Diodes ZXTN620MA User Manual

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p
A Product Line o
Diodes Incorporated
80V NPN LOW SATURATION TRANSISTOR
Features and Benefits
BV
I
Low Saturation Voltage (185mV max @ 1A)
R
h
Low profile 0.6mm high package for thin applications
R
4mm
Lead-Free, RoHS Compliant (Note 1)
Halogen and Antimony Free. "Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
> 80V
CEO
= 3.5A Continuous Collector Current
C
= 68 m for a low equivalent On-Resistance
SAT
specified up to 5A for high current gain hold up
FE
efficient, 60% lower than SOT23
JA
θ
2
footprint, 50% smaller than SOT23
DFN2020B-3
Top View
Bottom View
Mechanical Data
Case: DFN2020B-3
Case Material: Molded Plastic. “Green” Molding Compound.
Terminals: Pre-Plated NiPdAu leadframe.
Nominal Package Height: 0.6mm
UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Weight: 0.01 grams (approximate)
Applications
MOSFET Gate Driving
DC–DC Converters
Charging circuits
Motor Control
Power switches
B
Device Symbol
C
E
Bottom View
Pin-Out
ZXTN620MA
Ordering Information
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
ZXTN620MATA SE 7 8 3000
Notes: 1. No purposefully added lead.
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com
Marking Information
To
SE
View
ZXTN620MA
Document Number DS31894 Rev. 5 - 2
SE = Product Type Marking code
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Diodes Incorporated
ZXTN620MA
Maximum Ratings @T
= 25°C unless otherwise specified
A
Parameter Symbol Limit Unit
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Peak Pulse Current
Continuous Collector Current Base Current
V
CBO
V
CEO
V
EBO
I (Note 3) (Note 4) 3.8
CM
I
I
C
B
100
80
7 5
3.5
1
V
A
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Power Dissipation Linear Derating Factor
Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Lead (Note 5)
Operating and Storage Temperature Range
Notes: 3. For a device surface mounted on 31mm x 31mm (10cm2) FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink.
4. Same as note (3), except the device is measured at t 5 sec.
5. For a single device, thermal resistance from junction to solder-point (at the end of the drain lead).
(Note 3)
P
D
(Note 4) (Note 3)
(Note 4) 51
R R
T
J, TSTG
JA
θ
JL
1.5 12
2.45
19.6 83
16.8
-55 to +150
W
mW/°C
°C/W
°C
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Thermal Characteristics
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Diodes Incorporated
ZXTN620MA
V
CE(SAT)
10
Limited
1
DC
1s
100ms
0.1
Collector Current (A) I
Single Pulse , T
C
0.01
0.1 1 10 100
amb
10ms
1ms
100us
=25°C
VCE Colle ctor-Emitter Vo ltage (V)
Safe Operating Area
10 sqcm
80
Single 1oz Cu
60
D=0.5
40
D=0.2
20
Thermal Resistance (°C/W)
0
100µ 1m 10m 100m 1 10 100 1k
Single Pulse
D=0.05
D=0.1
Pulse Width (s)
Transient Thermal Impedance
2.0
1.5
1.0
0.5
0.0 0 25 50 75 100 125 150
Max Power Di ssi p at i o n (W )
Temperature (°C)
10 sqcm Single 1oz Cu T
=25°C
amb
Derating Curve
225 200 175 150 125 100
75 50 25
Thermal Resistance (°C/W)
0
0.1 1 10 100
1oz copper
2oz copper
Board Cu Area (sqcm)
Thermal Resistance v Board A rea
3.5
T
=25°C
amb
3.0
T
=150°C
j max
2.5
Continuous
2.0
1.5
1.0
Dissipat i on (W)
D
0.5
P
0.0
0.1 1 10 100
2oz copper
1oz copper
Board Cu Area (sqcm)
Power Dissipation v Board Area
ZXTN620MA
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Page 4
)
)
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ZXTN620MA
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage (Note 6) Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current Collector Emitter Cutoff Current
Static Forward Current Transfer Ratio (Note 6)
Collector-Emitter Saturation Voltage (Note 6)
Base-Emitter Turn-On Voltage (Note 6) Base-Emitter Saturation Voltage (Note 6) Output Capacitance
Transition Frequency Turn-On Time
Turn-Off Time
Notes: 6. Measured under pulsed conditions. Pulse width 300 µs. Duty cycle 2%.
BV BV BV
I I I
V
CE(sat)
V
BE(on
V
BE(sat
C
CBO CEO
EBO CBO EBO CES
h
FE
obo
f
T
t
on
t
off
100 180 - V
80 110 - V
7 8.2 - V
- - 100 nA
- - 100 nA
- - 100 nA
200 300 110
60 20
-
-
-
-
-
-
450 450 170
90 30 10
15
45 145 160 240
-
900
-
-
-
-
20
60 185 200 340
-
mV
- 0.96 1.05 V
- 1.09 1.175 V
- 11.5 18 pF
100 160 - MHz
- 86 - ns
- 1128 - ns
IC = 100 µA IC = 10 mA IE = 100 µA V
= 80V
CB
V
= 6V
EB
V
= 65V
CE
I
= 10mA, V
C
= 200mA, V
I
C
I
= 1A, V
C
= 1.5A, V
I
C
I
= 3A, V
C
= 5A, V
I
C
I
= 0.1A, IB = 10mA
C
I
= 0.5A, IB = 50mA
C
= 1A, IB = 20mA
I
C
I
= 1.5A, IB = 50mA
C
= 3.5A, IB = 300mA
I
C
IC = 3.5A, V
CE
CE CE
CE
= 2V
CE
= 2V = 2V
CE
= 2V
CE
= 2V
= 2V
= 2V
IC = 3.5A, IB = 300mA V
= 10V. f = 1MHz
CB
= 10V, IC = 50mA,
V
CE
f = 100MHz V
= 10V, IC = 1A
CC
= IB2 = 25mA
I
B1
ZXTN620MA
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Typical Electrical Characteristics
Tamb=25°C
100m
(V)
10m
CE(SAT)
V
IC/IB=100
IC/IB=20
IC/IB=50
IC/IB=10
(V)
V
0.25
0.20
0.15
0.10
CE(SAT)
0.05
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ZXTN620MA
IC/IB=50
100°C
25°C
-55°C
1m
1m 10m 100m 1 10
IC Colle ctor C urrent (A)
V
1.4
1.2
1.0
0.8
0.6
0.4
Normalised Gain
0.2
0.0 1m 10m 100m 1 10
100°C
25°C
-55°C
CE(SAT)
v I
C
VCE=2V
IC Collecto r Current (A)
hFE v I
VCE=2V
1.0
0.8
(V)
0.6
BE(ON)
V
0.4
-55°C
25°C
C
100°C
630 540 450 360 270 180 90 0
0.00 1m 10m 100m 1
IC Collecto r Current (A)
1.0
IC/IB=50
V
CE(SAT)
v I
C
)
FE
0.8
(V)
0.6
BE(SAT)
V
Typical Gain (h
0.4
1m 10m 100m 1
-55°C
25°C
100°C
IC Collecto r Current (A)
V
BE(SAT)
v I
C
0.2 1m 10m 100m 1 10
IC Colle ctor C urrent (A)
V
ZXTN620MA
Document Number DS31894 Rev. 5 - 2
BE(ON)
v I
C
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Page 6
Package Outline Dimensions
A
A1
D
D2
Z
D4
E
E2
E4
e
Suggested Pad Layout
G
X
X1
C
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Diodes Incorporated
ZXTN620MA
A3
SEATING PLANE
L
b
e
Y1
Y
Y2
Dimensions Value (in mm)
C 1.30
G 0.24
X 0.35
X1 1.52
Y 1.09 Y1 0.47 Y2 0.50
DFN2020B-3
Dim Min Max Typ
A 0.57 0.63 0.60
A1 0 0.05 0.02 A3
b 0.20 0.30 0.25
D 1.95 2.075 2.00 D2 1.22 1.42 1.32 D4 0.56 0.76 0.66
e
E 1.95 2.075 2.00 E2 0.79 0.99 0.89 E4 0.48 0.68 0.58
L 0.25 0.35 0.30
Z
All Dimensions in mm
0.152
0.65
0.225
ZXTN620MA
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
Diodes Incorporated
ZXTN620MA
ZXTN620MA
Document Number DS31894 Rev. 5 - 2
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