FAGOR FBI6M1M1, FBI6K1M1, FBI6J1M1, FBI6G1M1, FBI6D1M1 Datasheet

FBI6A

1M1

50
35

FBI6B

1M1

100

70

FBI6D

1M1

200
140

FBI6G

1M1

400
280

FBI6J

1M1

600
420

FBI6K

1M1

800
560

FBI6M

1M1

1000

700

• Mounting Instructions

• High temperature soldering guaranteed: 260 ºC – 10 sc.

• Recommended mounting torque: 8 Kg.cm.

FBI6A1M1.......FBI6M1M1

6 Amp. Glass Passivated Bridge Rectifier

Dimensions in mm.

Maximum Ratings, according to IEC publication No. 134

Peak recurrent reverse voltage (V)
Maximum RMS voltage (V)

Max. Average forward current with heatsink

without heatsink

10 ms. peak forward surge current

(Jedec Method)

Current squared time (rating for fusing)
(1ms.<t<10ms. Tc = 25ºC)
Dielectric strength (terminals to case, AC 1 min.)
Operating temperature range
Storage temperature range

VDIS
T

j

T

stg

6.0 A at 100 ºC

3.0 A at 40 ºC
170 A

2000 V

– 55 to + 150 °C

– 55 to +150 ºC

Electrical Characteristics at Tamb = 25°C

V

F

Max. forward voltage drop per diode at IF = 3.0 A

I

R

1.05 V

Max. instantaneous reverse current at V

RRM

Voltage

50 to 1000 V.

Current

6.0 A.

Plastic

Case

®

5 A

I2t

I

FSM

I

F(AV)

VRRM
VRMS

140 A2 sec

MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.

2.2 ºC/W
22 ºC/W

R

th (j-c)

R

th (j-a)

L suffix

17.5
8 –4

25

3.2

7.5 7.5 10
1

0.7

3.5

1

+ 0.05

+

_

• Glass Passivated Junction Chips.

• UL recognized under component index file

number E130180.

• Lead and polarity identifications.

• Case: Molded Plastic.

• Ideal for printed circuit board (P.C.B.).

• High surge current capability.

• The plastic material carries U/L recognition 94 V-O.

Jan - 00

V

F

, instantaneous forward voltage (V)

0.6 1.0 1.4

0

0.1

1.0

10

Tamb = 25° C

Characteristic Curves

FBI6 - 1M1

TYPICAL FORWARD CHARACTERISTIC

2

6

8

Tamb, ambient temperature (°C)

4

0 50 100 150 175

0

12525 75

FORWARD CURRENT DERATING CURVE

MAXIMUM NON-REPETITIVE PEAK

FORWARD SURGE CURRENT

Number of cycles at 50 Hz.

10 100

0

50

100

150

200

1

heatsink
Tc

Tc

sine wave
R-load
on heatsink

+

_

on glass-epoxi substrate

P.C.B.
soldering land 5 mm ø
sine wave
R-load
free in air

Jan - 00

+

_