MM74HCU04 — Hex Inverter
February 2008
MM74HCU04
Hex Inverter
Features
■
Typical propagation delay: 7ns
Fanout of 15 LS-TTL loads
■
■
Quiescent power consumption: 10µA maximum at
room temperature
Low input current: 1µA maximum
■
General Description
The MM74HCU04 inverters utilize advanced silicon-gate
CMOS technology to achieve operating speeds similar to
LS-TTL gates with the low power consumption of standard CMOS integrated circuits.
The MM74HCU04 is an unbuffered inverter. It has high
noise immunity and the ability to drive 15 LS-TTL loads.
The 74HCU logic family is functionally as well as pin-out
compatible with the standard 74LS logic family. All inputs
are protected from damage due to static discharge by
internal diode clamps to V
and ground.
CC
Ordering Information
Package
Order Number
MM74HCU04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
MM74HCU04SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HCU04MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
MM74HCU04N N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
Number Package Description
Wide
All packages are lead free per JEDEC: J-STD-020B standard.
©1983 Fairchild Semiconductor Corporation www.fairchildsemi.com
MM74HCU04 Rev. 1.4.0
Connection Diagram
MM74HCU04 — Hex Inverter
Pin Assignments for DIP, SOIC, SOP and TSSOP
Schematic Diagram
Top View
©1983 Fairchild Semiconductor Corporation www.fairchildsemi.com
MM74HCU04 Rev. 1.4.0 2
MM74HCU04 — Hex Inverter
Absolute Maximum Ratings
(1)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Rating
V
CC
V
IN
V
OUT
, I
I
IK
I
OUT
I
CC
T
STG
P
T
Notes:
1. Unless otherwise specified all voltages are referenced to ground.
2. Power Dissipation temperature derating — plastic “N” package: –12mW/°C from 65°C to 85°C.
Supply Voltage –0.5 to +7.0V
DC Input Voltage –1.5 to V
DC Output Voltage –0.5 to V
Clamp Diode Current ±20mA
OK
DC Output Current, per pin ±25mA
DC V
or GND Current, per pin ±50mA
CC
Storage Temperature Range –65°C to +150°C
Power Dissipation
D
Note 2 600mW
S.O. Package only 500mW
Lead Temperature (Soldering 10 seconds) 260°C
L
CC
CC
+1.5V
+0.5V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter Min. Max. Units
V
CC
V
, V
IN
T
A
Supply Voltage 2 6 V
DC Input or Output Voltage 0 V
OUT
Operating Temperature Range –40 +85 °C
CC
V
©1983 Fairchild Semiconductor Corporation www.fairchildsemi.com
MM74HCU04 Rev. 1.4.0 3