Under-Voltage Lockout (UVLO)
Optimized for Switching Frequencies up to 1MHz
Low-Profile SMD Package
Fairchild Green Packaging and RoHS Compliance
Based on the Intel
®
4.0 DrMOS Standard
Description
The XS™ DrMOS family is Fairchild’s next-generation,
fully optimized, integrated MOSFET plus driver power
stage solution for high-current, high-frequency,
synchronous buck DC-DC applications. The FDMF6707C
integrates a driver IC, two power MOSFETs, and a
bootstrap Schottky diode into a thermally enhanced,
ultra-compact 6x6mm PQFN package.
With an integrated approach, the complete switching
power stage is optimized for driver and MOSFET
dynamic performance, system inductance, and power
MOSFET R
performance PowerTrench
which dramatically reduces switch ringing, eliminating
the snubber circuit in most buck converter applications.
A new driver IC with reduced dead times and
propagation delays further enhances performance. A
thermal warning function indicates potential overtemperature situations. FDMF6707C also incorporates
features such as Skip Mode (SMOD) for improved lightload efficiency, along with a three-state 5V PWM input
for compatibility with a wide range of PWM controllers.
16 – 28 PGND Power ground. Output stage ground. Source pin of the low-side MOSFET.
36 GL For manufacturing test only. This pin must float; must not be connected to any pin.
38 THWN#
39 DISB#
40 PWM PWM signal input. This pin accepts a three-state 5VPWM signal from the controller.
VSWH
the low-side driver is disabled. This pin has a 10µA internal pull-up current source. Do not add a
noise filter capacitor.
Power for gate driver. Minimum 1µF ceramic capacitor is recommended, connected as close as
possible from this pin to CGND.
Bootstrap supply input. Provides voltage supply to the high-side MOSFET driver. Connect a
bootstrap capacitor from this pin to PHASE.
No connect. The pin is not electrically connected internally, but can be connected to VIN
for convenience.
Switch node input. Provides return for high-side bootstrapped driver and acts as a sense point
for the adaptive shoot-through protection.
Thermal warning flag, open collector output. When temperature exceeds the trip limit, the
output is pulled LOW. THWN# does not disable the module.
Output disable. When LOW, this pin disables the power MOSFET switching (GH and GL are
held LOW). This pin has a 10µA internal pull-down current source. Do not add a noise filter
capacitor.
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
V
Supply Voltage Referenced to CGND -0.3 6.0 V
CIN
V
Drive Voltage Referenced to CGND -0.3 6.0 V
DRV
V
Output Disable Referenced to CGND -0.3 6.0 V
DISB#
V
PWM Signal Input Referenced to CGND -0.3 6.0 V
PWM
V
Skip Mode Input Referenced to CGND -0.3 6.0 V
SMOD#
VGL Low Gate Manufacturing Test Pin Referenced to CGND -0.3 6.0 V
V
Thermal Warning Flag Referenced to CGND -0.3 6.0 V
THWN#
VIN Power Input Referenced to PGND, CGND -0.3 25.0 V
V
Bootstrap Supply
BOOT
VGH High Gate Manufacturing Test Pin
V
PHASE Referenced to CGND -0.3 25.0 V
PHS
V
Switch Node Input
SWH
V
Bootstrap Supply Referenced to VDRV 22 V
BOOT
I
THWN# Sink Current -0.1 7.0 mA
THWN#
I
O(AV)
θ
JPCB
Output Current
Junction-to-PCB Thermal Resistance 3.5 °C/W
(1)
TA Ambient Temperature Range -40 +125 °C
TJ Maximum Junction Temperature +150 °C
T
Storage Temperature Range -55 +150 °C
STG
ESD Electrostatic Discharge Protection
Note:
1. I
is rated using Fairchild’s DrMOS evaluation board, TA = 25°C, natural convection cooling. This rating is limited
O(AV)
by the peak DrMOS temperature, T
= 150°C, and varies depending on operating conditions and PCB layout. This
J
rating can be changed with different application settings.
Referenced to VSWH, PHASE -0.3 6.0 V
Referenced to CGND -0.3 25.0 V
Referenced to VSWH, PHASE -0.3 6.0 V
Referenced to CGND -0.3 25.0 V
Referenced to PGND, CGND (DC Only)-0.3 25.0 V
Referenced to PGND, <20ns -8.0 25.0 V
fSW=300kHz, VIN=12V, V
fSW=1MHz, VIN=12V, VO=1V 45
Human Body Model, JESD22-A114 2000
Charged Device Model, JESD22-C101 1000
=1V 50
O
A
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol Parameter Min. Typ. Max. Unit
V
Control Circuit Supply Voltage 4.5 5.0 5.5 V
CIN
V
Gate Drive Circuit Supply Voltage 4.5 5.0 5.5 V
DRV
VIN Output Stage Supply Voltage 3.0 12.0 15.0
Note:
2. Operating at high VIN can create excessive AC overshoots on the VSWH-to-GND and BOOT-to-GND nodes
during MOSFET switching transients. For reliable DrMOS operation, VSWH-to-GND and BOOT-to-GND must
remain at or below the Absolute Maximum Ratings shown in the table above. Refer to the “Application
Information” and “PCB Layout Guidelines” sections of this datasheet for additional information.