Fairchild Semiconductor NDC631N Datasheet
July 1996
NDC631N
N-Channel Logic Level Enhancement Mode Field Effect Transistor
General Description Features
These N-Channel logic level enhancement mode power field
effect transistors are produced using Fairchild's proprietary,
high cell density, DMOS technology. This very high density
process is tailored to minimize on-state resistance. These
devices are particularly suited for low voltage applications in
notebook computers, portable phones, PCMICA cards, and
other battery powered circuits where fast switching, and low
in-line power loss are needed in a very small outline surface
mount package.
____________________________________________________________________________________________
4.1 A, 20 V. R
R
= 0.06 Ω @ VGS = 4.5 V
DS(ON)
= 0.075 Ω @ VGS =2.7 V.
DS(ON)
Proprietary SuperSOTTM-6 package design using copper
lead frame for superior thermal and electrical capabilities.
High density cell design for extremely low R
DS(ON)
.
Exceptional on-resistance and maximum DC current
capability.
3
2
1
Absolute Maximum Ratings T
= 25°C unless otherwise note
A
4
5
6
Symbol Parameter NDC631N Units
V
V
I
D
Drain-Source Voltage 20 V
DSS
Gate-Source Voltage - Continuous 8 V
GSS
Drain Current - Continuous (Note 1a) 4.1 A
- Pulsed 15
P
TJ,T
Maximum Power Dissipation (Note 1a) 1.6 W
D
(Note 1b) 1
(Note 1c)
Operating and Storage Temperature Range -55 to 150 °C
STG
0.8
THERMAL CHARACTERISTICS
R
R
Thermal Resistance, Junction-to-Ambient (Note 1a) 78 °C/W
JA
θ
Thermal Resistance, Junction-to-Case (Note 1) 30 °C/W
JC
θ
© 1997 Fairchild Semiconductor Corporation
NDC631N Rev.D1
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
BV
I
DSS
I
GSSF
I
GSSR
DSS
Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 20 V
Zero Gate Voltage Drain Current
Gate - Body Leakage, Forward
Gate - Body Leakage, Reverse
VDS = 16 V, V
GS
= 0 V
VGS = 8 V, VDS = 0 V
VGS = -8 V, VDS= 0 V
TJ = 55oC
1 µA
10 µA
100 nA
-100 nA
ON CHARACTERISTICS (Note 2)
V
R
GS(th)
DS(ON)
Gate Threshold Voltage
VDS = VGS, ID = 250 µA
TJ = 125oC
Static Drain-Source On-Resistance VGS = 4.5 V, ID = 4.1 A 0.039 0.06
TJ = 125oC
0.4 0.7 1 V
0.3 0.5 0.8
Ω
0.06 0.11
VGS = 2.7 V, ID = 3.6 A 0.05 0.075
I
g
D(on)
On-State Drain Current
FS
Forward Transconductance VDS = 4.5 V, ID = 4.1 A 12 S
VGS = 4.5 V, VDS = 5 V
15 A
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance 230 pF
VDS = 10 V, V
f = 1.0 MHz
GS
= 0 V,
Reverse Transfer Capacitance 95 pF
365 pF
SWITCHING CHARACTERISTICS (Note 2)
t
t
t
t
Q
Q
Q
D(on)
r
D(off)
f
Turn - On Delay Time
Turn - On Rise Time 25 45 ns
VDD = 5 V, ID = 1 A,
V
= 4.5 V, R
GEN
GEN
= 6 Ω
Turn - Off Delay Time 28 50 ns
Turn - Off Fall Time 8 15 ns
g
gs
gd
Total Gate Charge
Gate-Source Charge 1 nC
Gate-Drain Charge 3.3 nC
VDS = 10 V,
ID = 4.1 A, VGS = 4.5 V
9 17 ns
10 14 nC
NDC631N Rev.D1
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Symbol Parameter Conditions Min Typ Max Units
DRAIN-SOURCE DIODE CHARACTERISTICS
I
S
V
SD
1. R
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
Continuous Source Diode Current 1.3 A
Drain-Source Diode Forward Voltage
Notes:
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
JA
θ
design while R
(t)
P
D
Typical R
is determined by the user's board design.
CA
θ
T
=
R
JA
θ
a. 78oC/W when mounted on a 1 in2 pad of 2oz copper.
b. 125oC/W when mounted on a 0.01 in2 pad of 2oz copper.
c. 156oC/W when mounted on a 0.003 in2 pad of 2oz copper.
T
J−TA
=
(t)
R
θJ A
θ
J C
using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
J−TA
+R
2
= I
(t) × R
DS(ON ) T
D
(t)
θ
CA
J
1a
VGS = 0 V, IS = 1.3 A (Note 2)
1b
1c
0.75 1.2 V
is guaranteed by
JC
θ
NDC631N Rev.D1
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