Fairchild Semiconductor IRFU210B, IRFR210B Datasheet
IRFR210B / IRFU210B
200V N-Channel MOSFET
IRFR210B / IRFU210B
November 2001
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
Features
• 2.7A, 200V, R
• Low gate charge ( typical 7.2 nC)
• Low Crss ( typical 6.8 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
= 1.5Ω @VGS = 10 V
DS(on)
suited for high efficiency switching DC/DC converters,
switch mode power supplies, DC-AC converters for
uninterrupted power supply and motor control.
D
GS
D-PAK
IRFR Series
GSD
Absolute Maximum Ratings T
I-PAK
IRFU Series
= 25°C unless otherwise noted
C
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G
D
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S
Symbol Parameter IRFR210B / IRFU210B Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt
P
D
Drain-Source Voltage 200 V
Drain Current
- Continuous (T
- Continuous (T
Drain Current - Pulsed
= 25°C)
C
= 100°C)
C
(Note 1)
2.7 A
1.7 A
10 A
Gate-Source Voltage ± 30 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Power Dissipation (TA = 25°C) *
Power Dissipation (T
= 25°C)
C
(Note 2)
(Note 1)
(Note 1)
(Note 3)
40 mJ
2.7 A
2.6 mJ
5.5 V/ns
2.5 W
26 W
- Derate above 25°C 0.2 W/°C
, T
T
J
stg
T
L
Operating and Storage Temperature Range -55 to +150 °C
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300 °C
Thermal Characteristics
Symbol Parameter Typ Max Units
R
θJC
R
θJA
R
θJA
* When mounted on the minimum pad size recommended (PCB Mount)
©2001 Fairchild Semiconductor Corporation
Thermal Resistance, Junction-to-Case -- 4.9 °C/W
Thermal Resistance, Junction-to-Ambient * -- 50 °C/W
Thermal Resistance, Junction-to-Ambient -- 110 °C/W
Rev. B, November 2001
IRFR210B / IRFU210B
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter T e s t Conditions Min Typ Max Units
Off Characteristics
BV
DSS
∆BV
DSS
/ ∆T
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
J
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
= 0 V, ID = 250 µA
V
GS
I
= 250 µA, Referenced to 25°C
D
V
= 200 V, VGS = 0 V
DS
V
= 160 V, TC = 125°C
DS
V
= 30 V, VDS = 0 V
GS
= -30 V, VDS = 0 V
V
GS
200 -- -- V
-- 0.2 -- V/°C
-- -- 10 µA
-- -- 100 µA
-- -- 100 nA
-- -- -100 nA
On Characteristics
V
R
g
FS
GS(th)
DS(on)
Gate Threshold Voltage
Static Drain-Source
On-Resistance
Forward Transconductance
V
= VGS, ID = 250 µA
DS
= 10 V , ID = 1.35 A
V
GS
= 40 V, ID = 1.35 A
V
DS
(Note 4)
2.0 -- 4.0 V
-- 1.16 1.5 Ω
-- 2.25 -- S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance -- 30 40 pF
Reverse Transfer Capacitance -- 6.8 9.0 pF
= 25 V, VGS = 0 V,
V
DS
f = 1.0 MHz
-- 175 225 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
g
gs
gd
Turn-On Delay Time
Turn-On Rise Time -- 35 80 ns
Turn-Off Delay Time -- 20 50 ns
Turn-Off Fall Time -- 25 60 ns
Total Gate Charge
Gate-Source Charge -- 1.3 -- nC
Gate-Drain Charge -- 3.5 -- nC
= 100 V, ID = 3.3 A,
V
DD
= 25 Ω
R
G
V
= 160 V, ID = 3.3 A,
DS
V
GS
= 10 V
(Note 4, 5)
(Note 4, 5)
-- 5.2 20 ns
-- 7.2 9.3 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 8.2mH, IAS = 2.7A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 3.3A, di/dt ≤ 300A/µs, VDD ≤ BV
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
©2001 Fairchild Semiconductor Corporation
Maximum Continuous Drain-Source Diode Forward Current -- -- 2.7 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 10 A
= 0 V, IS = 2.7 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 0.37 -- µC
Starting TJ = 25°C
DSS,
V
GS
= 0 V, IS = 3.3 A,
V
GS
/ dt = 100 A/µs
dI
F
-- -- 1.5 V
-- 106 -- ns
(Note 4)
Rev. B, November 2001
Typical Characteristics
IRFR210B / IRFU210B
10
10
, Drain Current [A]
D
I
-1
10
1
V
Top : 1 5 .0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
Botto m : 5.0 V
0
-1
10
GS
$
Note s :
1. 25 0's Pulse Test
%
2. TC = 25
0
10
1
10
VDS, Drain-Source Voltage [V]
8
6
],
&
[
4
DS(ON)
R
2
Drain-Source On-Resistance
0
02468
VGS = 10V
VGS = 20V
$
Note : T
%
= 25
J
ID, Drain Current [A]
1
10
0
10
150oC
, Drain Current [A]
D
25oC
I
-55oC
-1
10
246810
$
Notes :
= 40V
1. V
DS
2. 25 0's Pulse Test
VGS, Gate-Source Voltage [V]
Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s
1
10
0
10
%
, Reverse Drain Current [A]
DR
I
-1
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
150
VSD, Source-Drain voltage [V]
%
25
$
Note s :
= 0V
1. V
GS
2. 25 0's Pulse Te st
Figure 3. On-Resistance Variation vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
500
400
300
200
Capacitance [pF]
100
0
-1
10
VDS, Drain-Source Voltage [V]
C
= Cgs + Cgd (Cds = shorted)
iss
C
= Cds + C
oss
gd
C
= C
rss
gd
C
iss
C
oss
C
rss
0
10
10
1
$
Note s :
= 0 V
1. V
GS
2. f = 1 MHz
12
10
8
6
4
, Gate-Source Voltage [V]
GS
2
V
0
02468
QG, Tota l G a te C h a rg e [n C ]
VDS = 40V
VDS = 100V
VDS = 160V
$
Note : I
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Ch a ra ct eristics
= 3.3 A
D
Rev. B, November 2001©2001 Fairchild Semiconductor Corporation
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