May 1994
NDP708A / NDP708AE / NDP708B / NDP708BE
NDB708A / NDB708AE / NDB708B / NDB708BE
N-Channel Enhancement Mode Field Effect Transistor
General Description Features
These N-channel enhancement mode power field
effect transistors are produced using Fairchild's
proprietary, high cell density, DMOS technology. This
very high density process has been especially
tailored to minimize on-state resistance, provide
superior switching performance, and withstand high
energy pulses in the avalanche and commutation
modes. These devices are particularly suited for low
voltage applications such as automotive, DC/DC
converters, PWM motor controls, and other battery
powered circuits where fast switching, low in-line
power loss, and resistance to transients are needed.
_____________________________________________________________________
60 and 54A, 80V. R
= 0.022 and 0.025Ω.
DS(ON)
Critical DC electrical parameters specified at
elevated temperature.
Rugged internal source-drain diode can eliminate
the need for an external Zener diode transient
suppressor.
175°C maximum junction temperature rating.
High density cell design (3 million/in²) for extremely
low R
DS(ON)
.
TO-220 and TO-263 (D2PAK) package for both
through hole and surface mount applications.
D
Absolute Maximum Ratings T
Symbol Parameter
V
V
V
I
P
TJ,T
T
DSS
DGR
GSS
D
D
L
Drain-Source Voltage 80 V
Drain-Gate Voltage (RGS < 1 MΩ)
Gate-Source Voltage - Continuous ±20 V
- Nonrepetitive (tP < 50 µs)
Drain Current - Continuous 60 54 A
- Pulsed 180 162 A
Total Power Dissipation @ TC = 25°C
Derate above 25°C
Operating and Storage Temperature Range -65 to 175 °C
STG
Maximum lead temperature for soldering
purposes, 1/8" from case for 5 seconds
= 25°C unless otherwise noted
C
NDP708A NDP708AE
NDB708A NDB708AE
G
S
NDP708B NDP708BE
NDB708B NDB708BE Units
80 V
±40 V
150 W
1
W/°C
275 °C
© 1997 Fairchild Semiconductor Corporation
NDP708.SAM
Electrical Characteristics (T
= 25°C unless otherwise noted)
C
Symbol Parameter Conditions Type Min Typ Max Units
DRAIN-SOURCE AVALANCHE RATINGS (Note 1)
E
AS
I
AR
Single Pulse Drain-Source
Avalanche Energy
Maximum Drain-Source Avalanche Current 60 A
VDD = 25 V, ID = 60 A NDP708AE
NDP708BE
NDB708AE
NDB708BE
600 mJ
OFF CHARACTERISTICS
BV
Drain-Source Breakdown
DSS
VGS = 0 V, ID = 250 µA ALL 80 V
Voltage
I
DSS
I
GSSF
I
GSSR
Zero Gate Voltage Drain
Current
VDS = 80 V,
V
= 0 V
GS
TJ = 125°C
ALL 250 µA
1 mA
Gate - Body Leakage, Forward VGS = 20 V, VDS = 0 V ALL 100 nA
Gate - Body Leakage, Reverse
VGS = -20 V, VDS = 0 V
ALL -100 nA
ON CHARACTERISTICS (Note 2)
V
R
GS(th)
DS(ON)
Gate Threshold Voltage
Static Drain-Source
On-Resistance
VDS = VGS,
ID = 250 µA
VGS = 10 V,
ID = 30 A
TJ = 125°C
ALL 2 2.6 4 V
1.4 1.9 3.6 V
NDP708A
0.016 0.022
NDP708AE
NDB708A
0.025 0.04
0.25
VGS = 10 V,
ID = 27 A
TJ = 125°C
NDB708AE
NDP708B
NDP708BE
NDB708B
0.044
I
D(on)
TJ = 125°C
NDB708BE
On-State Drain Current VGS = 10 V, VDS = 10 V NDP708A
60 A
NDP708AE
NDB708A
NDB708AE
NDP708B
54 A
NDP708BE
NDB708B
NDB708BE
g
FS
Forward Transconductance VDS = 10 V, ID = 30 A ALL 16 33 S
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
Input Capacitance VDS = 25 V, VGS = 0 V,
Output Capacitance ALL 780 1000 pF
f = 1.0 MHz
Reverse Transfer Capacitance ALL 285 400 pF
ALL 2800 3600 pF
Ω
Ω
Ω
Ω
NDP708.SAM