DYNEX GP1200ESM33 Datasheet

GP1200ESM33
GP1200ESM33
High Reliability Single Switch IGBT Module
Advance Information
Replaces July 2000 version, DS5308-1.6 DS5308-2.1 February 2001
FEATURES
High Thermal Cycling Capability
Non Punch Through Silicon
Isolated MMC Base with AlN Substrates
APPLICATIONS
Motor Controllers
Traction Drives
Resonant Converters
The Powerline range of high power modules includes dual and single switch configurations covering voltages from 1200V to 3300V and currents up to 4800A.
The GP1200ESM33 is a single switch 3300V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications. This device is optimised for traction drives and other applications requiring high thermal cycling capability or very high reliability.
KEY PARAMETERS V V I
C
I
C(PK)
CES CE(sat)
Aux C
G Aux E
(typ) 3.4V (max) 1200A (max) 2400A
E1 E2 E3
Fig. 1 Single switch circuit diagram
3300V
External connection
C2C1
External connection
C3
The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
GP1200ESM33
Note: When ordering, please use the whole part number.
Outline type code: E
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/9
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GP1200ESM33
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
= 25˚C unless stated otherwise
T
case
Symbol
V
CES
V
GES
I
C
I
C(PK)
P
max
V
isol
Collector-emitter voltage
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Isolation voltage
Parameter
THERMAL AND MECHANICAL RATINGS
Symbol
R
th(j-c)
R
th(j-c)
Thermal resistance - transistor
Thermal resistance - diode
Parameter
Test Conditions
= 0V
V
GE
-
T
= 80˚C
case
1ms, T
T
case
= 120˚C
case
= 25˚C, Tj = 150˚C
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
Min.
-
-
Max.
3300
±20
1200
2400
14.7
6000
Max.
8.5
16.3
Units
V
V
A
A
kW
V
Units
˚C/kW
˚C/kW
junction to case
R
th(c-h)
Thermal resistance - case to heatsink (per module)
Mounting torque 5Nm
-
˚C/kW
4
(with mounting grease)
-
T
Junction temperature
j
Transistor
Diode
T
stg
-
Storage temperature range
Screw torque
Mounting - M6
-
–40
Electrical connections - M4
Electrical connections - M8
125
-
125
125
-
-
-
5
2
10
˚C
˚C
˚C
Nm
Nm
Nm
2/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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ELECTRICAL CHARACTERISTICS
T
= 25˚C unless stated otherwise.
case
GP1200ESM33
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(sat)
I
F
I
FM
V
F
C
ies
L
M
Parameter
Collector cut-off current
Gate leakage current
Gate threshold voltage
Collector-emitter saturation voltage
Diode forward current
Diode maximum forward current
Diode forward voltage
Input capacitance
Module inductance
Test Conditions
= 0V, VCE = V
V
GE
VGE = 0V, VCE = V
= ±20V, VCE = 0V
V
GE
= 120mA, VGE = V
I
C
CES
CES
, T
CE
VGE = 15V, IC = 1200A
= 15V, IC = 1200A, , T
V
GE
DC
= 1ms
t
p
= 1200A
I
F
= 1200A, T
I
F
= 25V, VGE = 0V, f = 1MHz
V
CE
= 125˚C
case
-
= 125˚C
case
case
= 125˚C
Min.
-
-
-
4.5
-
-
-
-
-
-
-
-
Typ.
-
-
-
5.5
3.4
4.3
-
-
2.3
2.4
300
10
Max.
3
100
12
6.5
4.3
5
1200
2400
2.9
3
-
-
Units
mA
mA
µA
V
V
V
A
A
V
V
nF
nH
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 3/9
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