- Hardware method of locking a sector to prevent
any program or erase operation within that sector
- Two methods are provided :
- In-system method by RESET# pin
- A9 high-voltage method for PROM programmers
• Temporary Sector Unprotection ( RESET# )
- Allows temporary unprotection of previously
protected sectors to change data in-system
ES29LV160D
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Rev. 1C Jan 5 , 2006
GENERAL PRODUCT DESCRIPTION
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Excel Semiconductor inc.
The ES29LV160 is a 16 megabit, 3.0 volt-only flash
memory device, organized as 2M x 8 bits (Byte
mode) or 1M x 16 bits (Word mode) which is configurable by BYTE#. Four boot sectors and thirty one
main sectors are provided : 16Kbytes x 1, 8Kbytes
x 2, 32Kbytes x 1 and 64Kbytes x 31. The device is
manufactured with ESI’s proprietary, high performance and highly reliable 0.18um CMOS flash
technology. The device can be programmed or
erased in-system with standard 3.0 Volt Vcc supply
( 2.7V-3.6V) and can also be programmed in standard EPROM programmers. The device of fers minimum endurance of 100,000 program/erase cycles
and more than 10 years of data retention.
The ES29LV160 offers access time as fast as 70ns
or 90ns, allowing operation of high-speed microprocessors without wait states. Three separate control
pins are provided to eliminate bus contention : chip
enable (CE#), write enable (WE#) and output
enable (OE#).
All program and erase operation are automatically
and internally performed and controlled by embedded program/erase algorithms built in the device.
The device automatically generates and times the
necessary high-voltage pulses to be applied to the
cells, performs the verification, and counts the number of sequences. Some status bits (DQ7, DQ6 and
DQ5) read by data# polling or toggling between
consecutive read cycles provide to the users the
internal status of program/erase operation: whether
it is successfully done or still being progressed.
The ES29LV160 is completely compatible with the
JEDEC standard command set of single power supply Flash. Commands are written to the internal
command register using standard write timings of
microprocessor and data can be re ad out from the
cell array in the device with the same way as used i n
other EPROM or flash devices.
Several device operational modes are provided in
the ES29LV160 device. Commands are used to initiate the device operations. They are latched and
stored into internal registers with the address and
data information needed to execute the device
operation.
The available device operational modes are listed
in Table 1 with the required inputs, controls, and the
resulting outputs. Each operational mode is
described in further detail in the following subsections.
Read
The internal state of the device is set for the read
mode and the device is ready for reading arra y da t a
upon device power-up, or after a hardware reset. To
read the stored data from the cell array of the
device, CE# and OE# pins should be driven to V
while WE# pin remains at VIH. CE# is the power
control and selects the device. OE# is the output
control and gates array data to the output pins.
Word or byte mode of output data is determined by
the BYTE# pin. No additional command is needed
in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses
on the device address inputs produce valid data on
the device data outputs. The device st ays at the read
mode until another operation is activated by writing
commands into the internal command register. Refer
to the AC read cycle timing diagrams for further
details ( Fig. 16 ).
Word/Byte Mode Configuration ( BYTE# )
The device data output can be configured by BYTE#
into one of two modes : word and byte modes. If the
BYTE# pin is set at logic ‘1’, the device is configured
in word mode, DQ0 - DQ15 are active and controlled
by CE# and OE#. If the BYTE# pin is set at logic ‘0’,
the device is configured in byte mode, and only data
I/O pins DQ0 - DQ7 are active and controlled by CE#
and OE#. The data I/O pins DQ8 - DQ14 are tristated, and the DQ15 pin is used as an input for the
LSB (A-1) address.
IL
Standby Mode
When the device is not selected or activated in a
system, it needs to stay at the standby mode, in
which current consumption is greatly reduced with
outputs in the high impedance state.
ES29LV160D
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Rev. 1C Jan 5 , 2006
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The device enters the CMOS standby mode when
CE# and RESET# pins are both held at Vcc
(Note that this is a more restricted voltage range
than V
not within Vcc
standby mode, but the standby current will be
greater than the CMOS standby current (0.2uA typically). When the device is in the standby mode, only
standard access time (t
access, before it is ready for read data. And even if
the device is deselected by CE# pin during erase or
programming operation, the device draws active cur rent until the operation is completely done. While the
device stays in the standby mode, the output is
placed in the high impedance state, independent of
the OE# input.
The device can enter the deep power-down mode
where current consumption is greatly reduced down
to less than 0.2uA typically by the following three
ways:
- CMOS standby ( CE#, RESET# = Vcc + 0.3V )
Refer to the CMOS DC characteristics Table11 for
further current specification .
) If CE# and RESET# are held at VIH, but
IH.
+
0.3V, the device will be still in the
) is required for read
CE
- During the device reset ( RESET# = Vss
- In Autosleep Mode ( after t
ACC
+ 30ns )
+
0.3V.
+ 0.3V )
Autosleep Mode
The device automatically enters a deep power-down
mode called the autosleep mode when addresses
remain stable for t
consumption is greatly reduced ( less than 0.2uA
typical ), regardless of CE#, WE# and OE# control
signals.
+30ns. In this mode, current
ACC
Writing Commands
To write a command or command sequences to initiate some operations such as program or erase, the
system must drive WE# and CE# to V
. For program operations, the BYTE# pin deter-
V
IH
mines whether the device accepts pro gram data in
bytes or words. Refer to “BYTE# timings for Write
Operations” in the Fig. 19 for more information.
, and OE# to
IL
Unlock Bypass Mode
To reduce more the programming time, an unlockbypass mode is provided. Once the device enters
this mode, only two write cycles are required to initiate the programming operation instead of four
cycles in the normal program command sequences
which are composed of two unlock cycles, program
set-up cycle and the last cycle with the program data
and addresses. In this mode, two unlock cycles are
saved ( or bypassed ).
Sector Addresses
The entire memory space of cell array is divided into
a many of small sectors: 16Kbytes x 1, 8Kbytes x 2,
32Kbytes x 1 and 64Kbytes x 31 main sectors. In
erase operation, a single sector, multiple sectors, or
the entire device (chip erase) can be selected for
erase. The address space that each sector occupies
is shown in detail in the Table 3-4.
Autoselect Mode
Flash memories are intended for use in applications
where the local CPU alters memory contents. In
such applications, manufacturer and device identification (ID) codes must be accessible while the
device resides in the target system ( the so called
“in-system program”). On the other hand, signature
codes have been typically accessed by raising A9
pin to a high voltage in PROM programmers. However, multiplexing high voltage onto address lines is
not the generally desired system design practice.
Therefore, in the ES29LV160 device an autoselectcommand is provided to allow the system to access
the signature codes without any high voltage. The
conventional A9 high-voltage method used in the
PROM programers for signature codes are still supported in this device.
If the system writes the autoselect command
sequence, the device enters the Autoselect mode.
The system can then read some useful codes such
as manufacturer and device ID from the int er na l re gisters on DQ7 - DQ0. Standard read cycle timings
apply in this mode. In the Autoselect mode, the following three informations can be acc essed through
either autoselect command method or A9 high-voltage autoselect method. Refer to the Table 2.
-
-
-
Manufacturer ID
Device ID
Sector protection verify
Hardware Device Reset ( RESET# )
The RESET# pin provides a hardware method of
resetting the device to read array data. When the
RESET# pin is driven low for at least a period of t
RP
,
ES29LV160D
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Rev. 1C Jan 5 , 2006
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Excel Semiconductor inc.
the device immediately terminates any operation in
progress, tristates all output pins, and ignores all
read/write commands for the duration of the
RESET# pulse The device also resets the internal
state machine to reading array data. The operation
that was interrupted should be reinitiated once after
the device is ready to accept another command
sequence, to ensure data integrity.
CMOS Standby during Device Reset
Current is reduced for the duration of the RESET#
pulse. When RESET# is held at Vss
device draws the greatly reduced CMOS standby
current ( I
within Vss
). If RESET# is held at VIL but not
CC4
+
0.3V, the standby current will be greater.
+
0.3V, the
RY/BY# and Terminating Operations
If RESET# is asserted during a program or erase
operation, the RY/BY# pin remains a “0” (busy) until
the internal reset operation is completed, which
requires a time of t
rithms). The system can thus monitor RY/BY# to
determine whether the reset operation is completed.
If RESET# is asserted when a program or erase
operation is not executing (RY/BY# pin is “1”), the
reset operation is completed within a time of t
(not during Embedded Algorithms). The system can
read data after the RESET# pin returns to V
requires a time of t
READY
RH.
(during Embedded Algo-
READY
, which
IH
Sector protection can be implemented via two
methods.
-
-
To check whether the sector protection was successfully executed or not, another operation called
“protect verification” needs to be performed after
the protection operation on a sector. All protection
and protect verifications provided in the device are
summarized in detail at the Table 1.
In-system protection
A9 High-voltage protection
In-System Protection
“In-system protection”, the primary method,
requires V
A6=0, A1=1, and A0=0. This method can be implemented either in-system or via programming equipment. This method uses standard microprocessor
bus cycle timing. Refer to Fig. 26 for timing diagram
and Fig. 2 for the protection algorithm.
(11.5V~12.5V) on the RESET# with
ID
A9 High-Voltage Protection
“High-voltage protection”, the alternate method
intended only for programming equipment, must
force V
trol pin OE# with A6=0, A1=1 and A0=0. Refer to
Fig. 28 for timing diagram and Fig. 4 for the protection algorithm.
(11.5~12.5V) on address pin A9 and con-
ID
RESET# tied to the System Reset
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the
Flash memory , enab ling the system to read the bootup firmware from the Flash memory.Refer to the AC
Characteristics tables for RESET# parameters and
to Fig. 17 for the timing diagram.
SECTOR PROTECTION
The ES29LV160 features hardware sector protection. In the device, sector protection is performed on
the sector previously defined in the Table 3-4. Once
after a sector is protected, any program or erase
operation is not allowed in the protected sector. The
previously protected sectors must be unprotected by
one of the unprotect methods provided here before
changing data in those sectors.
SECTOR UNPROTECTION
The previously protected sectors must be unprotected before modifying any data in the sectors.
The sector unprotection algorithm unprotects all
sectors in parallel. All unprotected sectors must first
be protected prior to the first sector unprotection
write cycle to avoid any over-erase due to the intrinsic erase characteristics of the protection cell. After
the unprotection operation, all previously protected
sectors will need to be individually re-protected.
Standard microprocessor bus cycle timings are
used in the unprotection and unprotect verification
operations. Three unprotect methods are provided
in the ES29LV160 device. All unprotection and
unprotect verification cycles are summarized in
detail at the Table 1.
-
-
-
In-system unprotection
A9 High-voltage unprotection
T emporary sector unprotection
ES29LV160D
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Rev. 1C Jan 5 , 2006
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Excel Semiconductor inc.
In-System Unprotection
“In-system unprotection”, the primary method,
requires V
(11.5V~12.5V) on the RESET# with
ID
A6=1, A1=1, and A0=0. This method can be implemented either in-system or via programming equipment. This method uses standard microprocessor
bus cycle timing. Refer to Fig. 26 for timing diagram
and Fig. 3 for the unprotection algorithm.
A9 High-Voltage Unprotection
“High-voltage unprotection”, the alternate method
intended only for programming equipment, must
force V
(11.5~12.5V) on address pin A9 and con-
ID
trol pin OE# with A6=1, A1=1 and A0=0. Refer to
Fig. 29 for timing diagram and Fig. 5 for the unprotection algorithm.
Temporary Sector Unprotect
This feature allows temporary unprotection of previously protected sectors to change data in-system.
The Sector Unprotect mode is activated by setting
the RESET# pin to V
(11.5V-12.5V). During this
ID
mode, formerly protected sectors can be programmed or erased by selecting the sector
addresses. Once V
is removed from the RESET#
ID
pin, all the previously protected sectors are protected again. Fig. 1 shows the algorithm, and Fig. 25
shows the timing diagrams for this feature.
HARDWARE DATA PROTECTION
The command register and all internal program/
erase circuits are disabled, and the devi ce resets to
the read mode. Subsequent writes are ignored until
Vcc is greater than V
. The system must provide
LKO
proper signals to the control pins to prevent unintentional writes when Vcc is greater than V
LKO
.
Write Pulse “Glitch” Protection
Noise pulses of less than 5ns (typical) on OE#, CE#
or WE# do not initiate a write cycle.
Logical inhibit
Write cycles are inhibited by holding any one of
OE#=V
, CE#=VIH or WE#=VIH. To initiate a write
IL
cycle, CE# and WE# must be a logical zero while
OE# is a logical one.
Power-up Write Inhibit
If WE#=CE#=VIL and OE#=VIH during power up,
the device does not accept any commands on the
rising edge of WE#. The internal state machine is
automatically reset to the read mode on power-up.
START
RESET# = V
(Note 1)
ID
The ES29LV160 device provides some protection
measures against accidental erasure or programming caused by spurious system level signals that
may exist during power transition. During power-up,
all internal registers and latches in the device are
cleared and the device automatically resets to the
read mode. In addition, with its internal state
machine built-in the device, any alteration of the
memory contents or any initiation of new operationcan only occur after successful completion of specific command sequences. And several features are
incorporated to prevent inadvertent write cycles
resulting from Vcc power-up and power -dow n tr an sition or system noise.
Low Vcc Write inhibit
When Vcc is less than V
accept any write cycles. This protects data during
Vcc power-up and power-down.
ES29LV160D
, the device does not
LKO
9
Perform Erase or
Program Operations
RESET# = V
Temporary Sector
Unprotect Completed
(Note 2)
Notes:
1. All protected sectors are unprotected .
2. All previously protected sectors are protected once again.
IH
Figure 1. Temporary Sector Unprotect
Operation
Rev. 1C Jan 5 , 2006
Table 1. ES29LV160 Device Bus Operations
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Excel Semiconductor inc.
OperationCE# OE# WE# RESET#Addresses
Read
Write
Standby
Output Disable
Reset
In-system
A9 High-Voltage Method
L
L
Vcc+
0.3V
LHHHXHigh-ZHigh-Z
XXXLXHigh-ZHigh-Z
Sector Protect
(Note 2)
Sector Unprotect
(Note 2)LHLV
Temporary Sector
UnprotectXXX
Sector protect
Sector unprotect
LHL
L
L
H
L
L
H
XX Vcc+
V
L
ID
V
L
ID
H
H
0.3V
V
V
H
H
DQ0
~
(Note 1)
A
IN
A
IN
XHigh-ZHigh-Z
ID
ID
ID
SA,A6=L,
A1=H,A0=L
SA,A6=H,
A1=H,A0=L
A
IN
SA,A9=V
A6=L,
A1=H,A0=L
SA,A9=V
A6=H,
A1=H,A0=L
DQ7
D
OUT
(Note 3)(Note 3)
(Note 3)XX
(Note 3)XX
(Note 3)(Note 3)High-Z
,
ID
(Note 3)(Note 3)High-Z
,
ID
BYTE#
= V
D
OUT
DQ8~DQ15
IH
BYTE#
= V
IL
DQ8~DQ14 = High-Z,
DQ15 = A-1
High-Z
Legend:
D
L=Logic Low=VIL, H=Logic High=VIH, VID=11. 5-12.5V, X=Don’t Care, SA=Sector Address, AIN=Address In, DIN=Data In,
=Data Out
OUT
Notes:
1. Addresses are A19:A0 in word mode (BYTE#=VIH) , A19:A-1 in byte mode (BYTE#=VIL).
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector Pro tection and Unprotection” section.
3. D
IN
or D
as required by command sequence, data polling, or sector protection algorithm.
CFI is supported in the ES29LV160 device. The
Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows specific vendor-specified
software algorithms to be used for entire families of
devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and
backward-compatible for the specified flash device
families. Flash vendors can standardize their existing interfaces for long-term compatibility.
Table 5. CFI Query Identification String
Addresses
(Word Mode)
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
Addresses
(Byte Mode)
20h
22h
24h
26h
28h
2Ah
2Ch
2Eh
30h
32h
34h
DataDescription
0051h
0052h
0059h
0002h
0000h
0040h
0000h
0000h
0000h
0000h
0000h
This device enters the CFI Query mode when the
system writes the CFI query command, 98h, to
address 55h in word mode (or address AAh in byte
mode), any time the device is ready to read array
data. The system can read CFI information at the
addresses given in Tables 5-8. To termin ate reading
CFI data, the system must write the reset com-mand.The CFI query command can be written to the
system when the device is in the autoselect mode
or the erase-suspend-read mode. The device
enters the CFI query mode, and the system can read
CFI data at the addresses given in Tables 5-8.
When the reset command is written, the device
returns respectively to the read mode or erase-suspend-read mode.
Query Unique ASCII string “QRY”
Primary OEM Command Set
Address for Primary Extended Table
Alternate OEM Command Set(00h = none exists)
Address for Alternate OEM Extended Table (00h = none exists)
Table 6. System Interface String
Addresses
(Word Mode)
1Bh36h0027h
1Ch38h0036h
1Dh3Ah0000hVpp Min. voltage (00h = no Vpp pin present)
1Eh3Ch0000hVpp Max. voltage (00h = no Vpp pin present)
Vcc Min. (write/erase)
D7-D4: volt, D3-D0: 100 millivolt
Vcc Max. (write/erase)
D7-D4: volt, D3-D0: 100 millivolt
Typical timeout per single byte/word write 2
Typical timeout for Min. size buffer write 2
Typical timeout per individual block erase 2
Typical timeout for full chip erase 2
Max. timeout for byte/word write 2
Max. timeout for buffer write 2
Max. timeout per individual block erase 2
Max. timeout for full chip erase 2
N
N
times typical
N
times typical (00h = not supported)
N
N
us (00h = not supported)
N
N
ms (00h = not supported)
times typical
N
times typical
us
ms
ES29LV160D
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Rev. 1C Jan 5 , 2006
Table 7. Device Geometry Definition
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Addresses
(Word Mode)
27h4Eh0015h
28h
29h
2Ah
2Bh
2Ch58h0004hNumber of Erase Block Regions within device
2Dh