DIODS BZT52C39, BZT52C36, BZT52C33, BZT52C2V4, BZT52C27 Datasheet

BZT52C2V4 - BZT52C39

SURFACE MOUNT ZENER DIODE

Features

Planar Die Construction

500mW Power Dissipation on Ceramic PCB

General Purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Mechanical Data

Case: SOD-123, Plastic

UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020A

Terminals: Solderable per MIL-STD-202, Method 208

Polarity: Cathode Band

Marking: See Below

Weight: 0.01 grams (approx.)

Ordering Information: See Page 4

				SOD-123
			Dim	Min	Max
			A	3.55	3.85
H	D	J	B	2.55	2.85
	G		C	1.40	1.70
			D	—	1.35
	A		E	0.55 Typical
	B
			G	0.25	—
C	E		H	0.11 Typical
			J	—	0.10
				0	8
			All Dimensions in mm

Maximum Ratings	@ TA = 25 C unless otherwise specified
Characteristic		Symbol		Value	Unit
Forward Voltage (Note 2)	@ IF = 10mA	VF		0.9	V
Power Dissipation (Note 1)		Pd		500	mW
Thermal Resistance, Junction to Ambient Air (Note 1)		R JA		305	C/W
Operating and Storage Temperature Range		Tj, TSTG		-65 to +150	C

Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2. 2. Short duration test pulse used to minimize self-heating effect.

Marking Information

XX

YM

XX = Product Type Marking Code (See Page 2) YM = Date Code Marking

Y = Year (ex: N = 2002)

M = Month (ex: 9 = September)

Date Code Key

Year

1998

1999

2000

2001

2002

2003

2004

2005

Code

J

K

L

M

N

P

R

S

Month

Jan

Feb

March

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

Code

1

2

3

4

5

6

7

8

9

O

N

D

DS18004 Rev. 19 - 2

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BZT52C2V4 - BZT52C39