Address Bus.
To deactivate the internal pull-up resistor, set the appropriate
GPIO bit in the GPIOA_PUR register.
Example: GPIOA0, set bit 0 in the GPIOA_PUR register.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor21
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Description
GPIOB0
(A16)
D0
33Schmitt
Input/
Output
Output
59Input/
Output
Input
Tri-stated
Tri-stated
Port B GPIO — This GPIO pin can be programmed as an input or
output pin.
Address Bus — A16 specifies one of the address lines for
external program or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), A16 and EMI control signals are tri-stated when the
external bus is inactive.
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
After reset, the startup state of GPIOB0 (GPIO or address) is
determined as a function of EXTBOOT, EM I_MODE a nd the Fla sh
security setting. See Table 4-4 for further information on when this
pin is configured as an addre ss pin at res et. In al l cas es , this stat e
may be changed by writing to GPIOB_PER.
To deactivate the internal pull-up resistor, set bit 0 in the
GPIOB_PUR register.
Data Bus — D0 - D6 specify part of the data for external program or
data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), D0 - D6 are tri-stated when the external bus is
inactive.
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
(GPIOF9)
D1
(GPIOF10)
D2
(GPIOF11)
D3
(GPIOF12)
D4
(GPIOF13)
D5
(GPIOF14)
D6
(GPIOF15)
22 Freescale Semiconductor
60
72
75
76
77
78
Input/
Output
Input
56F8366 Technical Data, Rev. 2.0
Port F GPIO — These seven GPIO pins can be individually
programmed as input or output pins.
At reset, these pins default to the EMI Data Bus function.
To deactivate the internal pull-up resistor, set the appropriate
GPIO bit in the GPIOF_PUR register.
Example: GPIOF9, set bit 9 in the GPIOF_PUR register.
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Pins
Signal Description
D7
(GPIOF0)
D8
(GPIOF1)
D9
(GPIOF2)
D10
(GPIOF3)
D11
(GPIOF4)
D12
(GPIOF5)
D13
(GPIOF6)
28Input/
Output
Input/
Output
29
30
32
133
134
135
Tri-stated
Input
Data Bus — D7 - D14 specify part of the data for external pro gram
or data memory accesses.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), D7 - D14 are tri-stated when the external bus is
inactive.
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
Port F GPIO — These eight GPIO pins can be individually
programmed as input or output pins.
At reset, these pins default to Data Bus functionality.
To deactivate the internal pull-up resistor, clear the appropriate
GPIO bit in the GPIOF_PUR register.
Example: GPIOF0, clear bit 0 in the GPIOF_PUR register.
D14
(GPIOF7)
D15
(GPIOF8)
Freescale Semiconduc tor23
Preliminary
136
137Input/
Output
Input/
Output
Tri-stated
Input
56F8366 Technical Data, Rev. 2.0
Data Bus — D15 specifie s part of the data fo r ex ter nal pro gra m or
data memory accesses.
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
Port F GPIO — This GPIO pin can be individually programmed as
an input or output pin.
At reset, this pin defaults to the data bus function.
To deactivate the internal pull-up resistor, set bit 8 in the
GPIOF_PUR register.
Table 2-2 Signal and Package Information for the 144-Pin LQFP
State
Signal NamePin No.Type
RD45OutputTri-statedRead Enable — RD is asserted during external memory read
During
Reset
Signal Description
cycles. When RD
and an external device is enabled onto the data bus. When RD
deasserted high, the external data is latched inside the device.
When RD
pins. RD can be connected directly to the OE pin of a static RAM or
ROM.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), RD
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
To deactivate the internal pull-up resistor, set the CTRL bit in the
SIM_PUDR register.
is asserted low, pins D0 - D15 become inputs
is asserted, it qualifies the A0 - A16, PS, DS, and CSn
is tri-stated when the external bus is inactive.
is
WR
PS
(CS0)
44OutputTri-statedWrite Enable — WR is asserted during external memory write
46Output
Tri-stated
cycles. When WR
and the device put s data on th e bus. When WR
the external data is latch ed inside th e externa l device . When WR
asserted, it qualifies the A0 - A16, PS
be connected directly to the WE
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), WR
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
To deactivate the internal pull-up resistor, set the CTRL bit in the
SIM_PUDR register.
Program Memory Select — This signal is actually CS0 in the
EMI, which is programmed at reset for compatibility with the
56F80x PS signal. PS is asserted low for external program
memory access.
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), PS
CS0 resets to provide the PS function as defined on the 56F80x
devices.
is asserted low, pins D0 - D15 become outputs
is deasserted high,
, DS, and CSn pins. WR can
pin of a static RAM.
is tri-sta ted when the external bus is inacti ve.
is tri-stated when the external bus is inactive.
is
(GPIOD8)
24 Freescale Semiconductor
Input/
Output
Input
56F8366 Technical Data, Rev. 2.0
Port D GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
To deactivate the Internal pull-up resistor, clear bit 8 in the
GPIOD_PUR register.
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Pins
Signal Description
DS
(CS1)
(GPIOD9)
GPIOD0
(CS2
)
47Output
Input/
Output
48Input/
Output
Output
Tri-stated
Input
Input
Tri-stated
Data Memory Select — This signal is actually CS1 in the EMI,
which is programmed at reset for compatib ility with the 56F80 x DS
signal. DS
Depending upon the state of the DRV bit in the EMI bus control
register (BCR), DS
CS1
devices.
Port D GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
To deactivate the Internal pull-up resistor, clear bit 9 in the
GPIOD_PUR register.
Port D GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
Chip Select — CS2 may be programmed within the EMI module to
act as a chip select for speci fic areas of the externa l me mory map .
Depending upon the state of the DRV bit in the EMI Bus Control
Register (BCR), CS2
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
is asserted low for external data memory access.
is tri-stated when the external bus is inactive.
resets to provide the DS function as defined on the 56F80x
is tri-stated when the external bu s is inactiv e.
(CAN2_TX)
Open
Drain
Output
Output
56F8366 Technical Data, Rev. 2.0
FlexCAN2 Transmit Data — CAN output.
At reset, this pin is configured as GPIO. This configuration can be
changed by setting bit 0 in the GPIO_D_PER register. Then
change bit 4 in the SIM_GPS register to select the desired
peripheral function.
To deactivate the internal pull-up resistor, clear bit 0 in the
GPIOD_PUR register.
Freescale Semiconduc tor25
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Description
GPIOD1
(CS3
)
(CAN2_RX)
TXD0
(GPIOE0)
49Schmitt
Input/
Output
Output
Schmitt
Input
4Output
Input/
Output
Input
Tri-stated
Input
Tri-stated
Input
Port D GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
Chip Select — CS3 may be programmed within the EMI module to
act as a chip select for speci fic areas of the externa l me mory map .
Depending upon the state of the DRV bit in the EMI Bus Control
Register (BCR), CS3
Most designs will want to change the DRV state to DRV = 1 instead of
using the default setting.
FlexCAN2 Receive Data — This is the CAN input. This pin has an
internal pull-up resistor.
At reset, this pin is configured as GPIO. This configuration can be
changed by setting bit 1 in the GPIO_D_PER register. Then
change bit 5 in the SIM_GPS register to select the desired
peripheral function.
To deactivate the internal pull-up resistor, clear bit 1 in the
GPIOD_PUR register.
Transmit Data — SCI0 transmit data output
Port E GPIO — This GPIO pin can be in div id ually programmed as
an input or output pin.
is tri-stated when the external bu s is inactiv e.
After reset, the default state is SCI output.
To deactivate the internal pull-up resistor, clear bit 0 in the
GPIOE_PUR register.
RXD0
(GPIOE1)
26 Freescale Semiconductor
5Input
Input/
Output
Input
Input
56F8366 Technical Data, Rev. 2.0
Receive Data — SCI0 receive data input
Port E GPIO — This GPIO pin can be in div id ually programmed as
an input or output pin.
After reset, the default state is SCI output.
To deactivate the internal pull-up resistor, clear bit 1 in the
GPIOE_PUR register.
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Pins
Signal Description
TXD1
(GPIOD6)
RXD1
(GPIOD7)
TCK121Schmitt
TMS122Schmitt
42Output
43Input
Input/
Output
Input/
Output
Input
Input
Tri-stated
Input
Input
Input
Input,
pulled low
internally
Input,
pulled high
internally
Transmit Data — SCI1 transmit data output
Port D GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
After reset, the default state is SCI output.
To deactivate the internal pull-up resistor, clear bit 6 in the
GPIOD_PUR register.
Receive Data — SCI1 receive data input
Port D GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
After reset, the default state is SCI input.
To deactivate the internal pull-up resistor, clear bit 7 in the
GPIOD_PUR register.
Test Clock Input — This input pin provides a gated clock to
synchronize the test logic and sh ift serial data to the JTAG/EOnCE
port. The pin is connected internally to a pull-down resistor.
Test Mode Select Input — This in pu t pin is us ed to se que nc e the
JTAG TAP controller’s state machine. It is sampled on the rising
edge of TCK and has an on-chip pull-up resistor.
To deactivate the internal pull-up res is tor, set the JTAG bit in the
SIM_PUDR register.
TDI123Schmitt
Input
TDO124OutputTri-statedTest Data Output — This tri-stateable output pin prov id es a serial
Input,
pulled high
internally
56F8366 Technical Data, Rev. 2.0
Test Data Input — This input pin provides a serial input data
stream to the JTAG/EOnCE port. It is sampled on the rising edge
of TCK and has an on-chip pull-up resistor.
To deactivate the internal pull-up res is tor, set the JTAG bit in the
SIM_PUDR register.
output data stream from the JTAG/EOnCE port. It is driven in the
shift-IR and shift-DR controller states, and changes on the falling
edge of TCK.
Freescale Semiconduc tor27
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Description
TRST120Schmitt
PHASEA0
(TA0)
(GPIOC4)
PHASEB0
139Schmitt
Schmitt
Input/
Output
Schmitt
Input/
Output
140Schmitt
Input
Input
Input
Input,
pulled high
internally
Input
Input
Input
Input
Test Reset — As an input, a low s ignal on this pi n prov ides a re set
signal to the JTAG TAP controller. To ensure complete hardware
reset, TRST should be asserted whenever RESET is asserted.
The only exception occurs in a debugging environment when a
hardware device reset is required and the JTAG/EOnCE module
must not be reset. In this case, assert RESET
.
TRST
To deactivate the internal pull-up res is tor, set the JTAG bit in the
SIM_PUDR register.
Phase A — Quadrature Decoder 0, PHASEA input
TA0 — Timer A, Channel 0
Port C GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
After reset, the default state is PHASEA0.
To deactivate the internal pull-up resistor, clear bit 4 of the
GPIOC_PUR register.
Phase B — Quadrature Decoder 0, PHASEB input
, but do not assert
(TA1)
(GPIOC5)
Schmitt
Input/
Output
Schmitt
Input/
Output
Input
Input
56F8366 Technical Data, Rev. 2.0
TA1 — Timer A, Channel
Port C GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
After reset, the default state is PHASEB0.
To deactivate the internal pull-up resistor, clear bit 5 of the
GPIOC_PUR register.
28 Freescale Semiconductor
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Pins
Signal Description
INDEX0
(TA2)
(GPOPC6)
HOME0
(TA3)
(GPIOC7)
141Schmitt
Input
Schmitt
Input/
Output
Schmitt
Input/
Output
142Schmitt
Input
Schmitt
Input/
Output
Schmitt
Input/
Output
Input
Input
Input
Input
Input
Input
Index — Quadrature Decoder 0, INDEX input
TA2 — Timer A, Channel 2
Port C GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
After reset, the default state is INDEX0.
To deactivate the internal pull-up resistor, clear bit 6 of the
GPIOC_PUR register.
Home — Quadrature Decoder 0, HOME input
TA3 — Timer A, Channel 3
Port C GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
After reset, the default state is HOME0.
SCLK0
(GPIOE4)
130Schmitt
Input/
Output
Schmitt
Input/
Output
Input
Input
To deactivate the internal pull-up resistor, clear bit 7 of the
GPIOC_PUR register.
SPI 0 Serial Clock — In the master mode, this pin serves as an
output, clocking slaved listeners. In slave mode, this pin serves as
the data clock input.
Port E GPIO — This GPIO pin can be in div id ually programmed as
an input or output pin.
After reset, the default state is SCLK0.
To deactivate the internal pull-up resistor, clear bit 4 in the
GPIOE_PUR register.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor29
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Description
MOSI0
(GPIOE5)
MISO0
(GPIOE6)
132Input/
Output
Input/
Output
131Input/
Output
Input/
Output
Tri-stated
Input
Input
Input
SPI 0 Master Out/Slave In — This serial data pin is an output from
a master devic e a nd an input to a slav e d ev ic e. The m aster device
places data on the MOSI li ne a half -cycle b efore the clock e dge th e
slave device uses to latch the data.
Port E GPIO — This GPIO pin can be in div id ually programmed as
an input or output pin.
After reset, the default state is MOSI0.
To deactivate the internal pull-up resistor, clear bit 5 in the
GPIOE_PUR register.
SPI 0 Master In/Slave Out — This serial data pin is an input to a
master device and an outp ut from a slav e device. Th e MISO line o f
a slave device is placed in the high-impedance state if the slave
device is not selected. The slave device places data on the MISO
line a half-cycle before the clock edge the master device uses to
latch the data.
Port E GPIO — This GPIO pin can be in div id ually programmed as
an input or output pin.
After reset, the default state is MISO0.
To deactivate the internal pull-up resistor, clear bit 6 in the
GPIOE_PUR register.
SS0
(GPIOE7)
129Input
Input/
Output
Input
Input
56F8366 Technical Data, Rev. 2.0
SPI 0 Slave Select — SS0
SPI module that the current transfer is to be received.
Port E GPIO — This GPIO pin can be in div id ually programmed as
input or output pin.
After reset, the default state is SS0
To deactivate the internal pull-up resistor, clear bit 7 in the
GPIOE_PUR register.
is used in slave mode to ind icate to the
.
30 Freescale Semiconductor
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Pins
Signal Description
PHASEA1
(TB0)
(SCLK1)
(GPIOC0)
PHASEB1
6Schmitt
Input
Schmitt
Input/
Output
Schmitt
Input/
Output
Schmitt
Input/
Output
7Schmitt
Input
Input
Input
Input
Input
Input
Phase A1 — Quadrature Decoder 1, PHASEA i npu t fo r dec od er 1.
TB0 — Timer B, Channel 0
SPI 1 Serial Clock — In the master mode, this pin serves as an
output, clocking slaved listeners. In slave mode, this pin serves as
the data clock input. To activate the SPI function, set the
PHSA_ALT bit in the SIM_GPS register. For details, see Part
6.5.8.
Port C GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
In the 56F8366, the default state after reset is PHASEA1.
In the 56F8166, the d efault state i s not o ne of th e func tions o ffered
and must be reconfigured.
To deactivate the internal pull-up resistor, clear bit 0 in the
GPIOC_PUR register.
Phase B1 — Quadrature Decoder 1, PHASEB i npu t fo r dec od er 1.
(TB1)
(MOSI1)
(GPIOC1)
Schmitt
Input/
Output
Schmitt
Input/
Output
Schmitt
Input/
Output
Input
Tri-stated
Input
TB1 — Timer B, Channel 1
SPI 1 Master Out/Slave In — This serial data pin is an output from
a master devic e a nd an input to a slav e d ev ic e. The m aster device
places data on the MOSI li ne a half -cycle b efore the clock e dge th e
slave device uses to latch the data. To activate the SPI function,
set the PHSB_ALT bit in the SIM_GPS register. For details, see
Part 6.5.8.
Port C GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
In the 56F8366, the default state after reset is PHASEB1.
In the 56F8166, the d efault state i s not o ne of th e func tions o ffered
and must be reconfigured.
To deactivate the internal pull-up resistor, clear bit 1 in the
GPIOC_PUR register.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor31
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Description
INDEX1
(TB2)
(MISO1)
(GPIOC2)
HOME1
(TB3)
8Schmitt
Input
Schmitt
Input/
Output
Schmitt
Input/
Output
Schmitt
Input/
Output
9Schmitt
Input
Schmitt
Input/
Output
Input
Input
Input
Input
Input
Input
Index1 — Quadrature Decoder 1, INDEX input
TB2 — Timer B, Channel 2
SPI 1 Master In/Slave Out — This serial data pin is an input to a
master device and an outp ut from a slav e device. Th e MISO line o f
a slave device is placed in the high-impedance state if the slave
device is not selected. The slave device places data on the MISO
line a half-cycle before the clock edge the master device uses to
latch the data. To activa te the SPI fu nction , set the INDEX_ALT bit
in the SIM_GPS register. For details, see Part 6.5.8.
Port C GPIO — This GPIO pin can be individually programm ed as
an input or output pin.
After reset, the default state is INDEX1.
To deactivate the internal pull-up resistor, clear bit 2 in the
GPIOC_PUR register.
Home — Quadrature Decoder 1, HOME input
TB3 — Timer B, Channel 3
)
(SS1
(GPIOC3)
32 Freescale Semiconductor
Schmitt
Input
Schmitt
Input/
Output
Input
Input
56F8366 Technical Data, Rev. 2.0
SPI 1 Slave Select — In the master mode, this pin is used to
arbitrate multiple masters. In slave mode, this pin is used to select
the slave. To activate the SPI function, set the HOME_ALT bit in
the SIM_GPS register. For details, see Part 6.5.8.
Port C GPIO — This GPIO pin can be individually programm ed as
input or an output pin.
In the 56F8366, the default state after reset is HOME1.
In the 56F8166, the d efault state i s not o ne of th e func tions o ffered
and must be reconfigured.
To deactivate the internal pull-up resistor, clear bit 3 in the
GPIOC_PUR register.
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
State
Signal NamePin No.Type
PWMA062OutputTri-StatePWMA0 - 5 — These are six PWMA outputs.
PWMA164
PWMA265
PWMA367
PWMA468
PWMA570
During
Reset
Signal Description
Signal Pins
ISA0
(GPIOC8)
ISA1
(GPIOC9)
ISA2
(GPIOC10)
FAULTA071Schmitt
FAULTA173
FAULTA274
PWMB034OutputTri-StatePWMB0 - 5 — Six PWMB output pins.
PWMB135
PWMB236
113Schmitt
Input
Schmitt
114
115
Input/
Output
Input
Input
Input
InputFAULTA0 - 2 — These three fault input pins are used fo r disa bling
ISA0 - 2 — These three input current status pins are used for
top/bottom pulse width correction in complementary channel
operation for PWMA.
Port C GPIO — These three GPIO pins can be individually
programmed as input or output pins.
In the 56F8366, these pins default to ISA functionality after reset.
In the 56F8166, the d efault state i s not o ne of th e func tions o ffered
and must be reconfigured.
To deactivate the internal pull-up resistor, clear the appropriate bit
of the GPIOC_PUR register. For details, see Part 6.5.8.
selected PWMA outputs in cases where fault conditions originate
off-chip.
To deactivate the in ternal pul l-up resis tor, set t he PWMA0 bi t in the
SIM_PUDR register. For details, see Part 6.5.8.
PWMB339
PWMB440
PWMB541
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor33
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Description
ISB0
50Schmitt
Input
Input
ISB0 - 2 — These three input current status pins are used for
top/bottom pulse width correction in complementary channel
operation for PWMB.
(GPIOD10)
ISB1
52
(GPIOD11)
ISB2
53
(GPIOD12)
FAULTB056Schmitt
FAULTB157
FAULTB258
FAULTB361
Schmitt
Input/
Output
Input
Input
Port D GPIO — These GPIO pins can b e indi vidua lly pro gramm ed
as input or output pins.
At reset, these pins default to ISB functionality.
To deactivate the internal pull-up resistor, clear the appropriate bit
of the GPIOD_PUR register. For details, see Part 6.5.8.
InputFAULTB0 - 3 — These four fault input pins are used for disabling
selected PWMB outputs in cases where fault conditions originate
off-chip.
To deactivate the internal pull-up resistor, set the PWMB bit in the
SIM_PUDR register. For details, see Part 6.5.8.
ANA088InputInputANA0 - 3 — Analog inputs to ADC A, channel 0
ANA189
ANA290
ANA391
ANA492InputInputANA4 - 7 — Analog inputs to ADC A, channel 1
ANA593
ANA694
ANA795
V
REFH
V
REFP
V
REFMID
V
REFN
V
REFLO
101InputInputV
100Input/
Output
Input/
Output
99
98
97InputInputV
— Analog Reference Voltage High. V
REFH
than or equal to
V
, V
REFP
REFMID
VDDA_ADC.
& V
REFN
— Internal pins for voltage reference
which are brought off-chip so they can be bypassed. Connect to a
0.1µF or low ESR capacitor.
— Analog Reference Voltage Low. This should normally
REFLO
be connected to a low-noise V
SSA
.
must be less
REFH
56F8366 Technical Data, Rev. 2.0
34 Freescale Semiconductor
Preliminary
Signal Pins
Table 2-2 Signal and Package Information for the 144-Pin LQFP
State
Signal NamePin No.Type
ANB0104InputInputANB0 - 3 — Analog inputs to ADC B, channel 0
ANB1105
ANB2106
ANB3107
ANB4108InputInputANB4 - 7 — Analog inputs to ADC B, channel 1
ANB5109
ANB6110
ANB7111
TEMP_SENSE96OutputOutputTemperature Sense Diode — This signal connects to an on-chip
During
Reset
Signal Description
diode that can be connected to one of the ADC input s an d us ed to
monitor the temperature of the die. Must be bypassed with a
0.01µF capacitor.
CAN_RX127Schmitt
Input
CAN_TX126Open
Drain
Output
TC0
(GPIOE8)
118Schmitt
Input/
Output
Schmitt
Input/
Outpu
InputFlexCAN Receive Data — This is the CAN input. This pin has an
internal pull-up resistor.
To deactivate the internal pull-up resistor, set the CAN bit in the
SIM_PUDR register.
Open
Drain
Output
Input
Input
FlexCAN Transmit Data — CAN output
TC0 — Timer C, Channel 0
Port E GPIO — These GPIO pin can be individually programmed
as an input or output pin.
At reset, this pin defaults to timer functionality.
To deactivate the internal pull-up resistor, clear bit 8 of the
GPIOE_PUR register.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor35
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Description
TD0
(GPIOE10)
TD1
(GPIOE11)
IRQA
IRQB
RESET
116Schmitt
Input/
Output
Schmitt
117
54Schmitt
55
86Schmitt
Input/
Output
Input
Input
Input
Input
InputExternal Interrupt Request A and B — The IRQA and IRQB
InputReset — This input is a direct hardware reset on the processor.
TD0 - TD1 — Timer D, Channels 0 and 1
Port E GPIO — These GPIO pins can be indiv idual ly progr ammed
as input or output pins.
At reset, these pins default to Timer functionality.
To deactivate the internal pull-up resistor, clear the appropriate bit
of the GPIOE_PUR register. See Part 6.5.6 for details.
inputs are asynchronous external interrupt requests during Stop
and Wait mode operation. During other operating modes, they are
synchronized external interrupt requests, which indicate an
external device is req ues ti ng s erv ic e. Th ey ca n be prog ram me d to
be level-sensitive or negative-edge triggered.
To deactivate the internal pull-up resistor, set the IRQ bit in the
SIM_PUDR register. See Part 6.5.6 for details.
When RESET
in the reset state. A Schmitt trigger input is used for noise
immunity. When the RESET pin is deasserted, the initial chip
operating mode is latched from the EXTBOOT pin. The internal
reset signal will be deasserted synchronous with the internal
clocks after a fixed number of internal clocks.
is asserted low, the device is initialized and placed
To ensure complete hardware reset, RESET and TRST should be
asserted together. The only exception occurs in a debugging
environment when a hardware device reset is required and the
JTAG/EOnCE module must not be reset. In this case, assert
RESET but do not assert TRST.
Note: The internal Power-On Reset will assert on initial power-up.
To deactivate the int erna l p ull -up resis tor, set the RESET
SIM_PUDR register. See Part 6.5.6 for details.
RSTO85OutputOutputReset Output — This output reflects the internal reset state of the
chip.
56F8366 Technical Data, Rev. 2.0
36 Freescale Semiconductor
bit in the
Preliminary
Table 2-2 Signal and Package Information for the 144-Pin LQFP
Signal NamePin No.Type
State
During
Reset
Signal Pins
Signal Description
EXTBOOT112Schmitt
Input
EMI_MODE143Schmitt
Input
InputExternal Boot — This input is tied to VDD to force the device to
boot from off-chip memory (assuming that the on-chip Flash
memory is not in a secure state). Otherwise, it is tied to ground.
For details, see Table 4-4.
Note: When this pin is tie d low, the custom er boot softw are shou ld
disable the internal pul l-up resi stor by se tting the XBOOT bit of the
SIM_PUDR; see Part 6.5.6.
InputExternal Memory Mode — The EMI_MODE input is internally tied
low (to V
under normal operation. This function is also affected by
EXTBOOT and the Flash security mode. For detail s, see
Table 4-4.
If a 20-bit address bus is not des ired, th en this pin is tied to g round.
Note: When this pin is tied lo w, the customer b oot soft ware shou ld
disable the i nternal pull -up re sisto r by sett ing the EMI_MO DE b it of
the SIM_PUDR; see Part 6.5.6.
). This device will boot from internal Flash memory
SS
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor37
Preliminary
Part 3 On-Chip Clock Synthesis (OCCS)
3.1 Introduction
Refer to the OCCS chapter of the 56F8300 Peripheral User Manual for a full description of the OCCS.
The material contained here identifies the specific features of the OCCS design. Figure 3-1 shows the
specific OCCS block diagram to reference in the OCCS chapter in the 56F8300 Peripheral User Manual.
CLKMODE
XTAL
EXTAL
Crystal
OSC
PLLCID
Prescaler
÷ (1,2,4,8)
MUX
PLLDB
PLL
REF
F
x (1 to 128)
Prescaler CLK
F
OUT
÷2
F
OUT/2
PLLCOD
Postscaler
÷ (1,2,4,8)
ZSRC
SYS_CLK2
Source to SIM
MUX
Postscaler CLK
Bus Interface & Control
MSTR_OSC
FEEDBACK
Lock
Detector
Loss of
Reference
Clock
Detector
LCK
Loss of Reference
Clock Interrupt
Bus
Interface
Figure 3-1 OCCS Block Diagram
3.2 External Clock Operation
The system clock can be derived from an external crystal, ceramic resonator, or an external system clock
signal. To generate a reference frequency using the internal oscillator, a reference crystal or ceramic
resonator must be connected between the EXTAL and XTAL pins.
3.2.1Crystal Oscillator
The internal oscillator is designed to interface with a parallel-resonant crystal resonator in the frequency
range specified for the ex ternal cr ystal in Table 10-15. A recommended crystal oscillator circuit is shown
in Figure 3-2. Follow the crystal supplier’s recommendations when selecting a crystal, since crystal
parameters determine the component values required to provide maximum stability and reliable start-up.
56F8366 Technical Data, Rev. 2.0
38 Freescale Semiconductor
Preliminary
External Clock Operation
The crystal and associated components should be mounted as near as possible to the EXTAL and XTAL
pins to minimize output distortion and start-up stabilization time.
Crystal Frequency = 4 - 8MHz (optimized for 8MHz)
EXTAL XTAL
CL2
R
z
Sample External Crystal Parameters:
R
= 750 KΩ
z
Note: If the operating tem perature rang e is limit ed to
below 85
o
C(105oC junction), then Rz = 10 Meg Ω
CLKMODE = 0
EXTAL XTAL
CL1
R
z
Figure 3-2 Connecting to a Crystal Oscillator
Note:The OCCS_COHL bit must be set to 1 wh en a crystal oscillator is used. The reset condition on the
OCCS_COHL bit is 0. Please see the COHL bit in the Osc illa tor Cont rol (OSCTL) regi st er , dis cuss ed
in the 56F8300 Peripheral User Manual.
3.2.2Ceramic Resonator (Default)
It is also possible to drive the internal oscillator with a ceramic resonator, assuming the overall system
design can tolerate the reduced signal integrity. A typical ceramic resonator circuit is shown in Figure 3-3.
Refer to the supplier’s recommendations when selecting a ceramic resonator and associated components.
The resonator and components should be mounted as near as possible to the EXTAL and XTAL pins.
Resonator Frequency = 4 - 8MHz (optimized for 8MHz)
2 Terminal
EXTALXTAL
CL1
R
z
CL2
3 Terminal
EXTALXTAL
R
z
C1
Sample External Ceramic Resonator Parameters:
= 750 KΩ
R
z
CLKMODE = 0
C2
Figure 3-3 Connecting a Ceramic Resonator
Note:The OCCS_COHL bit must be set to 0 when a ceramic resonator is used. The reset condition on the
OCCS_COHL bit is 0. Please see the COHL bit in the Osc illa tor Cont rol (OSCTL) regi st er , dis cuss ed
in the 56F8300 Peripheral User Manual.
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor39
Preliminary
3.2.3External Clock Source
The recommended method of connecting an external clock is given in Figure 3-4. The external c lock
source is connected to XTAL and the EXTAL pin is grounded. Set OCCS_COHL bit high when using an
external clock source as well.
XTAL
External
Clock
EXTAL
V
SS
Note: When using an external clocking source
with this configuration, the input “CLKMODE”
should be high and the COHL bit in the O SCTL
register should be set to 1.
Figure 3-4 Connecting an External Clock Register
3.3 Registers
When referring to the register definition s for the OCCS in the 56F8300 Peripheral User Manual, use the
register definitions without the internal Relaxation Oscillator, since the 56F8366/56F8166 devices do
NOT contain this oscillator.
Part 4 Memory Map
4.1 Introduction
The 56F8366 and 56F8166 devices are 16-bit motor-control chip based on the 56800E core. These parts
use a Harvard-style architecture with two independent memory spaces for Data and Program. On-chip
RAM and Flash memories are used in both spaces.
This section provides memory maps for:
•Program Address Space, including the Interrupt Vector Table
•Data Address Space, including the EOnCE Memory and Peripheral Memory Maps
On-chip memory sizes for e ach device are summarized in Table 4-1. Flash memories’ restrictions are
identified in the “Use Restrictions” column of Table 4-1.
56F8366 Technical Data, Rev. 2.0
40 Freescale Semiconductor
Preliminary
Note: Data Flash and Program RAM are NOT available on the 56F8166 device.
Table 4-1 Chip Memory Configurations
On-Chip Memory56F836656F8166Use Restrictions
Program Flash512KB512KBErase / Program via Flash interface unit and word writes to
CDBW
Data Flash32KB—Erase / Program via Flash interface unit and word writes to
CDBW. Data Flash can be read via either CDBR or XDB2, but
not by both simultaneously
Program RAM4KB—None
Data RAM32KB32KBNone
Program Boot Flash32KB32KBErase / Program via Flash Interface unit and word to CDBW
4.2 Program Map
Program Map
The operating mode control bits (MA and MB) in the Operating Mode Register (OMR) control the
Program memory map. At reset, thes e bits a re set as indica ted in Table 4-2. Table 4-4 shows the memory
map configurations that are possible at reset. After reset, the OMR MA bit can be changed and will have
an effect on the P-space memory map, as shown in Table 4-3. Changing the OMR MB bit will have no
effect.
Table 4-2 OMR MB/MA Value at Reset
OMR MB =
Flash Secured
1. This bit is only configured at reset. If the Flash secured state changes, this will not be reflected in MB until the next reset.
2. C hanging MB in software wi ll not af f ect Fl as h m em o r y se curity.
1, 2
State
00Mode 0 – Internal Boot; EMI is configured to use 16 address lines; Flash
01Not valid; cannot boot externally if the Flash is secured and will actually
10Mode 0 – Internal Boot; EMI is configured to use 16 address lines
11Mode 1 – External Boot; Flash Memory is not secured; EMI configuration is
OMR MA =
EXTBOOT Pin
Chip Operating Mode
Memory is secured; external P-space is not allowed; the EOnCE is disabled
configure to 00 state
determined by the state of the EMI_MODE pin
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor41
Preliminary
Table 4-3 Changing OMR MA Value During Normal Operation
OMR MAChip Operating Mode
0Use internal P-space memory map configuration
1Use external P-space memory map configuration – If MB = 0 at reset, changing this bit has no
effect.
The device’s external memory interface (EMI) can operate much like the 56F80x family’s EMI, or it can
be operated in a mode similar to that used on other products in the 56800E family. Initially, C S0 and CS1
are configured as PS and DS, in a mode compatible with earlier 56800 devices.
Eighteen address lines are required to shadow the first 192K of internal program space when booting
externally for development purposes. Therefore, the entire complement of on-chip memory cannot be
accessed using a 16-bit 56800-compatible address bus. To address this situation, the EMI_MODE pin can
be used to configure four GPIO pins as Address[19:16] upon reset (only one of these pins [A16] is usable
in the 56F8366/56F8166).
The EMI_MODE pin also affects the reset vector address, as provided in Table 4-4. Additional pins must
be configured as address or chip select signals to access addresses at P:$10 and above.
56F8366 Technical Data, Rev. 2.0
42 Freescale Semiconductor
Preliminary
Note: Program RAM is NOT available on the 56F8166 device.
1. If Fl as h Security Mode is enabled, EXTBO OT Mode 1 cannot be used. See Security Features, Part 7.
2. This mode provides maximum compatibility with 56F80x parts while operating externally.
3. “EMI_MODE =0” when EMI_M OD E pin is tied to ground at boot up.
4. “EMI_MODE =1” when EMI_MODE pin is tied to VDD at boot up.
5. Not accessible in reset configuration, since the address is above P:$00 FFFF. The higher bit address/GPIO (and/or chip selects) pins must be reco nf ig ur ed before this external me m ory is accessible.
6. Not accessible in reset configuration, since the address is above P:$0F FFFF. The higher bit address/GPIO (and/or chip selects) pins must be reco nf ig ur ed before this external me m ory is accessible.
7. Booting from this external add re ss allows prototyping of the inte rn al Boot Flash.
8. Tw o independent program f l as h bl ocks allow one to be p ro gr am m ed/erased while exe cu ting from another. Each bl ock must
have its own mass eras e.
7
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor43
Preliminary
4.3 Interrupt Vector Table
Table 4-5 provides the reset and interrupt priority structure, including on-chip peripher als. The table is
organized with higher-priority vectors at the top and lower-priority interrupts lower in the table. The
priority of an interrupt can be assigned to different levels, as indicated, allowing some control over
interrupt priorities. All level 3 interrupts will be serviced before level 2, and so on. For a selected priority
level, the lowest vector number has the highest priority.
The location of the vector table is determined by the Vector Base Address (VBA) register. Please see Part
5.6.12for the reset value of the VBA.
In some configurations, the reset address and COP reset address will correspond to vector 0 and 1 of the
interrupt vector table. In these instances, the first two locations in the vector table must contain branch or
JMP instructions. All other entries must contain JSR instructions.
Note: PWMA, FlexCAN, Quadrature Decoder 1, and Quad Timers B and D are NOT available on the
56F8166 device.
Table 4-5 Interrupt Vector Table Contents
Peripheral
core23P:$04Illegal Instruction
core33P:$06SW Interrupt 3
core43P:$08HW Stack Overflow
core53P:$0AMisaligned Long Word Access
core61-3P:$0COnCE Step Counter
core71-3P:$0EOnCE Breakpoint Unit 0
SCI0710-2P:$8ESCI 0 Receiver Error
SCI0720-2P:$90SCI 0 Receiver Full
ADCB730-2P:$92ADC B Conversion Compete / End of Scan
ADCA740-2P:$94ADC A Conversion Complete / End of Scan
ADCB750-2P:$96ADC B Zero Crossing or Limit Error
ADCA760-2P:$98ADC A Zero Crossing or Limit Error
PWMB770-2P:$9AReload PWM B
PWMA780-2P:$9CReload PWM A
PWMB790-2P:$9EPWM B Fault
PWMA800-2P:$A0PWM A Fault
core81- 1P:$A2SW Interrupt LP
FLEXCAN2820-2P:$A4FlexCAN Bus Off
FLEXCAN2830-2P:$A6FlexCAN Error
FLEXCAN2840-2P:$A8FlexCAN Wake Up
FLEXCAN2850-2P:$AAFlexCAN Message Buffer Interrupt
1. Two words are allocated for each entry in the vector table. This does not allow the full address range to be referenced
from the vector table, provi di ng only 19 bits of address.
2. If the VBA is set to $0200 (or VBA = 0000 for Mode 1, EMI_MODE = 0), the first two locations of the ve ctor table ar e
the chip reset addresse s; th er ef or e, the se locations are not interrup t vect or s.
2.
Vector
Number
Priority
Level
Vector Base
Address +
Interrupt Function
4.4 Data Map
Note: Data Flash is NOT available on the 56F8166 device.
1
EX = 1
Begin/End
Address
X:$FF FFFF
X:$FF FF00
Table 4-6 Data Memory Map
EX = 0
EOnCE
256 locations allocated
2
EOnCE
256 locations alloca ted
X:$FF FEFF
X:$01 0000
X:$00 FFFF
X:$00 F000
X:$00 EFFF
X:$00 8000
X:$00 7FFF
X:$00 4000
X:$00 3FFF
X:$00 0000
1. All addresses are 16-bit Word addresses, not byte addresses.
2. In the Operation Mode Register (OMR).
3. The Data RAM is organized a s an 8K x 32-bit memory to allow si ngl e -c ycl e long-word operations .
External MemoryExternal Memory
On-Chip Peripherals
4096 locations alloca ted
External MemoryExternal Memory
On-Chip Data Flash
32KB
On-Chip Data RAM
3
32KB
On-Chip Peripherals
4096 locations allocated
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor47
Preliminary
4.5 Flash Memory Map
Figure 4-1 illustrates the Flash Memory (FM) map on the system bus.
The Flash Memory is divided into three functional blocks. The Program and boot memories reside on the
Program Memory buses. They are controlled by one set of banked registers. Data Memory Flash resides
on the Data Memory buses and is controlled separately by its own set of banked registers.
The top nine words of the Progr am Memory F lash are treate d as specia l memory location s. The content of
these words is used to control the operation of the Flash Controller. Because these words are part of the
Flash Memory content, their state is maintained during power-down and reset. During chip initialization,
the content of these memory locations is loa ded into Flash M emory control re gisters, det ailed in the Flas h
Memory chapter of the 56F8300 Peripheral User Manual. These configuration parameters are located
between $03_FFF7 and $03_FFFF.
X:$FF FFFCOCLSR (8 bits)Core Lock / Unlock Status Register
X:$FF FFFDOTXRXSR (8 bits)Transmit and Receive Status and Control Register
X:$FF FFFEOTX / ORX (32 bits)Transmit Register / Receive Register
X:$FF FFFFOTX1 / ORX1Transmit Register Upper Word
Receive Register Upper Word
4.7 Peripheral Memory Mapped Registers
On-chip peripheral registers are part of the data memory map on the 56800E series. These locations may
be accessed with the same addressing modes used for ordinary Data memory, except all peripheral
registers should be read/written using word accesses only.
Table 4-9 summarizes base addresses for the set of peripherals on the 56F8366 and 56F8166 devices.
Peripherals are listed in order of the base address.
The following tables list all of the peripheral registers required to control or access the peripherals.Note:Features in italics are NOT available on the 56F8166 device.
Table 4-9 Data Memory Peripheral Base Address Map Summary
TMRA0_CMP1$0Co mp are R egi ste r 1
TMRA0_CMP2$1Co mp are R egi ste r 2
TMRA0_CAP$2Capture Register
TMRA0_LOAD$3Load Register
TMRA0_HOLD$4Hold Register
TMRA0_CNTR$5Counter Register
TMRA0_CTRL$6Control Register
TMRA0_SCR$7Status and Control Register
TMRA0_CMPLD1$8Comparator Load Register 1
TMRA0_CMPLD2$9Comparator Load Register 2
TMRA0_COMSCR$AComparator Status and Control Register
TMRA1_CNTR$15Counter Register
TMRA1_CTRL$16Control Register
TMRA1_SCR$17Status and Control Register
TMRA1_CMPLD1$18Comparator Load Register 1
TMRA1_CMPLD2$19Comparator Load Register 2
TMRA1_COMSCR$1AComparator Status and Control Register
Reserved
TMRA2_CMP1$20Compare Register 1
TMRA2_CMP2$21Compare Register 2
TMRA2_CAP$22Capture Register
TMRA2_LOAD$23Load Register
TMRA2_HOLD$24Hold Register
TMRA2_CNTR$25Counter Register
TMRA2_CTRL$26Control Register
TMRA2_SCR$27Status and Control Register
TMRA2_CMPLD1$28Comparator Load Register 1
TMRA2_CMPLD2$29Comparator Load Register 2
TMRA2_COMSCR$2AComparator Status and Control Register
Reserved
TMRA3_CMP1$30Compare Register 1
TMRA3_CMP2$31Compare Register 2
TMRA3_CAP$32Capture Register
TMRA3_LOAD$33Load Register
TMRA3_HOLD$34Hold Register
TMRA3_CNTR$35Counter Register
TMRA3_CTRL$36Control Register
TMRA3_SCR$37Status and Control Register
TMRA3_CMPLD1$38Comparator Load Register 1
TMRA3_CMPLD2$39Comparator Load Register 2
TMRA3_COMSC$3AComparator Status and Control Register
56F8366 Technical Data, Rev. 2.0
54 Freescale Semiconductor
Preliminary
Table 4-12 Quad Timer B Registers Address Map
(TMRB_BASE = $00 F080)
Quad Timer B is NOT available in the 56F8166 device
TMRB2_CTRL$26Control Register
TMRB2_SCR$27Status and Control Register
TMRB2_CMPLD1$28Comparator Load Register 1
TMRB2_CMPLD2$29Comparator Load Register 2
TMRB2_COMSCR$2AComparator Status and Control Register
Reserved
TMRB3_CMP1$30Compare Register 1
TMRB3_CMP2$31Compare Register 2
TMRB3_CAP$32Capture Register
TMRB3_LOAD$33Load Register
TMRB3_HOLD$34Hold Register
TMRB3_CNTR$35Counter Register
TMRB3_CTRL$36Control Register
TMRB3_SCR$37Status and Control Register
TMRB3_CMPLD1$38Comparator Load Register 1
TMRB3_CMPLD2$39Comparator Load Register 2
TMRB3_COMSCR$3AComparator Status and Control Register
TMRC3_CTRL$36Control Register
TMRC3_SCR$37Status and Control Register
TMRC3_CMPLD1$38Comparator Load Register 1
TMRC3_CMPLD2$39Comparator Load Register 2
TMRC3_COMSCR$3AComparator Status and Control Register
Table 4-14 Quad Timer D Registers Address Map
(TMRD_BASE = $00 F100)
Quad Timer D is NOT available in the 56F8166 device
DEC1_DECCR$0Decoder Control Register
DEC1_FIR$1Filter Interval Register
DEC1_WTR$2Watchdog Time-out Register
DEC1_POSD$3Position Difference Counter Register
DEC1_POSDH$4Position Difference Counter Hold Register
DEC1_REV$5Revolution Counter Register
DEC1_REVH$6Revolution Hold Register
DEC1_UPOS$7Upper Position Counter Register
DEC1_LPOS$8Lower Position Counter Register
DEC1_UPOSH$9Upper Position Hold Register
DEC1_LPOSH$ALower Position Hold Register
DEC1_UIR$BUpper Initialization Regi ste r
DEC1_LIR$CLower Initialization Re gi ste r
DEC1_IMR$DInput Monitor Register
Table 4-19 Interrupt Control Registers Address Map
Register AcronymAddress OffsetRegister Description R eset Value
GPIOB_PUR$0Pull-up Enable Register0 x 00FF
GPIOB_DR$1Data Register0 x 0000
GPIOB_DDR$2Data Direction Register0 x 0000
GPIOB_PER$3Peripheral Enable Register0 x 000F for 20-bit EMI
address at reset.
0 x 0000 for all other cases.
See Table 4-4 for details.
GPIOB_IAR$4Interrupt Assert Register0 x 0000
GPIOB_IENR$5Interrupt Enable Register0 x 0000
GPIOB_IPOLR$6Interrupt Polarity Register0 x 0000
GPIOB_IPR$7Interrupt Pending Register0 x 0000
GPIOB_IESR$8Interrupt Edge-Sensitive Register0 x 0000
GPIOB_PPMODE$9Push-Pull Mode Register0 x 00FF
GPIOB_RAWDATA$ARaw Data Input Register—
Table 4-31 GPIOC Registers Address Map
(GPIOC_BASE = $00 F310)
Register AcronymAddress OffsetRegister Description Reset Value
GPIOC_PUR$0Pull-up Enable Register0 x 07FF
GPIOC_DR$1Data Register0 x 0000
GPIOC_DDR$2Data Direction Register0 x 0000
GPIOC_PER$3Peripheral Enable Register0 x 07FF
GPIOC_IAR$4Interrupt Assert Register0 x 0000
GPIOC_IENR$5Interrupt Enable Register0 x 0000
GPIOC_IPOLR$6Interrupt Polarity Register0 x 0000
GPIOC_IPR$7Interrupt Pending Register0 x 0000
GPIOC_IESR$8Interrupt Edge-Sensitive Register0 x 0000
GPIOC_PPMODE$9Push-Pull Mode Register0 x 07FF
GPIOC_RAWDATA$ARaw Data Input Register—
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor69
Preliminary
Table 4-32 GPIOD Registers Address Map
(GPIOD_BASE = $00 F320)
Register AcronymAddress OffsetRegister Description Reset Value
GPIOD_PUR$0Pull-up Enable Register0 x 1FFF
GPIOD_DR$1Data Register0 x 0000
GPIOD_DDR$2Data Direction Register0 x 0000
GPIOD_PER$3Peripheral Enable Register0 x 1FC0
GPIOD_IAR$4Interrupt Assert Register0 x 0000
GPIOD_IENR$5Interrupt Enable Register0 x 0000
GPIOD_IPOLR$6Interrupt Polarity Register0 x 0000
GPIOD_IPR$7Interrupt Pending Register0 x 0000
GPIOD_IESR$8Interrupt Edge-Sensitive Register0 x 0000
GPIOD_PPMO DE$9Push-Pull Mode Register0 x 1F FF
GPIOD_RAWDATA$ARaw Data Input Register—
Table 4-33 GPIOE Registers Address Map
(GPIOE_BASE = $00 F330)
Register AcronymAddress OffsetRegister Description Reset Value
GPIOE_PUR$0Pull-up Enable Register0 x 3FFF
GPIOE_DR$1Data Register0 x 0000
GPIOE_DDR$2Data Direction Register0 x 0000
GPIOE_PER$3Peripheral Enable Register0 x 3FFF
GPIOE_IAR$4Interrupt Assert Register0 x 0000
GPIOE_IENR$5Interrupt Enable Register0 x 0000
GPIOE_IPOLR$6Interrupt Polarity Register0 x 0000
GPIOE_IPR$7Interrupt Pending Register0 x 0000
GPIOE_IESR$8Interrupt Edge-Sensitive Register0 x 0000
GPIOE_PPMODE$9Push-Pul l Mode Register0 x 3FFF
GPIOE_RAWDATA$ARaw Data Input Register—
56F8366 Technical Data, Rev. 2.0
70 Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-34 GPIOF Registers Address Map
(GPIOF_BASE = $00 F340)
Register AcronymAddress OffsetRegister Description Reset Value
GPIOF_PUR$0Pull-up Enable Register0 x FFFF
GPIOF_DR$1Data Register0 x 0000
GPIOF_DDR$2Data Direction Register0 x 0000
GPIOF_PER$3Peripheral Enable Register0 x FFFF
GPIOF_IAR$4Interrupt Assert Register0 x 0000
GPIOF_IENR$5Interrupt Enable Register0 x 0000
GPIOF_IPOLR$6Interrupt Polarity Register0 x 0000
GPIOF_IPR$7Interrupt Pending Register0 x 0000
GPIOF_IESR$8Interrupt Edge-Sensitive Register0 x 0000
GPIOF_PPMODE$9Push-Pull Mode Register0 x FFFF
GPIOF_RAWDATA$ARaw Data Input Register—
Table 4-35 System Integration Module Registers Address Map
SIM_CONTROL$0Control Register
SIM_RSTSTS$1Reset Status Register
SIM_SCR0$2Software Control Register 0
SIM_SCR1$3Software Control Register 1
SIM_SCR2$4Software Control Register 2
SIM_SCR3$5Software Control Register 3
SIM_MSH_ID$6Most Significant Half JTAG ID
SIM_LSH_ID$7Least Significant Half JTAG ID
SIM_PUDR$8Pull-up Disable Register
Reserved
SIM_CLKOSR$AClock Out Select Register
SIM_GPS$BQuad Decoder 1 / Timer B / SPI 1 Select Register
SIM_PCE$CPeripheral Clock Enable Register
SIM_ISALH$DI/O Short Address Location High Register
SIM_ISALL$EI/O Short Address Location Low Register
SIM_PCE2$FPeripheral Clock Enable Register 2
FCRXGMASK_H$8Receive Global Mask High Register
FCRXGMASK_L$9Receive Global Mask Low Register
FCRX14MASK_H$AReceive Buffer 14 Mask High Register
FCRX14MASK_L$BReceive Buffer 14 Mask Low Register
FCRX15MASK_H$CReceive Buffer 15 Mask High Register
FCRX15MASK_L$DReceive Buffer 15 Mask Low Register
Reserved
FCSTATUS$10Error and Status Register
FCIMASK1$11Interrupt Masks 1 Register
FCIFLAG1$12Interrupt Flags 1 Register
FCR/T_ERROR_CNTRS$13Receive and Transmit Error Counters Register
Reserved
Reserved
Reserved
FCMB0_CONTROL$40Message Buffer 0 Control / Status Register
FCMB0_ID_HIGH$41Message Buffer 0 ID High Register
FCMB0_ID_LOW$42Message Buffer 0 ID Low Register
FCMB0_DATA$43Message Buffer 0 Data Register
FCMB0_DATA$44Message Buffer 0 Data Register
FCMB0_DATA$45Message Buffer 0 Data Register
FCMB0_DATA$46Message Buffer 0 Data Register
Reserved
FCMSB1_CONTROL$48Message Buffer 1 Control / Status Register
FCMSB1_ID_HIGH$49Message Buffer 1 ID High Register
FCMSB1_ID_LOW$4AMessage Buffer 1 ID Low Register
FCMB1_DATA$4BMessage Buffer 1 Data Register
FCMB1_DATA$4CMessage Buffer 1 Data Register
FCMB1_DATA$4DMessage Buffer 1 Data Register
FCMB1_DATA$4EMessage Buffer 1 Data Register
Reserved
FCMB2_CONTROL$50Message Buffer 2 Control / Status Register
FCMB2_ID_HIGH$51Message Buffer 2 ID High Register
FCMB2_ID_LOW$52Message Buffer 2 ID Low Register
FCMB2_DATA$53Message Buffer 2 Data Register
FCMB2_DATA$54Message Buffer 2 Data Register
FCMB2_DATA$55Message Buffer 2 Data Register
FCMB2_DATA$56Message Buffer 2 Data Register
Reserved
FCMB3_CONTROL$58Message Buffer 3 Control / Status Register
FCMB3_ID_HIGH$59Message Buffer 3 ID High Register
FCMB3_ID_LOW$5AMessage Buffer 3 ID Low Register
FCMB3_DATA$5BMessage Buffer 3 Data Register
FCMB3_DATA$5CMessage Buffer 3 Data Register
FCMB3_DATA$5DMessage Buffer 3 Data Register
FCMB3_DATA$5EMessage Buffer 3 Data Register
Reserved
FCMB4_CONTROL$60Message Buffer 4 Control / Status Register
FCMB4_ID_HIGH$61Message Buffer 4 ID High Register
FCMB4_ID_LOW$62Message Buffer 4 ID Low Register
FCMB4_DATA$63Message Buffer 4 Data Register
FCMB4_DATA$64Message Buffer 4 Data Register
FCMB4_DATA$65Message Buffer 4 Data Register
FCMB4_DATA$66Message Buffer 4 Data Register
FCMB5_CONTROL$68Message Buffer 5 Control / Status Register
FCMB5_ID_HIGH$69Message Buffer 5 ID High Register
FCMB5_ID_LOW$6AMessage Buffer 5 ID Low Register
FCMB5_DATA$6BMessage Buffer 5 Data Register
FCMB5_DATA$6CMessage Buffer 5 Data Register
FCMB5_DATA$6DMessage Buffer 5 Data Register
FCMB5_DATA$6EMessage Buffer 5 Data Register
Reserved
FCMB6_CONTROL$70Message Buffer 6 Control / Status Register
FCMB6_ID_HIGH$71Message Buffer 6 ID High Register
FCMB6_ID_LOW$72Message Buffer 6 ID Low Register
FCMB6_DATA$73Message Buffer 6 Data Register
FCMB6_DATA$74Message Buffer 6 Data Register
FCMB6_DATA$75Message Buffer 6 Data Register
FCMB6_DATA$76Message Buffer 6 Data Register
Reserved
FCMB7_CONTROL$78Message Buffer 7 Control / Status Register
FCMB7_ID_HIGH$79Message Buffer 7 ID High Register
FCMB7_ID_LOW$7AMessage Buffer 7 ID Low Register
FCMB7_DATA$7BMessage Buffer 7 Data Register
FCMB7_DATA$7CMessage Buffer 7 Data Register
FCMB7_DATA$7DMessage Buffer 7 Data Register
FCMB7_DATA$7EMessage Buffer 7 Data Register
Reserved
FCMB8_CONTROL$80Message Buffer 8 Control / Status Register
FCMB8_ID_HIGH$81Message Buffer 8 ID High Register
FCMB8_ID_LOW$82Message Buffer 8 ID Low Register
FCMB8_DATA$83Message Buffer 8 Data Register
FCMB8_DATA$84Message Buffer 8 Data Register
FCMB8_DATA$85Message Buffer 8 Data Register
FCMB8_DATA$86Message Buffer 8 Data Register
FCMB9_CONTROL$88Message Buffer 9 Control / Status Register
FCMB9_ID_HIGH$89Message Buffer 9 ID High Register
FCMB9_ID_LOW$8AMessage Buffer 9 ID Low Register
FCMB9_DATA$8BMessage Buffer 9 Data Register
FCMB9_DATA$8CMessage Buffer 9 Data Register
FCMB9_DATA$8DMessage Buffer 9 Data Register
FCMB9_DATA$8EMessage Buffer 9 Data Register
Reserved
FCMB10_CONTROL$90Message Buffer 10 Control / Status Register
FCMB10_ID_HIGH$91Message Buffer 10 ID High Register
FCMB10_ID_LOW$92Message Buffer 10 ID Low Register
FCMB10_DATA$93Message Buffer 10 Data Register
FCMB10_DATA$94Message Buffer 10 Data Register
FCMB10_DATA$95Message Buffer 10 Data Register
FCMB10_DATA$96Message Buffer 10 Data Register
Reserved
FCMB11_CONTROL$98Message Buffer 11 Control / Status Register
FCMB11_ID_HIGH$99Message Buffer 11 ID High Register
FCMB11_ID_LOW$9AMessage Buffer 11 ID Low Register
FCMB11_DATA$9BMessage Buffer 11 Data Register
FCMB11_DATA$9CMessage Buffer 11 Data Register
FCMB11_DATA$9DMessage Buffer 11 Data Register
FCMB11_DATA$9EMessage Buffer 11 Data Register
Reserved
FCMB12_CONTROL$A0Message Buffer 12 Control / Status Register
FCMB12_ID_HIGH$A1Message Buffer 12 ID High Register
FCMB12_ID_LOW$A2Message Buffer 12 ID Low Register
FCMB12_DATA$A3Message Buffer 12 Data Register
FCMB12_DATA$A4Message Buffer 12 Data Register
FCMB12_DATA$A5Message Buffer 12 Data Register
FCMB13_CONTROL$A8Message Buffer 13 Control / Status Register
FCMB13_ID_HIGH$A9Message Buffer 13 ID High Register
FCMB13_ID_LOW$AAMessage Buffer 13 ID Low Register
FCMB13_DATA$ABMessage Buffer 13 Data Register
FCMB13_DATA$ACMessage Buffer 13 Data Register
FCMB13_DATA$ADMessage Buffer 13 Data Register
FCMB13_DATA$AEMessage Buffer 13 Data Register
Reserved
FCMB14_CONTROL$B0Message Buffer 14 Control / Status Register
FCMB14_ID_HIGH$B1Message Buffer 14 ID High Register
FCMB14_ID_LOW$B2Message Buffer 14 ID Low Register
FCMB14_DATA$B3Message Buffer 14 Data Register
FCMB14_DATA$B4Message Buffer 14 Data Register
FCMB14_DATA$B5Message Buffer 14 Data Register
FCMB14_DATA$B6Message Buffer 14 Data Register
Reserved
FCMB15_CONTROL$B8Message Buffer 15 Control / Status Register
FCMB15_ID_HIGH$B9Message Buffer 15 ID High Register
FCMB15_ID_LOW$BAMessage Buffer 15 ID Low Register
FCMB15_DATA$BBMessage Buffer 15 Data Register
FCMB15_DATA$BCMessage Buffer 15 Data Register
FCMB15_DATA$BDMessage Buffer 15 Data Register
FCMB15_DATA$BEMessage Buffer 15 Data Register
FC2STATUS$10Error and Status Register
FC2IMASK1$11Interrupt Masks 1 Register
FC2IFLAG1$12Interrupt Flags 1 Register
FC2R/T_ERROR_CNTRS$13Receive and Transmit Error Counters Register
Reserved
FC2IFLAG 2$1BInterrupt Flags 2 Register
Reserved
FC2MB0_CONTROL$40Message Buffer 0 Control / Status Register
FC2MB0_ID_HIGH$41Message Buffer 0 ID High Register
FC2MB0_ID_LOW$42Message Buffer 0 ID Low Register
FC2MB0_DATA$43Message Buffer 0 Data Register
FC2MB0_DATA$44Message Buffer 0 Data Register
FC2MB0_DATA$45Message Buffer 0 Data Register
FC2MB0_DATA$46Message Buffer 0 Data Register
Reserved
FC2MSB1_CONTROL$48Message Buffer 1 Control / Status Register
56F8366 Technical Data, Rev. 2.0
78 Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-39 FlexCAN2 Registers Address Map (Co n tinued)
FC2MSB1_ID_HIGH$49Message Buffer 1 ID High Register
FC2MSB1_ID_LOW$4AMessage Buffer 1 ID Low Register
FC2MB1_DATA$4BMessage Buffer 1 Data Register
FC2MB1_DATA$4CMessage Buffer 1 Data Register
FC2MB1_DATA$4DMessage Buffer 1 Data Register
FC2MB1_DATA$4EMessage Buffer 1 Data Register
Reserved
FC2MB2_CONTROL$50Message Buffer 2 Control / Status Register
FC2MB2_ID_HIGH$51Message Buffer 2 ID High Register
FC2MB2_ID_LOW$52Message Buffer 2 ID Low Register
FC2MB2_DATA$53Message Buffer 2 Data Register
FC2MB2_DATA$54Message Buffer 2 Data Register
FC2MB2_DATA$55Message Buffer 2 Data Register
FC2MB2_DATA$56Message Buffer 2 Data Register
Reserved
FC2MB3_CONTROL$58Message Buffer 3 Control / Status Register
FC2MB3_ID_HIGH$59Message Buffer 3 ID High Register
FC2MB3_ID_LOW$5AMessage Buffer 3 ID Low Register
FC2MB3_DATA$5BMessage Buffer 3 Data Register
FC2MB3_DATA$5CMessage Buffer 3 Data Register
FC2MB3_DATA$5DMessage Buffer 3 Data Register
FC2MB3_DATA$5EMessage Buffer 3 Data Register
Reserved
FC2MB4_CONTROL$60Message Buffer 4 Control / Status Register
FC2MB4_ID_HIGH$61Message Buffer 4 ID High Register
FC2MB4_ID_LOW$62Message Buffer 4 ID Low Register
FC2MB4_DATA$63Message Buffer 4 Data Register
FC2MB4_DATA$64Message Buffer 4 Data Register
FC2MB4_DATA$65Message Buffer 4 Data Register
FC2MB4_DATA$66Message Buffer 4 Data Register
Reserved
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor79
Preliminary
Table 4-39 FlexCAN2 Registers Address Map (Co n tinued)
FC2MB5_CONTROL$68Message Buffer 5 Control / Status Register
FC2MB5_ID_HIGH$69Message Buffer 5 ID High Register
FC2MB5_ID_LOW$6AMessage Buffer 5 ID Low Register
FC2MB5_DATA$6BMessage Buffer 5 Data Register
FC2MB5_DATA$6CMessage Buffer 5 Data Register
FC2MB5_DATA$6DMessage Buffer 5 Data Register
FC2MB5_DATA$6EMessage Buffer 5 Data Register
Reserved
FC2MB6_CONTROL$70Message Buffer 6 Control / Status Register
FC2MB6_ID_HIGH$71Message Buffer 6 ID High Register
FC2MB6_ID_LOW$72Message Buffer 6 ID Low Register
FC2MB6_DATA$73Message Buffer 6 Data Register
FC2MB6_DATA$74Message Buffer 6 Data Register
FC2MB6_DATA$75Message Buffer 6 Data Register
FC2MB6_DATA$76Message Buffer 6 Data Register
Reserved
FC2MB7_CONTROL$78Message Buffer 7 Control / Status Register
FC2MB7_ID_HIGH$79Message Buffer 7 ID High Register
FC2MB7_ID_LOW$7AMessage Buffer 7 ID Low Register
FC2MB7_DATA$7BMessage Buffer 7 Data Register
FC2MB7_DATA$7CMessage Buffer 7 Data Register
FC2MB7_DATA$7DMessage Buffer 7 Data Register
FC2MB7_DATA$7EMessage Buffer 7 Data Register
Reserved
FC2MB8_CONTROL$80Message Buffer 8 Contro l /Status Register
FC2MB8_ID_HIGH$81Message Buffer 8 ID High Register
FC2MB8_ID_LOW$82Message Buffer 8 ID Low Register
FC2MB8_DATA$83Message Buffer 8 Data Register
FC2MB8_DATA$84Message Buffer 8 Data Register
FC2MB8_DATA$85Message Buffer 8 Data Register
FC2MB8_DATA$86Message Buffer 8 Data Register
56F8366 Technical Data, Rev. 2.0
80 Freescale Semiconductor
Preliminary
Peripheral Memory Mapped Registers
Table 4-39 FlexCAN2 Registers Address Map (Co n tinued)
FC2MB9_CONTROL$88Message Buffer 9 Control / Status Register
FC2MB9_ID_HIGH$89Message Buffer 9 ID High Register
FC2MB9_ID_LOW$8AMessage Buffer 9 ID Low Register
FC2MB9_DATA$8BMessage Buffer 9 Data Register
FC2MB9_DATA$8CMessage Buffer 9 Data Register
FC2MB9_DATA$8DMessage Buffer 9 Data Register
FC2MB9_DATA$8EMessage Buffer 9 Data Register
Reserved
FC2MB10_CONTROL$90Message Buffer 10 Control / Status Register
FC2MB10_ID_HIGH$91Message Buffer 10 ID High Register
FC2MB10_ID_LOW$92Message Buffer 10 ID Low Register
FC2MB10_DATA$93Message Buffer 10 Data Register
FC2MB10_DATA$94Message Buffer 10 Data Register
FC2MB10_DATA$95Message Buffer 10 Data Register
FC2MB10_DATA$96Message Buffer 10 Data Register
Reserved
FC2MB11_CONTROL$98Message Buffer 11 Control / Status Register
FC2MB11_ID_HIGH$99Message Buffer 11 ID High Register
FC2MB11_ID_LOW$9AMessage Buffer 11 ID Low Register
FC2MB11_DATA$9BMessage Buffer 11 Data Register
FC2MB11_DATA$9CMessage Buffer 11 Data Register
FC2MB11_DATA$9DMessage Buffer 11 Data Register
FC2MB11_DATA$9EMessage Buffer 11 Data Register
Reserved
FC2MB12_CONTROL$A0Message Buffer 12 Control / Status Register
FC2MB12_ID_HIGH$A1Message Buffer 12 ID High Register
FC2MB12_ID_LOW$A2Message Buffer 12 ID Low Register
FC2MB12_DATA$A3Message Buffer 12 Data Register
FC2MB12_DATA$A4Message Buffer 12 Data Register
56F8366 Technical Data, Rev. 2.0
Freescale Semiconduc tor81
Preliminary
Table 4-39 FlexCAN2 Registers Address Map (Co n tinued)
FC2MB12_DATA$A5Message Buffer 12 Data Register
FC2MB12_DATA$A6Message Buffer 12 Data Register
Reserved
FC2MB13_CONTROL$A8Message Buffer 13 Control / Status Register
FC2MB13_ID_HIGH$A9Message Buffer 13 ID High Register
FC2MB13_ID_LOW$AAMessage Buffer 13 ID Low Register
FC2MB13_DATA$ABMessage Buffer 13 Data Register
FC2MB13_DATA$ACMessage Buffer 13 Data Register
FC2MB13_DATA$ADMessage Buffer 13 Data Register
FC2MB13_DATA$AEMessage Buffer 13 Data Register
Reserved
FC2MB14_CONTROL$B0Message Buffer 14 Control / Status Register
FC2MB14_ID_HIGH$B1Message Buffer 14 ID High Register
FC2MB14_ID_LOW$B2Message Buffer 14 ID Low Register
FC2MB14_DATA$B3Message Buffer 14 Data Register
FC2MB14_DATA$B4Message Buffer 14 Data Register
FC2MB14_DATA$B5Message Buffer 14 Data Register
FC2MB14_DATA$B6Message Buffer 14 Data Register
Reserved
FC2MB15_CONTROL$B8Message Buffer 15 Control / Status Register
FC2MB15_ID_HIGH$B9Message Buffer 15 ID High Register
FC2MB15_ID_LOW$BAMessage Buffer 15 ID Low Register
FC2MB15_DATA$BBMessage Buffer 15 Data Register
FC2MB15_DATA$BCMessage Buffer 15 Data Register
FC2MB15_DATA$BDMessage Buffer 15 Data Register
FC2MB15_DATA$BEMessage Buffer 15 Data Register
Reserved
56F8366 Technical Data, Rev. 2.0
82 Freescale Semiconductor
Preliminary
Factory Programmed Memory
4.8 Factory Programmed Memory
The Boot Flash memory block is programmed during manufacturing with a default Serial Bootloader
program. The Serial Bootloader application can be used to load a user application into the Program and
Data Flash (NOT available in the 56F8166 device) mem ories of the device. The 56F83xx SCI/CAN
Bootloader User Manual (MC56F83xxBLUM) provides detailed information on this firmware. An
application note, Production Flash Programming (AN1973), details how the Serial Bootloader program
can be used to perform production flash programming of the on board flash memories a s well as other
potential methods.
Like all the flash memory blocks the Boot Flash can be erased and programmed by the user. The Serial
Bootloader application is programmed as an aid to the end user, but is not required to be used or maintained
in the Boot Flash memory.
Part 5 Interrupt Controller (ITCN)
5.1 Introduction
The Interrupt Controller (ITCN) module is used to arbitrate between various interrupt requests (IRQs), to
signal to the 56800E core when an interrupt of sufficient priority exists, and to what address to jump in
order to service this interrupt.
5.2 Features
The ITCN module design includes these distinctive features:
•Programmable priority levels for each IRQ
•Two programmable Fast Interrupts
•Notification to SIM module to restart clocks out of Wait and Stop modes
•Drives initial address on the address bus after reset
For further information, see Table 4-5, Interrupt Vector Table Contents.
5.3 Functional Description
The Interrupt Controller is a slave on the IPBus. It contains registers allowing each of the 86 interrupt
sources to be set to one of four priority levels, excluding certain interrupts of fixed priority. Next, all of
the interrupt requests of a given level are priority encoded to determine the lowest numerical value of the
active interrupt requests for that level. Within a given priority level, zero is the highest priority, while
number 85 is the lowest.
5.3.1Normal Interrupt Handling
Once the ITCN has determined that an interrupt is to be serviced and which interrupt has the highest
priority, an interrupt vector address is generated. Normal interrupt handling concatenates the VBA and the
vector number to determine the vector address. In this way, an offset is generated into the vector table for
each interrupt.
56F8366 Technical Data, Rev. 2.0
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Preliminary
5.3.2Interrupt Nesting
Interrupt exceptions may be nested to allow an IRQ of higher priority than the current exception to be
serviced. The following tables define the nesting requirements for each priority level.
1. Core status register bits indicat i ng current interrupt mask w ithin the core.
SR[8]
1
Permitted Exceptions Masked Exceptions
Table 5-2 Interrupt Priority Encoding
IPIC_LEVEL[1:0]
00No Interrupt or SWILPPriorities 0, 1, 2, 3
01Priority 0Priorities 1, 2, 3
10Priority 1Priorities 2, 3
11Prioriti es 2 or 3Priority 3
1. See IPIC field definition in Part 5.6.30.2.
1
Current Interrupt
Priority Level
Required Nested
Exception Priority
5.3.3Fast Interrupt Handling
Fast interrupts are described in the DSP56800E Reference Manual. The interrupt controller recognizes
fast interrupts before the core does.
A fast interrupt is defined (to the ITCN) by:
1. Setting the priority of the interrupt as level 2, with the appropriate field in the IPR registers
2. Setting the FIMn register to the appropriate vector number
3. Setting the FIVALn and FIVAHn registers with the address of the code for the fast interrupt
When an interrupt occurs, its vector number is compared with the FIM0 and FIM1 register values. If a
match occurs, and it is a level 2 interrupt, the ITCN handles it as a fast interrupt. The ITCN takes the vector
address from the appropriate FIVALn and FIVAHn registers, instead of generating an address that is an
offset from the VBA.
The core then fetches the instruction from the indicated vector adddress and if it is not a JSR, the core starts
its fast interrupt handling.
56F8366 Technical Data, Rev. 2.0
84 Freescale Semiconductor
Preliminary
5.4 Block Diagram
Block Diagram
INT1
INT82
Priority
Level
2 -> 4
Decode
Priority
Level
2 -> 4
Decode
Level 0
82 -> 7
Priority
Encoder
Level 3
82 -> 7
Priority
Encoder
any0
7
INT
VAB
CONTROL
IPIC
any3
IACK
7
SR[9:8]
PIC_EN
Figure 5-1 Interrupt Controller Block Diagram
5.5 Operating Modes
The ITCN module design contains two major modes of operation:
•Functional Mode
The ITCN is in this mode by default.
•Wait and Stop Modes
During Wait and Stop modes, the system clocks and the 56800E core are turned off. The ITCN will signal
a pending IRQ to the System Integration Module (SIM) to restart the clocks and service the IRQ. An IRQ
can only wake up the core if the IRQ is enabled prior to entering the Wait or Stop mode. Also, the IRQA
and IRQB
are set to make them falling-edge sensitive. This is because there is no clock available to detect the falling
edge.
A peripheral whic h requires a clock to ge nerate int errupts wil l not be abl e to generat e interrup ts during S top
mode. The FlexCAN module can wake the device from Stop mode, and a reset will do just that, or IRQA
and IRQB
signals automatical ly beco me low- level sensit ive in t hes e modes even if the co ntrol regist er bit s
can wake it up.
56F8366 Technical Data, Rev. 2.0
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Preliminary
5.6 Register Descriptions
A register address is the sum of a base address and an addres s offset. The base address is defined at the
system level and the address offset is defined at the module level. The ITCN peripheral has 24 registers.