DYNEX GP1600FSS12 Datasheet

GP1600FSS12
13
24
9
8
7
10
11
12
6
5
GP1600FSS12
Powerline N-Channel Single Switch IGBT Module
Advance Information
Replaces October 1999 version, DS5173-3.0 DS5173-4.0 January 2000
The GP1600FSS12 is a single switch 1200V, robust n channel enhancement mode insulated gate bipolar transistor (IGBT) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. The high impedance gate simplifies gate drive considerations enabling operation directly from low power control circuitry.
Fast switching times allow high frequency operation making the device suitable for the latest drive designs employing pwm and high frequency switching. The IGBT has a wide reverse bias safe operating area (RBSOA) for ultimate reliability in demanding applications.
These modules incorporate electrically isolated base plates and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety.
The powerline range of high power modules includes dual and single switch configurations with a range of current and voltage capabilities to match customer system demands.
Typical applications include dc motor drives, ac pwm drives, main traction drives and auxiliaries, large ups systems and resonant inverters.
V V I
C
I
C(PK)
CES CE(sat)
KEY PARAMETERS
1200V (typ) 2.7V (max) 1600A (max) 3200A
FEATURES
n - Channel
Enhancement Mode
High Input Impedance
Optimised For High Power High Frequency Operation
Isolated Base
Full 1200V Capability
1600A Per Module
APPLICATIONS
High Power Switching
Motor Control
Inverters
Traction Systems
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
Outline type code: F
(See package details for further information)
Fig. 1 Electrical connections - (not to scale)
3/4(E)
8(E1)
1
9(G
)
Fig.2 Single switch circuit diagram
1/2(C)
7(C1)
ORDERING INFORMATION
Order As: GP1600FSS12 Note: When ordering, please use the whole part number.
1/11
GP1600FSS12
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may inlcude potentially hazardous rupture of the package. Appropriate safety precautions should always be followed.
T
= 25˚C unless stated otherwise.
case
Test ConditionsSymbol
V
V
I
C(PK)
CES
GES
I
C
max
isol
Collector-emitter voltage Gate-emitter voltage
Collector current
Isolation voltageV
VGE = 0V 1200
­DC, T DC, T 1ms, T T
case
= 25˚C 2100
case
= 75˚C 1600 A
case
= 75˚C A3200
case
= 25˚C (Transistor)
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
THERMAL AND MECHANICAL RATINGS
Symbol Conditions
DC junction to case
Mounting torque 5Nm (with mounting grease)
Transistor Diode
R
R R
th(j-c)
th(j-c)
th(c-h)
T
j
Thermal resistance - transistor Thermal resistance - diode DC junction to case
Thermal resistance - Case to heatsink (per module)
Junction temperature
Max.Parameter
11400Maximum power dissipationP
Min.Parameter Units
-
-
-
Max.
8-
Units
V V±20 A
W
V2500
o
C/kW11
o
C/kW20-
o
C/kW
o
C150
o
C125-
T
stg
- Mounting - M6 Nm5-
Storage temperature range Screw torque
-
Electrical connections - M4 Nm2­Electrical connections - M8 Nm10-
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
2/11
–40
125
o
C
ELECTRICAL CHARACTERISTICS
T
= 25˚C unless stated otherwise.
case
GP1600FSS12
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(SAT)
I
F
I
FM
V
F
C
ies
L
M
Parameter
Collector cut-off current
Gate leakage current
Gate threshold voltage
Conditions
VGE = 0V, VCE = V VGE = 0V, VCE = V
CES
CES
, T
VGE = ±20V, VCE = 0V
= 125˚C mA75--
case
CE
Min.
VGE = 15V, IC =1600A
Collector-emitter saturation voltage
Diode forward current
Diode maximum forward current
VGE = 15V, IC = 1600A, T DC
tp = 1ms A
= 125˚C
case
Diode forward voltage IF =1600A 2.42.2-
Input capacitance Module inductance
IF =1600A, T
VCE = 25V, VGE = 0V, f = 1MHz
= 125˚C 2.52.3-
case
-
Typ.
-
-
-
-
Max.
-
-
-4IC = 120mA, VGE = V
1600
­3200
-
Units
mA2
8
µA
V7.5
3.52.7-
4.03.2-
V V
A
V
V
180
-
-
-
nF
nH
-15
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
3/11
GP1600FSS12
INDUCTIVE SWITCHING CHARACTERISTICS
For definition of switching waveforms, refer to figure 3 and 4.
T
= 25˚C unless stated otherwise
case
Symbol
t
d(off)
t
E
OFF
t
d(on)
E
ON
Q
Q
T
= 125˚C unless stated otherwise.
case
t
d(off)
t
E
OFF
t
d(on)
Turn-off delay time
Fall time
f
Turn-off energy loss
Turn-on delay time ns
Rise time
r
Turn-on energy loss
Diode reverse recovery charge
rr
Diode reverse recovery charge
rr
Turn-off delay time
Fall time
f
Turn-off energy loss
Turn-on delay time ns
Rise time
r
Parameter Min. Typ. Max. Units
Conditions
IC = 1600A
VGE = ±15V
VCE = 600
R
= R
G(ON)
G(OFF)
L ~ 100nH
IF = 1600A
VR = 50%V
dIF/dt = 2000A/µs
IC = 1600A
VGE = ±15V
VCE = 600
R
= R
G(ON)
G(OFF)
L ~ 100nH
= 3.3
,
CES
= 3.3
-
1650
200
-
-
350
1800
250 450
ns ns
mJ
1750- 1600
450
-t 160
-
100-
-
1900
250
­400
-
550
200
130
2100
300 500
ns
mJ
µC
µC-170-
ns ns
mJ
2000- 1750
500
-t
550
ns
4/11
E
Q
Q
Turn-on energy loss
ON
Diode reverse recovery charge
rr
Diode reverse recovery charge
rr
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
IF = 1600A
VR = 50%V
CES
,
dIF/dt = 2000A/µs
250
-
350
350250-
mJ
µC
µC-225-
Loading...
+ 7 hidden pages