Diodes ZXTN25100BFH User Manual

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100V NPN LOW SATURATION TRANSISTOR IN SOT23
Features
BV
BV
BV
I
Low saturation voltage, V
R
1.25W Power dissipation
h
Complementary PNP Type: ZXTP25100BFH
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
> 100V
CEO
> 170V forward blocking voltage
CEX
> 6V reverse blocking voltage
ECO
= 3A high Continuous Collector Current
C
= 67m for a low equivalent On-Resistance
CE(SAT)
specified up to 3A for high current gain hold up
FE
SOT23
Top View Device Symbol
CE(SAT)
< 80mV @1A
B
Mechanical Data
Case: SOT23
Case Material: molded plastic, “Green” molding compound
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight 0.008 grams (approximate)
Applications
Lamp relay and solenoid drivers
General switching in automotive and industrial applications
Motor drive and control
C
E
Diodes Incorporated
ZXTN25100BFH
E
C
B
Top View
Pin-Out
Ordering Information (Note 4)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
ZXTN25100BFHTA 021 7 8 3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
ZXTN25100BFH
Document number: DS33703 Rev. 2 - 2
021
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021 = Product Type Marking Code
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ZXTN25100BFH
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage Collector-Emitter Voltage (Forward Blocking) Collector-Emitter Voltage Emitter-Base Voltage (Reverse Blocking) Emitter-Base Voltage Continuous Collector Current Peak Pulse Current (Note 5)
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation Linear Derating Factor Power Dissipation Linear Derating Factor Power Dissipation Linear Derating Factor Power Dissipation Linear Derating Factor
(Note 5)
(Note 6)
(Note 7)
(Note 8)
Thermal Resistance, Junction to Ambient (Note 5) Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Ambient (Note 7) Thermal Resistance, Junction to Ambient (Note 8) Thermal Resistance, Junction to Leads (Note 9) Operating and Storage Temperature Range
ESD Ratings (Note 10)
V
CBO
V
CEX
V
CEO
V
ECO
V
EBO
I
I
CM
P
P
P
P
R R R R R
T
J, TSTG
C
θJA
θJA
θJA
θJA
θJL
D
D
D
D
170 V 170 V 100 V
6 V 7 V 3 A 9 A
0.73
5.84
1.05
8.4
1.25
9.6
1.81
14.5 171 119 100
69
74.96
-55 to +150
mW
mW
mW
mW
°C/W °C/W °C/W °C/W °C/W
°C
Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B
Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Machine Model ESD MM 400 V C
Notes: 5. For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
8. Same as note (7), except measured at t < 5secs.
measured when operating in a steady-state condition.
6. Same as note (5), except mounted on 25mm x 25mm x 1.6mm FR4 PCB with 2 oz copper.
7. Same as note (5), except mounted on 50mm x 50mm x 1.6mm FR4 PCB with 2 oz copper.
9. Thermal resistance from junction to solder-point (at the end of collector lead).
10.Refer to JEDEC specification JESD22-A114 and JESD22-A115.
ZXTN25100BFH
Document number: DS33703 Rev. 2 - 2
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Thermal Characteristics and Derating information
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ZXTN25100BFH
V
CE(sat)
10
Limited
1
DC
1s
=25°C
100ms
10ms
1ms
100µs
Single Pulse
100m
Collector Current (A) I
T
amb
50 mm X 50mm X 1 .6mm FR4
2oz Cu
C
10m
100m 1 10 100
VCE Collector-Emitter Voltage (V)
Safe Operating Area
100
80
60
40
20
0
100µ 1m 10m 100m 1 10 100 1k
Thermal Resistance (°C/W)
T
=25°C
amb
50 mm X 50mm X 1 .6mm FR 4
2oz Cu
D=0.5
D=0.2
Pulse Width (s)
Single Pulse
D=0.05
D=0.1
Transient Thermal Impedance
100µ
BV
(BR)CEO
=100V
Failure may occur
in this region
10µ
T
Collector Current (A)
C
I
amb
=25°C
BV
(BR)CEV
=170V
0 20 40 60 80 100 120 140 160 180
VCE Collector-Emitter Voltage (V)
Safe Operating Area
100
10
1
Maximum Power (W)
100µ 1m 10m 100m 1 10 100 1k
Pulse Width (s)
Single Pulse
T
=25°C
50mm X 50mm X 1.6mm FR4
amb
2oz Cu
Pulse Power Dissipation
1.4
1.2
1.0
0.8
50 mm X 50mm X 1 .6mm FR4
2oz Cu
25 mm X 25 mm X 1.6mm F R4 2oz Cu
0.6
0.4
15mm X 15mm X 1.6mm FR4
0.2
1oz Cu
0.0 0 20 40 60 80 100 120 140 160
Max Power Dissipation (W)
Temperature (°C)
Derating Curve
ZXTN25100BFH
Document number: DS33703 Rev. 2 - 2
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)
)
(d)
(r)
(s)
(f)
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ZXTN25100BFH
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage (Forward Blocking) (Note 11)
Collector-Emitter Breakdown Voltage (Note 11)
Emitter-Collector Breakdown Voltage (Reverse Blocking) (Note 11)
Emitter-Collector Breakdown Voltage Emitter-Base Breakdown Voltage
Collector Cut-off Current
Collector Emitter Cut-off Current
Emitter Cut-off Current
Static Forward Current Transfer Ratio (Note 11)
Collector-Emitter Saturation Voltage (Note 11)
Base-Emitter Saturation Voltage (Note 11) Base-Emitter Saturation Voltage (Note 11)
Transition Frequency
Collector Output Capacitance Delay Time Rise Time Storage Time Fall Time
Notes: 11. Measured under pulsed conditions. Pulse width 300µs. Duty cycle 2%
BV
BV
BV
BV
BV BV
I
I
I
h
V
CE(sat)
V
BE(sat
V
BE(on
C
CBO
CEX
CEO
ECX
ECO
EBO
CBO
CEX
EBO
FE
f
T
obo
t
t t t
170 220 - V
170 210 - V
100 120 - V
6 7 - V
6 8.4 - V 7 8 - V
- <1
50
20
nA
- - 100 nA
- <1 50 nA
100
50
-
-
-
-
-
200
85 20
40
100
70
200
300
-
-
55
135
80
250
-
mV
- 940 1050 mV
- 890 1000 mV
- 160 - MHz
- 9.4 20 pF
- 16 - ns
- 55 - ns
- 677 - ns
- 95 - ns
IC = 100µA
= 100µA, RBE < 1kΩ or
I
C
-1V < V
BE
< 0.25V
IC = 1mA
= 100µA, RBC < 1kΩ or
I
E
0.25V > V
> -0.25V
BC
IE = 100µA IE = 100µA
= 136V
V
CB
= 136V, TA = +100°C
V
CB
= 136V, RBE < 1kΩ or
V
CE
-1V < V V I
C
I
C
I
C
I
C
I
C
I
C
I
C
< 0.25V
BE
= 5.6V
EB
= 10mA, V = 1A, V = 3A, V
CE
CE
= 2V
CE
= 2V
= 2V = 0.5A, IB = 50mA = 0.5A, IB = 10mA = 1A, IB = 100mA = 3A, IB = 300mA
IC = 3A, IB = 300mA IC = 3A, V
= 100mA, V
I
C
CE
= 2V
CE
= 5V,
f = 100MHz V
= 10V, f = 1MHz
CB
= 10V, IC = 0.5A,
V
CC
= -IB2 = 50mA
I
B1
ZXTN25100BFH
Document number: DS33703 Rev. 2 - 2
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ZXTN25100BFH
Typical Electrical Characteristics (@T
1
Tamb=25°C
IC/IB=100
(V)
100m
CE(SAT)
V
10m
1m 10m 100m 1 10
1.6
1.4
1.2
1.0
0.8
0.6
0.4
Normalised Gain
0.2
0.0 1m 10m 100m 1 10
IC Collector Current (A)
V
CE(SAT)
150°C
100°C
25°C
-55°C
v I
C
IC Collector Current (A)
hFE v I
C
= +25°C, unless otherwise specified.)
A
0.5
IC/IB=10
0.4
0.3
(V)
0.2
CE(SAT)
V
0.1
0.0 10m 100m 1
1.2
IC/IB=10
FE
1.0
0.8
(V)
0.6
BE(SAT)
V
0.4
1m 10m 100m 1
)
Typical Gain (h
IC/IB=20
IC/IB=10
VCE=2V
IC/IB=50
350 325 300 275 250 225 200 175 150 125 100 75 50 25 0
150°C
100°C
25°C
IC Collector Current (A)
V
CE(SAT)
25°C
v I
-55°C
C
100°C
150°C
IC Collector Current (A)
V
BE(SAT)
v I
C
-55°C
1.0
0.8
VCE=2V
-55°C
25°C
(V)
0.6
BE(ON)
V
0.4
0.2 1m 10m 100m 1
100°C
150°C
IC Collector Current (A)
V
ZXTN25100BFH
Document number: DS33703 Rev. 2 - 2
BE(ON)
v I
C
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
K
J
H
F
D
G
C
B
K1
L
M
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
Z
X
E
Dimensions Value (in mm)
C
Z 2.9 X 0.8 Y 0.9 C E
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ZXTN25100BFH
Dim Min Max Typ
A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
α
SOT23
0° 8° -
All Dimensions in mm
2.0
1.35
ZXTN25100BFH
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
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ZXTN25100BFH
ZXTN25100BFH
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