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L830-EB
Service Manual
39 pgs1.98 Mb0

Fibocom L830-EB Service Manual

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L830-EBHardware User Manual Page 1 of 39
L830-EB Hardware User Manual
Version: V1.0.3 Update date: 2017.06.26
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L830-EB Hardware User Manual Page 2 of 39
Applicability Table
No.
Product model
Description
1
L830-EB-11
NA
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Copyright
Copyright © 2017 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee.
Version Record
Version
Update
Remark
V1.0.0
2017-03-06
Initial version
V1.0.1
2017-04-05
1. Delete SSIC section and description
2. Modify power consumption and RF performance “TBD”
V1.0.2
2017-06-02
Update RF band support,Modify I2S support
V1.0.3
2017-06-24
1. Modify timing diagram
2. Update power consumption and RF performance data
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L830-EB Hardware User Manual Page 4 of 39
Contents
1 Preface ...................................................................................................................................................... 6
1.1 Introduction ..................................................................................................................................... 6
1.2 Reference Standard ........................................................................................................................ 6
1.3 Related Documents ........................................................................................................................ 6
2 Overview.................................................................................................................................................... 7
2.1 Introduction ..................................................................................................................................... 7
2.2 Specification .................................................................................................................................... 7
2.3 Application Framework.................................................................................................................... 8
2.4 Hardware Framework ..................................................................................................................... 9
3 Application Interface .................................................................................................................................. 9
3.1 M.2 Interface ................................................................................................................................... 9
3.1.1 Pin Map ............................................................................................................................... 10
3.1.2 Pin Definition ........................................................................................................................ 11
3.2 Power Supply ................................................................................................................................ 14
3.2.1 Power Supply ...................................................................................................................... 15
3.2.2 Logic level ........................................................................................................................... 16
3.2.3 Power Consumption ........................................................................................................... 16
3.3 Control Signal ............................................................................................................................... 17
3.3.1 Module Start-Up .................................................................................................................. 18
3.3.1.1 Start-up Circuit .......................................................................................................... 18
3.3.1.2 Start-up Timing Sequence ........................................................................................ 19
3.3.2 Module Shutdown ............................................................................................................... 19
3.3.2.1 Software Shutdown .................................................................................................. 19
3.3.2.2 Hardware Shutdown ................................................................................................. 20
3.3.3 Module Reset ...................................................................................................................... 21
3.4 USB Interface ................................................................................................................................ 22
3.4.1 USB Interface Definition ..................................................................................................... 22
3.4.2 USB Interface Application ................................................................................................... 22
3.5 USIM Interface .............................................................................................................................. 23
3.5.1 USIM Pins ........................................................................................................................... 23
3.5.2 USIM Interface Circuit ........................................................................................................ 23
3.5.2.1 N.C. SIM Card Slot ................................................................................................... 23
3.5.2.2 N.O. SIM Card Slot ................................................................................................... 24
3.5.3 USIM Hot-Plugging ............................................................................................................. 24
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3.5.4 USIM Design ....................................................................................................................... 25
3.6 Status Indicator ............................................................................................................................. 26
3.6.1 LED#1 Signal ...................................................................................................................... 26
3.6.2 WOWWAN# ........................................................................................................................ 27
3.7 Interrupt Control ............................................................................................................................ 27
3.7.1 W_DISABLE1# ................................................................................................................... 27
3.7.2 Body SAR ........................................................................................................................... 27
3.8 Digital Audio .................................................................................................................................. 28
3.8.1 I2S Mode ............................................................................................................................ 28
3.8.2 PCM Mode .......................................................................................................................... 29
3.9 I2C Interface Description .............................................................................................................. 29
3.10 Clock Interface ............................................................................................................................ 30
3.11 Configuration Interface ................................................................................................................ 30
3.12 Other Interfaces .......................................................................................................................... 31
4 Radio Frequency ..................................................................................................................................... 31
4.1 RF Interface .................................................................................................................................. 31
4.1.1 RF Interface Functionality................................................................................................... 31
4.1.2 RF Connector Characteristic .............................................................................................. 31
4.1.3 RF Connector Dimension ................................................................................................... 31
4.2 Operating Band ............................................................................................................................. 33
4.3 Transmitting Power ....................................................................................................................... 33
4.4 Receiver Sensitivity ....................................................................................................................... 34
4.5 GNSS ............................................................................................................................................ 34
4.6 Antenna Design ............................................................................................................................. 34
5 Structure Specification ............................................................................................................................. 35
5.1 Product Appearance ..................................................................................................................... 35
5.2 Dimension of Structure ................................................................................................................. 35
5.3 M.2 Interface Model ...................................................................................................................... 36
5.4 M.2 Connector .............................................................................................................................. 36
5.5 Storage .......................................................................................................................................... 37
5.5.1 Storage Life ......................................................................................................................... 37
5.6 Packing ......................................................................................................................................... 37
5.6.1 Tray Package ...................................................................................................................... 38
5.6.2 Tray size ............................................................................................................................. 39
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1 Preface
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L830-EB (hereinafter referred to as L830). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L830 modules and develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio
transmission and reception (FDD);Part 1: Conformance specification
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio
transmission and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements  3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application
Toolkit(USAT)
3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile
terminals and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)  PCI_Express_M.2_Specification_Rev1.1
1.3 Related Documents
RF Antenna Application Design Specification  L8-Family System Driver Integration and Application Guidance  L8-Family AT Commands Manual
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L830-EB Hardware User Manual Page 7 of 39
2 Overview
2.1 Introduction
The L830 is a highly integrated 4G cellular module which uses the standard PCIe M.2 interface.It supports LTE FDD/WCDMA mode cellular communication.
2.2 Specification
Specification
Operating Band LTE FDD: Band 1,3,7,8,20,28,32
WCDMA/HSPA+: Band I, VIII
GPS/GLONASS: Not Support
CA LTE inter-band CA
1 +3,7,20
3 +7,8,20,28,32
7 +20,28
LTE intra-band CA
3,7
Data Transmission
LTE FDD
300Mbps DL/50Mbps UL(Cat 6)
UMTS/HSPA+ UMTS:384 kbps DL/384 kbps UL
DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)
Power Supply
DC 3.135V～4.4V, Typical 3.3V
Temperature Normal Operating temperature：-10°C ～+55°C
Extended Operating temperature：-30°C ～+65°C
Storage temperature：-40°C ～+85°C
Physical characteristics
Interface: M.2 Key-B
Dimension：30 x 42 x 2.3mm
Weight: About 5.8 g
Interface
Antenna WWAN Main Antenna x 1
WWAN Diversity Antenna x 1
Function Interface
USIM 3V/1.8V
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L830-EB Hardware User Manual Page 8 of 39
USB 2.0 x 1
I2S
I2C
EINT、System Indicator
Clock
Software
Protocol Stack
IPV4/IPV6
AT commands
3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands
Firmware update
USB
2.3 Application Framework
The peripheral applications for L830 module are shown in Figure 2-1:
Module
SIM USB
Power
Supply
ON/OFF# RESET#
Control
EINT Indicator
Host application
Main ANT
Div/GNSS ANT
SIM
Card
Figure2-1 Application Framework
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L830-EB Hardware User Manual Page 9 of 39
2.4 Hardware Framework
The hardware framework in Figure 2-2 shows the main hardware functions of L830 module, including baseband and RF functions. Baseband contains the followings:
UMTS/LTE FDD controller/Power supply  NAND/internal LPDDR2 RAM  Application interface
RF contains the followings:
RF Transceiver  RF Power/PA  RF Front end  RF Filter  Antenna Connector
+3.3V
FUL_CARD_POWER_OFF#
RESET#
USB2.0
USIM
EINT
WOWWAN#
LED
I2S I2C
CLOCK
Tunable ANT
Baseband
(UMTS/LTE FDD controller)
PMU
TX
LPDDR2
RAM
NAND
Div
FEM
Main
FEMiD
PA DCDC
PA
RF Transceiver
RX
RX
RF Part
TCXO
M.2 Key-B 75pin interface
Div/GNSS
ANT
Main ANT
GNSS
Figure 2-2 Hardware Framework
3 Application Interface
3.1 M.2 Interface
The L830 module uses standard M.2 Key-B interface, with a total of 75 pins.
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L830-EB Hardware User Manual Page 10 of 39
3.1.1 Pin Map
Figure 3-1 Pin Map
Note:
Pin “Notch” represents the gap of the gold fingers.
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L830-EB Hardware User Manual Page 11 of 39
3.1.2 Pin Definition
The pin definition is as follows:
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
1
CONFIG_3
O
L
Connected to internal GND, L830 M.2 module is configured as the WWAN-SSIC 0 interface type.
2
+3.3V
PI Module main power input.
Power Supply
3
GND
GND
Power Supply
4
+3.3V
PI Module main power input.
Power Supply
5
GND
GND
Power Supply
6
FULL_CARD_POWER_OFF#
I
Power on/off control signal,active High.
CMOS
3.3/1.8V
7
USB D+
I/O USB 2.0 D+ signal
0.3---3V
8
W_DISABLE1#
I
PU
WWAN Disable, active low.
CMOS 3.3V
9
USB D-
I/O USB 2.0 D- signal
0.3---3V
10
LED1#
O
OD
System status LED, drain output.
CMOS 3.3V
11
GND
GND
Power Supply
12
Notch
Notch
13
Notch
Notch
14
Notch
Notch
15
Notch
Notch
16
Notch
Notch
17
Notch
Notch
18
Notch
Notch
19
Notch
Notch
20
I2S_CLK
O
PD
I2S serial clock
CMOS 1.8V
21
CONFIG_0
O
NC
Not connected, L830 M.2 module is configured as the WWAN-SSIC 0 interface type.
22
I2S_RX
I
PD
I2S serial data input
CMOS 1.8V
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L830-EB Hardware User Manual Page 12 of 39
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
23
WOWWAN#
O
PU
Wake up host signal
CMOS 1.8V
24
I2S_TX
O
PD
I2S serial data output
CMOS 1.8V
25
DPR I PU
Body SAR detection
CMOS 1.8V
26
W_DISABLE2#
I
PU
GPS Disable signal, active low. (Not supported yet)
CMOS 1.8V
27
GND
GND
Power Supply
28
I2S_WA
O
PD
I2S clock for left and right channels
CMOS 1.8V
29
NC NC
30
UIM_RESET
O
PP
USIM reset signal
1.8V/3V
31
NC NC 32
UIM_CLK
O
PP
USIM clock signal
1.8V/3V
33
GND
GND
Power Supply
34
UIM_DATA
I/O
PU
USIM data signal, internal 4.7KΩ pull-up.
1.8V/3V 35
NC NC
36
UIM_PWR
O USIM power supply
1.8V/3V
37
NC NC 38
NC
NC
39
GND
GND
Power Supply
40
GNSS_SCL
O
PU
I2C serial clock signal, internal
4.7KΩ pull-up
CMOS 1.8V
41
NC
NC
42
GNSS_SDA
I/O
PU
I2C serial data signal, internal 4.7KΩ pull-up
CMOS 1.8V
43
NC
NC 44
GNSS_IRQ
I
PU
Reserved
CMOS 1.8V
45
GND
GND
Power Supply
46
SYSCLK
O L 26MHz clock output
1.8V
47
NC
NC
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