FDG6323L
Integrated Load Switch
General Description Features
V
=0.2V @ VIN=5V, IL=0.36A. R
ROP
This device is particularly suited for compact
power management in portable electronic
equipment where 2.5V to 8V input and 0.6A
output current capability are needed. This load
switch integrates a small N-Channel power
MOSFET (Q1) which drives a large P-Channel
power MOSFET (Q2) in one tiny SC70-6
package.
D
V
=0.2V @ VIN=2.5V, IL=0.27A. R
DROP
Very small package outline SC70-6.
Control MOSFET (Q1) includes Zener protection for ESD
ruggedness (>6KV Human Body Model).
High density cell design for extremely low
on-resistance.
Compact industry standard SC70-6 surface mount package.
March 1999
= 0.55Ω
(ON)
= 0.75Ω.
(ON)
SC70-6
SOT-23
SuperSOTTM-6
SuperSOTTM-8
SO-8
SOT-223
V , C
3
2
Q1
1
OUT
V , C
OUT
R
2
1
1
.23
1
pin
SC70-6
Absolute Maximum Ratings T
V , R
4
1
IN
Q2
V
ON/OFF
5
R , C
6
1
1
See Application Circuit
= 25°C unless otherwise noted
A
Symbol Parameter FDG6323L Units
V
V
I
L
IN
ON/OFF
Input Voltage Range 2.5 - 8 V
On/Off Voltage Range 1.5 - 8 V
Load Current - Continuous (Note 1) 0.6 A
- Pulsed (Note 1 & 3) 1.8
P
D
TJ,T
Maximum Power Dissipation (Note 2) 0.3 W
Operating and Storage Temperature Range -55 to 150 °C
STG
ESD Electrostatic Discharge Rating MIL-STD-883D Human Body
Model (100pf/1500Ohm)
THERMAL CHARACTERISTICS
R
JA
θ
Thermal Resistance, Junction-to-Ambient (Note 2) 415 °C/W
EQUIVALENT APPLICATION
V
DROP
+
IN
ON/OFF
-
6 kV
OUT
© 1999 Fairchild Semiconductor Corporation
FDG6323L Rev.C
Electrical Characteristics (T
= 25°C unless otherwise noted)
A
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
I
FL
Forward Leakage Current VIN = 8 V, V
= 0 V 1 µA
ON/OFF
ON CHARACTERISTICS (Note 3)
V
DROP
R
(ON)
Conduction Voltage Drop VIN = 5 V, V
VIN = 2.5 V, V
= 3.3 V, IL = 0.36 A 0.14 0.2 V
ON/OFF
= 3.3 V, IL = 0.27 A
ON/OFF
0.15 0.2
Q2 - Static On-Resistance VGS = -5 V, ID = -0.6 A 0.41 0.55
VGS = -2.5 V, ID = -0.5 A 0.58 0.75
I
L
Notes:
1. Range of Vin can be up to 8V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -8V.
2. R
θ
R
θ
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
Load Current V
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
JA
is guaranteed by design while R
JC
is determined by the user's board design.
CA
θ
= 0.2 V, VIN = 5 V, V
DROP
V
= 0.2 V, VIN = 2.5 V, V
DROP
= 3.3 V 0.36 A
ON/OFF
= 3.3 V 0.27
ON/OFF
FDG6323L Load Switch Application
APPLICATION CIRCUIT
Ω
Q2
IN
R1
Q1
ON/OFF
R2
External Component Recommendation
R1 is required to turn Q2 off.
R2 is optional for Slew Rate Control.
For Co ≤ 1uF applications:
First select R2,100 - 1KΩ, for Slew Rate control.
Then select R1 such that R1/R2 ratio maintains between 10 - 100.
OUT
C1
Co
LOAD
FDG6323L Rev.C
Typical Electrical Characteristics (T
= 25 OC unless otherwise noted )
A
1.5
V = 5V
IN
V = 1.5 - 8V
ON/OFF
1.2
PW =300us, D≤ 2%
0.9
DROP
0.6
V ,(V)
T = 125°C
J
T = 25°C
J
0.3
0
0 0.4 0.8 1.2 1.6 2
I ,(A)
L
Figure 1. Conduction Voltage Drop
Variation with Load Current.
1
0.8
0.6
(ON)
R ,(Ohm)
0.4
0.2
0 2 4 6 8 10
V , (V)
IN
I = 1A
L
V = 1.5 - 8V
ON/OFF
PW =300us, D≤ 2%
T = 125°C
J
T = 25°C
J
1.5
T = 125°C
I , (A)
L
J
T = 25°C
J
V = 2.5V
IN
V = 1.5 - 8V
ON/OFF
PW =300us, D≤ 2%
1.2
0.9
DROP
0.6
V , (V)
0.3
0
0 0.4 0.8 1.2 1.6 2
Figure 2. Conduction Voltage Drop
Variation with Load Current.
Figure 3. On-Resistance Variation
with Input Voltage.
1
D = 0.5
0.5
0.2
0.2
0.1
0.1
0.05
0.02
0.01
r(t), NORMALIZED EFFECTIVE
0.005
TRANSIENT THERMAL RESISTANCE
0.002
0.05
0.02
0.01
Single Pulse
0.0001 0.001 0.01 0.1 1 10 100 200
Figure 4. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 2.
Transient thermal response will change depending on the circuit board design.
t , TIME (sec)
1
R (t) = r(t) * R
JA
θ
R =415
JA
θ
P(pk)
t
1
t
2
T - T = P * R (t)
J
A
Duty Cycle, D = t / t
°C/W
JA
θ
1 2
JA
θ
FDG6323L Rev.C
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
CoolFET™
CROSSVOLT™
2
E
CMOS
TM
FACT™
FACT Quiet Series™
®
FAST
FASTr™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
POP™
PowerTrench™
QFET™
QS™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
TinyLogic™
UHC™
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or
In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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