FAGOR FBI8A5M1, FBI8M5M1, FBI8K5M1, FBI8J5M1, FBI8G5M1 Datasheet

...
8 Amp. Glass Passivated Bridge Rectifier
FBI8A5M1.......FBI8M5M1
Dimensions in mm.
25
3.2
_
+ 0.05
1
5
5 5
+
L suffix
17.5 8 –4
Plastic
Case
3.5
0.7
1
• Mounting Instructions
High temperature soldering guaranteed: 260 ºC – 10 sc.
Recommended mounting torque: 8 Kg.cm.
Voltage
50 to 1000 V.
• Glass Passivated Junction Chips.
UL recognized under component index file
number E130180.
Lead and polarity identifications.
Case: Molded Plastic.
Ideal for printed circuit board (P.C.B.).
High surge current capability.
The plastic material carries U/L recognition 94 V-O.
Maximum Ratings, according to IEC publication No. 134
FBI8A
5M1
FBI8B
5M1
FBI8D
5M1
FBI8G
5M1
5M1
Current
8.0 A.
®
FBI8K
5M1
FBI8M
5M1
V V
I
I I2t
V T T
Peak recurrent reverse voltage (V)
RRM
Maximum RMS voltage (V)
RMS
Max. Average forward current with heatsink
F(AV)
FSM
8.3 ms. peak forward surge current
(Jedec Method)
without heatsink
Rating for fusing ( t<8.3 ms.)
DIS
Dielectric strength Operating temperature range
j
Storage temperature range
stg
(terminals to case, AC 1 min.)
Electrical Characteristics at Tamb = 25°C
V I
R R
Max. forward voltage drop per element at I
F
Max. reverse current per element at V
R
MAXIMUM THERMAL RESISTANCE Junction-Case. With Heatsink.
th (j-c)
Junction-Ambient. Without Heatsink.
th (j-a)
= 8 A
F
RRM
50
100
200
400
600
800
1000
35 70 140 280 420 560 700
8.0 A at 100 ºC
3.0 A at 40 ºC 200 A
2
sec
166 A
1500 V
– 55 to + 150 °C
– 55 to +150 ºC
1.0 V
5 A
2.2 ºC/W 22 ºC/W
Jan - 00
Characteristic Curves
FBI8 - 5M1
TYPICAL FORWARD CHARACTERISTIC
Tamb = 25° C
10
1.0
0.1
0
0.6 1.0 1.4
V
, instantaneous forward voltage (V)
F
FORWARD CURRENT DERATING CURVE
heatsink
8
6
on glass-epoxi substrate
4
2
_
+
P.C.B. soldering land 5 mm ø sine wave R-load free in air
Tc
_
sine wave R-load on heatsink
0
0 50 100 150 175
12525 75
Tamb, ambient temperature (°C)
Tc
+
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
200
150
100
50
0
1
Number of cycles at 60 Hz.
10 100
Jan - 00
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