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MP02X130 Series
FEATURES
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
APPLICATIONS
■ Motor Control
■ Controlled Rectifier Bridges
■ Heater Control
■ AC Phase Control
VOLTAGE RATINGS
ORDERING INFORMATION
Order As:
MP02HBT130-20 or MP02HBT130-18 or MP02HBT130-16
MP02HBP130-20 or MP02HBP130-18 or MP02HBP130-16
MP02HBN130-20 or MP02HBN130-18 or MP02HBN130-16
Note: When ordering, please use the complete part number.
KEY PARAMETERS
V
DRM
2000V
I
TSM
4000A
I
T(AV)(per arm)
134A
V
isol
3000V
MP02X130 Series
Phase Control Dual SCR, SCR/Diode Modules
Replaces January 2000 version, DS4477-4.0 DS4477-5.0 August 2001
Code
Circuit
HBT
HBP
HBN
Fig.1 Circuit diagrams
123
Fig. 2 Electrical connections - (not to scale)
Module type code: MP02.
For further information see Package Details.
Lower voltage grades available.
Repetitive
Peak
Voltages
V
DRM VRRM
Type
Number
2000
1800
1600
MP02X130-20
MP02X130-18
MP02X130-16
T
vj
= 125oC
I
DRM
= I
RRM
= 30mA
V
DSM
& V
RSM
=
V
DRM
& V
RRM
+ 100V
respectively
Conditions
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MP02X130 Series
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Test Conditions
Half wave resistive load T
case
= 75˚C
T
case
= 85˚C
T
case
= 75˚C
10ms half sine, T
j
= 125˚C
V
R
= 0
10ms half sine, T
j
= 125˚C
V
R
= 50% V
DRM
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
Symbol
I
T(AV)
I
T(RMS
I
TSM
I2t
I
TSM
I2t
V
isol
Units
A
A
A
kA
A
2
s
kA
A
2
s
V
Max.
134
112
210
4.0
80 x 10
3
3.2
51.2 x 10
3
3000
Parameter
Mean on-state current
RMS value
Surge (non-repetitive) on-current
I2t for fusing
Surge (non-repetitive) on-current
I
2
t for fusing
Isolation voltage
Test Conditions
dc
Half wave
3 Phase
Mounting torque = 5Nm
with mounting compound
Reverse (blocking)
-
Mounting - M6
Electrical connections - M6
-
Parameter
Thermal resistance - junction to case
(per thyristor or diode)
Thermal resistance - case to heatsink
(per thyristor or diode)
Virtual junction temperature
Storage temperature range
Screw torque
Weight (nominal)
THERMAL AND MECHANICAL RATINGS
Symbol
R
th(j-c)
R
th(c-hs)
T
vj
T
stg
-
-
Units
˚C/kW
˚C/kW
˚C/kW
˚C/kW
˚C
˚C
Nm (lb.ins)
Nm (lb.ins)
g
Max.
0.21
0.22
0.23
0.07
125
125
6 (55)
5 (44)
350
Min.
-
-
-
-
-
–40
-
-
-
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MP02X130 Series
Units
mA
V/µs
A/µs
V
mΩ
Test Conditions
At V
RRM/VDRM
, Tj = 125˚C
To 67% V
DRM
, Tj = 125˚C
From 67% V
DRM
to 400A, Repetitive 50Hz
gate source 20V, 20Ω,
t
r
= 0.5µs, Tj = 125˚C
At T
vj
= 125˚C. See note 1
At T
vj
= 125˚C. See note 1
Parameter
Peak reverse and off-state current
Linear rate of rise of off-state voltage
Rate of rise of on-state current
Threshold voltage
On-state slope resistance
DYNAMIC CHARACTERISTICS - THYRISTOR
Symbol
I
RRM/IDRM
dV/dt
dI/dt
V
T(TO)
r
T
Max.
30
1000
500
1.25
1.33
Min.
-
-
-
-
-
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
Test Conditions
V
DRM
= 5V, T
case
= 25oC
V
DRM
= 5V, T
case
= 25oC
V
DRM
= 5V, T
case
= 25oC
Anode positive with respect to cathode
Anode negative with respect to cathode
-
Anode positive with respect to cathode
See table fig. 5
-
Symbol
V
GT
I
GT
V
GD
V
FGM
V
FGN
V
RGM
I
FGM
P
GM
P
G(AV)
GATE TRIGGER CHARACTERISTICS AND RATINGS
Max.
3.0
200
0.2
30
0.25
5
4
16
3
Units
V
mA
V
V
V
V
A
W
W