ESI ES29LV160D User Guide

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ES29LV160D
CMOS 3.0 Volt-only, Boot Sector Flash Memory
GENERAL FEATURES
• Single power supply operation
- 2.7V -3.6V for read, program and erase operations
•Sector Structure
- 16Kbyte x 1, 8Kbyte x 2, 32Kbyte x 1 boot sectors
- 64Kbyte x 31 sectors
• Top or Bottom boot block
- ES29LV160DT for Top boot block device
- ES29LV160DB for Bottom boot block device
• Package Options
- 48-pin TSOP
- 48-ball FBGA ( 6 x 8 mm )
- Pb-free packages
- All Pb-free products are RoHS-Compliant
• Low Vcc write inhibit
• Manufactured on 0.18um process technology
• Compatible with JEDEC standards
- Pinout and software compatible with single-power supply flash standard
DEVICE PERFORMANCE
• Read access time
- 90ns/120n for normal Vcc range ( 2.7V - 3.6V )
- 70ns for regulated Vcc range ( 3.0V - 3.6V )
• Program and erase time
- Program time : 6us/byte, 8us/word ( typical )
- Sector erase time : 0.7sec/sector ( typical )
• Power consumption (typical values)
- 200nA in standby or automatic sleep mode
- 9mA active read current at 5 MHz
- 15mA active write current during program or erase
• Minimum 100,000 program/erase cycles per sector
• 20 Year data retention at 125
o
C
SOFTWARE FEATURES
• Erase Suspend / Erase Resume
• Data# poll and toggle for Pro gr a m/erase status
• CFI ( Common Flash Interface) supported
• Unlock Bypass program
• Autoselect mode
• Auto-sleep mode after t
ACC
+ 30ns
HARDWARE FEATURES
• Hardware reset input pin ( RESET#)
- Provides a hardware reset to device
- Any internal device operation is terminated and the device returns to read mode by the reset
• Ready/Busy# output pin ( RY/BY#)
- Provides a program or erase operational status about whether it is finished for read or still being progressed
• Sector protection / unprotection ( RESET# , A9 )
- Hardware method of locking a sector to prevent any program or erase operation within that sector
- Two methods are provided :
- In-system method by RESET# pin
- A9 high-voltage method for PROM programmers
• Temporary Sector Unprotection ( RESET# )
- Allows temporary unprotection of previously protected sectors to change data in-system
ES29LV160D
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GENERAL PRODUCT DESCRIPTION
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The ES29LV160 is a 16 megabit, 3.0 volt-only flash memory device, organized as 2M x 8 bits (Byte mode) or 1M x 16 bits (Word mode) which is config­urable by BYTE#. Four boot sectors and thirty one main sectors are provided : 16Kbytes x 1, 8Kbytes x 2, 32Kbytes x 1 and 64Kbytes x 31. The device is manufactured with ESI’s proprietary, high perfor­mance and highly reliable 0.18um CMOS flash technology. The device can be programmed or erased in-system with standard 3.0 Volt Vcc supply ( 2.7V-3.6V) and can also be programmed in stan­dard EPROM programmers. The device of fers min­imum endurance of 100,000 program/erase cycles and more than 10 years of data retention.
The ES29LV160 offers access time as fast as 70ns or 90ns, allowing operation of high-speed micropro­cessors without wait states. Three separate control pins are provided to eliminate bus contention : chip enable (CE#), write enable (WE#) and output enable (OE#).
All program and erase operation are automatically and internally performed and controlled by embed­ded program/erase algorithms built in the device. The device automatically generates and times the necessary high-voltage pulses to be applied to the cells, performs the verification, and counts the num­ber of sequences. Some status bits (DQ7, DQ6 and DQ5) read by data# polling or toggling between consecutive read cycles provide to the users the internal status of program/erase operation: whether it is successfully done or still being progressed.
The ES29LV160 is completely compatible with the JEDEC standard command set of single power sup­ply Flash. Commands are written to the internal command register using standard write timings of microprocessor and data can be re ad out from the cell array in the device with the same way as used i n other EPROM or flash devices.
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PRODUCT SELECTOR GUIDE
Family Part Number ES29LV160
Voltage Range 3.0 ~ 3.6V 2.7 ~ 3.6V
Speed Option 70R 90 120
Max Access Time (ns) 70 90 120
CE# Access (ns) 70 90 120 OE# Access (ns) 35 40 50
FUNCTION BLOCK DIAGRAM
RY/BY#
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Vcc Vss
WE
RESET#
A<0:19>
CE# OE#
BYTE#
Vcc Detector
#
Command Register
Chip Enable Output Enable Logic
Timer/ Counter
Write State Machine
Analog Bias Generator
Sector Switches
Y-Decoder
X-Decoder
Address Latch
DQ0-DQ15(A-1)
Input/Output Buffers
Data Latch/ Sense Amps
Y-Decoder
Cell Array
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PIN DESCRIPTION
Pin Description
A0-A19 20 Addresses
DQ0-DQ14 15 Data Inputs/Outputs
DQ15/A-1
CE# Chip Enable OE# Output Enable
WE# Write Enable
RESET# Hardware Reset Pin, Active Low
BYTE# Se lects 8-bit or 16-bit mode
RY/BY# Ready/Busy Output (N/A SO 044)
Vcc
Vss Device Ground
NC Pin Not Connected Internally
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DQ15 (Data Input/Output, Word Mode) A-1 (LSB Address Input, Byte Mode)
3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances)
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LOGIC SYMBOL
20
A0 ~ A19
CE#
OE# WE# RESET#
BYTE#
16 or 8
DQ0 ~ DQ15 (A-1)
RY/BY# (N/A SO 044)
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CONNECTION DIAGRAM
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A15 A14
A13 A12 A11 A10
A9 A8
A19
NC
WE#
RESET#
NC
NC
RY/BY#
A18 A17
A7 A6 A5 A4 A3 A2 A1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48-Pin Standard TSOP
ES29LV160
48 47 46 45 44
43 42 41
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
A16 BYTE# Vss DQ15/A-1 DQ7 DQ14 DQ6 DQ13
DQ5 DQ12 DQ4 Vcc DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# Vss CE# A0
48-Ball FBGA (6 x 8 mm)
(Top View, Balls Facing Down)
A B C D E F G H
6
5
4
3
2
1
A13 A12
A9
WE#
RY/
BY#
A7
A3
A8
RESET#
NC
A17
A4
A14
A10
NC
A18
A6
A2
A15
A16
A11 DQ7
A19
NC
A5
DQ5
DQ2
DQ0
A0A1
BYTE#
DQ14
DQ12
DQ10 DQ11 DQ3
DQ8 DQ9 DQ1
DQ15/
A-1
DQ13
Vcc
OE#CE#
Vss
DQ6
DQ4
Vss
ES29LV160D
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Rev. 1C Jan 5 , 2006
DEVICE BUS OPERATIONS
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Several device operational modes are provided in the ES29LV160 device. Commands are used to ini­tiate the device operations. They are latched and stored into internal registers with the address and data information needed to execute the device operation.
The available device operational modes are listed in Table 1 with the required inputs, controls, and the resulting outputs. Each operational mode is described in further detail in the following subsec­tions.
Read
The internal state of the device is set for the read mode and the device is ready for reading arra y da t a upon device power-up, or after a hardware reset. To read the stored data from the cell array of the device, CE# and OE# pins should be driven to V
while WE# pin remains at VIH. CE# is the power control and selects the device. OE# is the output
control and gates array data to the output pins. Word or byte mode of output data is determined by
the BYTE# pin. No additional command is needed in this mode to obtain array data. Standard micro­processor read cycles that assert valid addresses
on the device address inputs produce valid data on the device data outputs. The device st ays at the read mode until another operation is activated by writing commands into the internal command register. Refer to the AC read cycle timing diagrams for further details ( Fig. 16 ).
Word/Byte Mode Configuration ( BYTE# )
The device data output can be configured by BYTE# into one of two modes : word and byte modes. If the BYTE# pin is set at logic ‘1’, the device is configured in word mode, DQ0 - DQ15 are active and controlled by CE# and OE#. If the BYTE# pin is set at logic ‘0’, the device is configured in byte mode, and only data I/O pins DQ0 - DQ7 are active and controlled by CE# and OE#. The data I/O pins DQ8 - DQ14 are tri­stated, and the DQ15 pin is used as an input for the LSB (A-1) address.
IL
Standby Mode
When the device is not selected or activated in a system, it needs to stay at the standby mode, in which current consumption is greatly reduced with outputs in the high impedance state.
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The device enters the CMOS standby mode when CE# and RESET# pins are both held at Vcc (Note that this is a more restricted voltage range than V
not within Vcc standby mode, but the standby current will be greater than the CMOS standby current (0.2uA typi­cally). When the device is in the standby mode, only standard access time (t
access, before it is ready for read data. And even if the device is deselected by CE# pin during erase or programming operation, the device draws active cur ­rent until the operation is completely done. While the device stays in the standby mode, the output is placed in the high impedance state, independent of the OE# input.
The device can enter the deep power-down mode where current consumption is greatly reduced down to less than 0.2uA typically by the following three ways:
- CMOS standby ( CE#, RESET# = Vcc + 0.3V )
Refer to the CMOS DC characteristics Table11 for further current specification .
) If CE# and RESET# are held at VIH, but
IH.
+
0.3V, the device will be still in the
) is required for read
CE
- During the device reset ( RESET# = Vss
- In Autosleep Mode ( after t
ACC
+ 30ns )
+
0.3V.
+ 0.3V )
Autosleep Mode
The device automatically enters a deep power-down mode called the autosleep mode when addresses remain stable for t
consumption is greatly reduced ( less than 0.2uA typical ), regardless of CE#, WE# and OE# control signals.
+30ns. In this mode, current
ACC
Writing Commands
To write a command or command sequences to ini­tiate some operations such as program or erase, the system must drive WE# and CE# to V
. For program operations, the BYTE# pin deter-
V
IH
mines whether the device accepts pro gram data in bytes or words. Refer to “BYTE# timings for Write Operations” in the Fig. 19 for more information.
, and OE# to
IL
Unlock Bypass Mode
To reduce more the programming time, an unlock­bypass mode is provided. Once the device enters this mode, only two write cycles are required to ini­tiate the programming operation instead of four cycles in the normal program command sequences which are composed of two unlock cycles, program
set-up cycle and the last cycle with the program data and addresses. In this mode, two unlock cycles are saved ( or bypassed ).
Sector Addresses
The entire memory space of cell array is divided into a many of small sectors: 16Kbytes x 1, 8Kbytes x 2, 32Kbytes x 1 and 64Kbytes x 31 main sectors. In erase operation, a single sector, multiple sectors, or the entire device (chip erase) can be selected for erase. The address space that each sector occupies is shown in detail in the Table 3-4.
Autoselect Mode
Flash memories are intended for use in applications where the local CPU alters memory contents. In such applications, manufacturer and device identifi­cation (ID) codes must be accessible while the device resides in the target system ( the so called “in-system program”). On the other hand, signature codes have been typically accessed by raising A9 pin to a high voltage in PROM programmers. How­ever, multiplexing high voltage onto address lines is not the generally desired system design practice. Therefore, in the ES29LV160 device an autoselect command is provided to allow the system to access the signature codes without any high voltage. The conventional A9 high-voltage method used in the PROM programers for signature codes are still sup­ported in this device. If the system writes the autoselect command sequence, the device enters the Autoselect mode. The system can then read some useful codes such as manufacturer and device ID from the int er na l re g­isters on DQ7 - DQ0. Standard read cycle timings apply in this mode. In the Autoselect mode, the fol­lowing three informations can be acc essed through either autoselect command method or A9 high-volt­age autoselect method. Refer to the Table 2.
-
-
-
Manufacturer ID Device ID Sector protection verify
Hardware Device Reset ( RESET# )
The RESET# pin provides a hardware method of resetting the device to read array data. When the RESET# pin is driven low for at least a period of t
RP
,
ES29LV160D
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the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once after the device is ready to accept another command sequence, to ensure data integrity.
CMOS Standby during Device Reset
Current is reduced for the duration of the RESET# pulse. When RESET# is held at Vss device draws the greatly reduced CMOS standby current ( I
within Vss
). If RESET# is held at VIL but not
CC4
+
0.3V, the standby current will be greater.
+
0.3V, the
RY/BY# and Terminating Operations
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the internal reset operation is completed, which requires a time of t
rithms). The system can thus monitor RY/BY# to determine whether the reset operation is completed. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is completed within a time of t
(not during Embedded Algorithms). The system can read data after the RESET# pin returns to V
requires a time of t
READY
RH.
(during Embedded Algo-
READY
, which
IH
Sector protection can be implemented via two methods.
-
-
To check whether the sector protection was suc­cessfully executed or not, another operation called “protect verification” needs to be performed after the protection operation on a sector. All protection and protect verifications provided in the device are summarized in detail at the Table 1.
In-system protection A9 High-voltage protection
In-System Protection
“In-system protection”, the primary method, requires V
A6=0, A1=1, and A0=0. This method can be imple­mented either in-system or via programming equip­ment. This method uses standard microprocessor bus cycle timing. Refer to Fig. 26 for timing diagram and Fig. 2 for the protection algorithm.
(11.5V~12.5V) on the RESET# with
ID
A9 High-Voltage Protection
“High-voltage protection”, the alternate method intended only for programming equipment, must force V
trol pin OE# with A6=0, A1=1 and A0=0. Refer to Fig. 28 for timing diagram and Fig. 4 for the protec­tion algorithm.
(11.5~12.5V) on address pin A9 and con-
ID
RESET# tied to the System Reset
The RESET# pin may be tied to the system reset cir­cuitry. A system reset would thus also reset the Flash memory , enab ling the system to read the boot­up firmware from the Flash memory.Refer to the AC Characteristics tables for RESET# parameters and to Fig. 17 for the timing diagram.
SECTOR PROTECTION
The ES29LV160 features hardware sector protec­tion. In the device, sector protection is performed on the sector previously defined in the Table 3-4. Once after a sector is protected, any program or erase operation is not allowed in the protected sector. The previously protected sectors must be unprotected by one of the unprotect methods provided here before changing data in those sectors.
SECTOR UNPROTECTION
The previously protected sectors must be unpro­tected before modifying any data in the sectors. The sector unprotection algorithm unprotects all sectors in parallel. All unprotected sectors must first be protected prior to the first sector unprotection write cycle to avoid any over-erase due to the intrin­sic erase characteristics of the protection cell. After the unprotection operation, all previously protected sectors will need to be individually re-protected. Standard microprocessor bus cycle timings are used in the unprotection and unprotect verification operations. Three unprotect methods are provided in the ES29LV160 device. All unprotection and unprotect verification cycles are summarized in detail at the Table 1.
-
-
-
In-system unprotection A9 High-voltage unprotection T emporary sector unprotection
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In-System Unprotection
“In-system unprotection”, the primary method, requires V
(11.5V~12.5V) on the RESET# with
ID
A6=1, A1=1, and A0=0. This method can be imple­mented either in-system or via programming equip­ment. This method uses standard microprocessor bus cycle timing. Refer to Fig. 26 for timing diagram and Fig. 3 for the unprotection algorithm.
A9 High-Voltage Unprotection
“High-voltage unprotection”, the alternate method intended only for programming equipment, must force V
(11.5~12.5V) on address pin A9 and con-
ID
trol pin OE# with A6=1, A1=1 and A0=0. Refer to Fig. 29 for timing diagram and Fig. 5 for the unpro­tection algorithm.
Temporary Sector Unprotect
This feature allows temporary unprotection of previ­ously protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET# pin to V
(11.5V-12.5V). During this
ID
mode, formerly protected sectors can be pro­grammed or erased by selecting the sector addresses. Once V
is removed from the RESET#
ID
pin, all the previously protected sectors are pro­tected again. Fig. 1 shows the algorithm, and Fig. 25 shows the timing diagrams for this feature.
HARDWARE DATA PROTECTION
The command register and all internal program/ erase circuits are disabled, and the devi ce resets to the read mode. Subsequent writes are ignored until Vcc is greater than V
. The system must provide
LKO
proper signals to the control pins to prevent unin­tentional writes when Vcc is greater than V
LKO
.
Write Pulse “Glitch” Protection
Noise pulses of less than 5ns (typical) on OE#, CE# or WE# do not initiate a write cycle.
Logical inhibit
Write cycles are inhibited by holding any one of OE#=V
, CE#=VIH or WE#=VIH. To initiate a write
IL
cycle, CE# and WE# must be a logical zero while OE# is a logical one.
Power-up Write Inhibit
If WE#=CE#=VIL and OE#=VIH during power up, the device does not accept any commands on the
rising edge of WE#. The internal state machine is automatically reset to the read mode on power-up.
START
RESET# = V
(Note 1)
ID
The ES29LV160 device provides some protection measures against accidental erasure or program­ming caused by spurious system level signals that may exist during power transition. During power-up, all internal registers and latches in the device are cleared and the device automatically resets to the read mode. In addition, with its internal state machine built-in the device, any alteration of the memory contents or any initiation of new operation­can only occur after successful completion of spe­cific command sequences. And several features are incorporated to prevent inadvertent write cycles resulting from Vcc power-up and power -dow n tr an si­tion or system noise.
Low Vcc Write inhibit
When Vcc is less than V accept any write cycles. This protects data during
Vcc power-up and power-down.
ES29LV160D
, the device does not
LKO
9
Perform Erase or
Program Operations
RESET# = V
Temporary Sector
Unprotect Completed
(Note 2)
Notes:
1. All protected sectors are unprotected .
2. All previously protected sectors are protected once again.
IH
Figure 1. Temporary Sector Unprotect Operation
Rev. 1C Jan 5 , 2006
Table 1. ES29LV160 Device Bus Operations
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Operation CE# OE# WE# RESET# Addresses
Read
Write
Standby
Output Disable Reset
In-system
A9 High-Volt­age Method
L L
Vcc+
0.3V
L H H H X High-Z High-Z X X X L X High-Z High-Z
Sector Protect (Note 2)
Sector Unprotect (Note 2) L H L V
Temporary Sector Unprotect X X X
Sector protect
Sector unprotect
LHL
L
L
H
L
L
H
XX Vcc+
V
L
ID
V
L
ID
H H
0.3V
V
V
H
H
DQ0
~
(Note 1)
A
IN
A
IN
X High-Z High-Z
ID
ID
ID
SA,A6=L,
A1=H,A0=L
SA,A6=H,
A1=H,A0=L
A
IN
SA,A9=V
A6=L,
A1=H,A0=L SA,A9=V
A6=H,
A1=H,A0=L
DQ7
D
OUT
(Note 3) (Note 3)
(Note 3) X X
(Note 3) X X
(Note 3) (Note 3) High-Z
,
ID
(Note 3) (Note 3) High-Z
,
ID
BYTE#
= V
D
OUT
DQ8~DQ15
IH
BYTE#
= V
IL
DQ8~DQ14 = High-Z,
DQ15 = A-1
High-Z
Legend:
D
L=Logic Low=VIL, H=Logic High=VIH, VID=11. 5-12.5V, X=Don’t Care, SA=Sector Address, AIN=Address In, DIN=Data In,
=Data Out
OUT
Notes:
1. Addresses are A19:A0 in word mode (BYTE#=VIH) , A19:A-1 in byte mode (BYTE#=VIL).
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector Pro­ tection and Unprotection” section.
3. D
IN
or D
as required by command sequence, data polling, or sector protection algorithm.
OUT
Table 2. Autoselect Codes (A9 High-Voltage Method)
A19
Description CE# OE# WE#
ManufactureID:ESI
Device ID:
ES29LV160
Sector Protection
Verification
Legend:
T= Top Boot Block, B = Bottom Boot Block, L=Logic Low=VIL, H=Logic High=VIH, SA=Sector Address, X = Don’t care
L
L
LLHX X
LLHSAX
A12
H
A11
to
to
A10
XX
A9A8toA7A6
V
XLXLL X
ID
V
X L X L H 22h X C4h(T),49h(B)
ID
V
XLXHL X X
ID
A5
toA2A1 A0
DQ8~DQ15
BYTE#
= V
IH
BYTE#
= V
IL
X4Ah
DQ7~DQ0
01h(protected)
00h(unprotected)
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Table 3. Top Boot Sector Addresses (ES29LV160DT)
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Sector
SA0 00000XXX 64/32 000000h~00FFFFh 00000h~07FFFh SA1 00001XXX 64/32 010000h~01FFFFh 08000h~0FFFFh SA2 00010XXX 64/32 020000h~02FFFFh 10000h~17FFFh SA3 00011XXX 64/32 030000h~03FFFFh 18000h~1FFFFh SA4 00100XXX 64/32 040000h~04FFFFh 20000h~27FFFh SA5 00101XXX 64/32 050000h~05FFFFh 28000h~2FFFFh SA6 00110XXX 64/32 060000h~06FFFFh 30000h~37FFFh SA7 00111XXX 64/32 070000h~07FFFFh 38000h~3FFFFh SA8 01000XXX 64/32 080000h~08FFFFh 40000h~47FFFh
SA9 01001XXX 64/32 090000h~09FFFFh 48000h~4FFFFh SA10 01010XXX 64/32 0A0000h~0AFFFFh 50000h~57FFFh SA11 01011XXX 64/32 0B0000h~0BFFFFh 58000h~5FFFFh SA12 01100XXX 64/32 0C0000h~0CFFFFh 60000h~67FFFh SA13 01101XXX 64/32 0D0000h~0DFFFFh 68000h~6FFFFh SA14 01110XXX 64/32 0E0000h~0EFFFFh 70000h~77FFFh SA15 01111XXX 64/32 0F0000h~0FFFFFh 78000h~7FFFFh SA16 10000XXX 64/32 100000h~10FFFFh 80000h~87FFFh SA17 10001XXX 64/32 110000h~11FFFFh 88000h~8FFFFh SA18 10010XXX 64/32 120000h~12FFFFh 90000h~97FFFh SA19 10011XXX 64/32 130000h~13FFFFh 98000h~9FFFFh SA20 10100XXX 64/32 140000h~14FFFFh A0000h~A7FFFh SA21 10101XXX 64/32 150000h~15FFFFh A8000h~AFFFFh SA22 10110XXX 64/32 160000h~16FFFFh B0000h~B7FFFh SA23 10111XXX 64/32 170000h~17FFFFh B8000h~BFFFFh SA24 11000XXX 64/32 180000h~18FFFFh C0000h~C7FFFh SA25 11001XXX 64/32 190000h~19FFFFh C8000h~CFFFFh SA26 11010XXX 64/32 1A0000h~1AFFFFh D0000h~D7FFFh SA27 11011XXX 64/32 1B0000h~1BFFFFh D8000h~DFFFFh SA28 11100XXX 64/32 1C0000h~1CFFFFh E0000h~E7FFFh SA29 11101XXX 64/32 1D0000h~1DFFFFh E8000h~EFFFFh SA30 11110XXX 64/32 1E0000h~1EFFFFh F0000h~F7FFFh SA31 111110XX 32/16 1F0000h~1F7FFFh F8000h~FBFFFh SA32 11111100 8/4 1F8000h~1F9FFFh FC000h~FCFFFh SA33 11111101 8/4 1FA000h~1FBFFFh FD000h~FDFFFh SA34 1111111X 16/8 1FC000h~1FFFFFh FE000h~FFFFFh
Sector address
A19~A12
Sector Size
(Kbytes/Kwords)
(X8)
Address Range
(X16)
Address Range
Remark
Main Sector
Boot Sector
Note:
The addresses range is A19:A-1 in byte mode (BYTE#=VIL) or A19:A0 in word mode (BYTE#=VIH).
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Table 4. Bottom Boot Sector Addresses (ES29LV160DB)
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Sector
SA0 0000000X 16/8 000000h~003FFFh 00000h~01FFFh SA1 00000010 8/4 004000h~005FFFh 02000h~02FFFh SA2 00000011 8/4 006000h~007FFFh 03000h~03FFFh SA3 000001XX 32/16 008000h~00FFFFh 04000h~07FFFh SA4 00001XXX 64/32 010000h~01FFFFh 08000h~0FFFFh SA5 00010XXX 64/32 020000h~02FFFFh 10000h~17FFFh SA6 00011XXX 64/32 030000h~03FFFFh 18000h~1FFFFh SA7 00100XXX 64/32 040000h~04FFFFh 20000h~27FFFh SA8 00101XXX 64/32 050000h~05FFFFh 28000h~2FFFFh SA9 00110XXX 64/32 060000h~06FFFFh 30000h~37FFFh
SA10 00111XXX 64/32 070000h~07FFFFh 38000h~3FFFFh
SA11 01000XXX 64/32 080000h~08FFFFh 40000h~47FFFh SA12 01001XXX 64/32 090000h~09FFFFh 48000h~4FFFFh SA13 01010XXX 64/32 0A0000h~0AFFFFh 50000h~57FFFh SA14 01011XXX 64/32 0B0000h~0BFFFFh 58000h~5FFFFh SA15 01100XXX 64/32 0C0000h~0CFFFFh 60000h~67FFFh SA16 01101XXX 64/32 0D0000h~0DFFFFh 68000h~6FFFFh SA17 01110XXX 64/32 0E0000h~0EFFFFh 70000h~77FFFh SA18 01111XXX 64/32 0F0000h~0FFFFFh 78000h~7FFFFh SA19 10000XXX 64/32 100000h~10FFFFh 80000h~87FFFh SA20 10001XXX 64/32 110000h~11FFFFh 88000h~8FFFFh SA21 10010XXX 64/32 120000h~12FFFFh 90000h~97FFFh SA22 10011XXX 64/32 130000h~13FFFFh 98000h~9FFFFh SA23 10100XXX 64/32 140000h~14FFFFh A0000h~A7FFFh SA24 10101XXX 64/32 150000h~15FFFFh A8000h~AFFFFh SA25 10110XXX 64/32 160000h~16FFFFh B0000h~B7FFFh SA26 10111XXX 64/32 170000h~17FFFFh B8000h~BFFFFh SA27 11000XXX 64/32 180000h~18FFFFh C0000h~C7FFFh SA28 11001XXX 64/32 190000h~19FFFFh C8000h~CFFFFh SA29 11010XXX 64/32 1A0000h~1AFFFFh D0000h~D7FFFh SA30 11011XXX 64/32 1B0000h~1BFFFFh D8000h~DFFFFh SA31 11100XXX 64/32 1C0000h~1CFFFFh E0000h~E7FFFh SA32 11101XXX 64/32 1D0000h~1DFFFFh E8000h~EFFFFh SA33 11110XXX 64/32 1E0000h~1EFFFFh F0000h~F7FFFh SA34 11111XXX 64/32 1F0000h~1FFFFFh F8000h~FFFFFh
Sector address
A19~A12
Sector Size
(Kbytes/Kwords)
(X8)
Address Range
(X16)
Address Range
Remark
Boot Sector
Main Sector
Note:
The addresses range is A19:A-1 in byte mode (BYTE#=VIL) or A19:A0 in word mode (BYTE#=VIH).
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Temporary Sector
Unprotect Mode
Increment
COUNT
No
COUNT=25?
Yes Yes
Device failed
No
Set up sector address
Sector Protect: Write 60h to sec­tor address with A6 = 0, A1 = 1, A0 = 0
Write 40h to sec-
tor address with
A6 = 0, A1 = 1,
Read from sec-
tor address with
A6 = 0, A1 = 1,
No
Sector Protect
In-System Protection / Unprotection Method
START
COUNT = 1
RESET# = V
Wait 1us
First Write Cycle = 60h?
Yes
Wait 150us
Verify Se ctor
Protect:
A0 = 0
A0 = 0
Data = 01h?
Protect another
sector?
No
Remove VID
from RESET#
Write reset
command
complete
Protect all sectors: The indicated por­tion of the sector
ID
Reset
COUNT = 1
Yes
protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address
Increment
COUNT
No
COUNT =1000?
Yes Yes
Device failed
No
No
START
COUNT = 1
RESET# = V
Wait 1us
First Write Cycle = 60h?
All sectors
protected ?
Set up first sector address
Sector Unpro­tect: Write 60h to sec­tor address with A6 = 1, A1 = 1,
Wait 15ms
Verify Se ctor Unprotect: Write 40h to sec­tor address with A6 = 1, A1 = 1, A0 = 0
Read from sec­tor address with A6 = 1, A1 = 1, A0 = 0
Data = 00h?
Last sector
verified?
Remove VID from RESET#
Write reset
command
Yes
Yes
Yes
ID
No
Temporary Sector
Unprotect Mode
Set up next sector address
No
Figure 2. In-System Sector Protect Algorithm
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Sector Unprotect complete
Figure 3. In-System Sector Unprotect Algorithm
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A9 High-Voltage Method
Start
Start
COUNT = 1
SET A9=OE#=V
ID
Note: All sectors must be previously protected.
COUNT = 1
SET A9=OE#=V
ID
Increase COUNT
No
COUNT= 25?
Yes
Device failed
CE#,OE#,A6,A0=V RESET#, A1 = V
No
Set Sector Address A<19 :12> CE#, A6, A0=V
RESET#, A1=V
SET WE# = V
Wait 150 us
SET WE# = V
Read Data
Data = 01h?
Protect Another Sector ?
Remove VID from A9 and Write
Reset Command
IL
IH
IL
IH
IH
Yes
No
CE#, A0=V RESET#,
A6, A1=V
SET WE# = V
Wait 15ms
SET WE# = V
Increase COUNT
IL
No
COUNT=1000?
Yes
Yes
Device failed
CE#,OE#, A0=V RESET#, A6, A1=V
Set Sector AddressA<19 :12>
Read Data
No
Data = 00h?
Yes
The Last Sector Address ?
Remove VID from A9 and Write Reset Command
IH
Yes
,
IL
IL
IH
IL
IH
Increase Sector Address
No
Sector Protection Complete
Figure 4. Sector Protection Algorithm (A9 High-Voltage Method)
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Sector Unprotection Complete
Figure 5. Sector Un-Protection Algorithm (A9 High-Voltage Method)
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Common Flash Memory Interface (CFI)
CFI is supported in the ES29LV160 device. The Common Flash Interface (CFI) specification out­lines device and host system software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of devices. Software support can then be device-inde­pendent, JEDEC ID-independent, and forward- and backward-compatible for the specified flash device families. Flash vendors can standardize their exist­ing interfaces for long-term compatibility.
Table 5. CFI Query Identification String
Addresses
(Word Mode)
10h 11h 12h
13h 14h
15h 16h
17h 18h
19h 1Ah
Addresses
(Byte Mode)
20h 22h 24h
26h 28h
2Ah 2Ch
2Eh
30h 32h
34h
Data Description
0051h 0052h 0059h
0002h 0000h
0040h 0000h
0000h 0000h
0000h 0000h
This device enters the CFI Query mode when the system writes the CFI query command, 98h, to address 55h in word mode (or address AAh in byte mode), any time the device is ready to read array data. The system can read CFI information at the addresses given in Tables 5-8. To termin ate reading CFI data, the system must write the reset com- mand.The CFI query command can be written to the system when the device is in the autoselect mode or the erase-suspend-read mode. The device enters the CFI query mode, and the system can read CFI data at the addresses given in Tables 5-8. When the reset command is written, the device returns respectively to the read mode or erase-sus­pend-read mode.
Query Unique ASCII string “QRY”
Primary OEM Command Set
Address for Primary Extended Table
Alternate OEM Command Set(00h = none exists)
Address for Alternate OEM Extended Table (00h = none exists)
Table 6. System Interface String
Addresses
(Word Mode)
1Bh 36h 0027h
1Ch 38h 0036h
1Dh 3Ah 0000h Vpp Min. voltage (00h = no Vpp pin present) 1Eh 3Ch 0000h Vpp Max. voltage (00h = no Vpp pin present)
1Fh 3Eh 0004h 20h 40h 0000h 21h 42h 000Ah 22h 44h 0000h 23h 46h 0005h 24h 48h 0000h 25h 4Ah 0004h 26h 4Ch 0000h
Addresses
(Byte Mode)
Data Description
Vcc Min. (write/erase) D7-D4: volt, D3-D0: 100 millivolt
Vcc Max. (write/erase) D7-D4: volt, D3-D0: 100 millivolt
Typical timeout per single byte/word write 2 Typical timeout for Min. size buffer write 2 Typical timeout per individual block erase 2 Typical timeout for full chip erase 2 Max. timeout for byte/word write 2 Max. timeout for buffer write 2 Max. timeout per individual block erase 2 Max. timeout for full chip erase 2
N
N
times typical
N
times typical (00h = not supported)
N
N
us (00h = not supported)
N
N
ms (00h = not supported)
times typical
N
times typical
us
ms
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Table 7. Device Geometry Definition
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Addresses
(Word Mode)
27h 4Eh 0015h 28h
29h
2Ah 2Bh
2Ch 58h 0004h Number of Erase Block Regions within device 2Dh
2Eh
2Fh 30h
31h 32h
33h 34h
35h 36h
37h 38h
39h
3Ah
Addresses
(Byte Mode)
50h 52h
54h 56h
5Ah 5Ch
5Eh 60h
62h 64h
66h 68h
6Ah 6Ch
6Eh 70h
72h 74h
Data Description
N
byte
0002h 0000h
0000h 0000h
0000h 0000h
0040h 0000h
0001h 0000h
0020h 0000h
0000h 0000h
0080h 0000h
001Eh 0000h
Device Size = 2 Flash Device Interface description
02 = x8, x16 Asynchronous Max. number of bytes multi-byte write = 2
(00h = not supported)
Erase Block Region 1 Information Number of identical size erase block = 0000h+1 = 1
Erase Block Region 1 Information Block size in Region 1 = 0040h * 256 byte = 16 Kbyte
Erase Block Region 2 Information Number of identical size erase block = 0001h+1 =2
Erase Block Region 2 Information Block size in Region 2 = 0020h * 256 byte = 8 Kbyte
Erase Block Region 3 Information Number of identical size erase block = 0000h+1 =1
Erase Block Region 3 Information Block size in Region 3 = 0080h * 256 byte = 32 Kbyte
Erase Block Region 4 Information Number of identical size erase block = 001Eh+1 =31
N
3Bh 3Ch
76h 78h
0000h 0001h
Erase Block Region 4 Information Block size in Region 4 = 0100h * 256 byte = 64 Kbyte
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Table 8. Primary Vendor-Specific Extended Query
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Addresses
(Word Mode)
40h 41h 42h
43h 86h 0031h Major version number, ASCII 44h 88h 0030h Minor version number, ASCII
45h 8Ah 0000h
46h 8Ch 0002h
47h 8Eh 0001h
48h 90h 0001h
49h 92h 0004h
4Ah 94h 0000h
4Bh 96h 0000h
4Ch 98h 0000h
Addresses
(Byte Mode)
80h 82h 84h
Data Description
0050h 0052h 0049h
Query-unique ASCII string “PRI”
Address Sensitive Unlock (Bits 1-0) 0 = Required, 1 = Not required Silicon Revision Number (Bits 7-2)
Erase Suspend 0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
Sector Protect 0 = Not Supported, X = Number of sectors in per group
Sector Temporary Unprotect 00 = Not Supported, 01 = Supported
Sector Protect/Unprotect scheme 04 = In-System Method and A9 High-Voltage Method
Simultaneous Operation 00 = Not Supported
Burst Mode Type 00 = Not Supported, 01 = Supported
Page Mode Type 00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
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