Fairchild Semiconductor IRFP244B Datasheet
IRFP244B
250V N-Channel MOSFET
IRFP244B
November 2001
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
Features
• 16A, 250V, R
• Low gate charge ( typical 47 nC)
• Low Crss ( typical 30 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
= 0.28Ω @VGS = 10 V
DS(on)
suited for high efficiency switching DC/DC converter and
switch mode power supplies.
D
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S
GSD
Absolute Maximum Ratings T
TO-3P
IRFP Series
= 25°C unless otherwise noted
C
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G
Symbol Parameter IRFP244B Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt
P
D
Drain-Source Voltage 250 V
Drain Current
- Continuous (T
- Continuous (T
Drain Current - Pulsed
= 25°C)
C
= 100°C)
C
(Note 1)
16 A
10.1 A
64 A
Gate-Source Voltage ± 30 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Power Dissipation (TC = 25°C)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
480 mJ
16 A
18 mJ
5.5 V/ns
180 W
- Derate above 25°C 1.45 W/°C
T
, T
J
STG
T
L
Operating and Storage Temperature Range -55 to +150 °C
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300 °C
Thermal Characteristics
Symbol Parameter Typ Max Units
R
θJC
R
θCS
R
θJA
©2001 Fairchild Semiconductor Corporation
Thermal Resistance, Junction-to-Case -- 0.69 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
Rev. B, November 2001
IRFP244B
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
∆BV
DSS
/ ∆T
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
J
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
= 0 V, ID = 250 µA
V
GS
I
= 250 µA, Referenced to 25°C
D
V
= 250 V, VGS = 0 V
DS
V
= 200 V, TC = 125°C
DS
V
= 30 V, VDS = 0 V
GS
= -30 V, VDS = 0 V
V
GS
250 -- -- V
-- 0.24 -- V/°C
-- -- 10 µA
-- -- 100 µA
-- -- 100 nA
-- -- -100 nA
On Characteristics
V
R
g
FS
GS(th)
DS(on)
Gate Threshold Voltage
Static Drain-Source
On-Resistance
Forward Transconductance
V
= VGS, ID = 250 µA
DS
= 10 V, ID = 8.0 A
V
GS
= 40 V, ID = 8.0 A
V
DS
(Note 4)
2.0 -- 4.0 V
-- 0.22 0.28 Ω
-- 12.5 -- S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance -- 150 195 pF
Reverse Transfer Capacitance -- 30 40 pF
= 25 V, VGS = 0 V,
V
DS
f = 1.0 MHz
-- 1250 1600 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
g
gs
gd
Turn-On Delay Time
Turn-On Rise Time -- 115 240 ns
Turn-Off Delay Time -- 150 310 n s
Turn-Off Fall Time -- 95 200 ns
Total Gate Charge
Gate-Source Charge -- 6.2 -- nC
Gate-Drain Charge -- 23 -- nC
= 125 V, ID = 14 A,
V
DD
= 25 Ω
R
G
V
= 200 V, ID = 14 A,
DS
V
GS
= 10 V
(Note 4, 5)
(Note 4, 5)
-- 20 50 ns
-- 47 60 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 3mH, IAS = 16A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 14A, di/dt ≤ 300A/µs, VDD ≤ BV
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
©2001 Fairchild Semiconductor Corporation
Maximum Continuous Drain-Source Diode Forward Current -- -- 16 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 64 A
= 0 V, IS = 16 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 1.96 -- µC
Starting TJ = 25°C
DSS,
V
GS
= 0 V, IS = 14 A,
V
GS
/ dt = 100 A/µs
dI
F
-- -- 1.5 V
-- 240 -- ns
(Note 4)
Rev. B, November 2001
Typical Characteristics
IRFP244B
V
GS
Top : 1 5 .0 V
10.0 V
8.0 V
7.0 V
6.5 V
1
6.0 V
10
5.5 V
Botto m : 5.0 V
0
10
, Drain Current [A]
D
I
-1
10
-1
10
0
10
%
Note s :
1. 25 0&s Pulse Test
$
2. TC = 25
1
10
VDS, Drain-Source Voltage [V]
1.5
1.2
],
0.9
'
[
DS(ON)
R
0.6
0.3
Drain-Source On-Resistance
0.0
0 1020304050
VGS = 10V
VGS = 20V
%
Note : T
$
= 25
J
ID, Drain Current [A]
1
10
150oC
0
25oC
10
, Drain Current [A]
D
I
-1
10
246810
-55oC
%
Note s :
= 40V
1. V
DS
2. 25 0&s Pulse Test
VGS, Gate-Source Voltage [V]
Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s
1
10
0
10
$
$
150
, Reverse Drain Current [A]
DR
I
-1
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
25
%
Note s :
= 0V
1. V
GS
2. 25 0&s Pulse Test
VSD, Source-D ra in voltage [V ]
Figure 3. On-Resistance Variation vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
3500
3000
2500
2000
1500
Capacitance [pF]
1000
500
0
-1
10
VDS, Drain-Source Voltage [V]
C
= Cgs + Cgd (Cds = shorted)
iss
C
= Cds + C
oss
gd
C
= C
rss
gd
C
iss
C
oss
C
rss
0
10
10
1
%
Note s :
1. V
= 0 V
GS
2. f = 1 MHz
12
10
8
6
4
, Gate-Source Voltage [V]
GS
2
V
0
0 5 10 15 20 25 30 35 40 45 50
QG, Tota l G a te C h a rg e [n C ]
VDS = 125V
VDS = 200V
VDS = 50V
%
Note : I
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Ch a ra ct eristics
= 14 A
D
Rev. B, November 2001©2001 Fairchild Semiconductor Corporation
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