Foxconn LIF223 User Manual

Document No:B650004 Rev.C

Foxconn LIF 223 Socket

User Guide

P/N: PL223*3-164*-01F

Approved by: Michael Lai Checked by: Gallen Hseih Prepared by: Peter Sun

Confidential

ICS/DQA

2006/03/20 Page:1

Contents

Contents

Contents

• Application

• Socket Outline Dimension

• Socket Pick & Place Design

• Recommended Soldering Condition

• Socket Actuation Introduce

• Unpacking Guide

• How to Reserve Socket

Confidential

ICS/DQA

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Application

Application

Application

Introduction

• Name : LIF 223 Socket

• Pin count : 223 Positions

• Socket envelop: 50.34mmx21.94mmx2.24mm

• Interface:

Carrier side : Low insertion force with 2 point contact for

m PGA pin on the package

PCB side : ∅∅∅∅0.76mm solder ball

Solder ball coplanarity 0.20mm max

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ICS/DQA

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Socket outline dimension

Socket outline dimension

Socket outline dimension

The outline dimensions of LIF223 socket are shown as below.

Dim H

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ICS/DQA

Dim H: 2.235+/- 0.127mm after
soldering process

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Socket Pick & Place Design

Socket Pick & Place Design

Socket Pick & Place Design

Foxconn’s packaging tray

dimension:

Center of Gravity

(Recommended Pick-up Location)

Confidential

ICS/DQA

Relation between socket

and tray pocket

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