EVERLIGHT EVL 67-21/RSC-F Datasheet

EVERLIGHT ELECTRONICS CO., LTD.

Technical Data Sheet
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Features

․P-LCC-2 package.

․White package.

․Optical indicator.

․Colorless clear window.

․Wide viewing angle.

․Suitable for vapor-phase reflow, Infrared reflow

and wave solder processes.

․Computable with automatic placement equipment.

․Available on tape and reel (8mm Tape).

․Pb-free.

67-21/RSC-FT2V1B/2T

․The product itself will remain within RoHS

compliant version

Descriptions

․The 67-21 series is available in soft orange, green, blue, and yellow.

Due to the package design, the LED has wide viewing angle and

optimized light coupling by inter reflector. This feature makes the LED

ideal for light pipe application. The low current requirement makes

this device ideal for portable equipment or any other application where

power is at a premium.

Applications

․Telecommunication: indicator and backlighting in

telephone and fax.

․Flat backlight for LCD, switch and symbol.

․Light pipe application.

․General use.

Device Selection Guide

Chip

Emitted Color Resin Color

Material

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Technical Data Sheet
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Package Dimensions

67-21/RSC-FT2V1B/2T

Note: Tolerance unless mentioned is ±0.1mm; Unit = mm

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Technical Data Sheet
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Absolute Maximum Ratings (Ta=25 )℃

Parameter Symbol Rating Units

Reverse Voltage VR 5 V

67-21/RSC-FT2V1B/2T

Forward Current I

Peak Forward Current(Duty 1/10 @1KHz)

Power Dissipation Pd 120 mW

Electrostatic Discharge(HBM) ESD 2000 V

Operating Temperature Topr -40 ~ +85

Storage Temperature Tstg -40 ~ +90

Soldering Temperature Tsol

Electro-Optical Characteristics (Ta=25 )℃

Parameter Symbol Min. Typ. Max. Unit Condition

Luminous Intensity Iv 360 ----- 900 mcd IF=20mA

Viewing Angle 2θ

Peak Wavelength λp ----- 632 ----- nm IF=20mA

1/2

----- 120 ----- deg IF=20mA

IFP

F

Reflow Soldering : 260

Hand Soldering : 350 ℃ for 3 sec.

50 mA

100 mA

℃
℃

℃ for 10 sec.

Dominant Wavelength λd 621 ----- 631 nm IF=20mA

Spectrum Radiation Bandwidth λ△ ----- 20 ----- nm I

Notes:

1. Tolerance of Luminous Intensity: ±11%

2. Tolerance of Dominant Wavelength: ±1nm

3. Tolerance of Forward Voltage: ±0.1V

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Forward Voltage V

Reverse Current I

=20mA

F

F

R

1.75 -- 2.35 V IF=20mA

----- ----- 10 μA VR=5V

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EVERLIGHT ELECTRONICS CO., LTD.

Technical Data Sheet
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67-21/RSC-FT2V1B/2T

Bin Range of Luminous Intensity

Bin Code Min. Max. Unit Condition

T2 360 450

U1 450 565

mcd IF=20mA

U2 565 715

V1 715 900

Bin Range of Dominant Wavelength

Group Bin Code Min. Max. Unit Condition

FF1 621 626

F

FF2 626 631

nm IF=20mA

Bin Range of Forward Voltage

Group Bin Code Min. Max. Unit Condition

0 1.75 1.95

B

Notes:

1. Tolerance of Luminous Intensity: ±11%

2. Tolerance of Dominant Wavelength: ±1nm

3. Tolerance of Forward Voltage: ±0.1V

1 1.95 2.15

2 2.15 2.35

V IF=20mA

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Technical Data Sheet
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Typical Electro-Optical Characteristics Curves

67-21/RSC-FT2V1B/2T

Relative luminous intensity

)%

(

% )
(

100

75

50

25

1000

100

10

Spectrum Distribution

0

600 650

550

Wavelength λp(nm)

Luminous Intensity vs.

Ambient Temperature

Ta=25°C

700 750

I (mA)

Forward Current

)%
(

Forward Current vs.

Forward Voltage

50

40

30

20

10

0

1.2

Forward Voltage V (V)

Luminous Intensity vs

Forward Current

1000

100

10

Ta=25°C

2.82.01.6 2.4 3.0

F

Ta=25°C

Relative luminous intensity

1

-60

60

50

I (mA)

40

30

20

10

Forward Current

0

-20-40 0 206040

Ambient Temperature T (°C

Forward Current Derating Curve

0

402060 10085

Ambient Temperature T (°C

10080

)

a

)

a

Relative luminous intensity

1

0

10

Forward Current

1.0

0.9

0.8

0.7

1

10

Radiation Diagram

10

I (mA)

0° 10° 20°

2

0.40.5 0.3 0.20.1 0.6

3

10

Ta=25°C

30°

40°

50°

60°

70°
80°

90°

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Technical Data Sheet
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Label Explanation

67-21/RSC-FT2V1B/2T

CAT: Luminous Intensity Rank

HUE: Dom. Wavelength Rank

REF: Forward Voltage Rank

Reel Dimensions

Pb

CPN :

N : XXXXXXXXXXXXX

P

XXXXXXXXXXXXX

QTY : XXX

LOT NO : XXXXXXXXXX

Reference : XXXXXXXX

EVERLIGHT

MADE IN TAIWAN

RoHS

CAT : XXX
HUE : XXX
REF : XXX

Note: Tolerance unless mentioned is ±0.1mm; Unit = mm

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Technical Data Sheet
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67-21/RSC-FT2V1B/2T

Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel.

Note: Tolerance unless mentioned is ±0.1mm; Unit = mm

Moisture Resistant Packaging

Label

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Aluminum moistue-proof bag

LabelDesiccant

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Technical Data Sheet
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Reliability Test Items and Conditions

The reliability of products shall be satisfied with items listed below.
Confidence level

：10%

LTPD

：90%

67-21/RSC-FT2V1B/2T

No. Items Test Condition

1 Reflow Soldering

2 Temperature Cycle

3 Thermal Shock

4 High Temperature Storage

5 Low Temperature Storage

Temp. : 260℃±5℃

Min. 5 sec.

H : +100

L : -40℃ 15min

H : +100℃ 5min

L : -10℃ 5min

Temp. : 100℃

Temp. : -40℃

℃ 15min

∫ 5 min

∫ 10 sec

Test

Hours/Cycles

6 Min. 22 PCS 0/1

300 Cycles 22 PCS.

300 Cycles 22 PCS.

1000 Hrs. 22 PCS. 0/1

1000 Hrs. 22 PCS. 0/1

Sample

Size

Ac/Re

0/1

0/1

6 DC Operating Life

7

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High Temperature / High

Humidity

I

= 20 mA / 25℃

F

85℃/85%RH

1000 Hrs. 22 PCS. 0/1

1000 Hrs. 22 PCS. 0/1

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Technical Data Sheet
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67-21/RSC-FT2V1B/2T

Precautions for Use

1. Over-current-proof

Customer must apply resistors for protection, otherwise slight voltage shift will cause big

current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 After opening the package: The LED's floor life is 168hrs under 30℃ or less and 60% RH or

less. If unused LEDs remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

1~5 °C / Sec.

260°C. Max.

10 Sec. Max.

1~5 °C / Sec.

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

Pre-heating

180~200°C

120 Sec. Max.

60 Sec. Max.

Above 220°C

.

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Device No. :DSE-0003710 Prepared date: 2-JUNE -2010 Prepared by: Irene Lin

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Technical Data Sheet
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67-21/RSC-FT2V1B/2T

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds

within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals,

and do soldering of each terminal. Be careful because the damage of the product is often started at

the time of the hand solder.

5. Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a

double-head soldering iron should be used (as below figure). It should be confirmed beforehand

whether the characteristics of the LEDs will or will not be damaged by repairing.

EVERLIGHT ELECTRONICS CO., LTD. Tel: [phone]
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: [phone]
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com

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Device No. :DSE-0003710 Prepared date: 2-JUNE -2010 Prepared by: Irene Lin

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