All items are measured across 8 Ω resistor at speaker output terminal.
DescriptionConditionUnitNominalLimit
1. Audio Output Power (Max.)(R/P)W1.00.8
2. Audio S/N (W/LPF)(R/P)dB4036
3. Audio distortion (W/LPF)(R/P)%3.05.0
4. Audio Freq. Response
(-20dB Ref. 1kHz)
Note: Nominal specifications represent the design specifications. All units should be able to approximate these.
Some will exceed and some may drop slightly below these specifications. Limit specifications represent
the absolute worst condition that still might be considered acceptable. In no case should a unit fail to meet
limit specifications.
Prior to shipment from the factory, our products are strictly inspected for recognized product safety and electrical
codes of the countries in which they are to be sold. However, in order to maintain such compliance, it is equally
important to implement the following precautions when a set is being serviced.
Safety Precautions for TV Circuit
1. Before returning an instrument to the
customer, always make a safety check of the
entire instrument, including, but not limited to, the
following items:
a. Be sure that no built-in protective devices are
defective and have been defeated during
servicing. (1) Protective shields are provided
on this chassis to protect both the technician
and the customer. Correctly replace all missing
protective shields, including any removed for
servicing convenience. (2) When reinstalling
the chassis and/or other assembly in the
cabinet, be sure to put back in place all
protective devices, including but not limited to,
nonmetallic control knobs, insulating
fishpapers, adjustment and compartment
covers/shields, and isolation resistor/capacitor
networks. Do not operate this instrument or
permit it to be operated without all
protective devices correctly installed and
functioning. Servicers who defeat safety
features or fail to perform safety checks
may be liable for any resulting damage.
b. Be sure that there are no cabinet openings
through which an adult or child might be able to
insert their fingers and contact a hazardous
voltage. Such openings include, but are not
limited to, (1) spacing between the picture tube
and the cabinet mask, (2) excessively wide
cabinet ventilation slots, and (3) an improperly
fitted and/or incorrectly secured cabinet back
cover.
c. Antenna Cold Check - With the instrument AC
plug removed from any AC source, connect an
electrical jumper across the two AC plug
prongs. Place the instrument AC switch in the
on position. Connect one lead of an ohmmeter
to the AC plug prongs tied together and touch
the other ohmmeter lead in turn to each tuner
antenna input exposed terminal screw and, if
applicable, to the coaxial connector. If the
measured resistance is less than 1.0 megohm
or greater than 5.2 megohm, an abnormality
exists that must be corrected before the
instrument is returned to the customer. Repeat
this test with the instrument AC switch in the off
position.
d. Leakage Current Hot Check - With the
instrument completely reassembled, plug the
AC line cord directly into a 120 V AC outlet. (Do
not use an isolation transformer during this
test.) Use a leakage current tester or a
metering system that complies with American
National Standards Institute (ANSI) C101.1
Leakage Current for Appliances and
Underwriters Laboratories (UL) 1410, (50.7).
With the instrument AC switch first in the on
position and then in the off position, measure
from a known earth ground (metal water pipe,
conduit, etc.) to all exposed metal parts of the
instrument (antennas, handle brackets, metal
cabinet, screw heads, metallic overlays, control
shafts, etc.), especially any exposed metal
parts that offer an electrical return path to the
chassis. Any current measured must not
exceed 0.5 milli-ampere. Reverse the
instrument power cord plug in the outlet and
repeat the test.
READING SHOULD
NOT BE ABOVE 0.5 mA
LEAKAGE
DEVICE
BEING
TESTED
TEST ALL EXPOSED
METAL SURFACES
ALSO TEST WITH
PLUG REVERSED
USING AC
ADAPTER PLUG
AS REQUIRED
ANY MEASUREMENTS NOT WITHIN THE
LIMITS SPECIFIED HEREIN INDICATE A
POTENTIAL SHOCK HAZARD THAT MUST
BE ELIMINATED BEFORE RETURNING THE
INSTRUMENT TO THE CUSTOMER OR
BEFORE CONNECTING THE ANTENNA OR
ACCESSORIES.
e. X-Radiation and High Voltage Limits -
Because the picture tube is the primary
potential source of X-radiation in solid-state TV
receivers, it is specially constructed to prohibit
X-radiation emissions. For continued
X-radiation protection, the replacement picture
tube must be the same type as the original.
Also, because the picture tube shields and
mounting hardware perform an X-radiation
protection function, they must be correctly in
place. High voltage must be measured each
time servicing is performed that involves B+,
horizontal deflection or high voltage. Correct
operation of the X-radiation protection circuits
also must be reconfirmed each time they are
serviced. (X-radiation protection circuits also
CURRENT
TESTER
+
EARTH
GROUND
_
1-2-1TVVCRP_ISP
Page 6
may be called “horizontal disable” or “hold
down.”) Read and apply the high voltage limits
and, if the chassis is so equipped, the
X-radiation protection circuit specifications
given on instrument labels and in the Product
Safety & X-Radiation Warning note on the
service data chassis schematic. High voltage is
maintained within specified limits by close
tolerance safety-related components/
adjustments in the high-voltage circuit. If high
voltage exceeds specified limits, check each
component specified on the chassis schematic
and take corrective action.
2. Read and comply with all caution and
safety-related notes on or inside the receiver
cabinet, on the receiver chassis, or on the picture
tube.
3. Design Alteration Warning - Do not alter or add
to the mechanical or electrical design of this TV
receiver. Design alterations and additions,
including, but not limited to circuit modifications
and the addition of items such as auxiliary audio
and/or video output connections, might alter the
safety characteristics of this receiver and create a
hazard to the user. Any design alterations or
additions will void the manufacturer's warranty and
may make you, the servicer, responsible for
personal injury or property damage resulting
therefrom.
4. Picture Tube Implosion Protection Warning -
The picture tube in this receiver employs integral
implosion protection. For continued implosion
protection, replace the picture tube only with one
of the same type number. Do not remove, install,
or otherwise handle the picture tube in any
manner without first putting on shatterproof
goggles equipped with side shields. People not so
equipped must be kept safely away while picture
tubes are handled. Keep the picture tube away
from your body. Do not handle the picture tube by
its neck. Some “in-line” picture tubes are equipped
with a permanently attached deflection yoke;
because of potential hazard, do not try to remove
such “permanently attached” yokes from the
picture tube.
5. Hot Chassis Warning -
a. Some TV receiver chassis are electrically
connected directly to one conductor of the AC
power cord and maybe safety-serviced without
an isolation transformer only if the AC power
plug is inserted so that the chassis is
connected to the ground side of the AC power
source. To confirm that the AC power plug is
inserted correctly, with an AC voltmeter,
measure between the chassis and a known
earth ground. If a voltage reading in excess of
1.0V is obtained, remove and reinsert the AC
power plug in the opposite polarity and again
measure the voltage potential between the
chassis and a known earth ground.
b. Some TV receiver chassis normally have 85V
AC(RMS) between chassis and earth ground
regardless of the AC plug polarity. This chassis
can be safety-serviced only with an isolation
transformer inserted in the power line between
the receiver and the AC power source, for both
personnel and test equipment protection.
c. Some TV receiver chassis have a secondary
ground system in addition to the main chassis
ground. This secondary ground system is not
isolated from the AC power line. The two
ground systems are electrically separated by
insulation material that must not be defeated or
altered.
6. Observe original lead dress. Take extra care to
assure correct lead dress in the following areas: a.
near sharp edges, b. near thermally hot parts-be
sure that leads and components do not touch
thermally hot parts, c. the AC supply, d. high
voltage, and e. antenna wiring. Always inspect in
all areas for pinched, out of place, or frayed wiring.
Check AC power cord for damage.
7. Components, parts, and/or wiring that appear to
have overheated or are otherwise damaged
should be replaced with components, parts, or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
8. Product Safety Notice - Some electrical and
mechanical parts have special safety-related
characteristics which are often not evident from
visual inspection, nor can the protection they give
necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special safety characteristics are
identified by a ! on schematics and in parts lists.
Use of a substitute replacement that does not
have the same safety characteristics as the
recommended replacement part might create
shock, fire, and/or other hazards. The Product's
Safety is under review continuously and new
instructions are issued whenever appropriate.
Prior to shipment from the factory, our products
are strictly inspected to confirm with the
recognized product safety and electrical codes of
the countries in which they are to be sold.
However, in order to maintain such compliance, it
is equally important to implement the following
precautions when a set is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety.
Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise
blocking capacitors, and noise blocking filters, etc.
1-2-2TVVCRP_ISP
Page 7
C. Use specified internal wiring. Note especially:
1) Wires covered with PVC tubing
2) Double insulated wires
3) High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1) Insulation Tape
2) PVC tubing
3) Spacers
4) Insulators for transistors.
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before
soldering.
F.Observe that the wires do not contact heat
producing parts (heat sinks, oxide metal film
resistors, fusible resistors, etc.)
G. Check that replaced wires do not contact sharp
edged or pointed parts.
H. When a power cord has been replaced, check that
5~6 kg of force in any direction will not loosen it.
I.Also check areas surrounding repaired locations.
J. Use care that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
When replacing the power transformer in sets
where the connections between the power cord
and power transformer primary lead wires are
performed using crimp type connectors, in order to
prevent shock hazards, perform carefully and
precisely the following steps.
Replacement procedure
1) Remove the old connector by cutting the wires
at a point close to the connector.
Important: Do not re-use a connector (discard
it).
2) Strip about 15 mm of the insulation from the
ends of the wires. If the wires are stranded,
twist the strands to avoid frayed conductors.
3) Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4) Use the crimping tool to crimp the metal sleeve
at the center position. Be sure to crimp fully to
the complete closure of the tool.
L. When connecting or disconnecting the VCR
connectors, first, disconnect the AC plug from AC
supply socket.
1-2-3TVVCRP_ISP
Page 8
Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts and
wires have been returned to original positions. Afterwards, perform the following tests and confirm the specified
values in order to verify compliance with safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d') between
soldered terminals, and between terminals and
surrounding metallic parts. (See Fig. 1)
Table 1: Ratings for selected area
Chassis or Secondary Conductor
Primary Circuit Terminals
AC Line VoltageClearance Distance (d), (d’)
220 to 240 V
Note: This table is unofficial and for reference only. Be
sure to confirm the precise values.
≥ 3 mm (d)
≥ 6 mm (d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs) and
externally exposed accessible parts (RF terminals,
antenna terminals, video and audio input and output
terminals, microphone jacks, earphone jacks, etc.).
Measuring Method: (Power ON)
Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC
voltmeter to measure across both terminals of load Z.
See Fig. 2 and following table.
dd'
Fig. 1
Exposed Accessible Part
Z
AC Voltmeter
(High Impedance)
Earth Ground
B
Power Cord Plug Prongs
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2 kΩ RES. Connected in parallel
220 to 240 V
50 kΩ RES. Connected in parallel
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
i ≤ 0.7 mA AC Peak
i ≤ 2 mA DC
i ≤ 0.7 mA AC Peak
i ≤ 2 mA DC
1-2-4TVVCRP_ISP
One side of power cord
plug prongs (B) to:
RF or Antenna terminals
Fig. 2
A/V Input, Output
Page 9
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
How to Read the Values of the
Rectangular Type Chip
Components
Example:
(a) Resistor
473
= 473 = 47 [kΩ]
(b) Capacitor
= Not shown
Caution:
Once chip parts (Resistors, Capacitors, Transistors,
etc.) are removed, they must not be reused. Always
use a new part.
(Top View)
(Top View)
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Pb (Lead) Free Solder
Pb free mark will be found on PCBs which use Pb
free solder. (Refer to figure.) For PCBs with Pb free
mark, be sure to use Pb free solder. For PCBs
without Pb free mark, use standard solder.
Pb free mark
1-3-1TVVCRP_SN
Page 10
Replacement Procedures for
Leadless (Chip) Components
The Following Procedures are
Recommended for the Replacement of the
Leadless Components Used in this Unit.
3. Installing the leadless component
a. Presolder the contact points of the circuit board.
b. Press the part downward with tweezers and solder
both electrodes as shown below.
Note: Do not glue the replacement leadless
component to the circuit board.
1. Preparation for replacement
1-1. Pb free solder
a. Soldering Iron
Use a soldering iron for Pb free solder.
b. Solder
Be sure to use Pb free solder.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before
installation. (130 °C ~ 150 °C, for about two
minutes.)
1-2. Standard solder
a. Soldering Iron
Use a pencil-type soldering iron (less than 30
watts).
b. Solder
Eutectic solder (Tin 63%, Lead 37%) is
recommended.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before
installation. (130 °C ~ 150 °C, for about two
minutes.)
Chip
Soldering Iron
Tweezers
Tweezers
Soldering Iron
Solder
Note:
a. Leadless components must not be reused after
removal.
b. Excessive mechanical stress and rubbing for
the component electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers
and alternately apply heat to both electrodes. When
the solder on both electrodes has melted, remove
leadless component with a twisting motion.
Note:
a. Do not attempt to lift the component off the
board until the component is completely
disconnected from the board by the twisting
action.
b. Take care not to break the copper foil on the
printed board
Soldering Iron
Presolder
1-3-2TVVCRP_SN
Page 11
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
Machine
Flat Pack-IC
Fig. S-1-2
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
Flat Pack-IC
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Fine Tip
Soldering Iron
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
Desoldering Braid
Soldering Iron
Fig. S-1-3
Sharp
Pin
Fig. S-1-4
1-3-3TVVCRP_SN
Page 12
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
or
Iron Wire
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
2. The “●” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
To Solid
Mounting Point
CBA
Tweezers
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Presolder
Fig. S-1-7
CBA
Flat Pack-IC
Fig. S-1-8
1-3-4TVVCRP_SN
Page 13
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
<Incorrect>
<Correct>
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-3-5TVVCRP_SN
Page 14
PREPARATION FOR SERVICING
How to Enter the Service Mode
Caution 1:
1. Optical sensors system are used for Tape Start
and End Sensor on this equipment. Read this
page carefully and prepare as described on this
page before starting to service; otherwise, the unit
may operate unexpectedly.
Preparing 1:
1. Cover Q202 (START SENSOR) and Q201 (END
SENSOR) with Insulation Tape or enter the
service mode to activate Sensor Inhibition
automatically.
Note: Avoid playing, rewinding or fast forwarding the
tape to its beginning or end, because both
Tape End Sensors are not active.
How to Enter the Service Mode
1. Turn the power on. (Use main power on the TV
unit.)
2. Press [STANDBY/ON], [2], [7], [1], and [MUTE]
buttons on the remote control unit in that order
within 5 seconds. When entering the service
mode, “4” will display at corners of the screen.
3. During the service mode, electrical adjustment
mode can be selected by remote control key.
Details are as follows.
KeyAdjustment Mode
KeyAdjustment Mode
Head switching position adjustment
5
6No need to use.
7No need to use.
8
9
Caution 2:
1. The deck mechanism assembly is mounted on the
Main CBA directly, and SW211 (REC-SAFETY
SW) is mounted on the Main CBA. When deck
mechanism assembly is removed from the Main
CBA due to servicing, this switch can not be
operated automatically.
(Manual adjustment): See adjustment
instructions page 1-6-7.
H. Shift adjustment: See adjustment
instructions page 1-6-4.
V. Size/V. Shift adjustment: See
adjustment instructions page 1-6-4.
Preparing 2:
1. To eject the tape, press the [STOP/EJECT] button
on the unit (or Remote Control).
2. When you want to record during the Service
mode, press the [Rec] button while depressing
SW211 (REC-SAFETY SW) on the Main CBA.
Q201
(END SENSOR)
Q202
(START SENSOR)
Picture adjustment mode: Press the
[MENU] button to change from BRT
(Bright), *CNT (Contrast), *COL (Color),
MENU
VOL-
0
1No need to use.
2
3
4
*TNT(Tint) and SHP(SHARP). Press
[PROG+/PROG-] buttons to adjust
Initial Value.
*Marked items are not necessary to
adjust normally.
SECAM Black Level adjustment: See
adjustment instructions page 1-6-3.
Cut-off adjustment: See adjustment
instructions page 1-6-5.
White Balance adjustment: See
adjustment instructions page 1-6-5.
C-Trap adjustment: See adjustment
instructions page 1-6-3.
H adjustment mode: See adjustment
instructions page 1-6-2.
Head switching position adjustment
(Auto adjustment): See adjustment
instructions page 1-6-7.
Auto record mode: Perform recording
(15 Sec.)-->Stop-->Rewind (Zero
return) automatically.
SW211
(REC-SAFETY SW)
MAIN CBA
1-4-1T6609PFS
Page 15
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps for the
cabinet parts and the CBA in order to gain access to
item(s) to be serviced. When reassembling, follow the
steps in reverse order. Bend, route and dress the
cables as they were.
CAUTION!
When removing the CRT, be sure to discharge the
Anode Lead of the CRT with the CRT Ground Wire
before removing the Anode Cap.
[1] Rear Cabinet
[2] Power Unit and Tray Chassis Unit
[3] Power Unit[5] H.V./Power
Supply CBA
[4] Tray Chassis Unit
[6] Top Cover
[7] Bottom Plate
[8] Deck Unit
[9] Main CBA
[10] CRT
2. Disassembly Method
Removal
Step/
Loc.
No.
[1]
[2]
[3]Power Unit
[4]
[5]
[6]Top CoverD3 5(S-4), *CL6045
[7]
Part
Rear
Cabinet
Power Unit
and Tray
Chassis
Unit
Tr ay
Chassis
Unit
H.V./Power
Supply
CBA
Bottom
Plate
Remove/*Unhook/
Fig.
No.
D1
D2
D5
D3
D4
D5
D3D5*CN502, *CN552,
D3 -------------
D3
D5
D3 (S-5)6
Unlock/Release/
Unplug/Unclamp/
Desolder
4(S-1), 2(S-2),
*CN151
Anode Cap, *CN501,
*CN551, *CN601,
CRT CBA, Power
Knob
*CN602
6(S-3)4
Note
1
2
3
Removal
Step/
Loc.
No.
[8]Deck Unit
[9]Main CBA
[10] CRT
↓
(1)
Note:
(1) Order of steps in procedure. When reassembling,
follow the steps in reverse order. These numbers
are also used as the Identification (location) No. of
parts in figures.
(2) Parts to be removed or installed.
(3) Fig. No. showing procedure of part location
(4) Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P = Spring, L = Locking Tab, S = Screw,
CN = Connector
* = Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5) Refer to the following “Reference Notes in the
1. Removal of the Rear Cabinet.
Remove four screws (S-1) and two screws (S-2).
Disconnect connector CN151 and remove the
Rear Cabinet.
2. CAUTION!: Discharge the Anode Lead of the CRT
with the CRT Ground Wire before removing the
Anode Cap.
Removal of the Power Unit and Tray Chassis Unit.
Discharge the Anode Lead of the CRT with the
CRT Ground before removing the Anode Cap.
Disconnect the following: Anode Cap, CN501,
CN551, CN601, CRT CBA, and Power Button.
Then pull the Power Unit and Tray Chassis Unit out
backward.
3. Removal of the Power Unit.
Disconnect connectors CN502, CN552, and
CN602. Then slide the Power Unit out.
4. Removal of the H.V./Power Supply CBA.
Remove six screws (S-3) and pull up the H.V./
Power Supply CBA.
1-5-1T6609DC
Page 16
5. Removal of the Top Cover.
Remove five screws (S-4) and CL604, and remove
the Top Cover.
6. Removal of the Bottom Plate.
Remove a screw (S-5). Then slide the Bottom
Plate out front.
7. Removal of the Deck Unit.
Remove seven screws (S-6), screw (S-7) and
screw (S-8). Then, desolder connectors (CN201,
CL401, CL402, CL403) and lift up the Deck Unit.
(S-2)
8. Removal of the Main CBA.
Remove four screws (S-9) and pull up the Main
CBA.
9. Removal of the CRT.
Remove four screws (S-10) and pull the CRT
backward.
(S-1)
[1] Rear Cabinet
(S-2)
(S-1)
(S-1)
(S-1)
[1] Rear Cabinet
Fig. D1
(S-2)
(S-1)
(S-2)
(S-1)
Fig. D2
1-5-2T6609DC
Page 17
(S-4)
(S-4)
[4] Tray
Chassis Unit
(S-4)
(S-6)
[8] Deck Unit
(S-9)
(S-7)
(S-6)
(S-9)
(S-4)
[6] Top Cover
(S-6)
(S-6)
(S-9)
[9] Main CBA
(S-8)
A
CL604
(S-9)
Power Button
(S-3)
[2] Power Unit and
Tray Chassis Unit
(S-3)
(S-3)
(S-5)
[5] H.V./Power
Supply CBA
[7] Bottom Plate
A
[3] Power Unit
Fig. D3
1-5-3T6609DC
Page 18
(S-10)
(S-10)
[10] CRT
Anode Cap
CRT CBA
(S-10)
(S-10)
Fig. D4
1-5-4T6609DC
Page 19
ANODE
CRT
GND
CRT CBA
CN501B
SCREEN
CN502
H.V./POWER SUPPLY CBA
CN552
CL501A
FOCUS
CN501
CN551
MAIN CBA
CN151
CN601
TO DEGAUSS
COIL
CL403
CL401
CL402
CN201
CN602
CL302A
CL301A
CL603A
TO SPEAKER
CYLINDER
ASSEMBLY
FE HEAD
CAPSTAN
ACE HEAD
ASSEMBLY
MOTOR
TO TOP COVER
DECK UNIT
CL604
1-5-5T6609DC
Fig. D5
Page 20
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: “CBA” is abbreviation for
“Circuit Board Assembly.”
Note: Electrical adjustments are required after
replacing circuit components and certain
mechanical parts. It is important to perform
these adjustments only after all repairs and
replacements have been completed.
Also, do not attempt these adjustments unless
the proper equipment is available.
Test Equipment Required
1. PAL Pattern Generator (Color Bar, Monoscope,
Black Raster, White Raster, Sympte)
10. Ext.input
FRONT VIDEO-IN JACK or REAR SCART JACK
How to Set up the Service mode:
Note: After replacing the IC202 (Memory) or Main
CBA, the set value in IC202 (Memory) will be
lost. So it is necessary to set up or adjust in
the Service mode after its replacement.
Service Mode:
1. Turn the power on. (Use main power on the TV
unit.)
2. Press [STANDBY/ON], [2], [7], [1], and [MUTE]
buttons on the remote control unit in that order
within 5 seconds.
-To cancel the Service mode, press [STANDBY/
ON] button on the remote control.
How to Set up the Option Code
1. Enter the Service mode.
2. Press the [STATUS] button on the remote control
unit. The option code appears on the display.
3. If needed, input the option code (0128) using
number buttons on the remote control unit.
4. To reset the software, press [PAUSE] and [5]
buttons on the remote control unit.
The option code is changed.
1-6-1T6609EA
Page 21
1. DC 105V (+B) Adjustment
2. H Adjustment
Purpose: To obtain correct operation.
Symptom of Misadjustment: The picture is dark and
unit does not operate correctly.
Test PointAdj. PointModeInput
TP503(+B),
TP504(GND)
TapeM. E Q .Sp e c.
---
Note: TP503(+B), TP504(GND),
VR601 --- H.V./Power Supply CBA
1. Connect the unit to AC Power Outlet. (exact AC
230 V)
2. Input a color bar signal from RF (or Ext.) input and
leave it for at least 20 minutes.
3. Connect DC Volt Meter to TP503(+B) and
TP504(GND).
4. Adjust VR601 so that the voltage of TP503(+B)
becomes +105±0.5 V DC.
VR601
DC Voltmeter,
Plastic Tip Driver
RF
(or Ext.)
+105±0.5 V DC
Color
Bar
Purpose: To get correct horizontal position and size of
screen image.
Symptom of Misadjustment: Horizontal position and
size of screen image may not be properly displayed.
Test PointAdj. PointModeInput
R590
TapeM. EQ.Spec.
---Frequency Counter 15.625 kHz±250 Hz
Note: R590 --- H.V./Power Supply CBA
1. Connect Frequency Counter to R590.
2. Set the unit to the Ext. mode and no input is
necessary. Enter the Service mode.
(See page 1-6-1.)
3. Operate the unit for at least 20 minutes.
4. Press [2] button on the remote control unit and
select H-Adj mode.
5. Press [PROG+/PROG-] buttons on the remote
control unit so that the display will change “0” to
“7.”
At this moment, choose display “0” to “7” when the
Frequency counter display is closest to 15.625
kHz ± 250 Hz.
6. Turn the power off and on again.
[PROG+/PROG-]
buttons
Ext.---
1-6-2T6609EA
Page 22
3. C-Trap Adjustment
4. SECAM Black Level Adjustment
Purpose: To get minimum leakage of the color signal
carrier.
Symptom of Misadjustment: If C-Trap Adjustment is
incorrect, stripes will appear on the screen.
Test PointAdj. PointModeInput
J349F3
(B-OUT)
TapeM. EQ.Spec.
---
[PROG+/PROG-]
buttons
Oscilloscope,
Pattern Generator
Figure
RF
(or Ext.)
200 mVp-p Max.
Color Bar
minimum
Fig. 1
Note: J349F3(B-OIT) --- Main CBA
1. Connect Oscilloscope to J349F3.
2. Input a color bar signal from RF (or Ext.) input.
Enter the Service mode. (See page 1-6-1.)
3. Press [0] button on the remote control unit and
select C-TRAP mode.
4. Press [PROG+/PROG-] buttons on the remote
control unit so that the carrier leakage B-Out (4.43
MHz) value becomes minimum on the
oscilloscope.
5. Turn the power off and on again.
Purpose: To set Black Level of the SECAM signal RY/B-Y to Ref. level.
Symptom of Misadjustment: If Black Level of the
SECAM signal R-Y/B-Y is incorrect, the picture is
bluish or reddish in grayscale compared with PAL
signal.
Test PointAdj. PointModeInput
J361G4
TapeM. EQ.Spec.
---
Note: J361G4 --- Main CBA
1. Degauss the CRT and allow CRT to operate for 20
minutes before starting the alignment.
2. Input the SECAM Gray Scale signal from Ext.
input.
3. Enter the Service mode. (See page 1-6-1.)
4. To enter the C/D/S mode, press [VOL-] button on
the remote control unit.
5. To select SBR (SECAM Black Level R-Y), press
[6] button on the remote control unit.
6. Press [PROG+/PROG-] buttons to adjust Y signal
to the black ref. level.
7. To select SBB (SECAM Black Level B-Y), press [7]
button on the remote control unit.
8. Press [PROG+/PROG-] buttons to adjust Y signal
to the black ref. level.
[PROG+/PROG-]
buttons
Pattern Generator,
Analog Oscilloscope
(unusable Digital
Oscilloscope)
Ext.
SECAM
Gray
Scale
---
Y Signal
1H
Black REF. Level
1H
1H
5 mV/Div (10:1 Prove)
Fig. 2
1-6-3T6609EA
Page 23
5. V. Size Adjustment
7. H. Shift Adjustment
Purpose: To obtain correct vertical height of screen
image.
Symptom of Misadjustment: If V. Size is incorrect,
vertical height of image on the screen may not be
properly displayed.
Test PointAdj. PointModeInput
Screen
TapeM. EQ.Spec.
---
1. Enter the Service mode. (See page 1-6-1.)
Press [9] button on the remote control unit and
select V-S mode. (Press [9] button then display will
change to V-P and V-S).
2. Input monoscope pattern and leave it for at least
20 minutes.
3. Press [PROG+/PROG-] buttons on the remote
control unit so that the monoscope pattern is
90±5% of display size and the circle is round.
[PROG+/PROG-]
buttons
Pattern
Generator
RF
(or Ext.)
Monoscope
90±5%
Purpose: To obtain correct horizontal position and
size of screen image.
Symptom of Misadjustment: Horizontal position and
size of screen image may not be properly displayed.
Test PointAdj. PointModeInput
Screen
TapeM. EQ.Spec.
---
1. Enter the Service mode. (See page 1-6-1.)
Press [8] button on the remote control unit and
select H-P mode.
2. Input monoscope pattern and leave it for at least
20 minutes.
3. Press [PROG+/PROG-] buttons on the remote
control unit so that the left and right side of the
monoscope pattern are equal to each other.
4. Turn the power off and on again.
[PROG+/PROG-]
buttons
Pattern
Generator
RF
(or Ext.)
Monoscope
90±5%
6. V. Shift Adjustment
Purpose: To obtain correct vertical position of screen
image.
Symptom of Misadjustment: If V. position is
incorrect, vertical position of image on the screen may
not be properly displayed.
Test PointAdj. PointModeInput
Screen
TapeM. EQ.Spec.
---
1. Enter the Service mode. (See page 1-6-1.)
Press [9] button on the remote control unit and
select V-P mode. (Press [9] button then display will
change to V-P and V-S).
2. Input monoscope pattern and leave it for at least
20 minutes.
3. Press [PROG+/PROG-] buttons on the remote
control unit so that the top and bottom of the
monoscope pattern are equal to each other.
[PROG+/PROG-]
buttons
Pattern
Generator
RF
(or Ext.)
Monoscope
90±5%
1-6-4T6609EA
Page 24
8. Cut-off Adjustment
9. White Balance Adjustment
Purpose: To adjust the beam current of R, G, B, and
screen voltage.
Symptom of Misadjustment: White color may be
reddish, greenish or bluish.
Test PointAdj. PointModeInput
Screen-Control,
Screen
TapeM. EQ.Spec.
---
Note: Screen Control (FBT) --- H.V./Power Supply
1. Degauss the CRT and allow CRT to operate for 20
minutes before starting the alignment.
2. Set the screen control to minimum position. Input
the Black raster signal from RF (or Ext.) input.
3. Enter the Service mode. (See page 1-6-1.)
Dimmed horizontal line appears on the CRT.
4. To enter the C/D/S mode, press the [VOL-] button
on the remote control unit.
5. To enter the CUT OFF (R) mode, press [1] button
on the remote control unit.
6. Turn the screen control up until dimmed horizontal
line appears.
7. Press the [PROG+/PROG-] buttons until the
horizontal line becomes white.
8. To enter the CUT OFF (G) mode, press [2] button
on the remote control unit.
9. Press the [PROG+/PROG-] buttons until the
horizontal line becomes white.
10. To enter the CUT OFF (B) mode, press [3] button
on the remote control unit.
11. Press the [PROG+/PROG-] buttons until the
horizontal line becomes white.
12. Turn the screen control so that the horizontal line
adjusted white looks lightly.
13. Turn the power off and on again.
[PROG+/PROG-]
buttons
Pattern
Generator
CBA
FBT= Fly Back Transformer
Use the Remote Control Unit
RF
(or Ext.)
See Reference Notes
Black
Raster
below
Purpose: To mix red, green and blue beams correctly
for pure white.
Symptom of Misadjustment: White becomes bluish
or reddish.
Tes t
Point
Screen
TapeM. EQ.Spec.
---
Note: Use remote control unit
1. Operate the unit more than 20 minutes.
2. Face the unit to east. Degauss the CRT using
Degaussing Coil.
3. Input the White Raster (APL 100%).
4. Set the color analyzer to the CHROMA mode and
after zero point calibration, bring the optical
receptor to the center on the tube surface (CRT).
5. Enter the Service mode. Press [VOL-] button on
the remote control.
6. Press [4] button on the remote control unit for Red
adjustment. Press [5] button on the remote control
unit for Blue adjustment.
7. In each color mode, Press [PROG+/PROG-]
buttons to adjust the values of color.
8. Adjusting Red and Blue color so that the
temperature becomes 8500K (x: 290 / y: 300)
±3%.
9. At this time, Re-check that Horizontal line is white.
If not, Re-adjust Cut-off Adjustment until the
Horizontal Line becomes pure white.
10. Turn off and on again to return to normal mode.
Receive APL 100% white signal and Check
Chroma temperatures become 8500K (x: 290 / y:
300) ±3%.
Note: Confirm that Cut Off Adj. is correct after this
adjustment, and attempt Cut Off Adj. if
needed.
Adj. PointModeInput
Screen-Control,
[PROG+/PROG-]
buttons
Pattern Generator,
Color analyzer
Figure
RF
(or Ext.)
See below
Color Ajalyzer
White
Raster
(APL 100%)
Fig. 3
1-6-5T6609EA
Page 25
10. Sub-Brightness Adjustment
Purpose: To get proper brightness.
11. Setting for CONTRAST, COLOR,
TINT and SHARP Data Values
Symptom of Misadjustment: If Sub-Brightness is
incorrect, proper brightness cannot be obtained by
adjusting the Brightness Control.
Test PointAdj. PointModeInput
Screen
TapeM. EQ.Spec.
---
White
Note: Bar (A) in Fig. 4 --- 0 IRE
1. Enter the Service mode. (See page 1-6-1.)
Then input SYMPTE signal from RF (or Ext.) input
and leave it for at least 20 minutes.
2. Press [MENU] button. (Each time [MENU] button
is pressed, display will change BRT, CNT, COL,
TNT, and SHP in that order.) Select BRT and
press [PROG+/PROG-] buttons so that the bar (A)
in Fig. 4 is just visible.
3. Turn the power off and on again.
[PROG+/PROG-]
buttons
Pattern
Generator
Figure
RF
(or Ext.)
See below
ABC
SYMPTE
Black
This bar
(A) just
visible
Fig. 4
General
1. Enter the Service mode. (See page 1-6-1.)
2. Press [MENU] button. (Each time [MENU] button
is pressed, display will change BRT, CNT, COL,
TNT, and SHP in that order.)
CONTRAST (CNT)
1. Press [MENU] button on the remote control unit.
Then select CNT display.
2. Press [PROG+/PROG-] buttons on the remote
control unit so that the value of “CONTRAST”
(CNT) becomes 83.
COLOR (COL)
1. Press [MENU] button on the remote control unit.
Then select “COLOR” (COL) display.
2. Press [PROG+/PROG-] buttons on the remote
control unit so that the value of “COLOR” (COL)
becomes 65.
TINT (TNT)
1. Press [MENU] button on the remote control unit.
Then select “TINT” (TNT) display.
2. Press [PROG+/PROG-] buttons on the remote
control unit so that the value of “TINT” (TNT)
becomes 68.
SHARP (SHP)
1. Press [MENU] button on the remote control unit.
Then select “SHARP” (SHP) display.
2. Press [PROG+/PROG-] buttons on the remote
control unit and select “1.”
1-6-6T6609EA
Page 26
12. Focus Adjustment
Purpose: Set the optimum Focus.
13. Head Switching Position
Adjustment
Symptom of Misadjustment: If Focus Adjustment is
incorrect, blurred images are shown on the display.
Test PointAdj. PointModeInput
ScreenFocus Control
TapeM. EQ.Spec.
---
Note: Focus VR (FBT) --- H.V./Power Supply CBA
FBT = Fly Back Transformer
1. Operate the unit more than 30 minutes.
2. Face the unit to the East and degauss the CRT
using a Degaussing Coil.
3. Input the monoscope pattern.
4. Adjust the Focus Control on the FBT to obtain
clear picture.
Pattern
Generator
RF
(or Ext.)
See below.
Monoscope
Purpose: Determine the Head Switching Position
during Playback.
Symptom of Misadjustment: May cause Head
Switching Noise or Vertical Jitter in the picture.
Note: Unit reads Head Switching Position
automatically and displays it on the screen
(Upper Left Corner).
Manual Adjustment
1. Enter the Service mode. (See page 1-6-1.)
2. Playback the test tape (FL6A).
3. Press the number [5] button on the remote control
unit.
4. The Head Switching position will display on the
screen; if adjustment is necessary follow step 4.
7.0H (448 µs) is preferable.
5. Press [PROG+/PROG-] buttons on the remote
control unit if necessary. The value will be
changed in 0.5H steps up or down. Adjustable
range is up to 9.5H. If the value is beyond
adjustable range, the display will change as:
Lower out of range: 0.0H
Upper out of range: -.-H
6. Turn the power off and on again.
Auto Adjustment
1. Load the test tape (FL6A) that have been recorded
the Head Switching Position Value.
2. Enter the Service mode. (See page 1-6-1.)
3. Press [3] button on the remote control unit in the
tape stop mode. The unit playback and adjust the
Head Switching Position automatically.
4. The adjusting report appears on upper left corner
of the screen with blueback.
In case of adjusting correctly: the Head Switching
Position Value recorded in the test tape (FL6A) is
indicated with green.
In case of adjusting incorrectly: “NG” (red) is
indicated with ejecting tape.
TVCRTVCR
7.0H
NG
Correct
1-6-7T6609EA
Incorrect
Fig. 5
Page 27
HOW TO INITIALIZE THE TV/VCR COMBINATION
To put the program back at the factory-default,
initialize the TV/VCR Combination as the following
procedure.
1. Turn the power on. (Use main power on the TV
unit.)
2. To enter the Service mode, press [STANDBY/ON],
[2], [7], [1], and [MUTE] buttons on the remote
control unit in that order within 5 seconds.
-To cancel the Service mode, press [STANDBY/
ON] button on the remote control.
3. Press [SLEEP] button on the remote control unit to
start initializing.
- During initializing, OSD indication (digit) on the
four corners on TV screen blinks to white.
- After initializing, OSD indication lights to red.
4. Turn the power off by pressing main power button
on the TV unit, and unplug the AC cord from the
AC outlet.
1-7-1T6609INT
Page 28
MECHANICAL TROUBLE INDICATOR
1. Each Malfunction Indication
If the MONITOR is turned ON right after the
Mechanical Malfunction occurs or POWER SAFETY/
X-RAY is turned ON, display the following character to
show Malfunction after the EJECT display.
Immediately preceding
Malfunction
REEL MalfunctionR
DRUM MalfunctionD
CASSETTE LOADING
Malfunction
TAPE LOADING MalfunctionT
P-SAFETY 11
P-SAFETY 2 2
X-RAYX
Example: If REEL Malfunction
EJECT R
Display character
C
2. Each Malfunction evaluation
method
X-RAY protect
POWER SAFETY
POWER SAFETY 1
If P-SAFETY 1 port becomes continuously 2.5 V or
less for 120 msec. (4 times 40 msec. interval) when
MONITOR is ON, the unit shall be assumed to be the
Power Malfunction 1 and immediately turn OFF the
POWER/MONITOR and switch over the Mechanical
Malfunction mode with POWER OFF.
(To return from this mode shall become possible only
by POWER Key as in the case of the Mechanical
Malfunction).
* However the POWER SAFETY 1 function shall be
disabled during 500 msec. right after the MONITOR
turns ON.
POWER SAFETY 2
If P-SAFETY 2 port becomes continuously 2.5 V or
less for 120 msec. (4 times 40 msec. interval) when PON-H port is ON, the unit shall be assumed to be the
Power Malfunction 2 and immediately turn OFF the
POWER/MONITOR and switch over the Mechanical
Malfunction mode with POWER OFF.
(To return from this mode shall become possible only
by POWER Key as in the case of the Mechanical
Malfunction).
* However the POWER SAFETY 2 function shall be
disabled during 500 msec. right after the P-ON-H port
turns ON.
If X-RAY port becomes continuously 2.5 V or more for
120 msec. (4 times 40 msec. interval), the unit shall
immediately turn OFF the POWER/MONITOR and
switch over to the Mechanical Malfunction mode with
POWER OFF.
(To return from this mode shall become possible only
by POWER Key as in the case of the Mechanical
Malfunction).
1-8-1T6609MTI
Page 29
Mechanical Malfunction determination
1. REEL Malfunction detection
Countermeasure for REEL and CAPSTAN motor
rotation malfunction (Except CASSETTE
LOADING function)
After the Malfunction detection with REEL/CAPSTAN sensor, the unit shall switch over to STOP
(B) and be REEL Mechanical Malfunction.
a. If the T-REEL pulse is not impressed after a
lapse of 7 sec. at SP, 14 sec. at LP, or more in
the REEL Rotation Mode like PLAY/REC, FS/
RS Mode, and the T-REEL or S-REEL pulse is
not impress after a lapse of 4 sec. or more in
REEL Rotation Mode of FF/REW, it shall be
assumed to stop the rotation and switch over to
STOP (B) position, then POWER be turned
OFF and the unit be REEL Mechanical
Malfunction. (T-REEL and S-REEL for the
models on S-REEL and only T-REEL for other
models)
b. If the C-FG pulse is not impressed for a lapse
of 1 sec. or more during the CAPSTAN MOTOR
rotation, it shall be MOTOR Rotation
Malfunction (REEL Malfunction).
2. DRUM Malfunction detection
Detect the DRUM rotation at the D-FG input
terminal.
If the variation of D-FG input level is not detected
for a lapse of 1 sec. or more when D-CONT is “H”,
it shall be assumed to be Rotation Malfunction and
be DRUM Malfunction.
When detect Drum Malfunction, POWER shall be
turned OFF after the unit switches over to STOP
(B) Mode.
3. Countermeasure for TAPE LOADING Malfunction
Detect the Malfunction with the LOADING Switch.
a. TAPE LOADING Malfunction
If LD-SW does not go to the established
position after a lapse of 7 sec. or more from
TAPE LOADING or TAPE UNLOADING start,
the LOADING function shall immediately be
stopped and POWER be turned OFF, and
inform the Timer about the LOADING
Mechanical Malfunction.
b. LD-SW Position Malfunction at each mode
When the unit operates at each mode, even if
the LD-SW position changes from the
established one in its mode, it keeps the
function according to its mode.
4. Countermeasure for CASSETTE LOADING
Malfunction
a. CASSETTE IN operating Malfunction
If LD-SW does not go to SB position after a
lapse of 5 sec. or more from the CASSETTE
insertion start, the unit starts the CASSETTE
OUT operation.
After switch over to CASSETTE OUT operation
and then a laps of 5 sec. or more from the
CASSETTE OUT operation start, if LD-SW
does not go to the EJ position or if START
Sensor and END Sensor does not turn “ON” at
the EJ position, the unit starts again to insert
CASSETTE.
(However in S-INH state, the START/END
Sensor shall be disabled).
b. CASSETTE OUT operating Malfunction
After a lapse of 5 sec. or more from
CASSETTE OUT operation start, if LD-SW
does not go to the EJ position or if START
Sensor and END Sensor does not turn “ON” at
the EJ position, the unit starts to insert
CASSETTE.
(However in S-INH state, the START/END
Sensor shall be disabled).
When the unit switches over to CASSETTE
insertion at CASSETTE IN or CASSETTE OUT
Malfunction, if LD-SW does not go to the SB
position after a lapse of 5 sec. or more from
CASSETTE insertion start, the function shall
immediately be stopped and POWER be
turned OFF, and the unit be CASSETTE
LOADING Malfunction.
c. When POWER is turned ON, if the CL position
or GC position cannot be detected after 5 sec.
LD-REV operation and 5 sec. LD-FWD
operation, the function shall immediately be
stopped and POWER be turned OFF, and the
unit be CASSETTE LOADING Malfunction.
d. When POWER is turned ON without
CASSETTE (EJ position) and LD-SW is
monitored all the time, if the CL or GC position
is detected continuously for 1 sec. or more, the
POWER shall be turned OFF and the unit be
CASSETTE LOADING Malfunction.
Countermeasure for Mechanical
Malfunction
If the unit detects Mechanical Malfunction, turn the
POWER OFF. If the unit is Mechanical Malfunction,
Key input except POWER key shall be disabled and
CASSETTE insertion disabled. When POWER Key is
entered, the POWER is turned ON and the unit
switches over the EJECT Mode. (Return with POWER
ON)
1-8-2T6609MTI
Page 30
BLOCK DIAGRAMS
Servo/System Control Block Diagram
TO POWER
SUPPLY BLOCK
TO
TV BLOCK
TO
AUDIO BLOCK
TO
VIDEO BLOCK
KEY SWITCH
KEY SWITCH
SW206 SW210
SW201 SW205
8
7
KEY-2
KEY-1
RS201
D201
REMOTE
14
REMOTE
SENSOR
S-LED
TP001
WF3
IC201
(SERVO/SYSTEM CONTROL)
AL+5V
P-ON-H
P-DOWN-L
D202 REC
85
67
P-ON-H
P-DOWN-L
CTL AMP-OUT
CTL(-)
CTL(+)
94
95
97
CTL
AL+5V
D204 STANDBY
24
23
REC-LED
REC-LED
AL+5V
LD-SW
SW212
LD-SW9
(MEMORY)
SCL
IC202
6
71
SCL
ST-SENS.
10480
SDA
CS7
5
72
45
SDA
C-OPEN
2
I
T-REEL
END-SENS.
SCL
T-REEL
SDA
C-OPEN
2
I
Q204
SCL
RESET
34
RESET
TIMER+5V
SDA
SP-MUTE
A-MUTE-H
20
44
SP-MUTE
A-MUTE-H
EXT-L
SCART-H
424829
EXT-L
SCART-H
SCART-MUTE
SW211
31
REC-SAFETY
SCART-MUTE
C-FG
87
CM+12V
P-ON+5V(3)
1CM+12V
2P-ON+5V(3)
3C-FG
CN201
SCL
REC
SAFETY
C-F/R
78
4C-F/R
SDA
C-CONT
76
6FG-GND
5
D-REC-H
LD-CONT81D-CONT
D-PFG
77
90
7LD-CONT
8D-CONT
9
C-SYNC
DV-SYNC
74
47
C-SYNC
D-REC-H
AL+12V(1)
10M-GND
11AL+12V(1)
V-ENV
C-ROTA
6
15
13
V-ENV
C-ROTA
DV-SYNC
+33V
12VG
RF-SW
18
RF-SW
MAIN CBA
)
ASSEMBLY
(DECK
CL402
2CTL(+)
1CTL(-)
ACE HEAD ASSEMBLY
CONTROL
HEAD
END-SENS.
ST-SENS.
Q202Q205Q201
SENSOR CBA
(END-SENSOR)
SENSOR CBA
(ST-SENSOR)
1-9-1
C-CONT
M
CAPSTAN
PG
SENSOR
MOTOR
M
DRUM
MOTOR
CAPSTAN MOTOR
CYLINDER ASSEMBLY
D-PFG
M
LOADING
MOTOR
T6609BLS
Page 31
Video Block Diagram
VIDEO (L)
HEAD
VIDEO (R)
HEAD
CYLINDER ASSEMBLY
(DECK ASSEMBLY)
123
V(L)
V(R)
CL401
V-COM
969593
94
WF1
TP002
RF-SW
RF-SW
D-REC-H
80
C-ROTA
TO SERVO/SYSTEM
CONTROL BLOCK
V-ENV
C-SYNC
DV-SYNC
84
62
70
67
SP
HEAD
AMP
SERIAL
DECORDER
Y. DELAY
P
R
LUMINANCE
SIGNAL
PROCESS
7978
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
69684643
SDA
SCL
65
TO
SERVO/SYSTEM
CONTROL BLOCK
IC401
(VIDEO/AUDIO SIGNAL PROCESS)
WF4
AGC
BYPASS
TUNER
SCART
485254
LINE
Y
CCD 1H DELAY
CHARA.
INS.
SCART
LINE
56
REC FM
AGC
+
C
1/2
MUTE
PB/EE
D-REC-H
RF-SW/C-ROTA
RPRP
CHROMINANCE
SIGNAL
PROCESS
MUTE
TUNER
PB/EE
DV-SYNC
Y/C
MIX
FBC
V-ENV
C-SYNC
PR
21
2928
AGCVXO
5859
61
63
WF2
C-PB
TP008
X401
WF6
4.43MHz
TO
MAIN CBA
C-VIDEO
TV BLOCK
TU001
17
VIDEO OUT
JK701
V-IN
JK703
20
V-IN
19
V-OUT
1-9-2
BUFFER
Q703
WF5
V-OUT
TP003
TU-VIDEO
TO
BUFFER
Q401
VIDEO
TV BLOCK
GND
TP010
T6609BLV
Page 32
Audio Block Diagram
SP151
SPEAKER
JK151
Mode : SP/REC
PB-AUDIO SIGNALREC-AUDIO SIGNAL
HEADPHONE JACK
1
AMP
MUTE
OUTPUT
CL801
CN804
SP2SP-GND1
5
TO
SERVO/SYSTEM
CONTROL BLOCK
SP-MUTE
ALC
12
DET
INV
LINE
R
11
MUTE
AMP
ALC
ATT
98
WF8
N-A-PB
TP007
TO
SERVO/SYSTEM
CONTROL BLOCK
SCL
SDA
A-MUTE-H
SERIAL
DECODER
AUDIO HD-SW
CONTROL
71
68 69
16
REC-ON
P
REC
AMP
100
IC151 (AMP)
7
MAIN CBA
50
ATT
(VIDEO/AUDIO/CHROMA/DEFLECTION/IF)
LINE
TUNER
IC301
52
53
WF7
AUDIO
54
MUTE
IC701 (SW)
WF9
7
EQ
AMP
SP/LP-ON
PB-ON
TUNER
LINE
IC401
(AUDIO SIGNAL PROCESS)
13
4
14
SCART
LINE
SCART
LINE
1
2155
3
12
17
SW CTL
5
6
+5V
Q854
TO SERVO
/SYSTEM
CONTROL
BLOCK
EXT-L
SCART-H
10119
SCART-MUTE
CL402
3 A-PB/REC
3
AUTO
1
Q855
BIAS
2
BIAS
4 A-COM
6 AE-H/FE-H
OSC
5 FE-H
Q856
Q853(PB=ON)
+5V
SWITCHING
D-REC-OFF
Q851
CL403
1 FE-H
Q852(PB=ON)
2 FE-H-GND
TU001
6
AUDIO OUT
JK702
A-IN
JK703
2
A-IN
1
A-OUT
1-9-3
Q701
AUDIO
HEAD
AUDIO
ERASE
HEAD
(DECK ASSEMBLY)
FE HEAD
ACE HEAD ASSEMBLY
FULL
ERASE
HEAD
T6609BLA
Page 33
TV Block Diagram
TO
VIDEO BLOCK
TU-VIDEO
VIDEO
36
34
X301
4.43MHz
TO
CRT/H.V. BLOCK
CL302A
WF11
CL302B
V-DRIVE3
FBP2
H-DRIVE1
ACL5
V-RAMP-FB4
6
7
TO
CRT/H.V. BLOCK
CL301B
BLUE2
GREEN1
RED
3
CL301A
32
143115
16
Mode : SP/REC
REC VIDEO SIGNALPB VIDEO SIGNAL
IC301 (VIDEO/AUDIO/CHROMA/DEFLECTION/IF)
MAIN CBA
SERIAL
I/F
11
10
LINE/PB
INTELLIGENT
MONITORING
43
Q711
+5V
TUNER
LINE/PB
TUNER
SYNC
SEPARATION
Q706
CLOCK
CONTROL
CHROMA
BPF
CHROMA
TRAP
CIRCUIT
Q704
Q702
SECAM
DECODER
PAL
DECODER
LUMA
SIGNAL
+5V
PROCESS
CIRCUIT
H-SYNC
V-SYNC
IC703 (SW)
BASE BAND
1H DELAY LINE
PROCESS
CIRCUIT
PROCESS
CIRCUIT
341
OSD MIX/RBG MATRIX/
BLANKING
INV
21
17
15
SW CTL
1314
10911
27
Q710
30
28
20
WF10
12
13
1
CN303
C-OPEN2
2
INT.MONITOR
I
SDA4
SCL5
(NO CONNECTION)
CN303 is used for
adjustment at factory
SCL
C-OPEN
2
I
TO
SERVO/SYSTEM
1-9-4
SDA
CONTROL BLOCK
JK703
SLOW-SW
7
16811
OSD-B
RAPID-SW
OSD-G
15
OSD-R
IC201
(SYSTEM CONTROL/OSD)
64
82
OSD-R
TEXT-L
C-VIDEO
56
C-VIDEO
TO
VIDEO
BLOCK
OSD-B
OSD-G
606263
OSD-BLK
SLOW-SW-IN
616568
59
V-SYNC
RGB CONT
RAPID-SW-IN
WF18
58
H-SYNC
WF17
T6609BLT
Page 34
CRT/H.V. Block Diagram
V-
DRIVEH-DRIVE
L551
DEFLECTION-YOKE
543
WF13
Mode : SP/REC
1
CN551
ANODE
JK501
FOCUS
SCREEN
GND
V501
RGB
CRT
HEATER
GND
CN501
WF16
REC VIDEO SIGNALPB VIDEO SIGNAL
IC551 (V-DEFLECTION CONTROL)
THERMAL
PROTECTION
7
5
AMP
WF15WF14
Q501
Q502
RED AMP
BLUE AMP
Q503
GREEN AMP
CRT CBA
CL501BCL501A
2
VCC
UP
T552
Q551
H.OUTPUT
3
6
PUMP
1
ANODE
FOCUS VR
HV
T551 F.B.T.
F
FOCUS
SCREEN
SCREEN VR
S
11
8107
1
5
3
HEATER11
P-ON+160V33
9
6
4
WF12
Q533
H.DRIVE
CN552
33V-DRIVE
11H-DRIVE
22FBP
55ACL
44V-RAMP-FB
H.V./POWER SUPPLY CBA
+B
DEF+B
TO
POWER SUPPLY
BLOCK
CN302CL302B
JUNCTION-B
CBA
125
TO TV
4
BLOCK
CL302A
3
1-9-5
CN502
32RED
CN301CL301B
321
TO TV
14GREEN
23BLUE
BLOCK
CL301A
JUNCTION-C
CBA
T6609BLCRT
Page 35
Power Supply Block Diagram
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
P-DOWN-L
(TO PIN85 OF IC201)
Q206
CM+12V
AL+33V
AL+9V
TIMER+5V
8
CL603A
11
8
11
CL603BCN603
8
11
AL+12V(1)
AL+12V(2)
AL+5V
7
546
3
7
546
3
7
546
3
P-ON+8V
P-ON-H
(TO PIN67 OF IC201)
IC681
Q682
12
12
12
P-ON+5V(3)
P-ON+5V(2)
+5V
REG.
+5V
Q684
JUNCTION-A
CBA
REG.
P-ON+5V(1)
Q686
+5V
REG.
IC301
3955
P-ON-ON
+5.7V
REG.
CL604
TOP
MAIN CBA
COVER
TO
CRT/H.V.
+B
GND
TP504
+B
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
TP503
14
T601
6
HOTCOLD
BRIDGE
RECTIFIER
D601 - D604
BLOCK
DEF+B
13
AL+9V
AL+33V
AL+12V(2)
AL+5V
P-ON+8V
P-ON-L
P-DOWN-L
AL+12V(1)3
7
8
546
11
CN602
12
11
4
9
10
2
8
1
Q606
+5V REG.
Q605
12
+8V REG.
Q607
+B ADJ.
IC601
ERROR
VR601
VOLTAGE DET
Q604
FEED
H.V./POWER SUPPLY CBA
BACK
Q608
41
32
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F601) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
F601L601
POWER
SW601
LINE
FILTER
T4.0A H 250V
W601
PS602
CN601
DG601
DEGAUSSING
COIL
1-9-6
Q602
SWITCHING
Q603
LIMITER
T6609BLP
Page 36
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these
special safety characteristics are identified in this
manual and its supplements; electrical components
having such features are identified by the mark “!” in
the schematic diagram and the parts list. Before
replacing any of these components, read the parts list
in this manual carefully. The use of substitute
replacement parts that do not have the same safety
characteristics as specified in the parts list may create
shock, fire, or other hazards.
Notes:
1. Do not use the part number shown on these
drawings for ordering. The correct part number is
shown in the parts list, and may be slightly
different or amended since these drawings were
prepared.
2. All resistance values are indicated in ohms
(K = 10
3. Resistor wattages are 1/4W or 1/6W unless
otherwise specified.
4. All capacitance values are indicated in µF
(P = 10
5. All voltages are DC voltages unless otherwise
specified.
3
, M = 106).
-6
µF).
1-10-1Z13P_SC
Page 37
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON
THE FOLLOWING PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE
FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F601) is blown, first check to see that all components in the power supply circuit are not
defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components
in the power supply circuit to fail.
3. Note:
1. Do not use the part number shown on the drawings for ordering. The correct part number is shown in the
parts list, and may be slightly different or amended since the drawings were prepared.
2. To maintain original function and reliability of repaired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Mode: SP/REC
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
6. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
5.0
231
5.0
(2.5)
Indicates that the voltage
is not consistent here.
Because a hot chassis ground is present in the power
supply circuit, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly,when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
Ref. No.
IC601
Ref. No.
Q602
Ref. No.
Q603
Q604
Q605
Q606
Q607
Q608
SDG
1.80304.0
ECB
00.21.8
6.7
10.3
5.9
1.2
12.0
10.3
9.7
9.6
6.5
7.3
1.2
0
5.5
0.10. 7
1234
13.112.10.21.6
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F601) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F601) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
Because a hot chassis ground is present in the power
supply circuit, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly,when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
R590
(H Adjustment)
TP503
+B
TP504
GND
VR601
+B ADJ
1-10-13
BT6600F01022-A
Page 49
H.V./Power Supply CBA Bottom View
Because a hot chassis ground is present in the power
supply circuit, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly,when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F601) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
WF12
Q551
Collector
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
WF13
PIN 5
OF CN551
1-10-14
BT6600F01022-A
Page 50
CRT CBA Top ViewCRT CBA Bottom View
WF14
Q501
Collector
WF16
Q503
Collector
WF15
Q502
Collector
1-10-15
BT6600F01022-B
Page 51
Junction-A CBA Top View
Junction-A CBA Bottom View
Junction-B CBA Top ViewJunction-B CBA Bottom View
Junction-C CBA Top ViewJunction-C CBA Bottom View
BT6600F01014
1-10-16
Page 52
µs
1DIV: 1V 20
IC201 PIN 58
WAVEFORMS
1DIV: 1V 5ms
IC201 PIN 59
WAVEFORM NOTES
INPUT: COLOR BAR SIGNAL
OTHER CONTROLS: CENTER POSITION
VOLTAGES SHOWN ARE RANGE OF
OSCILLOSCOPE SETTING
WF17
1DIV: 10V 5ms
CN551 PIN 5
WF13
1DIV: 0.5V 0.5ms
IC401 PIN 8
WF9
WF18
µs
1DIV: 20V 20
Q501 COLLECTOR
WF14
1DIV: 2V 5ms
IC301 PIN 13
WF10
µs
1DIV: 20V 20
Q502 COLLECTOR
WF15
µs
1DIV: 1V 20
IC301 PIN7
WF11
µs
1DIV: 20V 20
Q503 COLLECTOR
WF16
µs
1DIV: 200V 20
Q551 COLLECTOR
WF12
µs
1DIV: 0.5V 20
TP003 V-OUT
WF5
1DIV: 2V 5ms
TP002 RF-SW
WF1
1DIV: 0.2V 2DIV: 5V 5ms
Upper: WF6 Lower: WF1
µs
1DIV: 0.2V 0.1
IC401 PIN 29
WF2
1-11-1
TP008 C-PB
1DIV: 0.2V 0.5ms
IC301 PIN 52
WF7
1DIV: 1V 10ms
TP001 CTL
WF3
1DIV: 0.5V 0.5ms
TP007 N-A-PB
WF8
µs
1DIV: 0.25V 20
IC401 PIN 48
WF4
Z13PWF
Page 53
SP151
CL801
2
LOADING
MOTOR
CYLINDER ASSEMBLY
M
SPEAKER
CAPSTAN MOTOR
WIRING DIAGRAM FOR DECK MECHANISM SECTION
1
3
1
2
7
6
4
5
WIRING DIAGRAM
DRUM
MOTOR
VIDEO
(R)
HEAD
VIDEO
(L)
HEAD
M
PG
SENSOR
9
8
3
2
10
11
1
12
CONTROL HEAD
AUDIO HEAD
AUDIO ERASE
HEAD
ACE HEAD ASSEMBLY
FULL ERASE HEAD
FE HEAD
CN804
SP
SP-GND
CN201
SCREEN
P-ON+5V(3)
CM+12V
CL301A
GREEN1
123
CL301B
CN301
123
CN502
GREEN4
C-FG
BLUE2
BLUE3
C-F/R
RED3
JUNCTION-C CBA
RED2
C-CONT
FG-GND
GND4
4
4
GND1
LD-CONT
CN303
VG
D-PFG
D-CONT
AL+12V(1)
M-GND
C-OPEN2
2
INT.MONITOR1I
GND3
SDA4
SCL5
(NO CONNECTION)
CN303 IS USED FOR
ADJUSTMENT AT
FACTORY
SENSOR CBA
(END-SENSOR)
T551
FBT
CL401
V-COM
V(R)
SENSOR CBA
(ST-SENSOR)
V(L)
CL402
CL604
TOP
COVER
CL403
CTL(-)1
CTL(+)2
A-PB/REC 3
A-COM4
AE-H/FE-H 5
AE-H6
FE-H1
FE-H-GND 2
MAIN CBA
CL302A
H-DRIVE1
FBP2
12345
CL302BCN302
12345
CN552
H-DRIVE1
FBP2
V-DRIVE3
V-RAMP-FB4
ACL5
P-SAFETY16
6
JUNCTION-B CBA
6
V-DRIVE3
V-RAMP-FB 4
ACL5
P-SAFETY1 6
CL603A
GND1
NU2
AL+12V(1)3
P-DOWN-L4
AL+5V5
P-ON-L6
AL+12V(2)7
AL+9V8
GND9
GND10
AL+33V11
P-ON+8V12
77GND7GND7
123456789
CL603B
CN603
123456789
CN602
GND1
NU2
AL+12V(1) 3
P-DOWN-L 4
AL+5V5
P-ON-L6
101112
JUNCTION-A CBA
101112
AL+12V(2) 7
AL+9V8
GND9
GND10
AL+33V11
P-ON+8V12
ANODE
FOCUS
123456789
CRT CBA
CN551
D.Y.
H.V. / POWER SUPPLY CBA
1
CN601
2
5
1
3
HD
2
4
VD
W601
CN501
CL501B
HEATER1
GND2P-ON+160V3
GND
CRT
CL501A
HEATER1
GND2P-ON+160V3
JK703
1-12-1
1011121314151617181920
21
T6609WI
Page 54
Chart 1
DISPLAY
SYSTEM CONTROL TIMING CHARTS
LD-CONT
44
D-REC-H
D-PB-H
65
A-MUTE-H
31
P-ON
ROTATION
DRUM
66
C-F/R
C-DRIVE
82
CL/SS
EJ
AU
RS
SF
SM
TL
FB
AL
SB
1
LD-SW
PIN NO.
1. EJECT (POWER OFF) -> CASSETTE IN (POWER ON) -> STOP(B) -> STOP(A) -> PLAY -> RS -> FS -> PLAY -> STILL(N-CANCEL) -> PLAY -> STOP(A)
2SC2120-Y(TE2 F T)
2SC3331(T,U)
KRA103M-AT/P
KTA-1266-GR-AT/P
KTC3203-Y-AT/P
KTC3207
CD4053BCSJX
CD4053BNSR
TC4053BF(N)
16
9
M24C04-MN6
M24C04-WMN6P
M24C04-WMN6TP
81
50
123
M61209BFP R60T
48
49
64
1
1: IN
2: GND
3: OUT
33
16
17
32
52
5
4
SAA5265
27
1
8
100
1
31
30
LA4224
8
5
8
1
1
26
1
4
1-15-1T6609LE
Page 59
Cabinet
EXPLODED VIEWS
L9
Details for L551
and surrounding parts
V501-2
SHINWHA
TAPE SGT-730
(WHITE)
SHINWHA
TAPE SGT-730
(BLACK)
V501-3
A12
V501-1
L551
CLN551
V501
B2
PL2
PB1
PB5
PL1
L8
B2
PB4
PL2
PL2
PL1
A
L551
PL1
H.V./Power
Supply CBA
L8
CRT CBA
B2
DG601
TL1
TB2
TL1
TL1
TB10
Sensor
CBA
Main CBA
1B1
TB3
TB21
TB7
TL14
Scotch Tape
TL1
TL1
TL1
TL1
TL1
Sensor CBA
TL18
B3
TL1
CL604
SP151
B10
TL1
TL1
TL1
Junction B CBA
Junction C CBA
Junction A CBA
CL801
L1
L1
A2
L2
L1
A3
L2
L1
A1X
A1-2
A1-3
A1-1
A1-5
A1-4
B1
B2
Scotch
Tape #880
TL14
A
TB23
TB1
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
1-16-1T6609CEX
Page 60
Packing
S2
X1
TAPE
X3
X4
Loop Antenna
S6
X2X24
S3
TAPE
S12
(IC Tag Label)
S1
(Shipping Label)
FRONT
S5
S4
1-16-2T6609PEX
Page 61
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTE:
Parts that are not assigned part numbers (---------) are
not available.
! have special characteristics important to safety.
Before replacing any of these components, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.Parts that are not assigned part numbers (---------)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
MMA CBA
Ref. No.DescriptionPart No.
MMA CBA
Consists of the following:
MAIN CBA
JUNCTION A CBA
JUNCTION B CBA
JUNCTION C CBA
SENSOR CBA
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA
Consists of the following:
CAPACITORS
C001CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C002ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C006ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL010
ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C008ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL010
ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C009PCB JUMPER D0.6-P5.0JW5.0T
C151ELECTROLYTIC CAP. 330µF/16V M orCE1CMASDL331
ELECTROLYTIC CAP. 330µF/16V MCE1CMASTL331
C152CERAMIC CAP.(AX) X M 2200pF/16VCCA1CMT0X222
C154ELECTROLYTIC CAP. 470µF/16V M orCE1CMASDL471
ELECTROLYTIC CAP. 470µF/16V MCE1CMASTL471
C155ELECTROLYTIC CAP. 0.22µF/50V M H7CE1JMAVSLR22
C156CHIP CERAMIC CAP.(1608) B K 4700pF/50V or CHD1JK30B472
CHIP CERAMIC CAP. B K 4700pF/50VCHD1JKB0B472
C157ELECTROLYTIC CAP. 10µF/25V M H7CE1EMAVSL100
C160CHIP CERAMIC CAP.(1608) CH J 270pF/50V or CHD1JJ3CH271
CHIP CERAMIC CAP. CH J 270pF/50VCHD1JJBCH271
C203CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C205CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C207ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C208CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C211ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C212CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C213ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C214ELECTROLYTIC CAP. 330µF/6.3V M orCE0KMASDL331
ELECTROLYTIC CAP. 330µF/6.3V MCE0KMASTL331
C217CHIP CERAMIC CAP.(1608) CH D 10pF/50V or CHD1JD3CH100
CHIP CERAMIC CAP. CH D 10pF/50VCHD1JDBCH100
C218CHIP CERAMIC CAP.(1608) CH D 10pF/50V or CHD1JD3CH100
CHIP CERAMIC CAP. CH D 10pF/50VCHD1JDBCH100
C221ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C222CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C223CHIP CERAMIC CAP.(MELF) Y K 4700pF/16V or CZM1CK30Y472
CHIP CERAMIC CAP.(MELF) Y K 4700pF/16VCZM1CKB0Y472
C224CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
C240CHIP CERAMIC CAP.(MELF) Y K 4700pF/16V or CZM1CK30Y472
CHIP CERAMIC CAP.(MELF) Y K 4700pF/16VCZM1CKB0Y472
C241ELECTROLYTIC CAP. 22µF/50V M orCE1JMASDL220
ELECTROLYTIC CAP. 22µF/50V MCE1JMASTL220
C242CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
200506011-18-1T6609EL
Page 63
Ref. No.DescriptionPart No.
C243ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C244CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C245ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C248ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C253CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. CH J 560pF/50VCHD1JJBCH561
C256ELECTROLYTIC CAP. 10µF/25V M H7CE1EMAVSL100
C301CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C302ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C303CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C304CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C305ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL010
ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C307CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C308CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C309FILM CAP.(P) 0.1µF/50V J orCMA1JJS00104
FILM CAP.(P) 0.1µF/50V JCA1J104MS029
C310CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C311ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C312CHIP CERAMIC CAP.(MELF) B K 180pF/50V or CZM1JK30B181
CHIP CERAMIC CAP.(MELF) B K 180pF/50VCZM1JKB0B181
C313CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C314CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C315CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C316ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL010
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C319ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL010
ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C320CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C321ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL010
ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
Ref. No.DescriptionPart No.
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C322ELECTROLYTIC CAP. 470µF/10V M orCE1AMASDL471
ELECTROLYTIC CAP. 470µF/10V MCE1AMASTL471
C323ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C324CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C325MYLAR CAP. 0.22µF/50V J orCMA1JJS00224
FILM CAP.(P) 0.22µF/50V J orCA1J224MS029
TF CAP. 0.22µF/50V JCT1J224MS045
C326ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL010
ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C327CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C328MYLAR CAP. 0.22µF/50V J orCMA1JJS00224
FILM CAP.(P) 0.22µF/50V J orCA1J224MS029
TF CAP. 0.22µF/50V JCT1J224MS045
C330CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C331ELECTROLYTIC CAP. 47µF/10V M orCE1AMASDL470
ELECTROLYTIC CAP. 47µF/10V MCE1AMASTL470
C332CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C333CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C334CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C336ELECTROLYTIC CAP. 47µF/10V M orCE1AMASDL470
ELECTROLYTIC CAP. 47µF/10V MCE1AMASTL470
C338CHIP CERAMIC CAP.(MELF) Y K 1000pF/35V or CZM1GK30Y102
CHIP CERAMIC CAP.(MELF) Y K 1000pF/35VCZM1GKB0Y102
C340CHIP CERAMIC CAP.(MELF) B K 180pF/50V or CZM1JK30B181
CHIP CERAMIC CAP.(MELF) B K 180pF/50VCZM1JKB0B181
C341CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16V or CZM1CZ30F103
CHIP CERAMIC CAP.(MELF) F Z 0.01µF/16VCZM1CZB0F103
C344CHIP CERAMIC CAP.(MELF) Y K 1000pF/35V or CZM1GK30Y102
CHIP CERAMIC CAP.(MELF) Y K 1000pF/35VCZM1GKB0Y102
C350ELECTROLYTIC CAP. 220µF/10V M orCE1AMASDL221
ELECTROLYTIC CAP. 220µF/10V MCE1AMASTL221
C401CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C402ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C403ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C404ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C405CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C406CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C407CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C408CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C409CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
200506011-18-2T6609EL
Page 64
Ref. No.DescriptionPart No.
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C410CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C411CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C412ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C413CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C414CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C415CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C416ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C417ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C418ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C419CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C420CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C421ELECTROLYTIC CAP. 10µF/25V M H7CE1EMAVSL100
C424CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. CH J 68pF/50VCHD1JJBCH680
C426CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C427CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C430ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C431CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C432ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C433ELECTROLYTIC CAP. 10µF/25V M H7CE1EMAVSL100
C434ELECTROLYTIC CAP. 22µF/16V M H7CE1CMAVSL220
C435ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C684! CHIP CERAMIC CAP.(MELF) B K 180pF/50V or CZM1JK30B181
!CHIP CERAMIC CAP.(MELF) B K 180pF/50VCZM1JKB0B181
C687ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C688ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C691ELECTROLYTIC CAP. 2.2µF/50V M orCE1JMASDL2R2
ELECTROLYTIC CAP. 2.2µF/50V MCE1JMASTL2R2
C694ELECTROLYTIC CAP. 100µF/10V M orCE1AMASDL101
ELECTROLYTIC CAP. 100µF/10V MCE1AMASTL101
C703ELECTROLYTIC CAP. 4.7µF/50V M orCE1JMASDL4R7
ELECTROLYTIC CAP. 4.7µF/50V MCE1JMASTL4R7
C707ELECTROLYTIC CAP. 0.22µF/50V M orCE1JMASDLR22
ELECTROLYTIC CAP. 0.22µF/50V MCE1JMASTLR22
C708ELECTROLYTIC CAP. 0.47µF/50V M orCE1JMASDLR47
ELECTROLYTIC CAP. 0.47µF/50V MCE1JMASTLR47
C709ELECTROLYTIC CAP. 0.47µF/50V M orCE1JMASDLR47
ELECTROLYTIC CAP. 0.47µF/50V MCE1JMASTLR47
C710ELECTROLYTIC CAP. 0.47µF/50V M orCE1JMASDLR47
ELECTROLYTIC CAP. 0.47µF/50V MCE1JMASTLR47
C711ELECTROLYTIC CAP. 470µF/10V M orCE1AMASDL471
ELECTROLYTIC CAP. 470µF/10V MCE1AMASTL471
C713PCB JUMPER D0.6-P5.0JW5.0T
C715ELECTROLYTIC CAP. 4.7µF/50V M orCE1JMASDL4R7
ELECTROLYTIC CAP. 4.7µF/50V MCE1JMASTL4R7
C716CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C719ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL010
ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C723CHIP CERAMIC CAP.(MELF) Y K 1000pF/35V or CZM1GK30Y102
CHIP CERAMIC CAP.(MELF) Y K 1000pF/35VCZM1GKB0Y102
C724ELECTROLYTIC CAP. 47µF/10V M orCE1AMASDL470
ELECTROLYTIC CAP. 47µF/10V MCE1AMASTL470
C851ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C855ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C856CERAMIC CAP. B K 470pF/100V orCCD2AKS0B471
CERAMIC CAP. B K 470pF/500VCCD2JKS0B471
C857FILM CAP.(P) 0.018µF/100V J orCMA2AJS00183
FILM CAP.(P) 0.018µF/50V JCA1J183MS029
C858CHIP CERAMIC CAP. B K 2200pF/50V orCHD1JK30B222
CHIP CERAMIC CAP. B K 2200pF/50VCHD1JKB0B222
C859CHIP CERAMIC CAP.(MELF) SL J 33pF/50V or CZM1JJ3SL330
CHIP CERAMIC CAP.(MELF) SL J 33pF/50VCZM1JJBSL330
C860PCB JUMPER D0.6-P5.0JW5.0T
C861CERAMIC CAP.(AX) X M 1800pF/16VCCA1CMT0X182
C862ELECTROLYTIC CAP. 10µF/25V M H7CE1EMAVSL100
C863CHIP CERAMIC CAP.(1608) B K 0.01µF/50V or CHD1JK30B103
CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JKB0B103
C864CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
200506011-18-3T6609EL
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Ref. No.DescriptionPart No.
C865CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25V or CHD1EK30B223
CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EKB0B223
C866ELECTROLYTIC CAP. 33µF/10V H7CE1AMAVSL330
C867ELECTROLYTIC CAP. 4.7µF/50V M H7CE1JMAVSL4R7
C869CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1µF/25VCHD1EZB0F104
C871CHIP CERAMIC CAP.(MELF) B K 180pF/50V or CZM1JK30B181
CHIP CERAMIC CAP.(MELF) B K 180pF/50VCZM1JKB0B181
C872ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C874CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104