Fairchild Semiconductor FDG6324L Datasheet

FDG6324L

See Application Circuit

Integrated Load Switch

General Description Features

This device is intended to be configured as a load switch and
is particularly suited for compact computer peripheral
switching applications where 3V to 20V input and 0.6A output
current capability are needed. This device features a small
N-Channel MOSFET (Q1) together with a large P-Channel
Power MOSFET (Q2) in a single SC70-6 package.

V

DROP

VIN=5V, IL=0.27A. R
Very small package outline (SC70-6).
Control MOSFET (Q1) includes Zener protection for ESD

ruggedness (>6KV Human Body Model).

High density cell design for extremely low on-resistance.

=0.2V @ VIN=12V, IL=0.36A. R

= 0.75Ω.

(ON)

= 0.55Ω. V

(ON)

June 1999

=0.2V @

DROP

SC70-6 SuperSOTTM-6

SOT-23

SuperSOTTM-8

SO-8

SOT-223

V , C

OUT

V , COUT 1

R2

1

EQUIVALENT APPLICATION

IN

ON/OFF

V

DROP

+

-

pin 1

.24

V , R

IN

V

ON/OFF

R , C1

1

1

4

Q2

5

Q1

6

3

2

1

SC70-6

Absolute Maximum Ratings T

Symbol Parameter FDG6324L Units

V

IN

V

ON/OFF

I

L

P

D

TJ,T
ESD Electrostatic Discharge Rating

THERMAL CHARACTERISTICS

R

θJA

Input Voltage Range 3 - 20 V
On/Off Voltage Range 2.5 - 8 V
Load Current - Continuous (Note 1) 0.6 A

- Pulsed (Note 1 & 3) 1.8
Maximum Power Dissipation (Note 2) 0.3 W
Operating and Storage Temperature Range -55 to 150 °C

STG

Human Body Model (100pf/1500Ohm)

Thermal Resistance, Junction-to-Ambient (Note 2) 415 °C/W

= 25°C unless otherwise noted

A

6 kV

OUT

FDG6324L Rev.D

Electrical Characteristics (T

= 25°C unless otherwise noted)

A

Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS

I

FL

Forward Leakage Current

VIN = 20 V, V

ON/OFF

= 0 V

1 µA

ON CHARACTERISTICS (Note 3)

V

R

DROP

(ON)

Conduction Voltage Drop

VIN = 12 V, V
VIN = 5 V, V

= 3.3 V, IL = 0.36 A

ON/OFF

= 3.3 V, IL = 0.27 A

ON/OFF

Q2 - Static On-Resistance VGS = -12 V, ID = -0.6 A

VGS = -5 V, ID = -0.5 A

I

L

Notes:

1. Range of Vin can be up to 25V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -20V.

2. R

θJA

guaranteed by design while R

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%

Load Current

is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R

is determined by the user's board design. Thermal ratings based on minimum mounting pad.

θCA

V

= 0.2 V, VIN = 12 V, V

DROP

V

= 0.2 V, VIN = 5 V, V

DROP

ON/OFF

ON/OFF

= 3.3 V

= 3.3 V

0.14 0.2 V

0.16 0.2

0.37 0.55

0.58 0.75

0.36 A

0.27

is

θJC

FDG6324L Load Switch Application

APPLICATION CIRCUIT

Ω

Q2

IN OUT

R1

Q1

ON/OFF

R2

External Component Recommendation

For Co ≤ 1uF applications:
R1 is required to turn Q2 off.
R2 and C1 are optional for slew rate control.

First select R2, 100 -1KΩ, for slew rate control.

Then select R1 such that the ratio R1/R2 is maintained between 10-100.
SPICE model (FDG6324L.MOD) available at www.fairchildsemi.com.

C1

Co

LOAD

FDG6324L Rev.D

Typical Electrical Characteristics (T

= 25 OC unless otherwise noted )

A

1.2

V = 12V

IN

V = 2.5 - 8V

ON/OFF

1

PW =300us, D≤ 2%

0.8

0.6

DROP

V , (V)

0.4

T = 125°C

J

T = 25°C

J

0.2

0

0 0.5 1 1.5 2

I , (A)

L

Figure 1. Conduction Voltage Drop

Variation with Load Current.

1.5

1.2

0.9

(ON)

0.6

R ,(Ohm)

0.3

I = 0.5A

L

V = 2.5 - 8V

ON/OFF

PW =300us, D≤ 2%

T = 125°C

J

25°C

1.2

V = 5V

IN

V = 2.5 - 8V

ON/OFF

PW =300us, D≤ 2%

0.9

T = 125°C

J

T = 25°C

0.6

DROP

V , (V)

J

0.3

0

0 0.4 0.8 1.2 1.6 2

I , (A)

L

Figure 2. Conduction Voltage Drop

Variation with Load Current.

0

2 4 6 8 10 12

V , (V)

IN

Figure 3. On-Resistance Variation

with Input Voltage.

1

D = 0.5

0.5

0.2

0.2

0.1

0.1

0.05

0.05

0.02

0.01

r(t), NORMALIZED EFFECTIVE

0.005

TRANSIENT THERMAL RESISTANCE

0.002

0.0001 0.001 0.01 0.1 1 10 100 200

0.02

0.01
Single Pulse

Figure 4. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note

2. Transient thermal response will change depending on the circuit board

t , TIME (sec)

1

R (t) = r(t) * R

JA

θ

R =415 °C/W

JA

θ

P(pk)

1

t

t 2

T - T = P * R (t)

AJ

Duty Cycle, D = t / t

JA

θ

JA

θ

1 2

FDG6324L Rev.D