Fairchild NDP710A, NDP710AE, NDP710B, NDP710BE, NDB710A service manual

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NDP710A / NDP710AE / NDP710B / NDP710BE NDB710A / NDB710AE / NDB710B / NDB710BE N-Channel Enhancement Mode Field Effect Transistor
General Description Features
These N-channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage applications such as automotive, DC/DC converters, PWM motor controls, and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.
_____________________________________________________________________
42 and 40A, 100V. R
= 0.038 and 0.042Ω.
DS(ON)
Critical DC electrical parameters specified at elevated temperature.
Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor.
175°C maximum junction temperature rating. High density cell design (3 million/in²) for extremely
low R
DS(ON)
.
TO-220 and TO-263 (D2PAK) package for both through hole and surface mount applications.
May 1994
Symbol Parameter
V V V
I
P
TJ,T T
DSS
DGR
GSS
D
D
L
Drain-Source Voltage 100 V Drain-Gate Voltage (RGS < 1 M) Gate-Source Voltage - Continuous ±20 V
- Nonrepetitive (tP < 50 µs)
Drain Current - Continuous 42 40 A
- Pulsed 168 160 A Total Power Dissipation @ TC = 25°C
Derate above 25°C
Operating and Storage Temperature Range -65 to 175 °C
STG
Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds
= 25°C unless otherwise noted
C
NDP710A NDP710AE NDB710A NDB710AE
D
G
S
NDP710B NDP710BE NDB710B NDB710BE Units
100 V
±40 V
150 W
1
W/°C
275 °C
© 1997 Fairchild Semiconductor Corporation
NDP710.SAM
Electrical Characteristics (T
= 25°C unless otherwise noted)
C
Symbol Parameter Conditions Type Min Typ Max Units DRAIN-SOURCE AVALANCHE RATINGS (Note 1)
E
AS
I
AR
Single Pulse Drain-Source Avalanche Energy
Maximum Drain-Source Avalanche Current 42 A
VDD = 25 V, ID = 42 A NDP710AE
NDP710BE NDB710AE NDB710BE
700 mJ
OFF CHARACTERISTICS
BV
Drain-Source Breakdown
DSS
VGS = 0 V, ID = 250 µA
ALL 100 V
Voltage
I
DSS
I
GSSF
I
GSSR
Zero Gate Voltage Drain Current
VDS = 100 V, V
= 0 V
GS
TJ = 125°C
ALL 250 µA
1 mA Gate - Body Leakage, Forward VGS = 20 V, VDS = 0 V ALL 100 nA Gate - Body Leakage, Reverse
VGS = -20 V, VDS = 0 V
ALL -100 nA
ON CHARACTERISTICS (Note 2)
V
R
GS(th)
DS(ON)
Gate Threshold Voltage
Static Drain-Source On-Resistance
VDS = VGS, ID = 250 µA
VGS = 10 V, ID = 21 A
TJ = 125°C
ALL 2 2.9 4 V
1.4 2.2 3.6 V
NDP710A
0.026 0.038
NDP710AE
NDB710A
0.044 0.08
0.042
VGS = 10 V, ID = 20 A
TJ = 125°C
NDB710AE
NDP710B
NDP710BE
NDB710B
0.09
I
D(on)
TJ = 125°C
NDB710BE
On-State Drain Current VGS = 10 V, VDS = 10 V NDP710A
42 A
NDP710AE
NDB710A
NDB710AE
NDP710B
40 A
NDP710BE
NDB710B
NDB710BE
g
FS
Forward Transconductance VDS = 10 V, ID = 21 A ALL 20 28 S
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
Input Capacitance VDS = 25 V, VGS = 0 V, Output Capacitance ALL 550 700 pF
f = 1.0 MHz
Reverse Transfer Capacitance ALL 175 200 pF
ALL 2840 3600 pF
Ω Ω
NDP710.SAM
Electrical Characteristics (T
= 25°C unless otherwise noted)
C
Symbol Parameter Conditions Type Min Typ Max Units SWITCHING CHARACTERISTICS (Note 2)
t
D(ON)
t
r
t
D(OFF)
t
f
Q Q Q
g
gs
gd
Turn - On Delay Time VDD = 50 V, ID = 42 A, Turn - On Rise Time ALL 111 180 nS
VGS = 10 V, R
GEN
= 5
ALL 15 25 nS
Turn - Off Delay Time ALL 55 90 nS Turn - Off Fall Time ALL 81 130 nS
Total Gate Charge VDS = 80 V, Gate-Source Charge ALL 15 nC
ID = 42 A, VGS = 10V
ALL 92 130 nC
Gate-Drain Charge ALL 44 nC
DRAIN-SOURCE DIODE CHARACTERISTICS
I
S
Maximum Continuos Drain-Source Diode Forward Current NDP710A
42 A
NDP710AE
NDB710A
NDB710AE
NDP710B
40 A
NDP710BE
NDB710B
NDB710BE
ISM Maximum Pulsed Drain-Source Diode Forward Current NDP710A
168 A
NDP710AE
NDB710A
NDB710AE
NDP710B
160 A
NDP710BE
NDB710B
NDB710BE
V
SD
(Note 2)
t
rr
I
rr
Drain-Source Diode Forward Voltage
Reverse Recovery Time VGS = 0 V, IS = 42 A, Reverse Recovery Current ALL 8.7 13 A
VGS = 0 V, IS = 21 A
dIS/dt = 100 A/µs
ALL 0.89 1.3 V
TJ = 125°C 0.69 1.2 V
ALL 128 180 ns
THERMAL CHARACTERISTICS
R
JC
θ
R
JA
θ
Notes:
1. NDP710A/710B and NDB710A/710B are not rated for operation in avalanche mode.
2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.
Thermal Resistance, Junction-to-Case ALL 1 Thermal Resistance, Junction-to-Ambient ALL 62.5
°C/W °C/W
NDP710.SAM
Typical Electrical Characteristics
120
100
80
60
40
20
D
I , DRAIN-SOURCE CURRENT (A)
0
0 2 4 6 8
V = 20V
GS
12
10
8.0
7.0
V , DRAIN-SOURCE VOLTAGE (V)
DS
6.0
5.0
2.5
V = 5V
GS
2
1.5
R , NORMALIZEDDS(on)
1
DRAIN-SOURCE ON-RESISTANCE
0.5 0 20 40 60 80 100 120
6.0
I , DRAIN CURRENT (A)
D
7.0
Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with
Gate Voltage and Drain Current.
2.5
I = 15A
D
V = 10V
GS
2
1.5
DS(ON)
R , NORMALIZED
1
DRAIN-SOURCE ON-RESISTANCE
0.5
-50 -25 0 25 50 75 100 125 150 175 T , JUNCTION TEMPERATURE (°C)
J
2.5
1.5
DS(on)
R , NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
0.5
V = 10V
GS
2
1
0 20 40 60 80 100 120
T = 125°C
J
I , DRAIN CURRENT (A)
D
8.0 10
12
20
25°C
-55°C
Figure 3. On-Resistance Variation
with Temperature.
60
50
40
30
20
D
I , DRAIN CURRENT (A)
10
V = 10V
DS
0
2 3 4 5 6 7
V , GATE TO SOURCE VOLTAGE (V)
GS
T = -55°C
J
25
125
Figure 4. On-Resistance Variation with
Drain Current and Temperature.
1.2
1.1
1
0.9
0.8
th
V , NORMALIZED
0.7
0.6
GATE-SOURCE THRESHOLD VOLTAGE (V)
0.5
-50 -25 0 25 50 75 100 125 150 175 T , JUNCTION TEMPERATURE (°C)
J
Figure 5. Transfer Characteristics. Figure 6. Gate Threshold Variation
with Temperature.
V = V
DS GS
I = 250µA
D
NDP710.SAM
Pulse Width
Typical Electrical Characteristics (continued)
1.15
I = 250µA
D
1.1
1.05
1
DSS
BV , NORMALIZED
0.95
0.9
DRAIN-SOURCE BREAKDOWN VOLTAGE (V)
-50 -25 0 25 50 75 100 125 150 175 T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Breakdown Voltage
Variation with Temperature.
6000
3000 2000
1000
CAPACITANCE (pF)
300 200
100
f = 1 MHz V = 0V
GS
0.1 0.2 0.5 1 2 5 10 20 50 V , DRAIN TO SOURCE VOLTAGE (V)
DS
C
C
C
iss
oss
rss
30
V = 0V
GS
10
1
0.1
S
I , REVERSE DRAIN CURRENT (A)
0.01
0.2 0.4 0.6 0.8 1 1.2 1.4
T = 125°C
J
25°C
-55°C
V , BODY DIODE FORWARD VOLTAGE (V)
SD
Figure 8. Body Diode Forward Voltage
Variation with Current and Temperature.
20
I = 42A
D
15
10
5
GS
V , GATE-SOURCE VOLTAGE (V)
0
0 40 80 120 160
Q , GATE CHARGE (nC)
g
V = 20V
DS
50
80
Figure 9. Capacitance Characteristics. Figure 10. Gate Charge Characteristics.
in
10%
out
t
on
10%
50%
r
t
90%
t
d(off)
V
DD
t
d(on)
V
IN
V
GS
R
GEN
G
R
L
D
V
OUT
DUT
Input, V
S
50%
90%
t
10%
off
90%
Figure 36. Switching Test Circuit. Figure 12. Switching Waveforms.
t
f
Inverted
NDP710.SAM
Typical Electrical Characteristics (continued)
50
V = 10V
DS
40
30
20
10
FS
g , TRANSCONDUCTANCE (SIEMENS)
0
0 10 20 30 40 50 60
T = -55°C
J
25°C
125°C
I , DRAIN CURRENT (A)
D
V = 10V
GS
t is adjusted to reach
p
t
p
the desired peak inductive current, I .
L
t
p
I
L
BV
DSS
L
+
V
DD
-
V
DD
Figure 13. Transconductance Variation
with Drain Current and Temperature.
300
100
RDS(ON) Limit
50
10ms
10
5
V = 20V
D
I , DRAIN CURRENT (A)
2 1
0.5
GS
SINGLE PULSE
T = 25°C
C
1 2 3 5 10 20 50 100 150
V , DRAIN-SOURCE VOLTAGE (V))
DS
100ms DC
10µs
100µs
1ms
Figure 14. Unclamped Inductive Load
Circuit and Waveforms.
Figure 15. Maximum Safe Operating Area.
1
0.5
0.3
0.2
0.1
0.05
0.03
0.02
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10 20 50 100 200 500 1000
D = 0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
t ,TIME (ms)
1
R (t) = r(t) * R
JC
θ
R = 1.0 °C/W
JC
θ
P(pk)
t
1
t
2
T - T = P * R (t)
J
C
Duty Cycle, D = t /t
JC
θ
θ
JC
1 2
Figure 16. Transient Thermal Response Curve.
NDP710.SAM
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