GP200MLK12
GP200MKS12
IGBT Chopper Module
Preliminary Information
DS5448-1.2 April 2001
FEATURES
■ Internally Configured With Upper Arm Controlled
■ Non Punch Through Silicon
■ Isolated Copper Baseplate
■ Low Inductance Internal Construction
APPLICATIONS
■ High Power Choppers
■ Motor Controllers
■ Induction Heating
■ Resonant Converters
■ Power Supplies
The Powerline range of high power modules includes half
bridge, dual and single switch configurations covering voltages
from 600V to 3300V and currents up to 2400A.
The GP200MLS12 is a 1200V, n channel enhancement
mode, insulated gate bipolar transistor (IGBT) chopper module
configured with the upper arm of the bridge controlled. The
module incoporates high current rated freewheel diodes. The
IGBT has a wide reverse bias safe operating area (RBSOA)
ensuring reliability in demanding applications.
KEY PARAMETERS
V
V
I
C
I
C(PK)
CES
CE(sat)
1(A,E)
(typ) 2.7V
(max) 200A
(max) 400A
1
)
9(C
Fig. 1 Chopper circuit diagram
1200V
2(K)
3(C)
5(E
4(G)
1
)
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise earthed heat sinks for safety.
ORDERING INFORMATION
11
10
1
8
9
2
3
6
7
5
4
Order As:
GP200MKS12
Note: When ordering, please use the whole part number.
Outline type code: M
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/10
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GP200MKS12
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
= 25˚C unless stated otherwise
T
case
Symbol
V
CES
V
GES
I
C
I
C(PK)
P
max
V
isol
Collector-emitter voltage
Gate-emitter voltage
Collector current
Peak collector current
Max. transistor power dissipation
Isolation voltage
Parameter
THERMAL AND MECHANICAL RATINGS
Symbol
R
th(j-c)
R
th(j-c)
Thermal resistance - transistor (per arm)
Thermal resistance - antiparallel diode
Parameter
Test Conditions
= 0V
V
GE
-
DC, T
1ms, T
T
= 72˚C
case
= 72˚C
case
= 25˚C, Tj = 150˚C
case
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation
Min.
-
-
Max.
1200
±20
200
400
1490
2500
Max.
84
160
Units
V
V
A
A
W
V
Units
˚C/kW
˚C/kW
R
th(c-h)
Thermal resistance - freewheel diode
Thermal resistance - case to heatsink (per module)
Mounting torque 5Nm
-
-
80
15
˚C/kW
˚C/kW
(with mounting grease)
T
Junction temperature
j
Transistor
Diode
T
stg
-
Storage temperature range
Screw torque
Mounting - M6
-
Electrical connections - M6
-
-
–40
-
-
150
125
125
5
5
˚C
˚C
˚C
Nm
Nm
2/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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ELECTRICAL CHARACTERISTICS
T
= 25˚C unless stated otherwise.
case
GP200MLK12
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(sat)
I
F
I
FM
V
F
Parameter
Collector cut-off current
Gate leakage current
Gate threshold voltage
Collector-emitter saturation voltage
Diode forward current
Diode maximum forward current
Diode forward voltage - antiparallel diode
Diode forward voltage - freewheel diode
Test Conditions
= 0V, VCE = V
V
GE
VGE = 0V, VCE = V
= ±20V, VCE = 0V
V
GE
I
= 10mA, VGE = V
C
CES
CES
VGE = 15V, IC = 200A
= 15V, IC = 200A, , T
V
GE
DC
= 1ms
t
p
= 200A
I
F
= 200A, T
I
F
= 200A
I
F
= 200A, T
I
F
= 125˚C
case
= 125˚C
case
CE
, T
= 125˚C
case
case
= 125˚C
Min.
-
-
-
4.5
-
-
-
-
-
-
-
-
Typ.
-
-
-
-
2.7
3.2
-
-
2.2
2.3
1.7
1.7
Max.
1
12
±1
6.5
3.5
4.0
200
400
2.4
2.5
2.1
2.2
Units
mA
mA
µA
V
V
V
A
A
V
V
V
V
C
ies
L
M
Input capacitance
Module inductance
= 25V, VGE = 0V, f = 1MHz
V
CE
-
25
30
nF
-
nH
-
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 3/10
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