Fairchild Semiconductor IRF520A Datasheet

Advanced Power MOSFET
IRF520A
FEATURES
Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area
Ο
C
175 Operating Temperature Lower Leakage Current : 10 A (Max.) @ VDS = 100V Lower R
: 0.155 (Typ.)
DS(ON)
µ
Absolute Maximum Ratings
Characteristic Value UnitsSymbol
Drain-to-Source Voltage
Ο
Continuous Drain Current (T Continuous Drain Current (T
=25 )
C
=100 )
C
C
Ο
C
Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (T
=25 )
C
Ο
C
Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8” from case for 5-seconds
T
V
DSS
I
I
DM
V E
I
AR
E
dv/dt
P
, T
J
T
D
GS
AS
AR
D
STG
L
O O
O O
O
BV R I
= 100 V
DSS
DS(on)
= 9.2 A
D
= 0.2
TO-220
1
2
3
1.Gate 2. Drain 3. Source
100
9.2
6.5
1
2
1 1
3
+
_
37
20
113
9.2
4.5
6.5 45
0.3
- 55 to +175
300
V A A
V
mJ
A
mJ
V/ns
W
W/
Ο
C
Ο
C
Thermal Resistance
R
θ
JC
R
θ
CS
R
θ
JA
©1999 Fairchi ld Semiconduc tor Corpor ation
Characteristic Max. UnitsSymbol Typ.
Junction-to-Case
Case-to-Sink
Junction-to-Ambient
--
0.5
--
3.31
--
62.5
Ο
C
/W
Rev. B
IRF520A
N-CHANNEL
POWER MOSFET
Electrical Characteristics (T
CharacteristicSymbol
BV
BV/ T
V
GS(th)
I
I
R
DS(on)
C
C
C
t
d(on)
t
d(off)
Q Q
GSS
DSS
g
Q
Drain-Source Breakdown Voltage
DSS
Breakdown Voltage Temp. Coeff.
J
Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse
Drain-to-Source Leakage Current
Static Drain-Source On-State Resistance Forward Transconductance
fs
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer Capacitance
rss
Turn-On Delay Time
t
Rise Time
r
Turn-Off Delay Time
t
Fall Time
f
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain(“Miller”) Charge
gd
Ο
=25 unless otherwise specified)
C
C
Max. UnitsTyp.Min. Test Condition
V
100
--
2.0
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
0.12
--
--
--
--
--
--
6.35 370
95 38 14 14 36 28 16
2.7
7.8
-100
--
--
4.0
100
10
100
0.2
-­480 110
45 40 40 90 70 22
--
--
V
GS
Ο
I
V/
nA
µ
nC
=250 A See Fig 7
C
D
V
V
DS
V
GS
V
GS
V
DS
A
V
DS
V
GS
V
DS
V
GS
pF
ns
See Fig 5
V
DD
=18
R
G
V
DS
I
=9.2A
D
See Fig 6 & Fig 12
=0V,ID=250 A
µ
µ
=5V,ID=250 A
µ
=20V =-20V =100V
Ο
=80V,TC=150
=10V,ID=4.6A =40V,ID=4.6A
C
O O
=0V,VDS=25V,f =1MHz
=50V,ID=9.2A,
See Fig 13
O
4
O
=80V,VGS=10V,
4
O
O
4
4
5
5
Source-Drain Diode Ratings and Characteristics
CharacteristicSymbol Max. UnitsTyp.Min. Test Condition
I
I
SM
V
t
Q
Notes ;
Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature
1
O
2
L=2mH, I
O
3
I
O
SD
Pulse Test : Pulse Width = 250 s, Duty Cycle 2%
4
O
Essentially Independent of Operating Temperature
5
O
Continuous Source Current
S
Pulsed-Source Current Diode Forward Voltage
SD
Reverse Recovery Time
rr
Reverse Recovery Charge
rr
=9.2A, VDD=25V, RG=27 , Starting TJ =25
AS
_
µ
9.2A, di/dt 300A/ s, VDD BV
_
<
<
_
<
µ
, Starting TJ =25
DSS
O O
_
<
--
--
9.2
1
--
--
37
4
--
--
1.5
--
98
--
--
0.34
o
C
o
C
--
Integral reverse pn-diode
A
in the MOSFET
V
ns
µ
C
Ο
C
=25 ,IS=9.2A,VGS=0V
T
J
Ο
C
T
=25 ,IF=9.2A
J
/dt=100A/ s
di
F
µ
O
4
N-CHANNEL
POWER MOSFET
Fig 1. Output Characteristics Fig 2. Transfer Characteristics
V
GS
Top : 1 5 V 1 0 V
8.0 V
1
7.0 V
10
6.0 V
5.5 V
5.0 V Bottom : 4.5 V
0
10
, Drain Current [A]
D
I
-1
10
10
VDS , Drain-Source Voltage [V]
0
@ Notes :
1. 250
2. T
C
s Pulse Test
µ
= 25 oC
IRF520A
1
10
o
175
C
0
10
, Drain Current [A]
D
I
1
10
25 oC
o
- 55
C
-1
10
2 4 6 8 10
VGS , Gate-Source Voltage [V]
@ Notes :
1. V
GS
2. V
DS
3. 250
= 0 V = 40 V
s Pulse Test
µ
0.4
0.3
VGS = 10 V
]
, [
0.2
DS(on)
R
0.1
VGS = 20 V
Drain-Source On-Resistance
@ Note : TJ = 25 oC
0.0 0 10 20 30 40
ID , Drain Current [A]
600
C
iss
400
C
oss
200
Capacitance [pF]
C
rss
C
= Cgs+ Cgd ( Cds= shorted )
iss
C
= Cds+ C
oss
gd
C
= C
rss
gd
@ Notes :
1. VGS = 0 V
2. f = 1 MHz
Fig 4. Source-Drain Diode Forward VoltageFig 3. On-Resistance vs. Drain Current
1
10
0
10
, Reverse Drain Current [A]
DR
I
o
175
C
o
25
-1
10
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
C
@ Notes :
1. V
= 0 V
GS
2. 250 µs Pulse Test
VSD , Source-Drain Voltage [V]
Fig 6. Gate Charge vs. Gate-Source VoltageFig 5. Capacitance vs. Drain-Source Voltage
V
= 20 V
10
5
DS
VDS = 50 V
VDS = 80 V
, Gate-Source Voltage [V]
GS
0
0
10
1
10
VDS , Drain-Source Voltage [V]
V
0
0 5 10 15 20
QG , Total Gate Charge [nC]
@ Notes : ID = 9.2 A
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