Advanced Power MOSFET
IRFP140A
FEATURES
Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
Extended Safe Operating Area
Ο
175 Operating Temperature
C
Lower Leakage Current : 10 A (Max.) @ VDS = 100V
Lower R
: 0.041 (Typ.)
DS(ON)
Ω
µ
Absolute Maximum Ratings
Characteristic Value UnitsSymbol
Drain-to-Source Voltage
Continuous Drain Current (T
Continuous Drain Current (T
=25 )
C
=100 )
C
Ο
C
Ο
C
Drain Current-Pulsed
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Total Power Dissipation (T
=25 )
C
Ο
C
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8” from case for 5-seconds
T
V
DSS
I
D
I
DM
V
E
I
AR
E
dv/dt
P
, T
J
T
GS
AS
AR
D
STG
L
O
O
O
O
O
BV
R
I
= 100 V
DSS
DS(on)
= 31 A
D
= 0.052
Ω
TO-3P
1
2
3
1.Gate 2. Drain 3. Source
100
31
21.9
1
2
1
1
3
120
+
_
513
13.1
20
31
6.5
131
0.88
- 55 to +175
300
V
A
A
V
mJ
A
mJ
V/ns
W
W/
Ο
C
Ο
C
Thermal Resistance
R
θ
JC
R
θ
CS
R
θ
JA
©1999 Fairchi ld Semiconduc tor Corpor ation
Characteristic Max. UnitsSymbol Typ.
Junction-to-Case
Case-to-Sink
Junction-to-Ambient
--
0.24
--
1.14
--
40
Ο
C
/W
Rev. B
IRFP140A
Electrical Characteristics (T
Ο
=25 unless otherwise specified)
C
C
N-CHANNEL
POWER MOSFET
BV
∆ ∆
BV/ T
V
GS(th)
I
I
R
DS(on)
C
C
C
t
d(on)
t
d(off)
Q
Q
DSS
GSS
DSS
g
iss
oss
rss
t
t
Q
CharacteristicSymbol
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coeff.
J
Gate Threshold Voltage
Gate-Source Leakage , Forward
Gate-Source Leakage , Reverse
Drain-to-Source Leakage Current
Static Drain-Source
On-State Resistance
Forward Transconductance
fs
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Rise Time
r
Turn-Off Delay Time
Fall Time
f
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain(“Miller”) Charge
gd
100
--
2.0
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Max. UnitsTyp.Min. Test Condition
=0V,ID=250 A
V
--
--
4.0
10
--
380
170
50
50
180
120
78
--
--
V
GS
Ο
I
V/
nA
µ
=250 A See Fig 7
C
D
V
V
A
Ω
Ω
pF
ns
=5V,ID=250 A
DS
V
=20V
GS
V
=-20V
GS
V
=100V
DS
V
=80V,TC=150
DS
=10V,ID=15.5A
V
GS
=40V,ID=15.5A
V
DS
=0V,VDS=25V,f =1MHz
V
GS
See Fig 5
V
=50V,ID=28A,
DD
=9.1
R
G
See Fig 13
V
=80V,VGS=10V,
DS
nC
I
=28A
D
See Fig 6 & Fig 12
--
0.11
--
--
--
--
--
--
23.13
1320
325
148
18
18
90
56
60
10.8
27.9
100
-100
100
0.052
1710
µ
µ
µ
Ο
C
4
O
4
O
Ω
4
5
O
O
4
5
O
O
Source-Drain Diode Ratings and Characteristics
CharacteristicSymbol Max. UnitsTyp.Min. Test Condition
I
I
SM
V
t
Q
Notes ;
1
Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature
O
2
L=0.8mH, I
O
3
I
O
SD
4
Pulse Test : Pulse Width = 250 s, Duty Cycle 2%
O
5
Essentially Independent of Operating Temperature
O
Continuous Source Current
S
Pulsed-Source Current
Diode Forward Voltage
SD
Reverse Recovery Time
rr
Reverse Recovery Charge
rr
=31A, VDD=25V, RG=27 , Starting TJ =25
AS
_
28A, di/dt 400A/ s, VDD BV
<
_
<
µ
--
--
31
1.5
--
--
ns
µ
A
V
C
1
--
--
132
0.63
Ο
C
120
--
O
4
--
O
--
--
Ω
_
<
µ
, Starting TJ =25
DSS
_
<
Ο
C
Integral reverse pn-diode
in the MOSFET
Ο
C
T
=25 ,IS=31A,VGS=0V
J
Ο
C
T
=25 ,IF=28A
J
/dt=100A/ s
di
F
µ
O
4
N-CHANNEL
POWER MOSFET
IRFP140A
2
10
V
GS
Top : 1 5 V
1 0 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
1
10
, Drain Current [A]
D
I
0
10
-1
10
@ Notes :
1. 250
s Pulse Test
µ
2. T
= 25 oC
C
0
10
VDS , Drain-Source Voltage [V]
Fig 1. Output Characteristics Fig 2. Transfer Characteristics
0.08
= 10 V
]
Ω
, [
DS(on)
R
0.06
0.04
V
GS
VGS = 20 V
0.02
Drain-Source On-Resistance
0.00
0 30 60 90 120
ID , Drain Current [A]
1
10
@ Note : TJ = 25 oC
2
10
o
175
C
1
10
o
25
C
, Drain Current [A]
D
I
0
10
2 4 6 8 10
- 55
o
C
@ Notes :
1. V
2. V
3. 250
= 0 V
GS
= 40 V
DS
s Pulse Test
µ
VGS , Gate-Source Voltage [V]
Fig 4. Source-Drain Diode Forward VoltageFig 3. On-Resistance vs. Drain Current
2
10
1
10
175 oC
, Reverse Drain Current [A]
DR
I
0
10
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
o
C
25
@ Notes :
1. V
= 0 V
GS
2. 250 µs Pulse Test
VSD , Source-Drain Voltage [V]
2500
2000
C
iss
1500
C
oss
1000
Capacitance [pF]
C
rss
500
0
0
10
VDS , Drain-Source Voltage [V]
C
= Cgs+ Cgd ( Cds= shorted )
iss
C
= Cds+ C
oss
gd
C
= C
rss
gd
1
10
@ Notes :
= 0 V
1. V
GS
2. f = 1 MHz
Fig 6. Gate Charge vs. Gate-Source VoltageFig 5. Capacitance vs. Drain-Source Voltage
V
= 20 V
V
DS
V
DS
= 80 V
DS
= 50 V
10
5
, Gate-Source Voltage [V]
GS
V
0
0 10 20 30 40 50 60 70
@ Notes : ID =28.0 A
QG , Total Gate Charge [nC]