Fairchild Semiconductor FQPF5N60 Datasheet

FQPF5N60

600V N-Channel MOSFET

FQPF5N60

TM

QFET

General Description

These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supply.

Features

• 2.8A, 600V, R

• Low gate charge ( typical 16 nC)

• Low Crss ( typical 9.0 pF)

• Fast switching

• 100% avalanche tested

• Improved dv/dt capability

• TO-220F package isolation = 4.0kV

= 2.0Ω @VGS = 10 V

DS(on)

(Note 6)

D

!

!

"

"

"

"

!

!

"

"
"

"

!

!

S

GSD

TO-220F

FQPF Series

Absolute Maximum Ratings T

= 25°C unless otherwise noted

C

!

!

G

Symbol Parameter FQPF5N60 Units

V

DSS

I

D

I

DM

V

GSS

E

AS

I

AR

E

AR

dv/dt Peak Diode Recovery dv/dt
P

D

Drain-Source Voltage 600 V
Drain Current

- Continuous (T

- Continuous (T

Drain Current - Pulsed

= 25°C)

C

= 100°C)

C

(Note 1)

2.8 A

1.77 A

11.2 A
Gate-Source Voltage ± 30 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy

Power Dissipation (TC = 25°C)

(Note 2)
(Note 1)
(Note 1)
(Note 3)

300 mJ

2.8 A

4.0 mJ

4.5 V/ns
40 W

- Derate above 25°C 0.32 W/°C

T

, T

J

STG

T

L

Operating and Storage Temperature Range -55 to +150 °C
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds

300 °C

Thermal Characteristics

Symbol Parameter Typ Max Units

R

θJC

R

θJA

©2002 Fairchild Semiconductor Corporation Rev. B, June 2002

Thermal Resistance, Junction-to-Case -- 3.13 °C/W
Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W

FQPF5N60

Electrical Characteristics T

= 25°C unless otherwise noted

C

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics

BV
∆BV
/ ∆T
I

DSS

I

GSSF

I

GSSR

Drain-Source Breakdown Voltage

DSS

Breakdown Voltage Temperature

DSS

Coefficient

J

Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward

Gate-Body Leakage Current, Reverse

= 0 V, ID = 250 µA

V

GS

I

= 250 µA, Referenced to 25°C

D

V

= 600 V, VGS = 0 V

DS

V

= 480 V, TC = 125°C

DS

V

= 30 V, VDS = 0 V

GS

= -30 V, VDS = 0 V

V

GS

600 -- -- V

-- 0.6 -- V/°C

-- -- 10 µA

-- -- 100 µA

-- -- 100 nA

-- -- -100 nA

On Characteristics

V
R

g

FS

GS(th)

DS(on)

Gate Threshold Voltage
Static Drain-Source

On-Resistance
Forward Transconductance

V

= VGS, ID = 250 µA

DS

= 10 V, ID = 1.4 A

V

GS

= 50 V, ID = 1.4 A

V

DS

(Note 4)

3.0 -- 5.0 V

-- 1.57 2.0 Ω

-- 3.5 -- S

Dynamic Characteristics

C

iss

C

oss

C

rss

Input Capacitance
Output Capacitance -- 80 100 pF
Reverse Transfer Capacitance -- 9 12 pF

= 25 V, VGS = 0 V,

V

DS

f = 1.0 MHz

-- 560 730 pF

Switching Characteristics

t

d(on)

t

r

t

d(off)

t

f

Q
Q
Q

g
gs
gd

Turn-On Delay Time
Turn-On Rise Time -- 45 100 ns
Turn-Off Delay Time -- 35 80 ns
Turn-Off Fall Time -- 40 90 ns
Total Gate Charge
Gate-Source Charge -- 3.5 -- nC
Gate-Drain Charge -- 7.8 -- nC

= 300 V, ID = 5.0 A,

V

DD

= 25 Ω

R

G

V

= 480 V, ID = 5.0 A,

DS

V

GS

= 10 V

(Note 4, 5)

(Note 4, 5)

-- 13 3 5 ns

-- 16 2 0 nC

Drain-Source Diode Characteristics and Maximum Ratings

I

S

I

SM

V

SD

t

rr

Q

rr

Notes:

1. Repetitive Rating : Pulse width limited by maximum junction temperature

2. L = 70mH, IAS = 2.8A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C

3. ISD ≤ 5.0A, di/dt ≤ 200A/µs, VDD≤ BV

4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%

5. Essentially independent of operating temperature

6. Only for back side in V

©2002 Fairchild Semiconductor Corporation

Maximum Continuous Drain-Source Diode Forward Current -- -- 2.8 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 1 1.2 A

= 0 V, IS = 2.8 A

Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 1.9 -- µC

Starting TJ = 25°C

DSS,

= 4.0kV and t = 0.3s

iso

V

GS

= 0 V, IS = 5.0 A,

V

GS

/ dt = 100 A/µs

dI

F

-- -- 1.4 V

-- 270 -- ns

(Note 4)

Rev. B, June 2002

Typical Characteristics

FQPF5N60

1

10

0

10

, Drain Current [A]

D

I

-1

10

10

V
Top : 15 V
10 V

8.0 V

7.0 V

6.5 V

6.0 V
Bottom : 5.5 V

-1

GS

"

Notes :

1. 250#s Pulse Test

2. T

0

10

1

10

VDS , Drain-Source Voltage [V]

5

4

],

3

$

[

DS(ON)

2

R

1

Drain-Source On-Resistance

0

0 2 4 6 8 10 12 14

VGS = 10V

VGS = 20V

"

ID, Drain Current [A]

= 25

C

Note : T

1

10

!

150

!

0

10

, Dra in C u rre n t [A]

D

I

-1

10

246810

!

25

!

-55

"

Note s :

= 50V

1. V

DS

2. 250#s Pulse Test

VGS , Gate-Source Voltage [V]

Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s

1

10

!

= 25

J

0

10

!

, Reverse Drain Current [A]

DR

I

-1

10

0.2 0.4 0.6 0.8 1.0 1.2 1.4

150

VSD , Source-Drain Voltage [V]

!

25

"

Note s :

= 0V

1. V

GS

2. 250#s Pulse Test

Figure 3. On-Resistance Variati on vs.

Drain Current and Gate Voltage

Figure 4. Body Diode Forward Voltage

Variation vs. Source Current

and Temperature

VDS = 120V

VDS = 300V

VDS = 480V

"

Note : I

= 5.0 A

D

1200

1000

800

600

400

Capacitance [pF]

200

0

-1

10

VDS, Drain-Source Voltage [V]

C

= Cgs + Cgd (Cds = shorted)

iss

C

= Cds + C

oss

gd

C

= C

rss

gd

C

iss

C

oss

"

Note s :

1. V

= 0 V

GS

10

2. f = 1 MHz

1

C

rss

0

10

12

10

8

6

4

, Gate-Source Voltage [V]

GS

2

V

0

0369121518

QG, Total Gate Ch a rg e [nC]

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Ch a ra ct eristics

©2002 Fairchild Semiconductor Corporation Rev. B, June 2002