DYNEX MP02-130-20, MP02-130-22, MP02-130-18 Datasheet
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MP02 XX 130 Series
Symbol
Parameter
Max. Units
116
A
A
Conditions
114 A
T
case
= 75oC
T
heatsink
= 75oC
T
heatsink
= 85oC
T
case
= 85oC
T
case
= 75oC
I
F(RMS)
RMS value
A101
A
204
Mean forward current
Halfwave, resistive load
Code
Circuit
HB
G
GN
Repetitive
Peak
Voltages
V
RRM
Type
Number
Conditions
MP02/130 - 25
MP02/130 - 22
MP02/130 - 20
MP02/130 - 18
Lower voltage grades available. For full description of
part number see "Ordering Instructions" on page 3.
2500
2200
2000
1800
Tvj = 150oC
IRM = 30mA
V
RSM
= V
RRM
+ 100V
130
I
F(AV)
Module outline type code: MP02.
See Package Details for further information
VOLTAGE RATINGS
PACKAGE OUTLINE
FEATURES
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
APPLICATIONS
■ Rectifier Bridges
■ DC Power Supplies
■ Plating Rectifiers
■ Traction Systems
CURRENT RATINGS - PER ARM
KEY PARAMETERS
V
RRM
2500V
I
FSM
2200A
I
F(AV)
(per arm) 130A
V
isol
2500V
CIRCUIT OPTIONS
MP02 XX 130 Series
Dual Diode Modules
Replaces December 1998 version, DS5100-3.0 DS5100- January 2000
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MP02 XX 130 Series
Symbol
Parameter
Conditions Max.
Units
VR = 0
VR = 50% V
RRM
VR = 0
VR = 50% V
RRM
A2s
A2s
10ms half sine;
Tj = 150oC
10ms half sine;
Tj = 150oC
Surge (non-repetitive) on-state current
I
FSM
I2t for fusing
I2t
Symbol
Parameter
Conditions
Units
o
C/W
o
C/W
R
th(j-c)
Virtual junction temperature
T
vj
o
C
o
C
T
sto
Storage temperature range
Mounting torque = 6Nm
with mounting compound
3 phase
halfwave
dc
Commoned terminals to base plate
AC RMS, 1min, 50Hz
Max.
0.39
R
th(c-hs)
Isolation voltage
Symbol
Parameter
Conditions
1.53
mA
Forward voltageV
FM
I
RM
Peak reverse current At V
RRM
, Tj = 150oC
At 300A , T
case
= 25oC
V
TO
Threshold voltage
V1.10
mΩ1.30
At Tvj = 150oC
At Tvj = 150oC
r
T
On-state slope resistance
Thermal resistance - junction to case
per Diode
Thermal resistance - case to heatsink
per Diode
o
C/W
0.07
V
isol
2.5
150
A
A
24200
1760
2200
15490
o
C/W
0.37
0.38
-40 to 150
kV
UnitsMax.
V
30
SURGE RATINGS - PER ARM
THERMAL & MECHANICAL RATINGS
CHARACTERISTICS
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MP02 XX 130 Series
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the other. Such action may DAMAGE the
module.
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of VTO and r
T
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to remove
oxide build up and foreign material. Care should be taken
to ensure no foreign particles remain.
ORDERING INSTRUCTIONS
MOUNTING RECOMMENDATIONS
Part number is made up as follows:
MP02 HB 130 - 22
MP = Pressure contact module
02 = Outline type
HB = Circuit configuration code (see "circuit options" - front page)
130 = Nominal average current rating at T
case
= 75oC
22 = V
RRM
/100
Examples:
MP02HB130 - 20
MP02G130 - 25
MP02GN130 - 18
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when
requested.
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