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Document No:B650004 Rev.C
Foxconn LIF 223 Socket
User Guide
P/N: PL223*3-164*-01F
Approved by: Michael Lai Checked by: Gallen Hseih Prepared by: Peter Sun
Confidential
ICS/DQA
2006/03/20 Page:1
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Contents
Contents
Contents
• Application
• Socket Outline Dimension
• Socket Pick & Place Design
• Recommended Soldering Condition
• Socket Actuation Introduce
• Unpacking Guide
• How to Reserve Socket
Confidential
ICS/DQA
2006/03/20 Page:2
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Application
Application
Application
Introduction
• Name : LIF 223 Socket
• Pin count : 223 Positions
• Socket envelop: 50.34mmx21.94mmx2.24mm
• Interface:
Carrier side : Low insertion force with 2 point contact for
m PGA pin on the package
PCB side : ∅∅∅∅0.76mm solder ball
Solder ball coplanarity 0.20mm max
Confidential
ICS/DQA
2006/03/20 Page:3
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Socket outline dimension
Socket outline dimension
Socket outline dimension
The outline dimensions of LIF223 socket are shown as below.
Dim H
Confidential
ICS/DQA
Dim H: 2.235+/- 0.127mm after
soldering process
2006/03/20 Page:4
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Socket Pick & Place Design
Socket Pick & Place Design
Socket Pick & Place Design
Foxconn’s packaging tray
dimension:
Center of Gravity
(Recommended Pick-up Location)
Confidential
ICS/DQA
Relation between socket
and tray pocket
2006/03/20 Page:5