Fairchild Semiconductor ISL9N302AS3ST Datasheet

April 2002
ISL9N302AS3ST
N-Channel Logic Level PWM Optimized UltraFET® Trench P ower MOSFETs
ISL9N302AS3ST
General Description
This device employs a new advanced trench MOSFET
Features
• Fast switching technology and features low gate charge while maintaining low on-resistance.
Optimized for switching applications, this device improves the overall efficiency of DC/DC converters and allows operation to higher switchingfrequencies.
Applications
• DC/DC converters
DRAIN
(FLANGE)
GATE
SOURCE
•r
•r
•Q
•Q
•C
=0.0019Ω (Typ), VGS=10V
DS(ON)
=0.0027Ω (Typ), VGS=4.5V
DS(ON)
(Typ) = 110nC, VGS=5V
g
(Typ) = 31nC
gd
(Typ) = 11000pF
ISS
G
D
S
TO-263AB
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
DSS
V
GS
I
D
P
D
T
J,TSTG
Drainto SourceVoltage 30 V Gate to Source Voltage ±20 V DrainCurrent Continuous (T Continuous (T Continuous (T
=25oC, VGS=10V)
C
=100oC, VGS=4.5V) 75 A
C
=25oC, VGS=10V,R
C
Pulsed Figure 4 A Power dissipation
Derateabove 25
o
C
Operating and Storage Temperature -55 to 175
= 25°C unless otherwise noted
A
=43oC/W) 28 A
θJA
75 A
345
2.3
W
W/oC
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
ThermalResistanceJunction to Case TO-263 0.43 ThermalResistance Junctionto A mbient TO-263 62 ThermalResistance Junction to AmbientTO-263, 1in2copper pad area 43
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
N302AS ISL9N302AS3ST TO-263AB 330mm 24mm 800 units
©2002 FairchildSemiconductor Corporation
o
C/W
o
C/W
o
C/W
Rev. B1,April 2002
ISL9N302AS3ST
Electrical Characteristics T
= 25°C unless otherwise noted
A
Symbol Parameter Test Conditions Min Typ Max Units
Off Chara cteristics
B I
DSS
I
GSS
VDSS
DraintoSourceBreakdownVoltage ID=250µA, VGS=0V 30 - - V
V
=25V - - 1
Zero Gate Voltage Drain Current
DS
=0V TC=150
V
GS
o
--250
Gate to Source LeakageCurrent VGS= ±20V - - ±100 nA
On Character istics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS=VDS,ID=250µA1-3V
I
=75A,VGS= 10V - 0.0019 0.0023
Drainto SourceOn Resistance
D
=75A,VGS= 4.5V - 0.0027 0.0033
I
D
Dynamic Cha racteri stic s
C
ISS
C
OSS
C
RSS
Q
g(TOT)
Q
g(5)
Q
g(TH)
Q
gs
Q
gd
Input Capacitance OutputCapacitance - 2000 - pF ReverseTransfer Capacitance - 900 - pF TotalGateChargeat10V VGS=0Vto10V TotalGateChargeat5V VGS=0Vto 5V - 110 165 nC Threshold Gate Charge VGS= 0V to 1V - 12 18 nC Gate to Source Gate Charge - 25 - nC Gate to Drain “Miller” Charge - 31 - nC
Switching Ch aracteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 29 - ns Rise Time - 120 - ns Turn-Off Delay Time - 45 - ns Fall Time - 34 - ns Turn-Off Time - - 119 ns
(VGS=4.5V)
=15V,VGS=0V,
V
DS
f=1MHz
V
=15V,ID=28A
DD
V
=4.5V,RGS=1.5
GS
=15V
V
DD
I
=75A
D
I
=1.0mA
g
- 11000 - pF
200 300 nC
--224ns
µA
Switching Ch aracteristics (V
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 16 - ns Rise Time - 120 - ns Turn-Off Delay Time - 70 - ns Fall Time - 30 - ns Turn-Off Time - - 150 ns
GS
=10V)
V
=15V,ID=28A
DD
V
=10V,RGS=1.5
GS
--204ns
Unclamped Inductive Switching
t
AV
Avalanche Time ID= 7.2A, L = 3.0mH 480 - - µs
Drain-Source Diode Characteristics
I
= 75A - - 1.25 V
V
SD
t
rr
Q
RR
©2002 FairchildSemiconductor Corporation Rev. B1 April 2002
Source to Drain Diode Voltage Reverse Recovery Time ISD=75A,dISD/dt = 100A/µs- - 42 ns
ReverseRecovered Charge ISD=75A,dISD/dt = 100A/µs- - 34 nC
SD
= 40A - - 1.0 V
I
SD
Typical Characteristic
ISL9N302AS3ST
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0255075100 175
TC, CASE TEMPERATURE (oC)
125
150
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
,NORMALIZED
θJC
Z
THERMAL IMPEDANCE
0.01 10
-5
-4
10
SINGLE PULSE
-3
10
t, RECTANGULAR PULSE DURATION (s)
80
60
40
, DRAIN CURRENT (A)
20
D
I
0
25 50 75 100 125 150 175
TC, CASE TEMPERATURE(oC)
VGS=10V
VGS=4.5V
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
P
DM
t
1
t
NOTES: DUTY FACTOR: D = t PEAK TJ=PDMxZ
-2
10
-1
10
1/t2
θJCxRθJC+TC
0
10
2
10
1
Figure 3. Normalized Maximum Transient Thermal Impedance
5000
VGS=10V
1000
VGS=5V
, PEAK CURRENT (A)
DM
I
100
50
-5
10
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-4
10
-3
10
t, PULSE WIDTH (s)
-2
10
10
TC=25oC
FOR TEMPERATURES ABOVE 25 CURRENT AS FOLLOWS:
I=I
25
-1
o
C DERATE PEAK
175 - T
C
150
0
10
1
10
Figure 4. Peak Current Capability
©2002 FairchildSemiconductor Corporation Rev. B1 April 2002
Typical Characteristic(Continued)
ISL9N302AS3ST
150
PULSE DURATION= 80µs DUTY CYCLE = 0.5% MAX
125
V
=15V
DD
100
75
50
, DRAIN CURRENT (A)
D
I
25
0
1.5 2.0 2.5 3.0 3.5
TJ=25oC
TJ=175oC
T
=-55oC
J
VGS, GATE TO SOURCE VOLTAGE (V)
150
125
100
75
50
, DRAIN CURRENT (A)
D
I
25
0
0
VGS=4.5V
VGS= 10V
0.5 1.0 1.5 2.0
VDS, DRAIN TO SOURCE VOLTAGE (V)
VGS=3.5V
PULSE DURATION= 80µs DUTY CYCLE = 0.5% MAX
Figure 5. Transfer Characteristics Figure 6. Saturation Characteristics
10
, DRAIN TO SOURCE
ON RESISTANCE (mΩ)
DS(ON)
r
8
6
4
2
0
ID=75A
ID= 10A
246810
V
, GATE TO SOURCE VOLTAGE(V)
GS
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
1.8
PULSE DURATION= 80µs DUTY CYCLE = 0.5% MAX
1.6
1.4
1.2
1.0
ON RESISTANCE
0.8
NORMALIZED DRAIN TO SOURCE
0.6
-80 -40 0 40 80 120 160 200
TJ, JUNCTION TEMPERATURE (oC)
VGS=3V
TC=25oC
VGS= 10V, ID= 75A
Figure7. DraintoSourceOnResistancevsGate
Voltage and Drain Current
1.4
1.2
1.0
0.8
0.6
NORMALIZED GATE
THRESHOLD VOLTAGE
0.4
0.2
-80 -40 0 40 80 120 160 200
TJ, JUNCTION TEMPERATURE (oC)
VGS=VDS,ID= 250µA
Figure 9. Normalized Gate Threshold Voltage vs
Junction Temperature
©2002 FairchildSemiconductor Corporation Rev. B1 April 2002
Figure 8. Normalized Drain to Source On
Resistance vs Junction Temperature
1.2 ID= 250µA
1.1
1.0
BREAKDOWN VOLTAGE
NORMALIZED DRAIN TO SOURCE
0.9
-80 -40 0 40 80 120 160 200
T
, JUNCTION TEMPERATURE(oC)
J
Figure 10. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
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