93% Efficiency at 3MHz
800mA, 1A, or 1.1A Output Current
2
I
C™-Compatible Interface up to 3.4Mbps
6-bit V
Programmable from 0.75V to 1.975V
OUT
2.7V to 5.5V Input Voltage Range
3MHz Fixed-Frequency Operation
Excellent Load and Line Transient Response
Small Size, 1H Inductor Solution
±2% PWM DC Voltage Accuracy
35ns Minimum On-Time
High-Efficiency, Low-Ripple, Light-Load PFM
Smooth Transition between PWM and PFM
37A Operating PFM Quiescent Current
Pin-Selectable or I
2C™
Programmable Output Voltage
On-the-Fly External Clock Synchronization
10-lead MLP (3 x 3mm) or 12-bump CSP Packages
Applications
Cell Phones, Smart Phones
3G, WiFi
Netbooks
®
, WiMAX™, and WiBro® Data Cards
®
, Ultra-Mobile PCs
SmartReflex™-Compliant Power Supply
Split Supply DSPs and P Solutions OMAP™, XSCALE™
Mobile Graphic Processors (NVIDIA
®
, ATI)
LPDDR2 and Memory Modules
Description
The FAN5355 device is a high-frequency, ultra-fast transient
response, synchronous step-down DC-DC converter
optimized for low-power applications using small, low-cost
inductors and capacitors. The FAN5355 supports up to
800mA, 1A, or 1.1A load current.
The device is ideal for mobile phones and similar portable
applications powered by a single-cell Lithium-Ion battery. With
an output-voltage range adjustable via I
0.75V to 1.975V, the device supports low-voltage DSPs and
processors, core power supplies, and memory modules in
smart phones, PDAs, and handheld computers.
The FAN5355 operates at 3MHz (nominal) fixed switching
frequency using either its internal oscillator or an external
SYNC frequency.
During light-load conditions, the regulator includes a PFM
mode to enhance light-load efficiency. The regulator
transitions smoothly between PWM and PFM modes with no
glitches on V
consumption is reduced to less than 200nA.
The serial interface is compatible with Fast/Standard and
High-Speed mode I
3.4Mbps. This interface is used for dynamic voltage scaling
with 12.5mV voltage steps for reprogramming the mode of
operation (PFM or Forced PWM), or to disable/enable the
output voltage.
The chip's advanced protection features include short-circuit
protection and current and temperature limits. During a
sustained over-current event, the IC shuts down and restarts
after a delay to reduce average power dissipation into a fault.
During startup, the IC controls the output slew rate to minimize
input current and output overshoot at the end of soft start. The
IC maintains a consistent soft-start ramp, regardless of output
load during startup.
The FAN5355 is available in 10-lead MLP (3x3mm) and
12-bump WLCSP packages.
1. The “X” designator specifies tape and reel packaging.
2. V
is limited to the maximum voltage for all VSEL codes greater than the maximum V
OUT
OUT
listed.
Typical Application
AVIN
Q1
EN
VSEL
SYNC
Q2
MODULATOR
SDA
VCCIO
SCL
PVIN
SW
PGND
VIN
C
IN
VOUT
L
OUT
C
OUT
AGND
VOUT
Figure 1. Typical Application
Component Description Vendor Parameter Min. Typ. Max. Units
(3)
L
L1 (L
C
CIN
OUT
OUT
)
1H nominal
0603
6x0.8x0.8)
(1.
10F X5R or better
0603 (1.6x0.8x0.8)
4.7F X5R or better
Murata LQM31P
or FDK MIPSA2520
Murata or equivalent
GRM188R60G106ME47D
Murata or equivalent
GRM188R60J475KE19D
DCR (series R)100
0.7 1.0 1.2
(4)
C
5.6 10.0 12.0
(4)
C
3.0 4.7 5.6
Table 1. Recommended External Components
Notes:
3. Minimum L incorporates tolerance, temperature, and partial saturation effects (L decreases with increasing current).
4. Minimum C is a function of initial tolerance, maximum temperature, and the effective capacitance being reduced due to
frequency, dielectric, and voltage bias effects.
5. All logic inputs (SDA, SCL, SYNC, EN, and VSEL) are high impedance and should not be left floating. For minimum
quiescent power consumption, tie unused logic inputs to AVIN or AGND. If I
Name
(5)
Description
Power GND. Power return for gate drive and power transistors. Connect to AGND on PCB.
The connection from this pin to the bottom of C
should be as short as possible.
IN
Switching Node. Connect to output inductor.
Power Input Voltage. Connect to input power source. The connection from this pin to CIN
should be as short as possible.
Sync. When toggling and SYNC_EN bit is HIGH, the regulator synchronizes to the frequency
on this pin. In PWM mode, when this pin is statically LOW or statically HIGH, or when its
frequency is outside of the specified capture range, the regulator’s frequency is controlled by
its internal 3MHz clock.
Analog Input Voltage. Connect to input power source as close as possible to the input
bypass capacitor.
Analog GND. This is the signal ground reference for the IC. All voltage levels are measured
with respect to this pin.
Enable. When this pin is HIGH, the circuit is enabled. When LOW, quiescent current is
minimized. This pin should not be left floating.
2
SDA. I
C interface serial data.
Output Voltage Monitor. Tie this pin to the output voltage. This is a signal input pin to the
control circuit and does not carry DC current.
Voltage Select. When HIGH, V
behavior can be overridden through I
2
SCL. I
C interface serial clock.
is set by VSEL1. When LOW, V
OUT
2
C register settings. This pin should not be left floating.
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol Parameter Min. Max. Unit
VCC
ESD
TJ Junction Temperature –40 +150 °C
T
STG
TL Lead Soldering Temperature, 10 Seconds +260 °C
Note:
6. Lesser of 6.5V or AVIN+0.3V.
AVIN, SW, PVIN Pins -0.3 6.5 V
Other Pins -0.3 AVIN + 0.3
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114 3.5 KV
Charged Device Model per JESD22-C101 1.5 KV
(6)
V
Storage Temperature –65 +150 °C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
VIN = 3.6V, EN = VIN, VSEL = VIN, SYNC = GND, VSEL0(6) bit = 1, CONTROL2[4:3] = 00. TA = -40°C to +85°C, unless otherwise
noted. Typical values are at T
Symbol Parameter Conditions Min. Typ. Max. Units
Power Supplies
VIN Input Voltage Range 2.7 5.5 V
IQ Quiescent Current
ISD Shutdown Supply Current
V
Under-Voltage Lockout Threshold
UVLO
V
ENABLE, VSEL, SDA, SCL, SYNC
Power Switch and Protection
R
R
Frequency Control
Under-Voltage Lockout Hysteresis 200 250 300 mV
UVHYST
VIH HIGH-Level Input Voltage 1.2 V
VIL LOW-Level Input Voltage 0.4 V
IIN Input Bias Current Input tied to GND or VIN 0.01 1.00
DS(ON)P
I
LKGP
DS(ON)N
I
LKGN
R
I
LIMPK
T
LIMIT
T
HYST
Resistance
P-Channel Leakage Current VDS = 6V 1
N-Channel MOSFET On
Resistance
N-Channel Leakage Current VDS = 6V 1
Discharge Resistor for Power-
DIS
Down Sequence
P-MOS Current Limit
Thermal Shutdown 150 °C
Thermal Shutdown Hysteresis 20 °C
P-Channel MOSFET On
fSW Oscillator Frequency 2.65 3.00 3.35 MHz
f
Synchronization Range 2.7 3.0 3.3 MHz
SYNC
D
Synchronization Duty Cycle 20 80 %
SYNC
= 25°C. Circuit and components according to Figure 1.