DYNEX MP02-175-10, MP02-175-12, MP02-175-08 Datasheet
MP02 XX 175 Series
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Symbol
Parameter
Max.
Units
152
A
A
Conditions
A
T
case
= 75oCI
F(RMS)
RMS value
A
133
A267
Mean forward current
Halfwave, resistive load
Code
Circuit
HB
G
GN
Repetitive
Peak
Voltages
V
RRM
Type
Number
Conditions
MP02/175 - 12
MP02/175 - 10
MP02/175 - 08
Lower voltage grades available. For full description of part
number see "Ordering Instructions" on page 3.
1200
1000
800
Tvj = 150oC
IRM = 30mA
V
RSM
= V
RRM
+ 100V
Module outline type code: MP02.
See Package Details for further information
170
149
T
heatsink
= 85oC
T
heatsink
= 75oC
T
case
= 85oC
T
case
= 75oC
I
F(AV)
FEATURES
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
APPLICATIONS
■ Rectifier Bridges
■ DC Power Supplies
■ Plating Rectifiers
■ Traction Systems
CIRCUIT OPTIONS
KEY PARAMETERS
V
RRM
1200V
I
FSM
5625A
I
F(AV)
(per arm) 170A
V
isol
2500V
VOLTAGE RATINGS
PACKAGE OUTLINE
CURRENT RATINGS - PER ARM
MP02 XX 175 Series
Dual Diode Modules
Replaces December 1998 version, DS5101-3.0 DS5101-4.0 January 2000
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MP02 XX 175 Series
Symbol
Parameter
Conditions Max.
Units
AVR = 0
VR = 50% V
RRM
VR = 0
VR = 50% V
RRM
A2s
A2s
A
10ms half sine;
Tj = 150oC
10ms half sine;
Tj = 150oC
Surge (non-repetitive) on-state current
I
FSM
I2t for fusing
I2t
Symbol
Parameter
Conditions
o
C/W
Thermal resistance - junction to case
per Diode
R
th(j-c)
Virtual junction temperature
T
vj
o
C
o
C
T
sto
Storage temperature range
Mounting torque = 6Nm
with mounting compound
3 phase
halfwave
dc
Commoned terminals to base plate
AC RMS, 1min, 50Hz
Max.
0.38
150
R
th(c-hs)
Isolation voltage
Symbol
Parameter
Conditions
Forward voltage
30
V
FM
I
RM
Peak reverse current At V
RRM
, Tj = 150oC
At 450A , T
case
= 25oC
V
TO
Threshold voltage V0.81
mΩ0.84
At Tvj = 150oC
At Tvj = 150oC
r
T
On-state slope resistance
V
isol
kV
o
C/W
Thermal resistance - case to heatsink
per Diode
5625
4500
158000
100000
Units
0.37
o
C/W
o
C/W
0.39
0.07
-40 to 150
2.5
mA
UnitsMax.
V1.30
SURGE RATINGS - PER ARM
CHARACTERISTICS
THERMAL & MECHANICAL RATINGS
MP02 XX 175 Series
3/9
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of V
(TO)
and r
T
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should be
taken to ensure no foreign particles remain.
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP02 HB 175 - 12
MP = Pressure contact module
02 = Outline type
HB = Circuit configuration code (see "circuit options" - front page)
175 = Nominal average current rating at T
case
= 75oC
12 = V
RRM
/100
Examples:
MP02HB175 - 12
MP02G175 - 08
MP02GN175 - 10
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
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