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Advanced Power MOSFET
SSF25N40A
FEATURES
Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
Extended Safe Operating Area
Lower Leakage Current : 10 µA (Max.) @ VDS = 400V
Low R
: 0.162 Ω (Typ.)
DS(ON)
Absolute Maximum Ratings
Characteristic Value UnitsSymbol
Drain-to-Source Voltage
Continuous Drain Current (T
Continuous Drain Current (T
o
=25 )
C
=100 )
C
C
o
C
Drain Current-Pulsed
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Total Power Dissipation (T
=25 )
C
o
C
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8” from case for 5-seconds
T
V
DSS
I
I
DM
V
E
I
AR
E
dv/dt
P
, T
J
T
D
GS
AS
AR
D
STG
L
O
O
O
O
O
BV
R
I
= 400 V
DSS
= 0.2 Ω
DS(on)
= 14.3 A
D
TO-3PF
1
2
3
1.Gate 2. Drain 3. Source
400
14.3
9.1
1
2
1
1
3
100
+
_
30
1753
14.3
10
4.0
100
0.8
- 55 to +150
300
V
A
A
V
mJ
A
mJ
V/ns
W
W/
o
o
C
C
Thermal Resistance
Symbol Typ.
R
θ
JC
R
θ
JA
©1999 Fairchi ld Semiconduc tor Corpor ation
Characteristic Max.
Junction-to-Case
Junction-to-Ambient
Units
--
--
1.25
40
o
C
/W
Rev. B
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SSF25N40A
Electrical Characteristics (T
o
=25 unless otherwise specified)
C
C
N-CHANNEL
POWER MOSFET
BV
BV/ T
∆ ∆
V
R
DSS
GS(th)
I
GSS
I
DSS
DS(on)
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
Q
gs
Q
gd
CharacteristicSymbol
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coeff.
J
Gate Threshold Voltage
Gate-Source Leakage , Forward
Gate-Source Leakage , Reverse
Drain-to-Source Leakage Current
Static Drain-Source
On-State Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
g
Gate-Source Charge
Gate-Drain( “Miller” ) Charge
400
--
2.0
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Max. UnitsTyp.Min. Test Condition
=0V,ID=250 A
V
--
--
4.0
100
10
100
0.2
--
500
240
55
60
260
85
182
--
--
V
GS
o
I
V/
nA
µ
=250 A See Fig 7
C
D
V
V
A
Ω
Ω
pF
ns
=5V,ID=250 A
DS
V
=30V
GS
V
=-30V
GS
V
=400V
DS
V
=320V,TC=125
DS
=10V,ID=7.15A
V
GS
=50V,ID=7.15A
V
DS
=0V,VDS=25V,f =1MHz
V
GS
See Fig 5
V
=200V,ID=25A,
DD
=5.3
R
G
See Fig 13
V
=320V,VGS=10V,
DS
nC
I
=25A
D
See Fig 6 & Fig 12
µ
--
0.52
--
--
--
--
--
--
14.28
3180
435
200
22
25
127
38
140
21
64.8
-100
4130
µ
µ
o
C
4
O
4
O
Ω
5
O4O
5
O4O
Source-Drain Diode Ratings and Characteristics
CharacteristicSymbol Max. UnitsTyp.Min. Test Condition
I
I
SM
V
t
Q
Notes ;
Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature
1
O
2
L=15mH, I
O
3
I
O
Pulse Test : Pulse Width = 250 s, Duty Cycle 2%
4
O
Essentially Independent of Operating Temperature
5
O
Continuous Source Current
S
Pulsed-Source Current
Diode Forward Voltage
SD
Reverse Recovery Time
rr
Reverse Recovery Charge
rr
=14.3A, VDD=50V, RG=27 , Starting TJ =25
AS
_
_
<
25A, di/dt 320A/ s, VDDBV
SD
<
µ
--
o
C
--
--
484
7.6
o
C
14.3
100
1.5
--
--
A
V
ns
µ
C
--
1
--
O
4
--
O
--
--
Ω
_
<
, Starting TJ =25
DSS
µ
_
<
Integral reverse pn-diode
in the MOSFET
o
T
=25 ,IS=14.3A,VGS=0V
C
J
o
C
T
=25 ,IF=25A
J
/dt=100A/ s
di
F
µ
O
4
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N-CHANNEL
POWER MOSFET
SSF25N40A
2
10
1
10
0
, Drain Current [A]
10
D
I
-1
10
Fig 1. Output Characteristics Fig 2. Transfer Characteristics
V
GS
Top : 1 5 V
1 0 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
@ Notes :
1. 250
s Pulse Test
µ
2. T
= 25 oC
C
0
10
VDS , Drain-Source Voltage [V]
0.5
0.4
]
Ω
0.3
V
= 10 V
GS
, [
DS(on)
0.2
R
VGS = 20 V
0.1
Drain-Source On-Resistance
@ Note : TJ = 25 oC
0.0
0 20 40 60 80 100
ID , Drain Current [A]
2
10
o
150
25 oC
C
@ Notes :
= 0 V
1. V
GS
2. V
- 55
o
C
3. 250
= 50 V
DS
s Pulse Test
µ
1
10
, Drain Current [A]
D
I
0
1
10
10
2 4 6 8 10
VGS , Gate-Source Voltage [V]
Fig 4. Source-Drain Diode Forward VoltageFig 3. On-Resistance vs. Drain Current
2
10
1
10
150 oC
, Reverse Drain Current [A]
DR
0
I
10
25 oC
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
, Source-Drain Voltage [V]
V
SD
@ Notes :
1. V
= 0 V
GS
2. 250 µs Pulse Test
5000
C
4000
iss
3000
2000
C
oss
Capacitance [pF]
C
1000
0
10
rss
0
VDS , Drain-Source Voltage [V]
C
= Cgs+ Cgd ( Cds= shorted )
iss
C
= Cds+ C
oss
gd
C
= C
rss
gd
@ Notes :
1. VGS = 0 V
2. f = 1 MHz
1
10
Fig 6. Gate Charge vs. Gate-Source VoltageFig 5. Capacitance vs. Drain-Source Voltage
V
V
DS
= 80 V
DS
= 200 V
10
VDS = 320 V
5
, Gate-Source Voltage [V]
GS
V
0
0 30 60 90 120 150
@ Notes : ID = 25.0 A
QG , Total Gate Charge [nC]