Fairchild Semiconductor HUF76132P3, HUF76132S3S Datasheet

HUF76132P3, HUF76132S3S
Data Sheet January 2003
75A, 30V, 0.011 Ohm, N-Channel, Logic Level UltraFET Power MOSFETs
These N -Channe l powe r MOSFETs are manufactured using the innovative Ult r aF ET ™ pr ocess. T his
advanced process technolog y achieves the lowest possible on-resistance per silicon ar ea, resultin g in outstanding performance. This device is capab le of withstanding hi gh energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in appli cations where power efficiency is important, such as switching regulators, switchi ng converters, motor drivers, relay drivers , low­voltage bus switches, and power manage me nt i n po rtab le and battery-operated products.
Formerly developmental ty pe TA76132.
Ordering Information
PART NUMBER PACKAGE BRAND
HUF76132P3 TO-220AB 76132P HUF76132S3S TO-263AB 76132S
NOTE: When ordering, use the entire part number. Add the suffix T to obtain the TO-263AB variant in tape and reel, e.g., HUF76132S3ST.
Features
• Logic Level Gate Drive
• 75A, 30V
• Ultra Low On-Resistance, r
• Temperatur e Compensating PSPICE
• Temperatur e Compensating SABER
DS(ON)
= 0.011
®
Model
©
Model
• Thermal Impedance SPICE Model
• Thermal Impedance SABER Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount Components to PC Boards”
Symbol
D
G
S
Packaging
DRAIN
(FLANGE)
JEDEC TO-220AB JEDEC TO-263AB
SOURCE
DRAIN
GATE
GATE
SOURCE
DRAIN
(FLANGE)
©2003 Fairchild Semiconductor Corporation HUF76132P3, HUF76132S3S Rev. C1
HUF76132P3, HUF76132S3S
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gat e Voltage (R
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
GS
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
DGR
GS
30 V 30 V
±20 V
Drain Curr e nt
Continuous (T
Continuous (TC = 100oC, VGS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
= 25oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
C
Continuous (TC = 100oC, VGS = 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
, T
J
STG
D D D
DM
AS
D
75 44 41
Figure 4
Figures 6, 17, 18
120
0.97
-40 to 150
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Rati ngs” may cause permane nt damage to the device. This is a stress only rating and oper ation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
300 260
A A A
W
W/oC
o
C
o
C
o
C
NOTE:
= 25oC to 150oC.
1. T
J
Electrical Specifications T
= 25oC, Unless Otherwise Specified
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain t o Source Breakdown Voltage BV Zero Gat e V ol tag e D rain Curre nt I
Gate to Sour c e Le ak ag e C urr e nt I
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V Drain to Source On Resistance r
GS(TH)VGS
DS(ON)ID
THERMAL SPECIFICATIONS
Thermal R esis ta nc e Ju ncti on to Case R Thermal Resistance Junction to Ambient R SWITCHING SPECIFICATIONS (VGS = 4.5V) Turn-On Time t Turn-On Delay Time t
d(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Turn-Off Time t
DSSID
DSS
GSS
θJC θJA
ON
r
f
OFF
= 250µA, VGS = 0V (Figure 12) 30 - - V VDS = 25V, VGS = 0V - - 1 µA V
= 25V, VGS = 0V, TC = 150oC--250µA
DS
VGS = ±20V - - ±100 nA
= VDS, ID = 250µA (Figur e 11) 1 - 3 V = 75A, VGS = 10V (Figure 9, 10) - 0.0085 0.011 = 44A, VGS = 5V (Figure 9) - 0.013 0.016
I
D
I
= 41A, VGS = 4.5V (Figure 9) - 0.015 0.018
D
(Figure 3) - - 1.03oC/W TO-220 , TO - 26 2 an d TO - 26 3 - - 62
VDD = 15V, ID 41A, R
= 0.366Ω, VGS = 4.5V,
L
R
= 6.2
GS
(Figures 15, 21, 22)
--185ns
-17-ns
-105- ns
o
C/W
-33-ns
-42-ns
--113ns
©2003 Fairchild Semiconductor Corporation HUF76132P3, HUF76132S3S Rev. C1
HUF76132P3, HUF76132S3S
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continue d)
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
SWITCHING SPECIFICATIONS (VGS = 10V)
Turn-On Time t Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t Turn-Off Time t
GATE CHARGE SPECIFICATIONS
Total Gate Charg e Q Gate Charge at 5V Q Threshold Gate Charg e Q Gate to Source Gate Charg e Q Gate to Drai n “M ill er ” C ha r ge Q
CAPACITANCE SPECIFICATIONS
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C
ON
d(ON)
d(OFF)
OFF
g(TOT)VGS
g(5)
g(TH)
ISS OSS RSS
VDD = 15V, ID 75A, R R (Figures 16, 21, 22)
r
f
VGS = 0V to 5V - 25 30 nC VGS = 0V to 1V - 1.8 2.2 nC
gs gd
VDS = 25V, VGS = 0V, f = 1MHz (Figure 13)
= 0.20, VGS = 10V,
L
= 6.8
GS
= 0V to 10V VDD = 15V, ID 44A,
R
= 0.341
L
I
= 1.0mA
g(REF)
(Figures 14, 19, 20)
--72ns
-11-ns
-37-ns
-65-ns
-42 -ns
--160ns
-4452nC
-4.80- nC
-13.50- nC
- 1650 - pF
-850-pF
-200-pF
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Vol tage V Reverse Recovery Time t Reverse Recovered Charge Q
SD
RR
ISD = 44A - - 1.25 V ISD = 44A, dISD/dt = 100A/µs--71ns
rr
ISD = 44A, dISD/dt = 100A/µs - - 104 nC
Typical Performance Curves Unless Otherwise Specified
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
TA, AMBIENT TEMPERATURE (oC)
125
80
V
= 10V
GS
60
40
, DRAIN CURRENT (A)
20
D
I
0
25 50 75 100 125 150
VGS = 4.5V
TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED PO WER DISSIPATION vs CASE
TEMPERATURE
©2003 Fairchild Semiconductor Corporation HUF76132P3, HUF76132S3S Rev. C1
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
HUF76132P3, HUF76132S3S
Typical Performance Curves Unless Otherwise Specified (Continued)
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
JC
θ
Z
THERMAL IMPEDANCE
SINGLE PULSE
-4
10
10
-3
10
-2
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
2000
1000
0.01
-5
10
VGS = 10V
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-1
10
P
DM
t
1
t
2
1/t2
x R
JC
JC
θ
θ
0
10
TC = 25oC
FOR TEMPERATURES ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
150 - T
I = I
25
C
125
+ T
C
1
10
5
=
V
V
G
S
, PEAK CURRENT (A)
DM
100
I
TRANSCONDUCTANCE MAY LIMIT CURRENT
IN THIS REGION
50
-5
10
-4
10
10
FIGURE 4. PEAK CURRENT CAPABILITY
1000
100
10
, DRAIN CURRENT (A)
D
I
OPERATION IN THIS AREA MAY BE LIMITED BY r
1
BV
DS(ON)
DSS MAX
10
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
TJ = MAX RATED
= 25oC
T
C
100µs
1ms
10ms
= 30V
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
-3
-2
10
10
-1
0
10
10
1
t, PULSE WIDTH (s)
500
If R = 0 tAV = (L)(IAS)/(1.3*RATED BV
If R 0 t
= (L/R)ln[(IAS*R)/(1.3*RATED BV
AV
DSS
- VDD)
DSS
- VDD) +1]
100
STARTING TJ = 25oC
, AVALANCHE CURRENT (A)
AS
I
1001
10
STARTING TJ = 150oC
0.01
0.1
110
tAV, TIME IN AVALANCHE (ms)
NO TE: Refer to Fairchild App lication Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING
CAPABILITY
©2003 Fairchild Semiconductor Corporation HUF76132P3, HUF76132S3S Rev. C1
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