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October 2001
Revised October 2001
74ALVC16601
Low Voltage 18-Bit Universal Bus Transceivers
with 3.6V Tolerant Inputs and Outputs
74ALVC16601 Low Voltage 18-Bit Universal Bus Transceivers with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16601 is an 18-bit universal bus transceiver
which combines D-type latches and D-type flip-flops to
allow data flow in transparent, latched, and clocked modes.
Data flow in each dir ection is controlled by output-enable
(OEAB
and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs. The clock can be controlled by the clock-enable (CLKENAB
inputs. For A-to-B data flow, the device operates in the
transparent mode when LEAB is HIGH. When LEAB is
LOW, the A data is latched if CLKAB is held at a HIGH-toLOW logic level. If LEA B is LOW, the A bus data is s tored
in the latch/flip-flop on the LOW-to-HIGH transition of
CLKAB. When OEAB
OEAB
is HIGH, the outputs are in the high-impedance
state.
Data flow for B to A is similar to tha t of A to B but uses
OEBA
, LEBA, CLKBA and CLKENBA.
The ALVC16601 is designed for low voltage (1.65V to
3.6V) V
The ALVC16601 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintaining low CMOS power dissipation.
applications with I/O capability up to 3.6V.
CC
is LOW, the outputs are active. When
and CLKENBA)
Features
■ 1.65V–3.6V VCC supply operation
■ 3.6V tolerant inputs and outputs
(A to B, B to A)
■ t
PD
3.4 ns max for 3.0V to 3.6V V
4.0 ns max for 2.3V to 2.7V V
7.0 ns max for 1.65V 1.95V V
■ Power-down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
■ Uses patented noise/EMI reductio n circuitr y
■ Latchup conforms to JEDEC JED78
■ ESD performance:
Human body model
Machine model
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1: To ensure the high-impedance state d uring power up or power
down, OE
should be tied to VCC through a pull-up r esistor; the min imum
value of the res istor is d eter mine d by the cu rre nt-sou rcin g ca pa bility of t he
driver.
>200V
Ordering Code:
Order Number Package Number Package Description
74ALVC16601GX
(Note 2)
74ALVC16601MTD
(Note 3)
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
BGA54A
(Preliminary)
MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
CC
CC
CC
> 2000V
© 2001 Fairchild Semiconductor Corporation DS500682 www.fairchildsemi.com
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Connection Diagrams
Pin Descriptions
74ALVC16601
Pin Assignment for TSSOP
Pin Assignment for FBGA
(Top Thru View)
Pin Names Descriptio n
OEAB
, OEBA Output Enable Inputs (Active LOW)
LEAB, LEBA Latch Enable Inputs
CLKAB, CLKBA Clock Inputs
CLKENAB
A
B
, CLKENBA Clock Enable Inputs
1–A18
1–B18
Side A Inputs or 3-STATE Outputs
Side B Inputs or 3-STATE Outputs
FBGA Pin Assignments
123 4 56
A A
B A
C A
D A
E A
F A
G A
H A
J A
A1OEAB CLKENAB B
2
A3LEAB CLKAB B
4
A5V
6
A7GND GND B
8
A9GND GND B9B
10
12A11
14A13VCC
16A15
17A18
GND GND B
OEBA CLKBA B
LEBA CLKENBA B
CC
V
CC
V
CC
1
3
B
5
7
11B12
B
13B14
15B16
18B17
B
B
B
B
Truth Table
(Note 4)
Inputs Outputs
CLKENAB
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial (HIGH or LOW, inputs may not float)
Z = High Impedance
Note 4: A-to-B data flow is shown; B-to-A flow is similar but uses OEBA
LEBA, CLKBA, and C LKENBA
Note 5: Output level be fore the indicated steady-s tate input conditions
were established.
Note 6: Output level be fore the indicated steady-s tate input conditions
were established, prov ided that CLK AB was HIGH before LEAB went LOW.
OEAB LEAB CLKAB A
B
n
n
XHXXXZ
XLHXLL
XLHXHH
HLLXXB
HLLXXB
LLL
LLL
↑ LL
↑ HH
LLLLXB
LLLHXB
.
(Note 5)
0
(Note 5)
0
(Note 5)
0
(Note 6)
0
2
4
6
8
10
,
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