ERICSSON PKF 5000 User Manual

查询PKF5510PI供应商

• SMD and through-hole versions with
ultra low component height 8 mm
(0.315 in.)

• 18–72 V input voltage range

• 82% efficiency (typ at 5 V)

• 1,500 Vdc isolation voltage

• Switching frequency syncronization

• MTBF >4.9 million hours at +55°C
case temperature (+40°C ambient)

• Low EMI measured according to
CISPR 22 and FCC part 15J

PKF 5000 I

5–6 W DC/DC Power Modules

Wide Input Series

Patents

US: D357901 DE: M94022763

The MacroDens™ PKF 5000 I series true component
level on-board DC/DC power modules are intended
as distributed power sources in decentralized 24, 48
and 60V DC power systems. Utilization of thick film
technology and a high degree of silicon integration
has made it possible to achieve a MTBF of more than

4.9 million hour.
The highly reliable and rugged over-moulded design
and the ultra low height of these DC/DC power
modules makes them particularly suited for Informa­tion Technology and Telecom (IT&T) and other
demanding industrial applications, with board
spacing down to 15 mm or 0.6 in. These DC/DC
power modules are optimized for free convection
cooling and have an operational ambient temperature

range in compliance with present and future
application needs, including non temperature con­trolled environments.
The mechanical design offers the choice of surface
mount or through-hole versions, delivered in ready­to-use tubes, trays or tape & reel package, and
compatibility with semi and fully aqueous cleaning
processes.
The PKF series is manufactured using highly
automated manufacturing lines with a world-class
quality commitment and a five-year warranty.
Ericsson Microelectronics AB has been an ISO 9001
certified supplier since 1991. For a complete product

program please reference the back cover.

E

General

Absolute Maximum Ratings

Characteristics Unit

T

T

V

V

W

V

V

Input

V

V

V

C

P

P

Case temperature at full output power –45

C

Storage temperature –55 +125 °C

S

Continuous input voltage

I

Isolation voltage

ISO

(input to output test voltage)

Transient input energy

tr

Remote control voltage pin 10,11

RC

Output adjust voltage pin 8, 9

adj

< T

T

C

unless otherwise specified

Cmax

Characteristics max Unit

Input voltage range

I

Turn-off input voltage

Ioff

Turn-on input voltage

Ion

Input capacitance

I

Input idling power

Ii

Input stand-by power

RC

1)

Conditions

1)

(See typical characteristics)

(See typical characteristics)

=0,TC= – 30…+90°C

I

O

= – 30…+90°C

T

C

RC connected to pin 17

min

max

+100 °C

–0.5 +75 Vdc

1,500

0.01

–5

–5

min

18

15

typ

17.4 V

+16 Vdc

+40 Vdc

72 V

16 V

17.9

1.4 mF

(V

= 27V)

I

(V

= 53V)

I

(V

= 27V)

I

(V

= 53V)

I

244
240

18
67

Vdc

Ws

mW

mW

Stress in excess of Absolute Maximum Rat­ings may cause permanent damage. Absolute
Maximum Ratings, sometimes referred to as
no destruction limits, are normally tested
with one parameter at a time exceeding the
limits of Output data or Electrical Charac­teristics. If exposed to stress above these
limits, function and performance may de­grade in an unspecified manner.

NOTES:

1)

The input voltage range 18…72 Vdc meets
the European Telecom Standard
ETS 300 132-2 Nominal input voltage range
in 48 V and 60 V dc power systems, – 40.5…
–57.0 V and –50.0… – 72.0 V respectively. At
input voltages exceeding 72 V (abnormal
voltage) the power loss will be higher than at
normal input voltage and T
max +90°C. Absolute max continuous input
voltage is 75 Vdc. Output characteristics will
be marginally affected at input voltages
exceeding 72 V.

2)

The test is applicable for through-hole
versions.

must be limited to

C

Environmental Characteristics

Characteristics

Vibration
(Sinusoidal)

Random
vibration

Shock
(Half sinus)

Temperature
change

Accelerated
damp heat

Solder
resistability

Aggressive
environment

2)

JESD 22-B103

(IEC 68-2-6 Fc)

MIL-STD-883
Method 2026

(IEC 68-2-34 Ed)

JESD 22-B104

(IEC 68-2-27 Ea)

JESD 22-A104

(IEC 68-2-14 Na)

JESD 22-A101

(IEC 68-2-3 C
with bias)

a

JESD 22-B106

(IEC 68-2-20 Tb 1A)

IEC 68-2-11 K

a

2 EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) ©Ericsson Microelectronics, June 2000

Test procedure & conditions

Frequency 10…500 Hz
Amplitude 0.75 mm
Acceleration 10 g
Number of cycles 10 in each axis

Frequency 10…500 Hz
Acceleration density
spectrum 0.5 g

2

/Hz
Duration 10 min in 3 directions
Reproducability medium (IEC 62-2-36)

Peak acceleration 200 g

Shock duration 3 ms

Temperature –40°C…+125°C
Number of cycles 500

Temperature 85°C
Humidity 85% RH
Duration 1000 hours

Temperature, solder 260°C
Duration 10…13 s

Duration 96 h
Temperature 35°C
Concentration 5 %

Mechanical Data

Through-hole version

Surface-mount version

Foot print Component side

40.0 [1.575]

Dimensions in mm (in)

Foot print Component side

Connections

Pin Designation Function

1 Out 1 Output 1. Positive voltage ref. to Rtn.
2 Rtn Output return.
3–6 NC Not connected.
7 Sync Synchronization input.
8V

9 NOR Connection of Nominal Output voltage Resistor. (See output

10 Aux Internally connected to pin 11.
11 RC Remote control and turn-on/off input voltage adjust. Used to turn-on

12–16 NC Not connected.
17 –In Negative input.
18 +In Positive input.

adj

Output voltage adjust. To set typical output voltage (VOi)
connect pin 8 to pin 9.

voltage adjust p. 12).

and turn-off output.

16

18

17

12 345 6789

5.0 [0.197]

131415

40.0 [1.575]

12

Weight

Maximum 20 g (0.71 oz).

Case

The case consists of semiconductor grade
epoxy with embedded pins.

Coefficient of thermal expansion (CTE) is
typ. 15 ppm/°C.

Connection Pins

Base material is copper (Cu), first plating is
nickel (Ni) and second (outer) plating is
palladium (Pd).

1011

2.8 [0.110]

29.6 [1.165]

24.0 [0.945]

3.6 [0.142]

Dimensions in mm (in)

EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) ©Ericsson Microelectronics, June 2000

3

Thermal Data

Over-temperature protection

The PKF 5000 series will automatically shut down when the internal
junction temperature of the control IC in the converter reaches typ.
150 °C.
It will automatically re-start when the junction temperature cools
below typ. 140°C.

Two-parameter model

This model provides a more precise description of the thermal charac­teristics to be used for thermal calculations.

Thermally the power module can be considered as a component and
the case temperature can be used to characterize the properties. The
thermal data for a power module with the substrate in contact with
the case can be described with two thermal resistances. One from the
case to ambient air and one from case to PB (Printed Board).

The thermal characteristics can be calculated from the following
formula:

= (TC–TA)×(R

T

PB

th C–PB+Rth C–A

Where:
Pd: dissipated power, calculated as PO ×(l/h–1)

: max average case temperature

T

C

: ambient air temperature at the lower side of the power

T

A

module

: temperature in the PB between the PKF connection pins

T

PB

: thermal resistance from case to PB under the power

R

th C-PB

module

: thermal resistance from case to ambient air

R

th C-A

v: velocity of ambient air.
R

is constant and Rth

th C-PB

Free convection is equal to an air velocity of approx. 0.2 – 0.3 m/s.
See figure below.

)/R

th C–A–Pd×Rth C–PB+TA

is dependent on the air velocity.

C-A

Reflow Soldering Information

The PKF series of DC/DC power modules are manufactured in surface
mount technology. Extra precautions must therefore be taken when
reflow soldering the surface mount version. Neglecting the soldering
information given below may result in permanent damage or signifi­cant degradation of power module performance.

The PKF series can be reflow soldered using IR, Natural Convection,
Forced Convection or Combined IR/Convection Technologies. The high
thermal mass of the component and its effect on DT (°C) requires that
particular attention be paid to other temperature sensitive components.

IR Reflow technology may require the overall profile time to be ex­tended to approximately 8–10 minutes to ensure an acceptable DT.
Higher activity flux may be more suitable to overcome the increase in
oxidation and to avoid flux burn-up.

The general profile parameters detailed in the diagram, with this ex­tended time to reach peak temperatures, would then be suitable.

Note! These are maximum parameters. Depending on process varia­tions, an appropriate margin must be added.

Palladium plating is used on the terminal pins. A pin temperature (T
in excess of the solder fusing temperature (+183°C for Sn/Pb 63/37)
for more than 25 seconds and a peak temperature above 195°C, is
required to guarantee a reliable solder joint.

Both pin 1 and pin 9 must be monitored.

No responsibility is assumed if these recommendations are not
strictly followed.

4 EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) ©Ericsson Microelectronics, June 2000

)

p

Safety

Electrical Data

The PKF Series DC/DC power modules are designed in accordance
with EN 60 950, Safety of information technology equipment including
electrical business equipment. SEMKO approval pending.

The DC/DC power module shall be installed in an end-use equip­ment and considerations should be given to measuring the case tem­perature to comply with T
nent tests are conducted with the input protected by an external 3 A
fuse. The need for repeating these tests in the end-use appliance shall
be considered if installed in a circuit having higher rated devices.

When the supply to the DC/DC power module meets all the require­ments for SELV (<60 V dc), the output is considered to remain within
SELV limits (level 3). The isolation is an operational insulation in
accordance with EN 60 950.

The DC/DC power module is intended to be supplied by isolated
secondary circuitry and shall be installed in compliance with the
requirements of the ultimate application. If they are connected to a
60 V DC system reinforced insulation must be provided in the power
supply that isolates the input from the mains. Single fault testing in
the power supply must be performed in combination with the
DC/DC power module to demonstrate that the output meets the
requirement for SELV. One pole of the input and one pole of the
output is to be grounded or both are to be kept floating.

The terminal pins are only intended for connection to mating con­nectors of internal wiring inside the end-use equipment.

These DC/DC power modules may be used in telephone equipment
in accordance with paragraph 34 A.1 of UL 1459 (Standard for Tele­phone Equipment, second edition).

The galvanic isolation is verified in an electric strength test. Test
voltage (V
production the test duration is decreased to 1 s.

The capacitor between input and output has a value of 1 nF and the
leakage current is less than 1µA @ 53 Vdc.

The case is designed in non-conductive epoxy. Its flammability
rating meets UL 94V-0. The oxygen index is 34%

) between input and output is 1,500 V dc for 60 s. In

ISO

max

when in operation. Abnormal compo-

C

.

Fundamental circuit diagrams
Single output

Transient input voltage

Single voltage pulse at +25 °C ambient temperature.

EN/LZT 146 32 R1A (Replaces EN/LZT 137 27 R3) ©Ericsson Microelectronics, June 2000

5