Fairchild MM74HCT04 service manual
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MM74HCT04 — Hex Inverter
February 2008
MM74HCT04
Hex Inverter
Features
■
TTL, LS pin-out and threshold compatible
Fast switching: t
■
■
Low power: 10 µW at DC, 3.7 mW at 5 MHz
High fanout: ≥ 10 LS loads
■
■
Inverting, triple buffered
PLH
, t
PHL
12 ns (typ)
General Description
The MM74HCT04 is a logic function fabricated by using
advanced silicon-gate CMOS technology which provides
the inherent benefits of CMOS—low quiescent power
and wide power supply range. This device is input and
output characteristic as well as pin-out compatible with
standard 74LS logic families. The MM74HCT04, triple
buffered, hex inverters, features low power dissipation
and fast switching times. All inputs are protected from
static discharge by internal diodes to V
MM74HCT devices are intended to interface between
TTL and NMOS components and standard CMOS
devices. These parts are also plug-in replacements for
LS-TTL devices and can be used to reduce power
consumption in existing designs.
and ground.
CC
Ordering Information
Package
Order Number
MM74HCT04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
MM74HCT04SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HCT04MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
MM74HCT04N N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
Number Package Description
Narrow
4.4mm Wide
All packages are lead free per JEDEC: J-STD-020B standard.
©1984 Fairchild Semiconductor Corporation www.fairchildsemi.com
MM74HCT04 Rev. 1.3.0
Connection Diagram
MM74HCT04 — Hex Inverter
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View
©1984 Fairchild Semiconductor Corporation www.fairchildsemi.com
MM74HCT04 Rev. 1.3.0 2
MM74HCT04 — Hex Inverter
Absolute Maximum Ratings
(1)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Rating
V
CC
V
IN
V
OUT
, I
I
IK
I
OUT
I
CC
T
STG
P
T
Notes:
1. Unless otherwise specified all voltages are referenced to ground.
2. Power Dissipation temperature derating — plastic “N” package: –12mW/°C from 65°C to 85°C.
Supply Voltage –0.5 to +7.0V
DC Input Voltage –1.5 to V
DC Output Voltage –0.5 to V
Clamp Diode Current ±20mA
OK
DC Output Current, per pin ±25mA
DC V
or GND Current, per pin ±50mA
CC
Storage Temperature Range –65°C to +150°C
Power Dissipation
D
Note 2 600mW
S.O. Package only 500mW
Lead Temperature (Soldering 10 seconds) 260°C
L
CC
CC
+1.5V
+0.5V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter Min. Max. Units
V
CC
V
, V
IN
T
A
t
, t
r
Supply Voltage 4.5 5.5 V
DC Input or Output Voltage 0 V
OUT
Operating Temperature Range –40 +85 °C
Input Rise or Fall Times 500 ns
f
CC
V
©1984 Fairchild Semiconductor Corporation www.fairchildsemi.com
MM74HCT04 Rev. 1.3.0 3
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